CN100479212C - Led部件及其制造方法 - Google Patents

Led部件及其制造方法 Download PDF

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Publication number
CN100479212C
CN100479212C CNB200680000435XA CN200680000435A CN100479212C CN 100479212 C CN100479212 C CN 100479212C CN B200680000435X A CNB200680000435X A CN B200680000435XA CN 200680000435 A CN200680000435 A CN 200680000435A CN 100479212 C CN100479212 C CN 100479212C
Authority
CN
China
Prior art keywords
led
heating panel
circuit board
led chip
led parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200680000435XA
Other languages
English (en)
Chinese (zh)
Other versions
CN1977399A (zh
Inventor
桥本晃
胜又雅昭
叶山雅昭
远藤宪一
远藤谦二
平野人司
胜村英则
井上龙也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1977399A publication Critical patent/CN1977399A/zh
Application granted granted Critical
Publication of CN100479212C publication Critical patent/CN100479212C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
CNB200680000435XA 2005-04-01 2006-03-31 Led部件及其制造方法 Expired - Fee Related CN100479212C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP105873/2005 2005-04-01
JP2005105873A JP4915052B2 (ja) 2005-04-01 2005-04-01 Ｌｅｄ部品およびその製造方法
JP165112/2005 2005-06-06

Publications (2)

Publication Number Publication Date
CN1977399A CN1977399A (zh) 2007-06-06
CN100479212C true CN100479212C (zh) 2009-04-15

Family

ID=37408573

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200680000435XA Expired - Fee Related CN100479212C (zh) 2005-04-01 2006-03-31 Led部件及其制造方法

Country Status (2)

Country Link
JP (1) JP4915052B2 (ja)
CN (1) CN100479212C (ja)

Cited By (3)

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CN103972219A (zh) * 2013-01-29 2014-08-06 Lg伊诺特有限公司 灯单元
CN104854965A (zh) * 2012-12-21 2015-08-19 埃普科斯股份有限公司 器件载体和器件载体装置
CN107023760A (zh) * 2012-08-09 2017-08-08 Lg伊诺特有限公司 发光器件

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US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP4753904B2 (ja) 2007-03-15 2011-08-24 シャープ株式会社 発光装置
JP4888225B2 (ja) * 2007-03-30 2012-02-29 Ｔｄｋ株式会社 バリスタ及び発光装置
US7932806B2 (en) 2007-03-30 2011-04-26 Tdk Corporation Varistor and light emitting device
KR100830600B1 (ko) * 2007-07-04 2008-05-22 홍삼표 갓 교환 가능 ｌｅｄ 전구
JP2009049371A (ja) * 2007-07-26 2009-03-05 Sharp Corp 窒化物系化合物半導体発光素子およびその製造方法
JP2009071013A (ja) * 2007-09-13 2009-04-02 Ngk Spark Plug Co Ltd 発光素子実装用基板
CN100546058C (zh) 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 功率发光二极管封装结构
CN101216156A (zh) * 2007-12-30 2008-07-09 佛山市国星光电股份有限公司 应用于通用照明的led面光源
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
JP5163228B2 (ja) 2008-03-28 2013-03-13 Ｔｄｋ株式会社 バリスタ
WO2010050067A1 (ja) * 2008-10-31 2010-05-06 電気化学工業株式会社 発光素子パッケージ用基板及び発光素子パッケージ
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
WO2010115296A1 (zh) 2009-04-10 2010-10-14 佛山市国星光电股份有限公司 功率led散热基板、功率led产品及其制造方法
CN102804430B (zh) * 2010-01-19 2015-11-25 Lg伊诺特有限公司 封装结构及其制造方法
JP2011151112A (ja) * 2010-01-20 2011-08-04 Seiwa Electric Mfg Co Ltd 発光装置及び発光装置の製造方法
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
JPWO2012011562A1 (ja) 2010-07-23 2013-09-09 京セラ株式会社 光照射デバイス、光照射モジュール、および印刷装置
CN102447035B (zh) * 2010-10-06 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 发光二极管、制造该发光二极管的模具及方法
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
CN102644888A (zh) * 2012-04-01 2012-08-22 深圳市华星光电技术有限公司 带静电防护功能的led灯及用该led灯的背光模组
DE102012108107A1 (de) * 2012-08-31 2014-03-27 Epcos Ag Leuchtdiodenvorrichtung
USD735683S1 (en) 2013-05-03 2015-08-04 Cree, Inc. LED package
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD777122S1 (en) 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
JP7033060B2 (ja) * 2015-09-03 2022-03-09 ルミレッズ ホールディング ベーフェー Ｌｅｄデバイスを製造する方法
TWI646706B (zh) * 2015-09-21 2019-01-01 隆達電子股份有限公司 發光二極體晶片封裝體
JP2019114624A (ja) * 2017-12-22 2019-07-11 スタンレー電気株式会社 半導体発光装置及びその製造方法
JP7219401B2 (ja) * 2018-12-19 2023-02-08 日亜化学工業株式会社 発光モジュール

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3639428B2 (ja) * 1998-03-17 2005-04-20 三洋電機株式会社 光源装置
JP2002368277A (ja) * 2001-06-05 2002-12-20 Rohm Co Ltd チップ型半導体発光装置
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP4085917B2 (ja) * 2003-07-16 2008-05-14 松下電工株式会社 高熱伝導性発光素子用回路部品及び高放熱モジュール
JP2005064047A (ja) * 2003-08-13 2005-03-10 Citizen Electronics Co Ltd 発光ダイオード
EP1667241B1 (en) * 2003-08-19 2016-12-07 Nichia Corporation Semiconductor light emitting diode and method of manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107023760A (zh) * 2012-08-09 2017-08-08 Lg伊诺特有限公司 发光器件
CN104854965A (zh) * 2012-12-21 2015-08-19 埃普科斯股份有限公司 器件载体和器件载体装置
US10021776B2 (en) 2012-12-21 2018-07-10 Epcos Ag Component carrier and component carrier arrangement
CN103972219A (zh) * 2013-01-29 2014-08-06 Lg伊诺特有限公司 灯单元
CN103972219B (zh) * 2013-01-29 2018-05-15 Lg伊诺特有限公司 灯单元

Also Published As

Publication number Publication date
CN1977399A (zh) 2007-06-06
JP4915052B2 (ja) 2012-04-11
JP2006287020A (ja) 2006-10-19

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