CN100479212C - LED component and method for manufacturing same - Google Patents

LED component and method for manufacturing same Download PDF

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Publication number
CN100479212C
CN100479212C CNB200680000435XA CN200680000435A CN100479212C CN 100479212 C CN100479212 C CN 100479212C CN B200680000435X A CNB200680000435X A CN B200680000435XA CN 200680000435 A CN200680000435 A CN 200680000435A CN 100479212 C CN100479212 C CN 100479212C
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China
Prior art keywords
led
led component
led chip
formed
surface
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CNB200680000435XA
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Chinese (zh)
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CN1977399A (en
Inventor
井上龙也
叶山雅昭
平野人司
桥本晃
胜又雅昭
胜村英则
远藤宪一
远藤谦二
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松下电器产业株式会社
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Priority to JP2005105873A priority Critical patent/JP4915052B2/en
Priority to JP105873/2005 priority
Priority to JP165112/2005 priority
Application filed by 松下电器产业株式会社 filed Critical 松下电器产业株式会社
Publication of CN1977399A publication Critical patent/CN1977399A/en
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Publication of CN100479212C publication Critical patent/CN100479212C/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

本发明涉及一种LED部件,包含:在中央部设置有贯通孔的布线基板,收纳在贯通孔内侧的散热板,安装在散热板上的LED芯片,电连接LED芯片与布线基板的连接部,以及覆盖LED芯片与连接部的透明树脂。 The present invention relates to an LED component, comprising: a central portion is provided with a through-hole wiring board accommodated in the inside of the heat dissipation plate through hole, mounted on the heat dissipation plate LED chip, the LED chip is electrically connected to the connection portion of the wiring board, and a transparent resin covering the LED chip and the connecting portion. 本发明可以使LED芯片发出的热有效地散发、且生产率优良。 The present invention enables the heat emitted from the LED chip radiated effectively, and excellent in productivity.

Description

LED部件及其制造方法 LED component and manufacturing method

技术领域 FIELD

本发明涉及散热性优良的表面安装型LED部件及其制造方法。 The present invention relates to an excellent heat dissipation member surface mounting type LED and a manufacturing method. 背景技术 Background technique

众所周知的是如下的现有的发光二极管等LED部件的结构:在各种基板上安装LED芯片,并利用引线接合法或凸点安装(bump-mounting),将所述LED芯片与形成在各种基板上的电极图案连接,在LED芯片的表面上形成兼作透镜的透明绝缘体(例如,日本专利公开公报2004—207369号中所记载)。 Structure is well known in the conventional light emitting diode LED component as follows: mounting an LED chip on a variety of substrates, and the use of bump mounting or wire bonding (bump-mounting), the LED chip and formed in a variety of connecting the electrode pattern on the substrate, forming a transparent insulator serving as a lens (for example, Japanese Patent Laid-Open Publication No. 2004-207369 described) on the surface of the LED chip.

图40表示现有的表面安装型LED部件的剖面图。 40 shows a cross-sectional view of a conventional surface mounting type LED member. 如图40所示, 现有的表面安装型LED部件包括:布线基板100,在两端形成有导体布线部200、 300; LED芯片500,使用粘合剂400搭载在一个导体布线部200上;引线600,主要由金等构成,利用引线接合法,来连接LED芯片500与导体布线部200、 300;以及保护层700,以覆盖所述引线600与LED芯片500的表面的方式形成。 40, the conventional surface mounting type LED element comprising: a wiring board 100, conductor wiring portion at both ends 200, 300 are formed; LED chips 500 using an adhesive 400 is mounted on a wiring conductor portion 200; lead 600, mainly composed of gold or the like, using wire bonding to connect the LED chip 500 and the wiring conductor portion 200, 300; and a protective layer 700, is formed so as to cover the surface of the lead 600 of the LED chip 500.

而且,布线基板100使用平坦的敷铜箔印刷基板。 Further, the wiring board 100 using a flat copper clad printed circuit board. LED芯片500 使用Ag膏作为粘合剂400,被芯片接合(die-bonding)在布线基板100 上。 500 LED chip 400 using Ag paste as an adhesive, the chip is bonded (die-bonding) on ​​a wiring substrate 100. 进而,在印刷基板等上进行表面安装时,布线基板100的两端的导体布线部200、 300被用作锡焊连接部。 Furthermore, for surface mounting, it is used as a wiring conductor soldered connection portion 100 at both ends of the wiring substrate 200, 300 on a printed circuit board.

但是,所述现有结构中,在使LED部件长时间连续发光时的散热性、或者为了用于照明而对LED芯片供给大电流时的散热性方面存在课题。 However, in the conventional structure, heat dissipation in the LED element emit light continuously for a long time, or for use in illumination there is a problem in terms of heat when a large current is supplied to the LED chip. 进而,从可靠性角度来说,在半导体部件的低电压驱动技术的进步中产生的静电破坏正在成为课题。 Further, from the reliability point of view, resulting in electrostatic breakdown voltage driving technology advances low in semiconductor components is becoming a problem.

发明内容 SUMMARY

本发明的LED部件包括:在中央部设置有贯通孔(opening)的布线基板,收容在贯通孔内侧的散热板,安装在散热板上的LED芯片,以及覆盖LED芯片和连接部的透明树脂,在所述散热板的安装所述LED 芯片的面上,形成有与所述布线基板连接的布线图案。 LED components according to the present invention comprises: a wiring substrate provided with a through hole (Opening) in the central portion, housed in the inside of the heat dissipation plate through hole, mounted on the heat dissipation plate LED chip and a transparent resin covering the LED chip and the connecting portion, mounting the LED chip on a surface of the heat dissipation plate is formed with a wiring pattern connected to the wiring board.

利用所述结构,本发明的LED部件可以使LED芯片发出的热有效地散发出去。 With the structure, LED component according to the present invention enables the heat emitted from the LED chip to effectively dissipated.

而且,本发明的LED部件在内置有变阻器元件的布线基板的中央部设置有贯通孔,并将搭载有LED芯片的散热板接合配置在所述贯通孔的内部,LED芯片与在布线基板内设的变阻器元件并联连接,且利用透明树脂埋设LED芯片。 Moreover, LED component according to the invention is provided with a through hole in a central portion of the wiring board with built varistor element, and the LED chip is mounted is disposed inside the heat dissipation plate engages the through hole, the LED chip and the wiring board in the site varistor elements connected in parallel, and the LED chip is embedded in a transparent resin.

利用所述结构,本发明的LED部件可以使LED芯片发出的热有效地散热,且可以实现抗静电特性优良的表面安装型LED部件与其制造方法。 With the structure, LED components present invention enables the heat emitted from the LED chip effectively dissipate heat, and excellent antistatic properties of the surface mounting type LED component manufacturing method thereof can be realized.

本发明的LED部件的制造方法,包含:第一步骤,在布线基板上形成布线图案与贯通孔;第二步骤,使用含有导热性填料的树脂膏填充所述布线基板的所述贯通孔的内部,以此形成散热板;第三步骤, 加热固化所述被填充的树脂膏,以此接合所述布线基板与所述散热板; 第四步骤,在所述散热板的一面上形成布线图案;第五步骤,将LED 芯片安装在所述散热板的形成有所述布线图案的一面上;以及第六步骤,使用透明树脂埋设所述LED芯片。 The method of manufacturing a LED component according to the invention, comprising: a first step, a wiring pattern and through holes are formed on the wiring substrate; a second step, the thermally conductive resin paste containing a filler filling the interior of the through-hole wiring substrate , thus forming a heat radiating plate; a third step of heating and curing the resin paste is filled, thus engaging the printed circuit board and the radiator plate; and a fourth step of forming a wiring pattern on one surface of the heat radiating plate; a fifth step of forming an LED chip mounted on the heat dissipation plate on which the wiring pattern on one side; and a sixth step of embedding the transparent resin the LED chips.

本发明的另一种LED部件的制造方法,包括:第一步骤,在布线基板上形成变阻器元件与贯通孔;第二步骤,在所述贯通孔的内部填充绝缘膏,所述绝缘膏以导热性填料为主要成分且以低熔点玻璃为无机粘结剂;第三步骤,通过烧制所述填充的绝缘膏形成散热板,且接合所述散热板与所述布线基板;第四步骤,在所述散热板的一面上形成具有用于安装LED芯片的电极焊盘的布线图案;第五步骤,将所述LED芯片凸点接合在所述电极焊盘上,以此并联连接所述LED芯片与所述变阻器元件;以及第六步骤,使用透明树脂埋设所述LED芯片。 Another method of manufacturing a LED component according to the invention, comprising: a first step of forming through holes in the varistor elements on the wiring substrate; a second step, inside the through hole filled with an insulating paste, the insulating paste is thermally filler as a main component and the low melting point glass in the inorganic binder; a third step of forming a radiating plate by firing the filled insulating paste, and the printed circuit board engaged with the heat dissipation plate; and a fourth step of having a wiring pattern formed on one surface of the electrode pad for mounting the LED chip to the heat sink; a fifth step of the LED chip is bump-bonded on the electrode pad, the LED chip connected in parallel in order to the varistor element; and a sixth step of embedding the transparent resin the LED chips.

