WO2011065683A3 - 파워 ｌｅｄ를 갖는 대형 조명등의 제조 방법 - Google Patents

파워 ｌｅｄ를 갖는 대형 조명등의 제조 방법 Download PDF

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Publication number
WO2011065683A3
WO2011065683A3 PCT/KR2010/007755 KR2010007755W WO2011065683A3 WO 2011065683 A3 WO2011065683 A3 WO 2011065683A3 KR 2010007755 W KR2010007755 W KR 2010007755W WO 2011065683 A3 WO2011065683 A3 WO 2011065683A3
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WO
WIPO (PCT)
Prior art keywords
power
led
heat dissipation
lighting
led lighting
Prior art date
Application number
PCT/KR2010/007755
Other languages
English (en)
French (fr)
Other versions
WO2011065683A2 (ko
Inventor
이영섭
Original Assignee
(주)테크엔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)테크엔 filed Critical (주)테크엔
Priority to JP2012541007A priority Critical patent/JP5735976B2/ja
Priority to CN201080053924.8A priority patent/CN102695916B/zh
Priority to DE112010004593.3T priority patent/DE112010004593B4/de
Priority to US13/512,328 priority patent/US8535959B2/en
Publication of WO2011065683A2 publication Critical patent/WO2011065683A2/ko
Publication of WO2011065683A3 publication Critical patent/WO2011065683A3/ko
Priority to US13/968,317 priority patent/US8878228B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

본 발명은 가로등과 같은 대형 LED 조명등의 고열을 자연 대류형 방열 장치를 통해 대기온도에 신속하게 다중 분산시키도록 한 파워 LED를 갖는 대형 조명등의 제조 방법에 관한 것 으로서, 방열효율을 극대화시켜 적은 LED 수량에도 큰 광원을 방사하여 LED 광원 시스템의 발광효율을 높일 수 있으며, 또한 방열처리가 원활하여 가로등과 같은 대형 LED 조명등기구 생산에 따른 파워 LED 소자의 후면 방열처리에 대한 새로운 응용기술을 제안하는 독특한 효과를 갖는다.
PCT/KR2010/007755 2009-11-27 2010-11-04 파워 ｌｅｄ를 갖는 대형 조명등의 제조 방법 WO2011065683A2 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012541007A JP5735976B2 (ja) 2009-11-27 2010-11-04 パワーｌｅｄを有する大型照明灯の製造方法
CN201080053924.8A CN102695916B (zh) 2009-11-27 2010-11-04 具有功率发光二极管的大型照明灯的制造方法
DE112010004593.3T DE112010004593B4 (de) 2009-11-27 2010-11-04 Verfahren zur Herstellung einer LED-Beleuchtungseinrichtung
US13/512,328 US8535959B2 (en) 2009-11-27 2010-11-04 Method for producing large lighting with power LED
US13/968,317 US8878228B2 (en) 2009-11-27 2013-08-15 Method for producing large lighting with power LED

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0116242 2009-11-27
KR1020090116242A KR100962706B1 (ko) 2009-11-27 2009-11-27 파워 ｌｅｄ를 갖는 대형 조명등의 제조 방법

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/512,328 A-371-Of-International US8535959B2 (en) 2009-11-27 2010-11-04 Method for producing large lighting with power LED
US13/968,317 Continuation US8878228B2 (en) 2009-11-27 2013-08-15 Method for producing large lighting with power LED

Publications (2)

Publication Number Publication Date
WO2011065683A2 WO2011065683A2 (ko) 2011-06-03
WO2011065683A3 true WO2011065683A3 (ko) 2011-09-01

Family

ID=42369876

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/007755 WO2011065683A2 (ko) 2009-11-27 2010-11-04 파워 ｌｅｄ를 갖는 대형 조명등의 제조 방법

Country Status (6)

