CN102222665B - 带薄型复眼透镜的集成led模块 - Google Patents
带薄型复眼透镜的集成led模块 Download PDFInfo
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- CN102222665B CN102222665B CN2011101587014A CN201110158701A CN102222665B CN 102222665 B CN102222665 B CN 102222665B CN 2011101587014 A CN2011101587014 A CN 2011101587014A CN 201110158701 A CN201110158701 A CN 201110158701A CN 102222665 B CN102222665 B CN 102222665B
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- 238000003825 pressing Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 15
- 239000000741 silica gel Substances 0.000 claims abstract description 13
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 241000218202 Coptis Species 0.000 claims description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 238000009826 distribution Methods 0.000 description 17
- 230000005855 radiation Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101587014A CN102222665B (zh) | 2011-06-14 | 2011-06-14 | 带薄型复眼透镜的集成led模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101587014A CN102222665B (zh) | 2011-06-14 | 2011-06-14 | 带薄型复眼透镜的集成led模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102222665A CN102222665A (zh) | 2011-10-19 |
CN102222665B true CN102222665B (zh) | 2013-01-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011101587014A Expired - Fee Related CN102222665B (zh) | 2011-06-14 | 2011-06-14 | 带薄型复眼透镜的集成led模块 |
Country Status (1)
Country | Link |
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CN (1) | CN102222665B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094268A (zh) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | 应用于商业照明的led模组及其制作方法 |
CN103872228A (zh) * | 2012-12-11 | 2014-06-18 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管组合 |
CN108550598B (zh) * | 2018-06-01 | 2019-08-30 | 京东方科技集团股份有限公司 | 电子成像装置及其制备方法、柔性电子复眼及其制备方法 |
CN112563382A (zh) * | 2019-09-25 | 2021-03-26 | 昆山科技大学 | 白光发光二极管结构及其制造方法 |
CN113232342A (zh) * | 2021-05-07 | 2021-08-10 | 广景视睿科技(深圳)有限公司 | 一种复眼镜片模组的制作方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006301363A (ja) * | 2005-04-21 | 2006-11-02 | Harison Toshiba Lighting Corp | 照明装置 |
CN101299447A (zh) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | 一种大功率led的封装工艺 |
US20090052182A1 (en) * | 2005-03-18 | 2009-02-26 | Yoshiaki Matsuba | Illumination system |
CN101404317A (zh) * | 2008-11-12 | 2009-04-08 | 鹤山丽得电子实业有限公司 | 一种大功率白光led封装方法 |
CN201330972Y (zh) * | 2008-12-25 | 2009-10-21 | 复旦大学 | 一种采用复眼透镜的led隧道照明灯具 |
CN102034919A (zh) * | 2010-10-15 | 2011-04-27 | 陈林 | 高亮度大功率led及其制作方法 |
CN202150492U (zh) * | 2011-06-14 | 2012-02-22 | 符建 | 一种带薄型复眼透镜的集成led模块 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008016303A (ja) * | 2006-07-05 | 2008-01-24 | Toshiba Lighting & Technology Corp | 発光装置 |
US8046144B2 (en) * | 2007-06-26 | 2011-10-25 | Chrysler Group Llc | Systems and methods for non-linear proportional and derivative control during vehicle garage shifts |
-
2011
- 2011-06-14 CN CN2011101587014A patent/CN102222665B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090052182A1 (en) * | 2005-03-18 | 2009-02-26 | Yoshiaki Matsuba | Illumination system |
JP2006301363A (ja) * | 2005-04-21 | 2006-11-02 | Harison Toshiba Lighting Corp | 照明装置 |
CN101299447A (zh) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | 一种大功率led的封装工艺 |
CN101404317A (zh) * | 2008-11-12 | 2009-04-08 | 鹤山丽得电子实业有限公司 | 一种大功率白光led封装方法 |
CN201330972Y (zh) * | 2008-12-25 | 2009-10-21 | 复旦大学 | 一种采用复眼透镜的led隧道照明灯具 |
CN102034919A (zh) * | 2010-10-15 | 2011-04-27 | 陈林 | 高亮度大功率led及其制作方法 |
CN202150492U (zh) * | 2011-06-14 | 2012-02-22 | 符建 | 一种带薄型复眼透镜的集成led模块 |
Non-Patent Citations (2)
Title |
---|
JP特开2006-301363A 2006.11.02 |
JP特开2008-16303A 2008.01.24 |
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CN102222665A (zh) | 2011-10-19 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Fu Jian Inventor after: Zhang Hang Inventor after: Lu Zhe Inventor after: Gu Yingjie Inventor after: Zhang Yuefang Inventor before: Fu Jian Inventor before: Zhang Hang Inventor before: Lu Zhe Inventor before: Gu Yingjie |
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COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: FU JIAN ZHANG HANG LU ZHE GU YINGJIE TO: FU JIAN ZHANG HANG LU ZHE GU YINGJIE ZHANG YUEFANG |
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C14 | Grant of patent or utility model | ||
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Owner name: HANGZHOU GUANGZHUI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FU JIAN Effective date: 20130729 |
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Effective date of registration: 20130729 Address after: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee after: HANGZHOU LIGHT-CONE TECHNOLOGY CO.,LTD. Address before: Hangzhou City, Zhejiang Province, Xihu District Zijin building 24-701 310012 Patentee before: Fu Jian |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee after: Zhejiang guangcone Technology Co.,Ltd. Address before: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee before: HANGZHOU LIGHT-CONE TECHNOLOGY CO.,LTD. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 |
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CF01 | Termination of patent right due to non-payment of annual fee |