附图说明 BRIEF DESCRIPTION

图1是本发明的第一实施方式中的LED部件的剖面图。 FIG. 1 is a sectional view of a first LED member embodiment of the present invention. 图2是用以说明本发明的第一实施方式中的其他示例的LED部件的剖面图。 FIG 2 is a sectional view for explaining another example of a first LED member embodiment of the present invention. 图3是用以说明本发明的第一实施方式中的LED部件的制造方法的剖面图。 FIG 3 is a sectional view for explaining a manufacturing method of a first embodiment of the present invention, the LED components.

图4是用以说明本发明的第一实施方式中的LED部件的制造方法的剖面图。 FIG 4 is a sectional view for explaining a manufacturing method of a first embodiment of the present invention, the LED components.

图5是用以说明本发明的第一实施方式中的LED部件的制造方法的剖面图。 FIG 5 is a sectional view for explaining a manufacturing method of a first embodiment of the present invention, the LED components.

图6是用以说明本发明的第一实施方式中的LED部件的制造方法的剖面图。 FIG 6 is a sectional view for explaining a manufacturing method of a first embodiment of the present invention, the LED components.

图7是用以说明本发明的第一实施方式中的LED部件的制造方法的剖面图。 FIG. 7 is a sectional view for explaining a manufacturing method of a first embodiment of the present invention, the LED components.

图8是本发明的第二实施方式中的LED部件的剖面图。 FIG 8 is a sectional view of a second LED member embodiment of the present invention. 图9是用以说明本发明的第二实施方式中的LED部件的其他示例的剖面图。 9 is a sectional view for explaining another example of the second embodiment of the present invention, the LED components.

图10是用以说明本发明的第三实施方式中的LED部件的制造方法的剖面图。 FIG 10 is a sectional view for explaining a manufacturing method of the third embodiment of the present invention, the LED components. 图11是用以说明本发明的第三实施方式中的LED部件的制造方法的剖面图。 FIG 11 is a sectional view for explaining a manufacturing method of the third embodiment of the present invention, the LED components.

图12是用以说明本发明的第三实施方式中的LED部件的制造方法的剖面图。 FIG 12 is a sectional view for explaining a manufacturing method of the third embodiment of the present invention, the LED components.

图13是用以说明本发明的第三实施方式中的LED部件的制造方法的剖面图。 FIG 13 is a sectional view for explaining a manufacturing method of the third embodiment of the present invention, the LED components.

图14是用以说明本发明的第三实施方式中的LED部件的其他示例的剖面图。 FIG 14 is a sectional view for explaining another example of the third embodiment of the present invention, the LED components.

图15是本发明的第四实施方式中的LED部件的剖面图。 FIG 15 is a sectional view of a fourth embodiment of the LED component in the embodiment of the present invention.

图16是本发明的第四实施方式中的其他示例的LED部件的剖面图。 FIG 16 is a sectional view of another example of a fourth embodiment of an LED component according to the present invention.

图17是用以说明本发明的第四实施方式中的LED部件的制造方法的剖面图。 FIG 17 is a sectional view for explaining a manufacturing method of a fourth embodiment of the present invention, the LED components.

图18是用以说明本发明的第四实施方式中的LED部件的制造方法的剖面图。 FIG 18 is a sectional view for explaining a manufacturing method of a fourth embodiment of the present invention, the LED components.

图19是用以说明本发明的第四实施方式中的LED部件的制造方法的剖面图。 FIG 19 is a sectional view for explaining a manufacturing method of a fourth embodiment of the present invention, the LED components.

图20是用以说明本发明的第四实施方式中的LED部件的制造方法的剖面图。 FIG 20 is a sectional view for explaining a manufacturing method of a fourth embodiment of the present invention, the LED components.

图21是用以说明本发明的第四实施方式中的LED部件的制造方法的剖面图。 FIG 21 is a sectional view for explaining a manufacturing method of a fourth embodiment of the present invention, the LED components.

图22是用以说明本发明的第四实施方式中的LED部件的制造方法的剖面图。 FIG 22 is a sectional view for explaining a manufacturing method of a fourth embodiment of the present invention, the LED components.

图23是本发明的第五实施方式中的LED部件的剖面图。 FIG 23 is a cross-sectional view of an LED component according to a fifth embodiment of the present invention.

图24是本发明的第五实施方式中的其他示例的LED部件的剖面图。 FIG 24 is a sectional view of another exemplary embodiment of an LED component according to a fifth embodiment of the present invention.

图25是本发明的第六实施方式中的LED部件的剖面图。 FIG 25 is a cross-sectional view of an LED component according to a sixth embodiment of the present invention.

图26是本发明的第六实施方式中的其他示例的LED部件的剖面图。 FIG 26 is a sectional view of another example of a LED component according to a sixth embodiment of the present invention.

图27是用以说明本发明的第六实施方式中的LED部件的制造方法的剖面图。 FIG 27 is a sectional view for explaining a manufacturing method of a sixth embodiment of the present invention in an LED element. 图28是用以说明本发明的第六实施方式中的LED部件的制造方 FIG 28 is illustrative of producing a sixth embodiment of the present invention in an LED member

法的剖面图。 Method sectional view of FIG.

图29是用以说明本发明的第六实施方式中的LED部件的制造方法的剖面图。 FIG 29 is a sectional view for explaining a manufacturing method of a sixth embodiment of the present invention in an LED element.

图30是用以说明本发明的第六实施方式中的LED部件的制造方法的剖面图。 FIG 30 is a sectional view for explaining a manufacturing method of a sixth embodiment of the present invention in an LED element.

图31是用以说明本发明的第六实施方式中的LED部件的制造方法的剖面图。 FIG 31 is a sectional view for explaining a manufacturing method of a sixth embodiment of the present invention in an LED element.

图32是用以说明本发明的第六实施方式中的LED部件的制造方法的剖面图。 FIG 32 is a sectional view for explaining a manufacturing method of a sixth embodiment of the present invention in an LED element.

图33是本发明的第七实施方式中的LED部件的剖面图。 FIG 33 is a cross-sectional view of an LED component according to a seventh embodiment of the present invention. 图34是用以说明本发明的第七实施方式中的LED部件的制造方法的剖面图。 FIG 34 is a sectional view for explaining a manufacturing method of a seventh embodiment of the present invention, the LED components.

图35是用以说明本发明的第七实施方式中的LED部件的制造方法的剖面图。 FIG 35 is a sectional view for explaining a manufacturing method of a seventh embodiment of the present invention, the LED components.

图36是用以说明本发明的第七实施方式中的LED部件的制造方法的剖面图。 FIG 36 is a sectional view for explaining a manufacturing method of a seventh embodiment of the present invention, the LED components.

图37是用以说明本发明的第七实施方式中的LED部件的制造方法的剖面图。 FIG 37 is a sectional view for explaining a manufacturing method of a seventh embodiment of the present invention, the LED components.

图38是用以说明本发明的第七实施方式中的LED部件的制造方法的剖面图。 FIG 38 is a sectional view for explaining a manufacturing method of a seventh embodiment of the present invention, the LED components.

图39是本发明的第七实施方式中的其他示例的LED部件的剖面图。 FIG 39 is a sectional view of another exemplary embodiment of an LED component according to a seventh embodiment of the present invention.

图40是现有的LED部件的剖面图。 FIG 40 is a sectional view of a conventional LED component.

