WO2005099323A3 - Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung - Google Patents

Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung Download PDF

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Publication number
WO2005099323A3
WO2005099323A3 PCT/EP2005/003131 EP2005003131W WO2005099323A3 WO 2005099323 A3 WO2005099323 A3 WO 2005099323A3 EP 2005003131 W EP2005003131 W EP 2005003131W WO 2005099323 A3 WO2005099323 A3 WO 2005099323A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting diode
conductor track
production
arrangement
Prior art date
Application number
PCT/EP2005/003131
Other languages
English (en)
French (fr)
Other versions
WO2005099323A2 (de
Inventor
Ulrich Keth
Original Assignee
P M C Projekt Man Consult Gmbh
Ulrich Keth
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P M C Projekt Man Consult Gmbh, Ulrich Keth filed Critical P M C Projekt Man Consult Gmbh
Priority to EP05752758A priority Critical patent/EP1733599A2/de
Priority to BRPI0504768-4A priority patent/BRPI0504768A/pt
Publication of WO2005099323A2 publication Critical patent/WO2005099323A2/de
Publication of WO2005099323A3 publication Critical patent/WO2005099323A3/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Es wird eine Leuchtdiodenanordnung (1) angegeben mit einem Leiterbahnträger (2), der eine elektrische Leiterbahnanordnung (8, 9)aufweist, und mindestens einer Leuchtdiode (3), die mit der Leiterbahnanordnung (8, 9) elektrisch verbunden ist. Man möchte die Lebensdauer von Leuchtdioden mit höherer Leitung verlängern. Hierzu ist vorgesehen, dass auf der der Leuchtdiode (3) gegenüberliegenden Seite des Leiterbahnträgers (2) ein Kühlkörper (6) angeordnet ist und der Leiterbahnträger (2) zwischen der Leuchtdiode (3) und dem Kühlkörper (6) eine Durchgangsöffnung (22) aufweist.
PCT/EP2005/003131 2004-04-07 2005-03-24 Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung WO2005099323A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05752758A EP1733599A2 (de) 2004-04-07 2005-03-24 Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung
BRPI0504768-4A BRPI0504768A (pt) 2004-04-07 2005-03-24 conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminosos

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004016847.4 2004-04-07
DE102004016847A DE102004016847A1 (de) 2004-04-07 2004-04-07 Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung

Publications (2)

Publication Number Publication Date
WO2005099323A2 WO2005099323A2 (de) 2005-10-20
WO2005099323A3 true WO2005099323A3 (de) 2006-02-16

Family

ID=34970784

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/003131 WO2005099323A2 (de) 2004-04-07 2005-03-24 Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung

Country Status (4)

Country Link
EP (1) EP1733599A2 (de)
BR (1) BRPI0504768A (de)
DE (1) DE102004016847A1 (de)
WO (1) WO2005099323A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764380B1 (ko) 2005-12-16 2007-10-08 삼성전기주식회사 슬림형 백라이트유닛
EP1996860A2 (de) 2006-01-31 2008-12-03 3M Innovative Properties Company Led-beleuchtungsbaugruppe mit entsprechender folienkonstruktion
US7806560B2 (en) 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
TWI324669B (en) 2007-03-15 2010-05-11 Ind Tech Res Inst Light modules
DE102007023918A1 (de) 2007-05-23 2008-11-27 Siemens Ag Österreich Beleuchtungseinheit
KR100962706B1 (ko) * 2009-11-27 2010-06-15 주식회사 테크엔 파워 ｌｅｄ를 갖는 대형 조명등의 제조 방법
DE102009054840A1 (de) * 2009-12-17 2011-06-22 Poly-Tech Service GmbH, 67681 Leuchtmittel mit einer Mehrzahl von Leuchtdioden
DE202014102862U1 (de) * 2014-06-24 2015-09-25 Zumtobel Lighting Gmbh Anordnung zur Lichtabgabe mit LED und Trägerelement

