CN202534686U - Cob封装led光源模块 - Google Patents

Cob封装led光源模块 Download PDF

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Publication number
CN202534686U
CN202534686U CN2012201845406U CN201220184540U CN202534686U CN 202534686 U CN202534686 U CN 202534686U CN 2012201845406 U CN2012201845406 U CN 2012201845406U CN 201220184540 U CN201220184540 U CN 201220184540U CN 202534686 U CN202534686 U CN 202534686U
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lens
light source
aluminum substrate
led light
depression
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刘树高
安建春
秦立军
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Shandong Kaiyuan Electronic Co Ltd
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Shandong Kaiyuan Electronic Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges

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Abstract

本实用新型公开了一种COB封装LED光源模块，包括PCB铝基体，所述铝基体上设有系列凹穴，在凹穴内设有与覆铜电路键合的LED芯片，芯片上部设有荧光粉层和透镜，所述铝基体覆铜的一面设有与之紧密相接的覆面板，所述覆面板上设有与凹穴对应的透镜孔，所述透镜孔向外呈喇叭口状，透镜孔下口直径大于凹穴上口直径，覆铜线路键合点露出于透镜孔下口，透镜与透镜孔壁紧密相接。本实用新型用于制作大功率LED灯具，具有热阻小，充分利用芯片侧面出光，出光效率高，无需再造透镜围坝，工艺简单，制作方便，透镜形态也便于控制等优点。

Description

COB封装LED光源模块
技术领域
本实用新型属于LED封装技术领域，具体是涉及一种COB封装的多芯片LED模组。
背景技术
LED的COB封装（板上芯片封装）不仅能够制造大功率LED照明产品，而且具有热阻小、光线均匀、应用方便等优点。现有LED的COB封装，一般是在铝基覆铜板上做好电路，再将LED芯片固晶到覆铜板上，完成键合，然后在封装区周围加塑料或硅胶制作围坝，最后在围坝内点荧光粉和硅胶。普遍存在着光效偏低，制作麻烦，可靠性差的缺点。也有的在铝基覆铜板上设置反光腔，在反光腔内设置芯片，虽能提高光效，但仍需要在反光腔周围设置围栅，在围栅内涂覆硅胶透镜。也存在着工艺复杂，透镜形态难以控制等缺点。
发明内容
本实用新型要解决的技术问题是提供一种光效高，便于制作的COB封装LED光源模块。
为解决上述技术问题，本实用新型包括PCB铝基体，所述铝基体上设有系列凹穴，在凹穴内设有与覆铜电路键合的LED芯片，芯片上部设有荧光粉层和透镜，其结构特点是所述铝基体覆铜的一面设有与之紧密相接的覆面板，所述覆面板上设有与凹穴对应的透镜孔，所述透镜孔向外呈喇叭口状，透镜孔下口直径大于凹穴上口直径，覆铜线路键合点露出于透镜孔下口，透镜与透镜孔壁紧密相接。
优选的是所述凹穴底面为平面，其侧面为倒圆锥形，其底面与侧面内夹角为100至135度。
所述覆面板与铝基体间设有绝缘粘结层。
更为优选的是所述透镜为硅胶透镜，其顶面呈凸面状，透镜侧上沿不高于透镜孔上口沿。
所述凹穴及透镜孔侧壁表面设有反光层。
采用上述结构后，由于LED芯片设在铝基体上的凹穴内，芯片直接与铝基体相接，热阻小，同时在铝基体上设有覆面板，覆面板上设有与凹穴对应的透镜孔，且透镜孔呈喇叭口状，透镜孔壁具有反射作用，充分利用了芯片侧面出光，提高了出光效率。透镜直接点涂在透镜孔内，无需再造透镜围坝，工艺简单，制作方便，而且透镜形态也便于控制。
附图说明
下面结合附图和实施例对本实用新型作进一步描述：
图1是本实用新型结构示意图；
图2是本实用新型侧剖示意图；
图3是本实用新型部分放大示意图。
具体实施方式
参照附图，本实用新型包括PCB铝基体1，在铝基体1上设有系列凹穴2，凹穴2底面为平面，其侧面为倒圆锥形，其底面与侧面内夹角12为100至135度。凹穴2周围的铝基体1表面设有覆铜电路6。铝基体1覆铜的一面上设有与之紧密相接的铝基覆面板7，覆面板7与铝基体1间设有绝缘粘结层9，覆面板7上设有与凹穴2对应的透镜孔8，透镜孔8向外呈喇叭口状，透镜孔8下口直径大于凹穴2上口直径，以便于覆铜线路6的键合点露出于透镜孔8下口。LED芯片3设在凹穴2内，并通过键合金丝11与覆铜电路6键合，芯片3上部依次设有荧光粉层4和透镜5。透镜5为硅胶透镜，其顶面呈凸面状，透镜5的侧上沿不高于透镜孔8上口沿，透镜5与透镜孔8壁紧密相接。凹穴2、透镜孔8侧壁及键合点表面设有镀银反光层，在覆铜线路6与铝基体1之间设有绝缘层10。

