JP4915052B2 - Led部品およびその製造方法 - Google Patents
Led部品およびその製造方法 Download PDFInfo
- Publication number
- JP4915052B2 JP4915052B2 JP2005105873A JP2005105873A JP4915052B2 JP 4915052 B2 JP4915052 B2 JP 4915052B2 JP 2005105873 A JP2005105873 A JP 2005105873A JP 2005105873 A JP2005105873 A JP 2005105873A JP 4915052 B2 JP4915052 B2 JP 4915052B2
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- radiating plate
- led chip
- led
- led component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Description
以下、本発明の実施の形態1におけるLED部品およびその製造方法について、図面を参照しながら説明する。
以下、本発明の実施の形態2におけるLED部品およびその製造方法について、図面を参照しながら説明する。
以下、本発明の実施の形態3におけるLED部品およびその製造方法について、図面を参照しながら説明する。
2 配線パターン
3 接着剤
4 LEDチップ
5 ワイヤ
6 透明樹脂
7 放熱板
7a、7b、7c 放熱板
8 反射膜
9 反射面
10 爪部
11 スルホール孔
12 貫通孔
13 配線パターン
14 配線パターン
34 放熱板
Claims (5)
- 第1、第2の放熱板と、この第1の放熱板の上に実装されたLEDチップと、このLEDチップと電気的に接合した配線基板とからなるLED部品であって、
前記配線基板は貫通孔を有し、
この貫通孔の内部に前記LEDチップを搭載した前記第1の放熱板を、前記第2の放熱板を介して前記配線基板に接合し、
前記LEDチップと前記配線基板はワイヤにより電気的に接続し、透明樹脂によって前記LEDチップと前記ワイヤを埋設し、
前記第1の放熱板は、アルミニウム、銅、銀からなる金属板もしくはアルミナやフォルステライト、ステアタイト、低温焼結セラミック、窒化アルミニウム、炭化ケイ素の基板からなり、
前記第2の放熱板は、金、銀、アルミニウム、銅、もしくは酸化アルミニウム、窒化アルミニウム、炭化ケイ素、酸化マグネシウムのいずれか一つ以上からなるフィラを含んだ樹脂ペーストの硬化物からなるLED部品。 - 前記第1の放熱板の厚みを前記配線基板の厚みより薄くし、前記第1の放熱板に搭載したLEDチップを、前記第1の放熱板と前記配線基板とで形成した凹部に配置した請求項1に記載のLED部品。
- 貫通孔の内周部をテーパ状にした請求項1に記載のLED部品。
- テーパ状にした貫通孔の内周部の表面に反射膜を設けた請求項3に記載のLED部品。
- 配線基板に配線パターンと貫通孔を作製する第一の工程と、前記配線基板の貫通孔の内部に熱伝導性フィラを含有した樹脂ペーストを充填する第二の工程と、前記貫通孔の内部に第1の放熱板を配置する第三の工程と、充填された前記樹脂ペーストを加熱硬化することにより第2の放熱板を形成し、前記配線基板と前記第1の放熱板を前記第2の放熱板を介して接合する第四の工程と、前記第1の放熱板の一面にダイボンド用接着剤を用いてLEDチップを接合する第五の工程と、前記LEDチップと配線基板とをワイヤにて接続する第六の工程と、前記LEDチップとワイヤを透明樹脂を用いて埋設する第七の工程を有したLED部品の製造方法であって、
前記第1の放熱板は、アルミニウム、銅、銀からなる金属板もしくはアルミナやフォルステライト、ステアタイト、低温焼結セラミック、窒化アルミニウム、炭化ケイ素の基板からなり、
前記第2の放熱板は、金、銀、アルミニウム、銅、もしくは酸化アルミニウム、窒化アルミニウム、炭化ケイ素、酸化マグネシウムのいずれか一つ以上からなるフィラを含んだ樹脂ペーストの硬化物からなるLED部品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005105873A JP4915052B2 (ja) | 2005-04-01 | 2005-04-01 | Led部品およびその製造方法 |
US11/579,770 US20070200133A1 (en) | 2005-04-01 | 2006-03-31 | Led assembly and manufacturing method |
CNB200680000435XA CN100479212C (zh) | 2005-04-01 | 2006-03-31 | Led部件及其制造方法 |
PCT/JP2006/306798 WO2006106901A1 (ja) | 2005-04-01 | 2006-03-31 | Led部品およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005105873A JP4915052B2 (ja) | 2005-04-01 | 2005-04-01 | Led部品およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006287020A JP2006287020A (ja) | 2006-10-19 |
JP4915052B2 true JP4915052B2 (ja) | 2012-04-11 |
Family
ID=37408573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005105873A Expired - Fee Related JP4915052B2 (ja) | 2005-04-01 | 2005-04-01 | Led部品およびその製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4915052B2 (ja) |
CN (1) | CN100479212C (ja) |
Families Citing this family (45)
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US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US8367945B2 (en) | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
JP4753904B2 (ja) | 2007-03-15 | 2011-08-24 | シャープ株式会社 | 発光装置 |
US7932806B2 (en) | 2007-03-30 | 2011-04-26 | Tdk Corporation | Varistor and light emitting device |
JP4888225B2 (ja) * | 2007-03-30 | 2012-02-29 | Tdk株式会社 | バリスタ及び発光装置 |
KR100830600B1 (ko) * | 2007-07-04 | 2008-05-22 | 홍삼표 | 갓 교환 가능 led 전구 |
