CN102222665A - 带薄型复眼透镜的集成led模块 - Google Patents
带薄型复眼透镜的集成led模块 Download PDFInfo
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- CN102222665A CN102222665A CN2011101587014A CN201110158701A CN102222665A CN 102222665 A CN102222665 A CN 102222665A CN 2011101587014 A CN2011101587014 A CN 2011101587014A CN 201110158701 A CN201110158701 A CN 201110158701A CN 102222665 A CN102222665 A CN 102222665A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
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Priority Applications (1)
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CN2011101587014A CN102222665B (zh) | 2011-06-14 | 2011-06-14 | 带薄型复眼透镜的集成led模块 |
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CN2011101587014A CN102222665B (zh) | 2011-06-14 | 2011-06-14 | 带薄型复眼透镜的集成led模块 |
Publications (2)
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CN102222665A true CN102222665A (zh) | 2011-10-19 |
CN102222665B CN102222665B (zh) | 2013-01-23 |
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CN2011101587014A Active CN102222665B (zh) | 2011-06-14 | 2011-06-14 | 带薄型复眼透镜的集成led模块 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094268A (zh) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | 应用于商业照明的led模组及其制作方法 |
CN103872228A (zh) * | 2012-12-11 | 2014-06-18 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管组合 |
CN108550598A (zh) * | 2018-06-01 | 2018-09-18 | 京东方科技集团股份有限公司 | 电子成像装置及其制备方法、柔性电子复眼及其制备方法 |
CN112563382A (zh) * | 2019-09-25 | 2021-03-26 | 昆山科技大学 | 白光发光二极管结构及其制造方法 |
CN113232342A (zh) * | 2021-05-07 | 2021-08-10 | 广景视睿科技(深圳)有限公司 | 一种复眼镜片模组的制作方法 |
Citations (8)
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JP2006301363A (ja) * | 2005-04-21 | 2006-11-02 | Harison Toshiba Lighting Corp | 照明装置 |
JP2008016303A (ja) * | 2006-07-05 | 2008-01-24 | Toshiba Lighting & Technology Corp | 発光装置 |
CN101299447A (zh) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | 一种大功率led的封装工艺 |
US20090005218A1 (en) * | 2007-06-26 | 2009-01-01 | Gary Lowe | Systems and methods for non-linear proportional and derivative control during vehicle garage shifts |
CN101404317A (zh) * | 2008-11-12 | 2009-04-08 | 鹤山丽得电子实业有限公司 | 一种大功率白光led封装方法 |
CN201330972Y (zh) * | 2008-12-25 | 2009-10-21 | 复旦大学 | 一种采用复眼透镜的led隧道照明灯具 |
CN102034919A (zh) * | 2010-10-15 | 2011-04-27 | 陈林 | 高亮度大功率led及其制作方法 |
CN202150492U (zh) * | 2011-06-14 | 2012-02-22 | 符建 | 一种带薄型复眼透镜的集成led模块 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1860479A4 (en) * | 2005-03-18 | 2009-08-26 | Harison Toshiba Lighting Corp | LIGHTING SYSTEM |
-
2011
- 2011-06-14 CN CN2011101587014A patent/CN102222665B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006301363A (ja) * | 2005-04-21 | 2006-11-02 | Harison Toshiba Lighting Corp | 照明装置 |
JP2008016303A (ja) * | 2006-07-05 | 2008-01-24 | Toshiba Lighting & Technology Corp | 発光装置 |
US20090005218A1 (en) * | 2007-06-26 | 2009-01-01 | Gary Lowe | Systems and methods for non-linear proportional and derivative control during vehicle garage shifts |
CN101299447A (zh) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | 一种大功率led的封装工艺 |
CN101404317A (zh) * | 2008-11-12 | 2009-04-08 | 鹤山丽得电子实业有限公司 | 一种大功率白光led封装方法 |
CN201330972Y (zh) * | 2008-12-25 | 2009-10-21 | 复旦大学 | 一种采用复眼透镜的led隧道照明灯具 |
CN102034919A (zh) * | 2010-10-15 | 2011-04-27 | 陈林 | 高亮度大功率led及其制作方法 |
CN202150492U (zh) * | 2011-06-14 | 2012-02-22 | 符建 | 一种带薄型复眼透镜的集成led模块 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094268A (zh) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | 应用于商业照明的led模组及其制作方法 |
CN103872228A (zh) * | 2012-12-11 | 2014-06-18 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管组合 |
CN108550598A (zh) * | 2018-06-01 | 2018-09-18 | 京东方科技集团股份有限公司 | 电子成像装置及其制备方法、柔性电子复眼及其制备方法 |
CN108550598B (zh) * | 2018-06-01 | 2019-08-30 | 京东方科技集团股份有限公司 | 电子成像装置及其制备方法、柔性电子复眼及其制备方法 |
WO2019227961A1 (zh) * | 2018-06-01 | 2019-12-05 | 京东方科技集团股份有限公司 | 电子成像装置及其制备方法、柔性电子复眼及其制备方法 |
US11791364B2 (en) | 2018-06-01 | 2023-10-17 | Boe Technology Group Co., Ltd. | Electronic compound eye imaging device |
CN112563382A (zh) * | 2019-09-25 | 2021-03-26 | 昆山科技大学 | 白光发光二极管结构及其制造方法 |
CN113232342A (zh) * | 2021-05-07 | 2021-08-10 | 广景视睿科技(深圳)有限公司 | 一种复眼镜片模组的制作方法 |
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CN102222665B (zh) | 2013-01-23 |
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Inventor after: Fu Jian Inventor after: Zhang Hang Inventor after: Lu Zhe Inventor after: Gu Yingjie Inventor after: Zhang Yuefang Inventor before: Fu Jian Inventor before: Zhang Hang Inventor before: Lu Zhe Inventor before: Gu Yingjie |
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Free format text: CORRECT: INVENTOR; FROM: FU JIAN ZHANG HANG LU ZHE GU YINGJIE TO: FU JIAN ZHANG HANG LU ZHE GU YINGJIE ZHANG YUEFANG |
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Owner name: HANGZHOU GUANGZHUI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FU JIAN Effective date: 20130729 |
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Effective date of registration: 20130729 Address after: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee after: Hangzhou Guangzhui Technology Co., Ltd. Address before: Hangzhou City, Zhejiang Province, Xihu District Zijin building 24-701 310012 Patentee before: Fu Jian |
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Address after: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee after: Zhejiang guangcone Technology Co., Ltd Address before: 310012, room 6, building 262, 5-171 Wan Tang Road, Hangzhou, Zhejiang, Xihu District Patentee before: Hangzhou Guangzhui Technology Co., Ltd. |
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