Claims (5)

1.一种COB封装LED光源模块，包括PCB铝基体（1），所述铝基体（1）上设有系列凹穴（2），在凹穴（2）内设有与覆铜电路（6）键合的LED芯片（3），芯片（3）上部设有荧光粉层（4）和透镜（5），其特征是所述铝基体（1）覆铜的一面设有与之紧密相接的覆面板（7），所述覆面板（7）上设有与凹穴（2）对应的透镜孔（8），所述透镜孔（8）向外呈喇叭口状，透镜孔（8）下口直径大于凹穴（2）上口直径，覆铜线路（6）键合点露出于透镜孔（8）下口，透镜（5）与透镜孔（8）壁紧密相接。
2.按照权利要求1所述的COB封装LED光源模块，其特征是所述凹穴（2）底面为平面，其侧面为倒圆锥形，其底面与侧面内夹角（12）为100至135度。
3.按照权利要求1或2所述的COB封装LED光源模块，其特征是所述覆面板（7）与铝基体（1）间设有绝缘粘结层（9）。
4.按照权利要求3所述的COB封装LED光源模块，其特征是所述透镜（5）为硅胶透镜，其顶面呈凸面状，透镜（5）侧上沿不高于透镜孔（8）上口沿。
5.按照权利要求1所述的COB封装LED光源模块，其特征是所述凹穴（2）及透镜孔（8）侧壁表面设有反光层。
CN2012201845406U 2012-04-27 2012-04-27 Cob封装led光源模块 Expired - Lifetime CN202534686U (zh)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106024647A (zh) * 2016-06-14 2016-10-12 重庆切普电子技术有限公司 一种cob封装器件低成本生产工艺
WO2017206405A1 (zh) * 2016-05-30 2017-12-07 深圳市奥蕾达科技有限公司 新型cob全彩led发光面板及其制造方法
CN110167833A (zh) * 2016-10-31 2019-08-23 D·萨尔瓦焦 车辆本体中的集成电子部件
CN110233149A (zh) * 2018-05-09 2019-09-13 深圳市聚飞光电股份有限公司 Led支架制作方法、led支架及led
US11230338B2 (en) 2012-03-28 2022-01-25 Salvaggio Jr David Integrated electronic component in vehicle body

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11230338B2 (en) 2012-03-28 2022-01-25 Salvaggio Jr David Integrated electronic component in vehicle body
US11679833B2 (en) 2012-03-28 2023-06-20 Salvaggio Jr David Integrated electronic component in vehicle body
US12030576B2 (en) 2012-03-28 2024-07-09 David Salvaggio, JR. Integrated electronic component in vehicle body
WO2017206405A1 (zh) * 2016-05-30 2017-12-07 深圳市奥蕾达科技有限公司 新型cob全彩led发光面板及其制造方法
CN106024647A (zh) * 2016-06-14 2016-10-12 重庆切普电子技术有限公司 一种cob封装器件低成本生产工艺
CN110167833A (zh) * 2016-10-31 2019-08-23 D·萨尔瓦焦 车辆本体中的集成电子部件
CN110167833B (zh) * 2016-10-31 2021-11-09 D·萨尔瓦焦 车辆本体中的集成电子部件
CN110233149A (zh) * 2018-05-09 2019-09-13 深圳市聚飞光电股份有限公司 Led支架制作方法、led支架及led

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