附图标记的说明 DESCRIPTION OF REFERENCE NUMERALS

1 布线基板 A printed circuit board

2 布线图案 Wiring patterns 2

3 粘合剂 3 adhesive

4 LED芯片 4 LED chip

5 引线6 透明树脂 5 lead transparent resin 6

7 散热板 Heat radiating plate 7

7a、 7b、 7c、 7d 散热板 7a, 7b, 7c, 7d heat dissipation plate

8 反射膜' Reflective film 8 '

9 反射面 9 reflective surface

10 爪部 The claw portion 10

11 通孔 11 through holes

12 贯通孔 12 through hole

13 布线图案 Wiring patterns 13

14 布线图案 Wiring patterns 14

15 空穴部34 散热板 Radiator plate 15 hole 34

101 布线基板 101 wiring substrate

102 布线图案 A wiring pattern 102

103 布线图案 A wiring pattern 103

104 粘合剂 Adhesive 104

105 LED芯片 105 LED chip

105a 倒装型LED芯片 Flip chip type LED 105a

106 引线 106 lead

107 透明树脂108、 108a、 108b、 108c 散热板108d、 108e、 108f 散热板 107 transparent resin 108, 108a, 108b, 108c radiator plate 108d, 108e, 108f heat dissipation plate

109 反射面 The reflecting surface 109

110 反射膜 Reflection film 110

111 爪部 The claw portion 111

112 贯通孔 112 through hole

122 树脂膏 122 resin paste

123 绝缘膏 Insulating paste 123

131 变阻材料(varistor material) 131 varistor material (varistor material)

132 变阻电极(varistor electrode) 132 varistor electrodes (varistor electrode)

133 变阻电极134 变阻电极 133 varistor electrode varistor electrode 134

135 变阻器元件(varistor element) 135 varistor element (varistor element)

136 凸点 136 bump

具体实施方式 Detailed ways

(第一实施方式) (First Embodiment)

以下,参照附图说明本发明的第一实施方式中的LED部件及其制造方法。 The following describes the LED component and the manufacturing method of the first embodiment of the present invention are shown.

图1是用以说明本发明的第一实施方式中的表面安装型LED部件的结构的剖面图,图2是其他示例的LED部件的剖面图。 FIG. 1 is a sectional view for explaining a configuration of a first embodiment of the present invention, in the surface mounting type LED element, FIG. 2 is a sectional view of another example of the LED component.

图1中,优选布线基板1使用玻璃纤维环氧树脂等树脂基板或氧化铝基板等陶瓷基板。 In FIG 1, the wiring substrate 1 preferably using a glass epoxy resin substrate or a ceramic substrate is an alumina substrate. 在所述布线基板1上形成发挥作为布线与表面安装部件的端电极的作用的布线图案2。 End of the wiring pattern functioning as an electrode mounting surface and a wiring member 2 is formed on the wiring board 1. 优选所述布线图案2中使用铜或银等电极材料。 Preferably, the wiring pattern 2 using an electrode material such as copper or silver.

并且,为如下结构:在所述布线基板1的中央部设置贯通孔12, 在所述贯通孔12的内部配置比布线基板1的导热性更优良的散热板7。 Further, the structure is as follows: the central portion of the wiring board in a through hole 12 is provided, arranged more excellent thermal conductivity than the substrate 1 is a wiring inside the heat radiating plate 7 of the through hole 12. 进而,利用芯片接合,使用具有导电性的粘合剂3,将LED芯片4接合在所述散热板7的一面上。 Further, by die bonding using an adhesive having conductivity 3, 4 bonded to one face of the heat radiating plate 7 of the LED chip. 进而,使用金等的引线5,利用引线接合法电连接设置在布线图案2的一部分上的焊盘与LED芯片4。 Further, the gold wire 5 and the like, are electrically connected by wire bonding is provided on a part of the wiring pattern 2 and the LED chip pad 4.

所述结构中,重要的是使散热板7的热导率比布线基板1的热导率更高。 In the structure, it is important that the thermal conductivity of the heat radiating plate 7 is higher than the thermal conductivity of the wiring board 1. 从生产能力的角度来说,布线基板1优选使用玻璃纤维环氧树脂等树脂基板。 From the point of view of production capacity, the wiring substrate 1 is preferably a glass epoxy resin substrate used. 作为其他布线基板l,也可以使用聚酰亚胺基板、玻璃基板、SOI基板或搪瓷基板等。 As another printed circuit board L, may be used polyimide substrate, a glass substrate, the SOI substrate or enamel substrate. 其中,所谓SOI基板,是利用氧化膜对表面进行绝缘处理后的硅基板。 Wherein, the so-called SOI substrate, a silicon substrate is carried out after the surface treatment with the insulating oxide film. 而且,对于要求更高亮度与耐热可靠性的LED部件,优选使用将氧化铝等作为主要成分的陶瓷基板。 Moreover, the requirements for heat resistance reliability and higher brightness LED components, alumina or the like is preferably used as a main component of the ceramic substrate.

而且,优选散热板7使用导热性优良的金属材料。 Further, the heat radiating plate 7 is preferably used a metal material excellent in heat conductivity. 尤其,作为导热性优良的金属材料,优选热导率为240 W/nvK的铝、热导率为400 W/mK的铜、热导率为430 W/mK的银或热导率为340 W/nrK的金等。 In particular, as the metal material excellent in thermal conductivity, preferably a thermal conductivity of 240 W / nvK aluminum, thermal conductivity of 400 W / mK copper, thermal conductivity of 430 W / mK or a thermal conductivity of silver is 340 W / nrK of gold. 可以使用所述导热性优良的金属板作为散热板7,并且可以使用生产率高的玻璃纤维环氧树脂基板,聚酰胺、聚酰亚胺等的树脂基板,或耐热性优良的陶瓷基板等作为布线基板1。 The excellent thermal conductivity may be used a metal plate as a heat radiating plate 7, and a glass-epoxy substrate, a polyamide, a polyimide resin substrate or the like with high productivity, excellent in heat resistance or the like as a ceramic substrate the wiring board 1. 进而,通过使用耐热性与绝缘性优良的氧化铝或镁橄榄石、滑石、 低温烧结陶瓷基板等陶瓷基板作为散热板7,也可以实现耐热性与绝缘性更加优良的LED部件。 Further, the heat resistance and excellent insulating alumina ceramic substrate or magnesium olivine, talc, low-temperature sintered ceramic substrate as a heat dissipating plate 7, may be achieved with more excellent heat resistance, LED member and insulating. 而且,对于要求更高散热性与耐热性的用途, 也可以使用导热性更加优良的氮化铝、碳化硅等陶瓷材料。 Furthermore, for more demanding heat resistance and heat dissipation purposes, it may also be used more excellent thermal conductivity of aluminum nitride, silicon carbide ceramic material.

而且,利用如图l所示的结构,在安装LED部件的电路基板上配置形成散热用铜板,且使用导热性优良的粘合剂将散热板7固定在所述铜板上,从而可将从散热板7散出的热直接散发至形成在电路基板上的铜板上。 Further, with the structure shown in FIG. L, the heat dissipating copper plate arranged on the circuit board mounting the LED element, and a thermal conductivity excellent in the heat radiating plate 7 is fixed to the adhesive on the copper plate, thereby cooling from dissipated heat plate 7 is formed directly on a copper plate to distribute on the circuit board.

进而,也可以使用金属材料作为散热板7,这样,在将LED部件安装在电路基板等上时,其经由散热板7接地连接于电路基板,或者利用导热性优良的粘合剂或焊料固定散热板7与电路基板,以此提高安装强度。 Further, a metal material may be used as the heat radiating plate 7, so that, when the LED component is mounted on a circuit board, which is connected to the circuit board via the heat radiating plate 7 is grounded, or a thermally conductive adhesive or solder having excellent heat fixing plate 7 and the circuit board, in order to improve the mounting strength.

而且,当LED芯片4与散热板7之间必须为绝缘时,优选在金属构成的散热板7的安装有LED芯片4的一面上形成薄的绝缘膜。 Further, when the LED chip 4 and the heat radiating plate 7 must be insulated, is preferably mounted in a metal radiator plate 7 has an LED chip 4 formed on one side of a thin insulating film. 其中, 因为绝缘膜阻碍散热,所以绝缘膜的厚度优选为尽可能的薄。 Wherein, since the insulating film prevents heat dissipation, the thickness of the insulating film is preferably as thin as possible.

此外,也可以将氮化铝或碳化硅等具有更高导热性的陶瓷材料用于散热板7,所述氮化铝或碳化硅等为提高LED芯片4的散热所必要的最小量。 Moreover, aluminum nitride may be silicon carbide having a thermal conductivity higher minimum amount of ceramic material for the heat radiating plate 7, the aluminum nitride or silicon carbide, etc. In order to improve the heat dissipation LED chip 4 necessary.