JP2009049371A (ja) * | 2007-07-26 | 2009-03-05 | Sharp Corp | 窒化物系化合物半導体発光素子およびその製造方法 |
JP2009071013A (ja) * | 2007-09-13 | 2009-04-02 | Ngk Spark Plug Co Ltd | 発光素子実装用基板 |
CN100546058C (zh) | 2007-10-15 | 2009-09-30 | 佛山市国星光电股份有限公司 | 功率发光二极管封装结构 |
CN101216156A (zh) * | 2007-12-30 | 2008-07-09 | 佛山市国星光电股份有限公司 | 应用于通用照明的led面光源 |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
JP5163228B2 (ja) | 2008-03-28 | 2013-03-13 | Tdk株式会社 | バリスタ |
DE112008004058T5 (de) * | 2008-10-31 | 2013-02-28 | Denki Kagaku Kogyo K.K. | Substrat für Baugruppe mit lichtemittierendem Element und Baugruppe mit lichtemittierendem Element |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
US20120061716A1 (en) | 2009-04-10 | 2012-03-15 | Nationstar Optoelectronics Co., Ltd. | Manufacturing method for power led head-dissipating substrate and power led product and the products thereof |
US9219206B2 (en) | 2010-01-19 | 2015-12-22 | Lg Innotek Co., Ltd. | Package and manufacturing method of the same |
JP2011151112A (ja) * | 2010-01-20 | 2011-08-04 | Seiwa Electric Mfg Co Ltd | 発光装置及び発光装置の製造方法 |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
EP2597691B1 (en) | 2010-07-23 | 2015-09-09 | Kyocera Corporation | Light irradiation device, light irradiation module, and printing device |
CN102447035B (zh) * | 2010-10-06 | 2015-03-25 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光二极管、制造该发光二极管的模具及方法 |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
CN102644888A (zh) * | 2012-04-01 | 2012-08-22 | 深圳市华星光电技术有限公司 | 带静电防护功能的led灯及用该led灯的背光模组 |
KR101973395B1 (ko) * | 2012-08-09 | 2019-04-29 | 엘지이노텍 주식회사 | 발광 모듈 |
DE102012108107A1 (de) * | 2012-08-31 | 2014-03-27 | Epcos Ag | Leuchtdiodenvorrichtung |
DE102012113014A1 (de) * | 2012-12-21 | 2014-06-26 | Epcos Ag | Bauelementträger und Bauelementträgeranordnung |
KR20140096722A (ko) * | 2013-01-29 | 2014-08-06 | 엘지이노텍 주식회사 | 램프 유닛 |
USD735683S1 (en) | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
USD758976S1 (en) | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
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USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
WO2017036946A1 (en) * | 2015-09-03 | 2017-03-09 | Lumileds Holding B.V. | Method of making an led device |
TWI646706B (zh) * | 2015-09-21 | 2019-01-01 | 隆達電子股份有限公司 | 發光二極體晶片封裝體 |
JP2019114624A (ja) * | 2017-12-22 | 2019-07-11 | スタンレー電気株式会社 | 半導体発光装置及びその製造方法 |
JP7219401B2 (ja) * | 2018-12-19 | 2023-02-08 | 日亜化学工業株式会社 | 発光モジュール |
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JP3639428B2 (ja) * | 1998-03-17 | 2005-04-20 | 三洋電機株式会社 | 光源装置 |
JP2002368277A (ja) * | 2001-06-05 | 2002-12-20 | Rohm Co Ltd | チップ型半導体発光装置 |
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JP4085917B2 (ja) * | 2003-07-16 | 2008-05-14 | 松下電工株式会社 | 高熱伝導性発光素子用回路部品及び高放熱モジュール |
JP2005064047A (ja) * | 2003-08-13 | 2005-03-10 | Citizen Electronics Co Ltd | 発光ダイオード |
WO2005018008A1 (ja) * | 2003-08-19 | 2005-02-24 | Nichia Corporation | 半導体素子 |
-
2005
- 2005-04-01 JP JP2005105873A patent/JP4915052B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-31 CN CNB200680000435XA patent/CN100479212C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1977399A (zh) | 2007-06-06 |
JP2006287020A (ja) | 2006-10-19 |
CN100479212C (zh) | 2009-04-15 |
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