KR100962706B1 - 파워 led를 갖는 대형 조명등의 제조 방법 - Google Patents
파워 led를 갖는 대형 조명등의 제조 방법 Download PDFInfo
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- KR100962706B1 KR100962706B1 KR1020090116242A KR20090116242A KR100962706B1 KR 100962706 B1 KR100962706 B1 KR 100962706B1 KR 1020090116242 A KR1020090116242 A KR 1020090116242A KR 20090116242 A KR20090116242 A KR 20090116242A KR 100962706 B1 KR100962706 B1 KR 100962706B1
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- power led
- hole
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000005286 illumination Methods 0.000 title description 2
- 230000017525 heat dissipation Effects 0.000 claims abstract description 55
- 229910000679 solder Inorganic materials 0.000 claims abstract description 52
- 239000006071 cream Substances 0.000 claims abstract description 32
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- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 238000004080 punching Methods 0.000 claims abstract description 11
- 239000004519 grease Substances 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 16
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- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
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- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (8)
- 파워 LED를 갖는 대형 조명등의 제조 방법에 있어서,(A)상기 파워 LED의 리드 프레임(Lead Frame)(+극, -극)을 고정시킬 수 있는 솔더 패드(Solder Pad)를 구비하는 FR-4 소재의 상하부에 동(Cu)박면이 부착된 양면기판(FR-4 PCB)을 상기 파워 LED의 모양 및 크기에 따라 상기 양면기판을 모두 관통하지 않도록 상부 일부만을 펀칭 가공에 의해 하나의 스루 홀을 형성시키는 단계와;(B)상기 하나의 스루 홀과 연장되는 상기 양면기판의 나머지 일부를 관통시켜 다수의 스루 홀을 형성시키되, 상기 양면기판(FR-4 PCB)의 하부 동(Cu)박면은 펀칭되지 않도록 하는 2단 구조의 멀티-스루 홀(Multi-Through Hole)을 형성시키는 단계와;(C)상기 2단 구조의 멀티-스루 홀에는 기계적 장치를 사용하여 히트 슬러그(Heat Slug) 기능을 갖도록 하는 무연납 크림솔더(Pb-free Cream Solder)를 상기 솔더 패드의 높이만큼 주입시키는 단계와;(D)상기 무연납 크림솔더가 주입된 후 상기 파워 LED를 극판에 알맞게 앉혀 상기 무연납 크림솔더를 이동형 고온장비를 사용하여 상기 파워 LED 후면 발열부위의 방열점과 상기 무연납 크림솔더 및 상기 양면기판의 하부 동(Cu)박면이 하나로 일체화되도록 솔더링(Soldering)하여 피씨비 어셈블리(PCB Assy)를 완성하는 단계와;(E)상기 피씨비 어셈블리를 대형 방열구조체인 알루미늄 기구에 취부 고정시켜 LED 조명등으로서의 방열효율을 극대화하는 단계를 포함하는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
- 제1 항에 있어서, 상기 2단 구조의 멀티-스루 홀은, 상기 파워 LED 발열부위의 방열점과 수직으로 일치하는 지점에 천공되는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
- 제2 항에 있어서, 상기 2단 구조의 멀티-스루 홀은, 상기 양면기판(FR-4 PCB) 가공시에 미리 천공되는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
- 제3 항에 있어서, 상기 2단 구조의 멀티-스루 홀의 형태는 원형 또는 사각형으로 천공되는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
- 제1 항에 있어서, 상기 하나의 스루 홀은, 상기 하나의 스루 홀에 주입된 상기 무연납 크림솔더가 상기 이동형 고온장비에 의해 납땜구조의 열전달 매체가 되어 상기 파워 LED 발열부위의 방열점에서 발생된 고열을 순간적으로 축적시키는 기능을 갖는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
- 제5 항에 있어서, 상기 다수의 스루 홀은, 상기 하나의 스루 홀에 순간적으로 축적된 고열을 빠른 유속형태를 갖고 다중 분산시키는 기능을 갖는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