其次,布线图案2可通过以下方式形成,S卩,通过光刻或者电镀附着在玻璃纤维环氧树脂(glass-epoxy)基板上的铜箔或形成在氧化铝基板的表面上的铜电极,或者是通过印刷导电膏的方法。 Next, the wiring pattern 2 may be formed by, S Jie, by photolithography or plating adhered glass epoxy (glass-epoxy) on a substrate or a copper foil is formed on the copper electrode surface of the alumina substrate, or is a method by printing conductive paste. 至于所述导电膏,可以使用包含银或铜的树脂系导电膏。 As the conductive paste, silver may be used comprise resin-based conductive paste or copper. 而且,也可以使用包含纳米金属粉体或有机金属的导电性良好的导电膏。 Further, it may also be used a conductive metal nano metal powder or a highly conductive organic paste.

而且,使用氧化铝基板等陶瓷材料作为布线基板1时,可以使用在500。 Further, an alumina substrate using a ceramic material or the like as the wiring substrate 1, 500 can be used. C以上、140(TC以下烧制的高温烧制用导电膏。所述用于高温烧制的导电膏优选使用银、金、铂、钯(Pd)以及所述各金属的合金等贵金属材料,或者使用铜、镍、钨、钼以及所述各金属的合金等贱金属材料。 More C, 140 (TC fired high temperature firing the conductive paste. The noble metal material for high-temperature firing is preferred to use a conductive paste of silver, gold, platinum, palladium (Pd) and an alloy of the respective metal or the like, or a base metal material such as copper, nickel, tungsten, molybdenum, and alloys of the like of each metal.

而且,利用锡焊材料将LED部件接合在电路基板上时,在布线图案2的锡焊接合部积层镀镍膜或镀锡膜等,以防止由于电极材料的相互扩散带来的布线图案2的材料变化。 Further, when the engaging member on the LED circuit board by soldering material, the soldering joint laminating the wiring pattern 2 of the nickel plating film or a tin film, in order to prevent the wiring pattern due to mutual diffusion of the electrode material brought 2 material changes. LED芯片4以及引线5的绝缘保护并作为透镜而发挥作用的透明树脂6,优选使用热固型丙烯酸类树脂或环氧树脂等。 LED chips 4 and the insulating and protective transparent resin functioning as a lens 5 of the lead 6 is preferably a thermosetting type acrylic resin or epoxy resin and the like. 透明树脂6覆盖整个LED芯片4,且覆盖构成LED芯片4与布线基板1的连接部的引线5以及焊盘。 A transparent resin 6 covers the entire LED chip 4 and covers the LED chip are connected to lead portion 4 and the wiring board 1 and the pad 5.

其次,说明图2所示的其他示例的LED部件的结构。 Next, another example of the configuration of the LED component shown in FIG.

图2所示的LED部件的结构中,与图1所示的LED部件的结构的明显不同之处是,使散热板7比布线基板1的厚度更薄,以此使LED 芯片4的搭载面比布线基板1的平面更低,形成将散热板7的一面作为底面、利用布线基板l的贯通孔12的内部壁面的空穴结构。 LED structural member shown in FIG. 2, the LED significantly different from the components shown in FIG 1 is a configuration, the thickness of the heat radiating plate 7 is thinner than the wiring board 1, thereby enabling the LED chip mounting surface 4 a plane lower than that of the wiring substrate 1, a hole is formed on one side as a heat dissipation plate structure 7 of the bottom surface, with an internal wall surface of the through-hole of the wiring board 12 l. 进而, 在形成所述空穴结构的贯通孔12的内周部设置锥面80,将所述锥面80的倾斜面用作LED芯片4发光时的反射板。 Further, a through hole is formed in the configuration of the hole portion 12 of the inner periphery of the tapered surface 80, the inclined surface of the tapered surface 80 of the LED chip as the light emitting time of the reflection plate 4.

利用所述结构,可以实现比起图1所示的LED部件,发光效率更优良的LED部件。 With the structure, it can be achieved compared to the LED component shown in FIG. 1, more excellent emission efficiency LED components. 优选将设置在所述贯通孔12的内周部的锥面的形状加工为有效地反射光的形状。 The edging is preferably provided on the tapered inner peripheral portion of the through hole 12 in the shape of the reflected light efficiently. 即,将所述锥面80的形状加工为圆锥状、曲线状,以此可以实现反射率优良的LED部件。 That is, the tapered shape of the workpiece 80 in a conical shape, a curved shape, in order to realize excellent reflectivity can be LED components.

进而,在设置有所述锥面80的贯通孔12的内周部表面上,设置使用反射性优良的金属材料形成薄膜的反射膜8。 Further, there is provided a tapered surface on the inner circumferential surface 12 of the through hole 80 is provided a reflection film 8 using a reflective film of a metallic material having excellent. 通过设置所述反射膜8可以实现发光效率更加优良的LED部件,所述反射膜8可以通过形成金属薄膜而形成。 By providing the reflective film 8 can achieve more excellent light emission efficiency of the LED component, the reflective film 8 may be formed by forming a metal thin film.

此外,在安装有LED芯片4的散热板7的表面上也可形成所述反射膜8,以此可以实现反射性更优良的LED部件。 Further, the LED chip is mounted on the surface 4 of the radiator plate 7 may also form the reflective film 8, in order to be more excellent reflectivity LED member.

其次,使用图3〜图7说明本发明的LED部件的制造方法。 Next, using FIG 3 ~ FIG. 7 illustrates a method for manufacturing an LED component according to the invention. 本第一实施方式中,说明由金属材料制成散热板7、由氧化铝基板作为布线板1构成的LED部件的制造方法。 A first embodiment according to the present embodiment, a description is made of a metallic material, the heat radiating plate 7, a method for producing an alumina substrate is used as the wiring board 1 LED component configuration.

首先,作为第一步骤,如图3所示,制作预先进行开孔处理得到通孔11和贯通孔12的氧化铝基板作为布线基板1 (以下,称为氧化铝基板l),其中,通孔ll用作分割槽,将LED部件分割为单个,并用作单个的LED部件的端电极,贯通孔12用于插入散热板7。 First, as a first step, shown in Figure 3, the opening process prepared in advance to obtain the through hole 11 and through-holes 12 of the alumina substrate as the wiring substrate 1 (hereinafter referred to as alumina substrate L), wherein a through hole ll terminal electrode is used as dividing grooves, the member is divided into individual LED, and an LED as a single member, the through-hole 12 for inserting the heat radiating plate 7.

其次,如图4所示,利用丝网印刷法,使用银膏在氧化铝基板1 的两面与通孔11的内壁形成布线图案13、 14。 Next, as shown by a screen printing method using silver paste forming the wiring patterns 13, 144 and the inner wall of the through hole 11 on both sides of the alumina substrate 1.

其次,作为第二步骤,如图5所示,将导热性优良的铝、铜等金属材料加工为具有规定形状的散热板7后,作为第三步骤,将所述散热板7压入到贯通孔12的内部或者利用粘合剂接合而固定。 Next, as a second step, shown in Figure 5, the excellent thermal conductivity of aluminum, copper and other metal material after processing having 7, as a third step, the predetermined shape of the heat dissipation plate heat radiating plate 7 is pressed into the through inner bore 12 with an adhesive bonding or fixing. 此时,为了抑制由粘合剂而引起的导热性降低,优选使用散热性良好的导热孔或芯片接合用导电性粘合剂等作为粘合剂。 In this case, in order to suppress the reduction in thermal conductivity caused by the adhesive, it is preferable to use a good thermal heat dissipation aperture or die bonding with a conductive adhesive as the binder.

其次,作为第四步骤,如图6所示,使用粘合剂3,使LED芯片4固定在散热板7的一面。 Next, as a fourth step, shown in FIG. 6, using an adhesive 3, the LED chip 4 is fixed to one surface of the heat radiating plate 7.

之后,作为第五步骤,使用引线接合装置,通过引线接合,利用金的引线5电连接LED芯片4与设置在布线基板1的布线图案13上的电极焊盘部。 Thereafter, as a fifth step, using the wire bonding apparatus, by wire bonding, the LED chips 4 are connected with the electrode pad portions disposed on a wiring pattern of a wiring board 13 in electrically by wire 5 gold.

其次,作为第六步骤,涂敷透过性优良的丙烯酸树脂或环氧树脂等透明树脂6,所述透明树脂6发挥绝缘保护的作用以及使LED芯片4发出的光会聚的透镜的作用。 Next, as a sixth step, the coating excellent in resistance and the like through an acrylic resin or an epoxy transparent resin 6, the transparent resin 6 and the insulating protective role acting lens 4 focuses light emitted from the LED chip. 此时,通过选择适当的粘度或涂布法以使透明树脂6的形状成为规定的透镜形状。 In this case, by selecting an appropriate viscosity or a coating method such that the shape of the transparent resin 6 becomes a predetermined lens shape. 而且,所述透明树脂6也具有加强布线基板1与散热板7的接合的作用。 Further, the transparent resin 6 also has the role of strengthening the engagement of the wiring substrate 1 and the heat radiating plate 7.