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448662A (ja) * 1990-06-14 1992-02-18 Hitachi Cable Ltd 発光ダイオード・マイクロチップの実装方法
JPH11121805A (ja) * 1997-10-09 1999-04-30 Citizen Electronics Co Ltd 赤外線データ通信モジュール
JP2002162626A (ja) * 2000-11-22 2002-06-07 Sony Corp 液晶表示用光源の放熱装置及びその製造方法
JP2002232009A (ja) * 2001-01-30 2002-08-16 Harison Toshiba Lighting Corp 発光ダイオードアレイ及び光源装置
WO2003019679A1 (fr) * 2001-08-28 2003-03-06 Matsushita Electric Works, Ltd. Emetteur de lumiere mettant en application une diode electroluminescente
DE10246892A1 (de) * 2001-10-09 2003-04-24 Lumileds Lighting Us LED-Matrix mit hoher Strahlungsleistung
US20040027067A1 (en) * 2001-05-24 2004-02-12 Samsung Electro-Mechanics Co., Ltd. Light emitting diode, light emitting device using the same, and fabrication processes therefor
DE10234995A1 (de) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung mit thermischem Chipanschluß und Leuchtdiodenmodul
EP1398839A1 (de) * 2001-04-23 2004-03-17 Matsushita Electric Works, Ltd. Lichtemittierende einrichtung mit einem led-chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09329395A (ja) * 1996-06-06 1997-12-22 Furukawa Electric Co Ltd:The ヒートシンク
DE19922176C2 (de) 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
DE20120770U1 (de) * 2001-12-21 2002-03-28 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Oberflächenmontierte LED-Mehrfachanordnung und Beleuchtungseinrichtung damit
DE20300626U1 (de) * 2002-11-19 2003-05-28 electronic service willms GmbH & Co. KG, 52223 Stolberg Leiterkarte, Anordnung aus Leiterkarte, Bauteil und/oder Kühlelement sowie Hochleistungs-LED-Anordnung

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448662A (ja) * 1990-06-14 1992-02-18 Hitachi Cable Ltd 発光ダイオード・マイクロチップの実装方法
JPH11121805A (ja) * 1997-10-09 1999-04-30 Citizen Electronics Co Ltd 赤外線データ通信モジュール
JP2002162626A (ja) * 2000-11-22 2002-06-07 Sony Corp 液晶表示用光源の放熱装置及びその製造方法
JP2002232009A (ja) * 2001-01-30 2002-08-16 Harison Toshiba Lighting Corp 発光ダイオードアレイ及び光源装置
EP1398839A1 (de) * 2001-04-23 2004-03-17 Matsushita Electric Works, Ltd. Lichtemittierende einrichtung mit einem led-chip
US20040027067A1 (en) * 2001-05-24 2004-02-12 Samsung Electro-Mechanics Co., Ltd. Light emitting diode, light emitting device using the same, and fabrication processes therefor
WO2003019679A1 (fr) * 2001-08-28 2003-03-06 Matsushita Electric Works, Ltd. Emetteur de lumiere mettant en application une diode electroluminescente
DE10246892A1 (de) * 2001-10-09 2003-04-24 Lumileds Lighting Us LED-Matrix mit hoher Strahlungsleistung
DE10234995A1 (de) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung mit thermischem Chipanschluß und Leuchtdiodenmodul

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 236 (E - 1210) 29 May 1992 (1992-05-29) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 09 30 July 1999 (1999-07-30) *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 10 10 October 2002 (2002-10-10) *
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 12 12 December 2002 (2002-12-12) *
See also references of EP1733599A2 *

Also Published As

Publication number Publication date
WO2005099323A2 (de) 2005-10-20
BRPI0504768A (pt) 2006-10-24
EP1733599A2 (de) 2006-12-20
DE102004016847A1 (de) 2005-12-22

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