CN202188450U - 一种led模组及照明装置 - Google Patents
一种led模组及照明装置 Download PDFInfo
- Publication number
- CN202188450U CN202188450U CN2011202872302U CN201120287230U CN202188450U CN 202188450 U CN202188450 U CN 202188450U CN 2011202872302 U CN2011202872302 U CN 2011202872302U CN 201120287230 U CN201120287230 U CN 201120287230U CN 202188450 U CN202188450 U CN 202188450U
- Authority
- CN
- China
- Prior art keywords
- reflector
- led module
- chip
- base plate
- reflection cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 39
- 230000004888 barrier function Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000010412 perfusion Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202872302U CN202188450U (zh) | 2011-08-09 | 2011-08-09 | 一种led模组及照明装置 |
AU2011101723A AU2011101723A4 (en) | 2011-08-09 | 2011-10-28 | Led module and lighting device |
JP2013600044U JP3186293U (ja) | 2011-08-09 | 2011-10-28 | Ledモジュール及び照明装置 |
DE212011100217.1U DE212011100217U1 (de) | 2011-08-09 | 2011-10-28 | LED-Modul und -Beleuchtungsvorrichtung |
PCT/CN2011/081486 WO2013020330A1 (zh) | 2011-08-09 | 2011-10-28 | 一种led模组及照明装置 |
FR1257741A FR2979003B3 (fr) | 2011-08-09 | 2012-08-09 | Module a del et dispositif d'eclairage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202872302U CN202188450U (zh) | 2011-08-09 | 2011-08-09 | 一种led模组及照明装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202188450U true CN202188450U (zh) | 2012-04-11 |
Family
ID=45919900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202872302U Expired - Fee Related CN202188450U (zh) | 2011-08-09 | 2011-08-09 | 一种led模组及照明装置 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP3186293U (zh) |
CN (1) | CN202188450U (zh) |
AU (1) | AU2011101723A4 (zh) |
DE (1) | DE212011100217U1 (zh) |
FR (1) | FR2979003B3 (zh) |
WO (1) | WO2013020330A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104701443A (zh) * | 2013-12-05 | 2015-06-10 | 董挺波 | 一种适用于简单线路cob封装形式的led基板及制备方法 |
CN107438905A (zh) * | 2015-03-18 | 2017-12-05 | Lg伊诺特有限公司 | 发光元件阵列及包含该发光元件阵列的照明系统 |
CN117954564A (zh) * | 2024-03-26 | 2024-04-30 | 深圳市佑明光电有限公司 | 一种无光晕的Mini LED背光模组及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
CN2540685Y (zh) * | 2002-06-03 | 2003-03-19 | 葛世潮 | 高效率大功率发光二极管 |
CN2517112Y (zh) * | 2002-01-24 | 2002-10-16 | 葛世潮 | 大功率发光二极管 |
CN1725518A (zh) * | 2005-06-24 | 2006-01-25 | 南京汉德森半导体照明有限公司 | 新型大功率半导体发光二极管封装基座 |
JP5130815B2 (ja) * | 2007-07-25 | 2013-01-30 | 三菱化学株式会社 | Ledチップ固定用基板およびその製造方法 |
TW201022327A (en) * | 2008-10-30 | 2010-06-16 | Solvay Advanced Polymers Llc | Hydroquinone-containing polyesters having improved whiteness |
-
2011
- 2011-08-09 CN CN2011202872302U patent/CN202188450U/zh not_active Expired - Fee Related
- 2011-10-28 JP JP2013600044U patent/JP3186293U/ja not_active Expired - Fee Related
- 2011-10-28 DE DE212011100217.1U patent/DE212011100217U1/de not_active Expired - Lifetime
- 2011-10-28 AU AU2011101723A patent/AU2011101723A4/en not_active Ceased
- 2011-10-28 WO PCT/CN2011/081486 patent/WO2013020330A1/zh active Application Filing
-
2012
- 2012-08-09 FR FR1257741A patent/FR2979003B3/fr not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104701443A (zh) * | 2013-12-05 | 2015-06-10 | 董挺波 | 一种适用于简单线路cob封装形式的led基板及制备方法 |
CN107438905A (zh) * | 2015-03-18 | 2017-12-05 | Lg伊诺特有限公司 | 发光元件阵列及包含该发光元件阵列的照明系统 |
CN107438905B (zh) * | 2015-03-18 | 2020-07-10 | Lg伊诺特有限公司 | 发光器件阵列及包含该发光器件阵列的照明系统 |
CN117954564A (zh) * | 2024-03-26 | 2024-04-30 | 深圳市佑明光电有限公司 | 一种无光晕的Mini LED背光模组及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2979003B3 (fr) | 2013-08-09 |
FR2979003A3 (fr) | 2013-02-15 |
WO2013020330A1 (zh) | 2013-02-14 |
JP3186293U (ja) | 2013-10-03 |
AU2011101723A4 (en) | 2013-01-10 |
DE212011100217U1 (de) | 2014-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9401467B2 (en) | Light emitting device package having a package body including a recess and lighting system including the same | |
US8716744B2 (en) | LED package, method for making the LED package and light source having the same | |
CN203134860U (zh) | 一种中小功率led贴片封装结构 | |
CN102903824A (zh) | 发光二极管封装及其制造方法 | |
CN202076265U (zh) | 一种led模组的封装结构及照明装置 | |
CN202195315U (zh) | 一种led面光源装置 | |
US8907371B2 (en) | Light emitting diode package and light emitting device having the same | |
CN202188450U (zh) | 一种led模组及照明装置 | |
CN202534686U (zh) | Cob封装led光源模块 | |
CN102222665B (zh) | 带薄型复眼透镜的集成led模块 | |
CN201589092U (zh) | 一种发矩形光斑的led光源模块 | |
CN102522478A (zh) | 发光二极管模组及其支架 | |
CN102082217A (zh) | 一种发光二极管 | |
CN101814574A (zh) | 一种发光二极管基板散热结构及其制作方法 | |
CN201601146U (zh) | 一种led发光二极管 | |
US9105825B2 (en) | Light source package and method of manufacturing the same | |
CN201893369U (zh) | 一种发光二极管 | |
CN203131498U (zh) | 基于cob基板的led灯源 | |
CN202205814U (zh) | 一种发光二极管器件 | |
CN202758930U (zh) | 发光二极管封装结构 | |
CN103367343A (zh) | 发光模块 | |
CN203103348U (zh) | 具有cob基板结构的led灯源 | |
CN201638812U (zh) | 一种新型大功率led封装结构 | |
CN202691653U (zh) | 发光二极管模块 | |
CN201549529U (zh) | 一种新型的大功率led封装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHENZHEN LT PHOTOELECTRICITY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN REFOND OPTOELECTRONICS CO., LTD. Effective date: 20140508 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140508 Address after: 518000, Guangdong, Shenzhen, Baoan District Xixiang street, hang Chau Hengfeng Industrial City, B15 plant, five or six floor Patentee after: Shenzhen Lingtao Photoelectric Technology Co., Ltd. Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth. Patentee before: Shenzhen Refond Optoelectronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20180809 |
|
CF01 | Termination of patent right due to non-payment of annual fee |