Country Link
US (2) US8535959B2 (ko)
JP (1) JP5735976B2 (ko)
KR (1) KR100962706B1 (ko)
CN (1) CN102695916B (ko)
DE (1) DE112010004593B4 (ko)
WO (1) WO2011065683A2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489918B (zh) * 2012-11-23 2015-06-21 Subtron Technology Co Ltd 封裝載板
KR20160108867A (ko) * 2015-03-09 2016-09-21 엘이디라이텍(주) 엘이디 램프용 연성회로기판 조립체
CN105065951B (zh) * 2015-08-31 2018-07-20 宁波耐斯达光电有限公司 一种集泛光、聚光于一体的光源及其系统
ES2597740B1 (es) * 2016-10-05 2017-08-04 Sacyr Concesiones, S.L. Sistema de iluminación de túneles de carreteras
US10436416B2 (en) 2017-07-19 2019-10-08 Ford Global Technologies, Llc Vehicle light assembly with heat sink
CN114551641B (zh) * 2022-02-10 2023-09-12 中国科学院上海技术物理研究所 一种物理隔离耦合应力的焦平面探测器热层结构
CN116127903B (zh) * 2023-02-14 2023-11-14 电子科技大学 一种大功率pa芯片版图布局及风洞式自散热封装设计方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610650B1 (ko) * 2005-06-17 2006-08-09 (주) 파이오닉스 엘이디 패키지 및 그 제조방법
KR100851367B1 (ko) * 2006-12-27 2008-08-08 서울반도체 주식회사 발광 다이오드
KR100882588B1 (ko) * 2007-08-16 2009-02-12 알티전자 주식회사 발광 다이오드 패키지

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6097089A (en) * 1998-01-28 2000-08-01 Mitsubishi Gas Chemical Company, Inc. Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
JPS5836500B2 (ja) * 1974-06-07 1983-08-09 株式会社日立製作所 Ｉｃ用セラミック基板の製造法
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
JP4305896B2 (ja) * 2002-11-15 2009-07-29 シチズン電子株式会社 高輝度発光装置及びその製造方法
US6921971B2 (en) * 2003-01-15 2005-07-26 Kyocera Corporation Heat releasing member, package for accommodating semiconductor element and semiconductor device
DE102004016847A1 (de) * 2004-04-07 2005-12-22 P.M.C. Projekt Management Consult Gmbh Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
US6964884B1 (en) * 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
DE202005018009U1 (de) * 2005-06-30 2006-02-09 Lite-On Technology Corporation Halbleiter-Montagestruktur
KR101263934B1 (ko) * 2006-05-23 2013-05-10 엘지디스플레이 주식회사 발광다이오드 및 그의 제조방법
KR100854328B1 (ko) * 2006-07-07 2008-08-28 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
JP5142119B2 (ja) * 2006-09-20 2013-02-13 住友電装株式会社 放熱構造を備えたプリント基板の製造方法および該方法で製造されたプリント基板の放熱構造
JP2008078584A (ja) * 2006-09-25 2008-04-03 Matsushita Electric Works Ltd 発光装置
KR100923784B1 (ko) 2007-12-12 2009-10-27 세종메탈 주식회사 방열 특성이 우수한 금속 회로 기판 및 그 제조 방법
WO2009128354A1 (ja) * 2008-04-18 2009-10-22 旭硝子株式会社 発光ダイオードパッケージ
JP5363789B2 (ja) * 2008-11-18 2013-12-11 スタンレー電気株式会社 光半導体装置
KR101685698B1 (ko) * 2009-11-30 2016-12-12 엘지디스플레이 주식회사 발광소자 패키지 및 그의 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610650B1 (ko) * 2005-06-17 2006-08-09 (주) 파이오닉스 엘이디 패키지 및 그 제조방법
KR100851367B1 (ko) * 2006-12-27 2008-08-08 서울반도체 주식회사 발광 다이오드
KR100882588B1 (ko) * 2007-08-16 2009-02-12 알티전자 주식회사 발광 다이오드 패키지

Also Published As

Publication number Publication date
WO2011065683A2 (ko) 2011-06-03
US20130130418A1 (en) 2013-05-23
JP2013512560A (ja) 2013-04-11
KR100962706B1 (ko) 2010-06-15
CN102695916B (zh) 2014-11-05
DE112010004593T5 (de) 2013-01-24
CN102695916A (zh) 2012-09-26
US8535959B2 (en) 2013-09-17
US8878228B2 (en) 2014-11-04
DE112010004593B4 (de) 2016-12-15
JP5735976B2 (ja) 2015-06-17
US20130328099A1 (en) 2013-12-12

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