其次,如图7所示,可以在通孔ll的部分将氧化铝基板l切割或划分为一半,以此来制造经单个化而独立的表面安装用LED部件。 Next, as shown in FIG. 7, the alumina substrate l ll cut portion or the through hole is divided into half, in order to manufacture the independent singulated LED mounting surface member.

如以上所说明,在搭载如本第一实施方式的LED芯片4的布线基板1的一部分上形成的贯通孔12的内部,配置导热性优良的散热板7, 可以实现散热性优良且生产率优良的表面安装型LED部件及其制造方法。 As described above, in the interior of the through-hole 12 as mounted on a portion of the wiring substrate 1 of the first embodiment according to the present embodiment is formed of an LED chip 4, excellent thermal conductivity arranged radiator plate 7, can realize excellent productivity and excellent heat dissipation LED and method for manufacturing a surface mounted component type.

(第二实施方式) (Second Embodiment)

以下,参照附图说明本发明的第二实施方式中的LED部件及其制造方法。 The following describes the LED component and the manufacturing method of the second embodiment of the present invention are shown.

图8是用以说明本发明的第二实施方式中的表面安装型LED部件的结构的剖面图,图9是用以说明其他示例的剖面图。 FIG 8 is a sectional view for explaining a configuration of a second embodiment of the present invention, in the surface mounting type LED element, FIG. 9 is a cross-sectional view for explaining another example of FIG.

图8、图9中,本第二实施方式中的LED部件的结构与第一实施方式的明显不同之处是散热板7a、 7b的形状。 8, 9, clearly different from the structure of the first embodiment and the second embodiment of the present embodiment, an LED is that the heat dissipation member plates 7a, 7b of. 第二实施方式的散热板7a、 7b的明显特征是设置凹部而形成空穴结构。 The second embodiment the radiator plate 7a, 7b is a distinctive feature of the structure to form a hole recessed portion.

图8以及图9所示的散热板7a、 7b利用对铝、铜或银等导热性优良的金属进行机械加工来形成空穴结构。 And a heat dissipation plate 8 shown in FIG. 9 7a, 7b use of a metal excellent in thermal conductivity such as aluminum, copper or silver to form a hole machining structure. 构成为设置有能够在所述空穴结构的底面安装LED芯片4的空间。 Configuration capable of mounting space of the LED chip 4 is disposed in a bottom surface of the hole structure. 而且,在形成所述散热板7a、 7b的空穴结构的凹部的内周部,利用模具成型或抛光等设置有锥面,以此形成反射面9。 Further, in forming the heat radiating plate 7a, the inner circumferential portion of the recessed portion 7b of the cavity structure, molding or the like using a polishing is provided with a tapered surface, thereby forming the reflective surface 9. 通过使所述反射面9的锥面保持规定倾斜角度,从而可以使搭载在散热板7a、 7b的空穴结构的底面的LED芯片4的放射光高效地会聚,或者可以提高发光效率,从而可以控制LED部件的发光状态。 By the tapered surface 9 of the reflective surface to maintain a predetermined inclination angle, it can be mounted in that the heat radiating plate 7a, 7b of the bottom surface of the hole structures of the LED chips 4 radiated efficiently converging light, or light emission efficiency can be increased, thereby controlling the light emitting state of the LED component.

此外,可以将设置有所述凹部的内周部的锥面的反射面9表面镜面化,以此使光的反射更好。 Further, the surface of the reflective surface 9 is provided in the tapered portion has an inner peripheral portion of the concave mirror of the order of the reflected light better.

而且,为了在所述反射面9使LED芯片4的光更有效地反射,利用表面电镀或蒸镀等薄膜技术,将反射率更高的材料形成为反射膜9a, 以此能够实现反射特性进一步提高的LED部件。 Further, the reflecting surface 9 to the LED chip 4 light reflection more effectively by surface plating or other film deposition techniques, the higher reflectance of the reflective film is formed of a material 9a, reflection characteristics can be realized in order to further LED components improve. 因此,在散热板7a、 7b中使用导热性优良的金属材料,且在所述散热板7a、 7b上形成的凹部的内周部形成反射性优良的反射膜,以此能够实现生产率与发光效率优良的LED部件。 Thus, the heat radiating plate 7a, 7b using a metal material excellent in heat conductivity, and 7a, the inner circumferential portion of the recessed portion 7b is formed is formed on the reflective film excellent in reflection of the heat dissipation plate, thereby the productivity can be realized and emission efficiency excellent LED component.

其次,如图9所示,利用模具成型、使用金属板形成散热板7b的同时,能够利用模具成型形成爪部10,通过设置所述爪部IO,可以在向布线基板1的贯通孔12插入散热板7时,将插入深度调整并保持为一定的深度。 Next, as shown in FIG. 9, by using a mold, the heat radiating plate is formed using a metal plate 7b, while the pawl portion can be molded by the mold 10 is formed by providing the claw portion the IO, the wiring may be inserted into the through hole 12 in the substrate 1 heat radiating plate 7, to adjust the insertion depth and to maintain a constant depth.

此外,所述爪部IO也可以具有如沿部一样连续的突起。 Further, the claw portion IO portion may have the same direction as the continuous protrusions. 如上所述,本第二实施方式中,搭载LED芯片4的散热板7a、 7b As described above, the second embodiment according to the present embodiment, the LED chip mounted on heat dissipation plate 4 7a, 7b

使用金属材料等并机械加工,以此可以容易地在散热板7上形成空穴 Using a metal material or the like and mechanical processing, thus the heat dissipation plate can be easily formed in the hole 7

结构,并且可以同时形成反射面9。 Structure, the reflecting surface 9 and may be formed simultaneously. 利用所述结构,可以实现LED部 With the structure, can be realized LED unit

件小型化,同时实现生产率高的LED部件。 Miniaturized, while achieving high productivity of the LED component.

此外,也可以将导热性优良的陶瓷材料成型并形成为散热板7a、 In addition, excellent thermal conductivity may be formed of a ceramic material and is formed as a heat radiating plate 7a,

7b的形状,此时,除上述作用外,也可以实现耐热性更加优良的LED部件。 7b shape, at this time, in addition to the above-described effect may be achieved with more excellent heat resistance and LED components.

(第三实施方式) (Third Embodiment)

以下,参照附图说明本发明的第三实施方式中的LED部件及其制造方法。 The following describes the LED component and the manufacturing method of the third embodiment of the present invention with reference to the embodiment.

图10〜图13是用以说明本发明的第三实施方式中的LED部件的制造方法的剖面图,图14是本第三实施方式中的LED部件的其他示例的剖面图。 FIG. 10~ 13 is a sectional view for explaining a manufacturing method of the third embodiment of the present invention, the LED components, and FIG. 14 is a sectional view showing another example of the third embodiment of the LED component. 本发明的第三实施方式中的表面安装型LED部件的基本结构具有 The third embodiment of the present invention, the basic structure of the surface mounting type LED member having

图8所示的结构,本第三实施方式中的LED部件与第二实施方式的LED部件的明显不同之处是散热板7a的材质。 Significantly different from the structure shown in FIG. 8, a third embodiment according to the present embodiment of the LED component and the second LED member embodiment is a material of the heat radiating plate 7a. 本第三实施方式中的LED部件中,代替图8的散热板7a使用散热板7c。 The third embodiment according to the present embodiment of the LED component in place of the heat radiating plate 8 using the heat dissipation plate 7a 7c. 所述散热板7c由含有导热性优良的金属填料(导热填料)的树脂而构成。 7c and the heat radiating plate made of a resin containing a metal filler having excellent thermal conductivity (heat conductive filler). 以下说明用于所述散热板7c的金属填料。 The following description for the metal fillers in the heat dissipation plate 7c. 首先,将铜、铝、金、银等的粉末与环氧树脂等混炼,以此制作树脂膏。 First, copper, aluminum, gold and silver powder with an epoxy resin kneaded, thereby manufacturing a resin paste. 将所制作的树脂膏填充在形成于布线基板1上的贯通孔12的内部后,使之热固化。 The prepared resin paste filled in the through hole formed inside the wiring substrate 112, so that thermal curing. 因为通过使之热固化, 可以使散热板7c的形成及其与布线基板1的接合同时进行,所以可以实现生产率优良的LED部件。 Because cured by heat so that it can make the heat dissipation plate 7c is formed and a wiring substrate joined simultaneously, it is possible to realize excellent productivity LED components.