- 제1 항에 있어서, 상기 무연납 크림솔더는, 상기 양면기판(FR-4 PCB)에 상기 파워 LED를 취부하기 전에 먼저 주입되는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
- 제1 항에 있어서, 상기 피씨비 어셈블리와 대형 방열구조체인 알루미늄 기구는, 솔더링(Soldering, 납땜) 또는 써멀 그리스(Thermal Grease)에 의해 취부 고정되는 것을 특징으로 하는 파워 LED를 갖는 대형 조명등의 제조 방법.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090116242A KR100962706B1 (ko) | 2009-11-27 | 2009-11-27 | 파워 led를 갖는 대형 조명등의 제조 방법 |
PCT/KR2010/007755 WO2011065683A2 (ko) | 2009-11-27 | 2010-11-04 | 파워 led를 갖는 대형 조명등의 제조 방법 |
DE112010004593.3T DE112010004593B4 (de) | 2009-11-27 | 2010-11-04 | Verfahren zur Herstellung einer LED-Beleuchtungseinrichtung |
US13/512,328 US8535959B2 (en) | 2009-11-27 | 2010-11-04 | Method for producing large lighting with power LED |
CN201080053924.8A CN102695916B (zh) | 2009-11-27 | 2010-11-04 | 具有功率发光二极管的大型照明灯的制造方法 |
JP2012541007A JP5735976B2 (ja) | 2009-11-27 | 2010-11-04 | パワーledを有する大型照明灯の製造方法 |
US13/968,317 US8878228B2 (en) | 2009-11-27 | 2013-08-15 | Method for producing large lighting with power LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090116242A KR100962706B1 (ko) | 2009-11-27 | 2009-11-27 | 파워 led를 갖는 대형 조명등의 제조 방법 |
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KR100962706B1 true KR100962706B1 (ko) | 2010-06-15 |
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KR1020090116242A KR100962706B1 (ko) | 2009-11-27 | 2009-11-27 | 파워 led를 갖는 대형 조명등의 제조 방법 |
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US (2) | US8535959B2 (ko) |
JP (1) | JP5735976B2 (ko) |
KR (1) | KR100962706B1 (ko) |
CN (1) | CN102695916B (ko) |
DE (1) | DE112010004593B4 (ko) |
WO (1) | WO2011065683A2 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI489918B (zh) * | 2012-11-23 | 2015-06-21 | Subtron Technology Co Ltd | 封裝載板 |
KR20160108867A (ko) * | 2015-03-09 | 2016-09-21 | 엘이디라이텍(주) | 엘이디 램프용 연성회로기판 조립체 |
CN105065951B (zh) * | 2015-08-31 | 2018-07-20 | 宁波耐斯达光电有限公司 | 一种集泛光、聚光于一体的光源及其系统 |
ES2597740B1 (es) * | 2016-10-05 | 2017-08-04 | Sacyr Concesiones, S.L. | Sistema de iluminación de túneles de carreteras |
US10436416B2 (en) | 2017-07-19 | 2019-10-08 | Ford Global Technologies, Llc | Vehicle light assembly with heat sink |
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US20130130418A1 (en) | 2013-05-23 |
CN102695916A (zh) | 2012-09-26 |
US20130328099A1 (en) | 2013-12-12 |
DE112010004593T5 (de) | 2013-01-24 |
CN102695916B (zh) | 2014-11-05 |
WO2011065683A2 (ko) | 2011-06-03 |
US8535959B2 (en) | 2013-09-17 |
DE112010004593B4 (de) | 2016-12-15 |
WO2011065683A3 (ko) | 2011-09-01 |
JP5735976B2 (ja) | 2015-06-17 |
JP2013512560A (ja) | 2013-04-11 |
US8878228B2 (en) | 2014-11-04 |
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