进而,代替所述金属填料而使用无机填料时,除上述作用以外, 可以进一步获得绝缘性也优良的LED部件。 Further, instead of the metal filler when using an inorganic filler, in addition to the above effects can be further obtained LED is excellent insulating member. 通过使用氧化铝、氮化铝、 碳化硅、氧化镁等作为无机填料,可以实现散热性与生产率优良的LED 部件。 By using alumina, aluminum nitride, silicon carbide, magnesium oxide, etc. Examples of the inorganic filler, can achieve excellent productivity and heat dissipation LED component.

艮P,散热板7c是在将导热性良好的金属粉末或陶瓷粉末作为导热用填料而添加的树脂膏填充在布线基板1的贯通孔12的内部后,加热固化而制作的。 Gen P, the radiator plate 7c is a good thermal conductive resin paste of metal powder or a ceramic powder as the thermally conductive filler is added after the interior is filled in the through holes 12 of the wiring substrate 1, made of heat curing. 同时,在所述步骤中,利用模具成型或机械加工在散热板7c上形成凹部,从而加工为设置有空穴结构的构造。 Meanwhile, in the step, by using a mold or machining a recess portion is formed on the heat dissipation plate 7C, it has a structure such that a hole is provided for the processing structure.

关于除此以外的内容,因为具有与第二实施方式大致相同的结构所以省略说明。 Other than about the content, since the second embodiment has substantially the same configuration is omitted.

利用所述结构,可以在树脂膏的加热固化的同时,进行布线基板l 与散热板7c的接合,并且通过改变树脂膏的材料组成来控制布线基板1与散热板7c的膨胀系数。 With the structure, heating the resin paste may be cured at the same time, joining the wiring board and the radiator plate 7c, l, and controls the expansion coefficient of the wiring board 1 and the heat radiating plate 7c by changing the material of the resin paste.

其次,使用图10〜图14说明本第三实施方式中的LED部件的制 Next, using FIG. 10~ 14 illustrates a third embodiment of the present embodiment manufactured by the LED component

造方法。 Manufacturing methods.

首先,作为第一步骤,如图10所示,形成布线图案13、 14,并且制作进行开孔处理形成有通孔11和贯通孔12的氧化铝基板作为布线基板l。 First, as a first step, shown in Figure 10, forming the wiring patterns 13, 14, and subjected to the hole production process is formed with a through hole 11 and the through hole 12 of the alumina substrate as the wiring substrate l.

其次,作为第二步骤,利用丝网印刷法填充含有银等金属填料的树脂膏22后,作为第三步骤,使所填充的树脂膏22加热固化而制作散热板7,同时与布线基板l相接合。 Next, as a second step, by screen printing a resin paste containing a silver filler metal filler after 22, as a third step, the filled resin paste 22 is heated to prepare a curing radiator plate 7, simultaneously with the wiring board l engagement. 此处使用的金属填料,更优选的是热导率优良的金、银、铝、铜等的金属粉末。 Here the metal filler used, and more preferably excellent in the thermal conductivity of gold, silver, aluminum, copper and other metal powders. 进而,通过使所述金属填料的含有率变化,可以设计规定热导率的散热板7。 Further, by the metal filler content changes, the heat radiating plate can be designed to a predetermined thermal conductivity 7.

而且,除了金属填料之外,还可以使用无机填料。 Further, in addition to the metal filler, an inorganic filler may be used. 通过使用氧化 By using an oxidizing

铝、氮化铝、碳化硅、氧化镁等导热性优良的陶瓷粉末,可以实现耐 Aluminum, aluminum nitride, silicon carbide, magnesium oxide ceramic powder having excellent thermal conductivity, resistance can be achieved

热性、耐湿性等耐久特性优良的LED部件。 Heat resistance, moisture resistance, durability and the like excellent in LED element characteristics.

此外,优选在所述树脂膏22中使用固化收缩小的材料。 Further, it is preferable to use material having a small shrinkage in curing the resin paste 22. 其次,利用机械加工,将被加热固化的树脂膏22形成为如图11 所示的散热板7c的形状。 Then, by machining, to be heat-cured resin paste 22 is formed in a shape as shown in FIG radiator plate 11 7c of. 利用形成为所述形状的散热板7c,可以发挥与第二实施方式中所说明的散热板7a同样的功能。 7c is formed using a heat radiating plate of the shape can exhibit the same function as the second embodiment described heat radiating plate 7a. 之后,使用银或铜等的导电膏,禾拥印刷法,在布线基板1的两面与通孔11的内壁形成布线图案13、 14。 Thereafter, the conductive paste using silver or copper, etc., owned Wo printing method, forming a wiring pattern on both surfaces of the inner wall of the through hole 11 of the printed circuit board 1 13, 14.

之后,作为第四步骤,如图12所示,使用粘合剂3,将LED芯片4固定在散热板7c的凹部底面上。 Thereafter, as a fourth step, as shown in Figure 12, using 3, the bottom of the recess the LED chip 4 is fixed to the heat dissipation plate 7c of the adhesive.

其次,作为第五步骤,进而利用引线接合装置,进行引线接合, 利用金的引线5电连接LED芯片4与设置在布线基板1的布线图案13 的一部分上的焊盘部。 Next, as a fifth step, and further using a wire bonding apparatus, wire bonding, the LED chips 4 and the connection land portion provided on a part of the wiring pattern of the wiring board 13 by a lead 5 electrically gold.

其次,作为第六步骤,为了保护LED芯片4与引线5,以及为了发挥使发出的光进行会聚的透镜的作用,使用透过性优良的透明树脂6,覆盖LED芯片4与引线5。 Next, as a sixth step, in order to protect the LED chip 4 and the lead 5, and to play the role of the light emitted by the converging lens through the use of a transparent resin excellent in 6, cover the LED chip 4 and the lead 5. 之后,将通孔11作为分割的基准,进行分割,单个化为规定的形状,以此可以完成图13所示的表面安装型LED部件。 Thereafter, the through-hole 11 as a reference segmentation, segmentation, individual into a prescribed shape, thereby to complete the surface mounting type LED element 13 shown in FIG.

如上所述,本第三实施方式中,可以在搭载有LED芯片4的布线基板1上形成生产率优良的散热板7c,且可以实现小型化的LED部件及其制造方法。 As described above, the third embodiment according to the present embodiment may be mounted with excellent productivity 7c is formed on the heat radiating plate wiring board LED chip 4, and the miniaturization of components and a manufacturing method of the LED may be achieved.

而且,如图14所示,也可以在由含有填料的树脂膏构成的散热板7c的凹部底面,配置由平坦性与导热性更好的金属或陶瓷材料而形成的散热板34。 Further, the heat radiating plate as shown, may be in the bottom of the recess 7c of the heat radiating plate made of a resin paste containing a filler, a flat configuration better and thermal conductivity metal or ceramic material formed by 1434. 利用所述结构,可以实现更加小型化的LED部件及其制 The use of structure, further miniaturization can be realized and made part of the LED

造方法。 Manufacturing methods.

而且,可以在所述散热板34中使用导热性优良的金、银、铝以及铜等金属材料或氧化铝、氮化铝、碳化硅、氧化镁等陶瓷材料。 Further, excellent thermal conductivity may be used gold, silver, aluminum, and copper, or a metal material such as alumina, aluminum nitride, silicon carbide, magnesia ceramic material of the heat radiating plate 34. (第四实施方式)以下,参照附图说明本发明的第四实施方式中的LED部件及其制 (Fourth Embodiment) The following describes a fourth embodiment of the present invention with reference to the LED components manufactured and

造方法。 Manufacturing methods.

图15是用以说明本发明的第四实施方式中的表面安装型LED部件的结构的剖面图,图16是其他示例的LED部件的剖面图。 FIG 15 is a sectional view for explaining a configuration of a fourth embodiment of the present invention, in the surface mounting type LED element, FIG. 16 is a sectional view of another example of the LED component.

图15中,因为内置陶瓷材料的变阻器元件135,所以布线基板101 优选使用氧化铝、镁橄榄石或滑石等具有50(TC以上的耐热性的陶瓷基板。并且,在所述布线基板101的一面上,以如下方式形成变阻器元件135, g卩,隔着变阻材料131,变阻电极132与变阻电极133相向, 且变阻电极134与变阻电极133相向。 15, since the ceramic material is built varistor element 135, so that the wiring board 101 is preferably alumina, talc, forsterite, or the like having 50 (or more heat resistant ceramic substrate of TC. Further, in the wiring substrate 101 on one side, is formed in the following manner varistor element 135, g Jie, via the varistor material 131, electrode 132 and the varistor and varistor electrode 134 electrode 133 electrode 133 facing opposite the varistor and varistor.

例如,所述变阻器元件135在烧制完的氧化铝基板上,交替积层由变阻材料131制成的印刷电路板(green sheet)与电极膏印刷而成的印刷布线层,之后,通过一起烧制,可以形成内置有变阻器元件135 的布线基板101。 For example, the varistor element 135 on the alumina substrate fired finished, the printed wiring layer are alternately laminated printed circuit board (green sheet) 131 made of a varistor material is formed by printing the electrode paste, after which, together through firing, it may be formed with a wiring substrate 101 built varistor element 135. 而且,制作由各种材料构成的膏,用所制作的膏进行丝网印刷,也可以在氧化铝基板等上形成变阻器元件135。 Moreover, the production, by screen-printing a paste made of various materials produced paste, varistor element 135 may be formed on an alumina substrate or the like.

进而,也可以是其他方法:积层形成用于低温烧基板(LTCC)的玻璃陶瓷材料的印刷电路基板与形成变阻器元件135的印刷电路基板后,通过同时烧制,形成内置变阻器元件135的布线基板101。 Further, another method may be: a wiring formed by stacking the printed circuit board 135 is a glass ceramic substrate material for low temperature fired (LTCC) after the printed circuit board 135 of the varistor element is formed by simultaneous firing, forming a varistor element built the substrate 101. 此时, 变阻器元件135不仅可以形成于布线基板101的表面和背面,也可以形成于布线基板101的内层部,在布线基板101的表面,例如也可以安装芯片部件等,从而可以实现设计自由度高的布线基板101 。 In this case, the varistor element 135 may be formed only on the surface and back surface of the wiring substrate 101, may be formed on the inner portion of the wiring substrate 101, the surface of the wiring substrate 101, for example, chip components may be mounted, so as to achieve the design freedom can be high wiring substrate 101.

并且,作为用于所述变阻器元件135的变阻材料131,优选使用ZnO系变阻材料。 Further, as the varistor material of the varistor 131 to element 135, preferably a ZnO based varistor material. 所述ZnO系变阻材料,优选将含有率80 wt% (重量百分比)以上的ZnO作为主成分,使用Bi203、 BaO、 SrO、 Pr203等作为副成分。 The ZnO based varistor material, preferably containing of 80 wt% (by weight) or more as a main component of ZnO, using Bi203, BaO, SrO, Pr203 like as accessory components. ZnO的含有率在80wt。 The content of ZnO in 80wt. /。 /. 以上时,电绝缘特性提高。 Or more, the electrical insulation characteristics are improved. 进而, 为改善非欧姆性,更优选添加CoO、 MnO、八1203等。 Further, to improve the non-ohmic, and more preferably to add CoO, MnO, eight 1203 and the like. 而且,为了在电力负荷或各种环境条件下使晶粒界面稳定化,且提高可靠性,优选添加Sb2。3、 Cr203、玻璃粉或B203等。 Further, in order to make the grain boundaries, or power load stabilizing various environmental conditions, and to improve reliability, it is preferable to add Sb2.3, Cr203, B203 glass frit or the like.

而且,在布线基板101上,形成发挥布线与作为表面安装部件的端电极作用的布线图案102、 103。 Furthermore, on the wiring substrate 101, a wiring pattern to play a role and a wiring electrode end surface of the mounting member 102, 103. 所述布线图案102、 103优选使用铜、 The wiring patterns 102, 103 is preferably copper,

镍、银或包含所述各成分的合金等导电性优良的电极材料。 A conductive electrode material excellent in nickel, silver or an alloy comprising the respective components. 所述布线图案102、 103可以通过如下而形成:使用光学刻蚀法、电镀法形成在布线基板101上的铜电极而形成、或者涂覆导电膏而形成。 The wiring patterns 102, 103 may be formed by: an optical etching method, to form the copper electrode is formed on the wiring substrate 101 of an electroplating method, or coated with a conductive paste is formed. 并且,用于此的导电膏可以使用由导电性优良的电极材料而制作的导电膏。 Then, this conductive paste can be used for a conductive electrode material excellent in a conductive paste production. 而且,也可以是使用纳米金属粉体或有机金属的导电性良好的导电膏。 Further, it may be a conductive metal nano metal powder or a highly conductive organic paste. 所述导电膏可以使用银、金、铂以及所述各成分的合金等贵金属材料, 或者使用铜、镍、钨、钼以及所述各成分的合金等贱金属材料。 The conductive paste may be silver, gold, platinum, and an alloy of the noble metal material of each component, or a base metal material such as copper, nickel, tungsten, molybdenum, and alloys of the respective components. 并且, and,

在变阻电极132、 133、 134中也可以使用相同的电极,优选选择那些电极材料不会向变阻器元件135扩散,且不会引起变阻器特性恶化的电极材料。 In the varistor electrodes 132, 133, 134 may also be used the same electrode, the electrode material is preferably selected those not diffuse into the varistor element 135, the varistor material of the electrode without causing characteristic degradation. 尤其,根据变阻材料131的材料成分,存在铜电极发生扩散的情况,优选适当地选择不会使变阻材料的特性恶化的电极材料。 In particular, the material composition of varistor material 131, there is a case of diffused copper electrode, the electrode material preferably selected from the varistor material does not cause characteristic degradation.

其次,说明图15中的变阻器元件135的电极与布线图案102、 103 的布线结构。 Next, an electrode wiring structure and a wiring pattern 102, 103 in FIG. 15 varistor element 135. 图15中,变阻电极132与布线图案102相连接。 15, the electrode 132 and the varistor 102 is connected to the wiring pattern. 所述变阻电极132隔着变阻材料131与变阻电极133相向配置,由此形成具有电容器功能的变阻器元件135。 The varistor electrodes via the varistor material 132 and 131 face each other varistor electrode 133, thereby forming a capacitor having varistor element 135 functions. 而且,变阻电极133隔着变阻材料131与变阻电极134相向配置,由此形成具有电容器功能的变阻器元件135。 Further, the varistor electrodes via the varistor material 133 and 131 face each other varistor electrode 134, thereby forming a capacitor having varistor element 135 functions. 因此,图15所示的变阻器元件135为串联配置两个变阻器的结构。 Thus, the varistor element 15 shown in FIG. 135 is a two series arrangement of varistor structure. 利用所述结构,可以实现内置变阻器的小型LED部件。 With the structure allows a compact LED built varistor member.

此外,因为变阻器元件135可以将至少一个元件内置在布线基板101来发挥其功能,所以可以至少在布线基板101的一面上部分形成变阻器元件135,来发挥其效果。 Furthermore, since the varistor element 135 may be at least one element built in the wiring substrate 101 to perform its functions, the varistor element can be formed at least on one side of the wiring board 135 portion 101, exert their effect.

其次,为如下结构:在所述布线基板101的中央部设置有贯通孔112,在所述贯通孔112内部配置比布线基板101的导热性更优良的散热板108。 Secondly, a structure: the central portion of the printed circuit board 101 is provided with a through hole 112, the through-hole 112 arranged inside better than the thermal conductivity of the heat radiating wiring board 101 of the plate 108.

利用具有导电性的粘合剂104, LED芯片105通过芯片接合被接合到所述散热板108的一面上,并且使用金等引线106对设置在布线图案102、 103的一部分的焊盘与LED芯片105进行引线接合,从而使焊盘与LED芯片105电连接。 Using a conductive adhesive 104, the LED chip 105 is bonded to one side of the heat radiating plate 108 by die bonding, and gold wires, etc. provided on the wiring pattern 106 pairs of pads of a portion of the LED chips 102, 103 wire bonding 105, so that the pads of the LED chip 105 is electrically connected. 并且,形成所述LED芯片105与变阻器元件135并联连接的电路结构。 And forming a circuit configuration of the LED chip 105 and 135 connected in parallel with the varistor element.

其次,为了发挥作为对LED芯片105与引线106的绝缘保护的作用以及作为透镜的作用,用透明树脂107覆盖,使得埋设引线106与LED芯片105。 Secondly, in order to play a role as an insulating protection of the LED chip 105 and the leads 106 and a lens 107 is covered with a transparent resin, so that the embedded lead wire 106 and the LED chip 105. 所述透明树脂107优选使用热固型丙烯酸树脂或环氧树脂等。 The transparent resin 107 is preferably a thermosetting acrylic resin, or epoxy. 利用所述结构,静电等的噪音输入LED芯片105时,并联连接的变阻器元件135将吸收静电,从而可以防止LED芯片105受到静电破坏,因此可以实现抗静电特性优良的小型表面安装型LED部件。 With the configuration, noise such as static electricity input LED chips 105, 135 connected in parallel to varistor element will absorb static electricity, thereby preventing electrostatic discharge damage of the LED chip 105 by, so excellent antistatic properties can be realized a small surface mounting type LED member. 并且, 重要的是使散热板108的热导率高于布线基板101的热导率,所述散热板108更优选导热性优良的金属材料,尤其优选铝、铜、银等导热性优良的金属材料。 Further, it is important that a high thermal conductivity of the heat radiating plate 108 to the thermal conductivity of the wiring substrate 101, the heat radiating plate 108 is more preferably a metal material excellent in heat conductivity, in particular preferably aluminum, copper, silver and other metal excellent in heat conductivity material. 更优选,使用所述导热性优良的金属材料作为散热板108,并且使用耐热性优良的陶瓷基板作为布线基板101。 More preferably, the metal material excellent in heat conductivity as a heat dissipation plate 108, and excellent heat resistance as a wiring substrate 101 is a ceramic substrate.

进而,散热板108使用耐热性与绝缘性优良的氧化铝或镁橄榄石、 滑石、低温烧结陶瓷基板等陶瓷基板,从而可以实现耐热性与绝缘性更加优良的LED部件。 Further, the heat radiating plate 108 and heat resistance superior insulating alumina or forsterite, talc, low-temperature sintered ceramic substrate, a ceramic substrate, which can achieve further excellent in heat resistance LED and the insulating member of. 并且,对于要求更高散热性与耐热性的用途, 也可以使用导热性更加优良的氮化铝、碳化硅、氮化硅等陶瓷材料。 And for requiring higher heat resistance and heat dissipation purpose, it may be used more excellent thermal conductivity of aluminum nitride, silicon carbide, silicon nitride ceramic material.

而且,利用如图15所示的结构,在安装LED部件的电路基板上配置形成散热用铜板,在所述铜板上,通过导热性优良的粘合剂等, 直接固定散热板108的背面,从而可以将从散热板108发散的热量高效地直接散发在形成于电路基板上的铜板上。 Further, with the structure shown in Figure 15, the heat dissipating copper plate arranged on the circuit board mounting the LED element, on the copper plate, by adhesive or the like excellent in thermal conductivity, the heat dissipation plate fixed directly to the rear surface 108, such that diverging from the heat radiating plate 108 can heat efficiently distributed directly on a copper plate formed on the circuit board.

进而,通过使用金属材料作为散热板108,可以在将LED部件安装于电路基板等时,隔着散热板108与电路基板接地连接。 Further, by using a metal material as a heat radiating plate 108, when the LED component may be mounted on a circuit board or the like, via the radiator plate 108 connected to the circuit board ground. 而且,利用导热性优良的粘合剂或焊料固定散热板108与电路基板,也可以提高安装强度。 Moreover, the use of thermally conductive adhesive or solder excellent in heat dissipation plate 108 fixed to the circuit board, the mounting strength can be improved.

而且,LED芯片105与散热板108之间必须绝缘时,优选在安装LED芯片105的、由金属构成的散热板108的一面形成薄的绝缘膜。 Further, when the necessary insulation between the LED chips 108 and the radiator plate 105, an insulating thin film is preferably formed in mounting the LED chip 105, the heat radiating plate made of metal 108 side. 此时,因为所述绝缘膜阻碍散热性,所以优选绝缘膜的厚度尽可能的薄。 At this time, since the insulating film prevents heat dissipation property, the thickness of the insulating film is preferably as thin as possible.

而且,利用引线106连接布线图案102、 103与LED芯片105时, 可以利用在布线图案102、 103的接合焊盘部进行镀镍或镀金使引线接合后的可靠性提高。 Further, a wiring pattern 106 is connected by wire 102, the LED chips 103 and 105, may be utilized in the nickel-plated or gold-plated bond pad portion of the wiring patterns 102, 103, improving the reliability of the wire bonding.

而且,优选,在利用锡焊材料将LED部件接合在电路基板上时, 将镀镍膜或镀锡膜等积层在布线图案102、 103的焊料接合部,以防止由于电极材料的相互扩散而使布线图案102、 103的电极材料变化。 Further, preferably, when the LED component is bonded to the circuit board by soldering material, the nickel plating film or tin solder joint film is laminated wiring patterns 102, 103 in order to prevent mutual diffusion of the electrode material change the wiring pattern 102, 103 of the electrode material.

其次,说明图16所示的其他示例的LED部件的结构。 Next, another example of the configuration of the LED component shown in FIG. 16.

图16所示的LED部件的结构与图15所示的LED部件的机构的不同之处在于,通过使散热板108的厚度比布线基板101的厚度薄,使 Mechanism different from the LED structure member 15 shown in FIG LED component shown in FIG. 16 is that, by making the heat radiating plate 108 is thinner than the thickness of the wiring substrate 101, so

LED芯片105的搭载面比配置基板1的平面低,从而利用设置在布线基板101上的贯通孔112的内部壁面形成空穴结构。 Mounting surface of the LED chip 105 is disposed lower than a plane of the substrate, thereby using the internal wall surface of the through hole 101 is provided on the wiring substrate 112 is formed a hole structure. 其次,另一个不同点是,形成所述空穴结构的贯通孔112的内周部设有锥面,利用所述锥面作为LED芯片105发光时的反射面109的结构。 Next, another difference is that the inner peripheral portion of the through hole 112 of the hole structure with a tapered surface, as with the tapered configuration of the reflecting surface 109 when the LED chip 105 emits light. 并且,下述点也不相同:将变阻器元件135安装在布线基板101的安装有LED芯片105的面的另一面上。 Further, the following points are not the same: the varistor element 135 mounted on a mounting wiring substrate 101 on the other surface side of the LED chip 105.

图16所示的LED部件与图15所示的LED部件相比较,利用具有反射面109的结构,可以实现发光效率更优良的LED部件。 LED component LED component shown in FIG 15 shown in FIG. 16 as compared, with the structure having a reflective surface 109, can achieve more excellent luminous efficiency of the LED component. 并且, 设置在所述贯通孔112的内周部的锥面的形状优选加工为使光高效地反射的形状,通过将所述锥面加工为圆锥状、曲线状,可以实现反射效率更优良的LED部件。 And, to set the shape of the light is efficiently reflected by the conical tapering shape, curved shape, more excellent reflection efficiency can be achieved in the process is preferably tapered shape of the inner peripheral portion of the through hole 112 of the LED component.

进而,在设置有所述反射面109的贯通孔112的内周部的表面上, 设置使用反射性优良的金属材料而形成薄膜的反射膜110。 Further, there is provided in the upper surface of the inner peripheral portion of the through hole 109 of the reflective surface 112 is provided using a reflective metallic material excellent in the reflective film 110 is formed of a thin film. 通过设置所述反射膜IIO,可以进而实现发光效率优良的LED部件。 By providing the reflective film IIO, and thus can achieve excellent luminous efficiency of the LED component.

此外,所述反射膜110也可以形成在散热板108的安装有LED芯片105的表面上,由此,可以获得反射性更优良的LED部件。 Further, the reflective film 110 may be formed on the mounting surface of the LED chip 105 has a heat radiating plate 108, thereby, possible to obtain more excellent reflective LED member.

其次,使用图17〜图22说明本第四实施方式所示的LED部件的制造方法。 Next, using FIG. 17~ FIG method for manufacturing LED component shown a fourth embodiment 22 of the present embodiment. 在此,说明将散热板108作为金属材料,且使用氧化铝基板构成布线基板101的图16所示的LED部件的制造方法。 Here, the heat radiating plate 108 as a metal material, and using method of manufacturing the LED component shown alumina substrate 101 constituting the wiring substrate 16 of FIG.

首先,作为第一步骤,如剖面图17所示,在氧化铝基板上形成反射面109和用于插入散热板108的贯通孔112,这样制作布线基板101 (以下,有时称为氧化铝基板101)。 First, as a first step, as shown in cross-section in FIG. 17, the reflective surface 109 and a heat dissipation plate for insertion through-hole 108 is formed on an alumina substrate 112, a wiring substrate 101 thus prepared (hereinafter sometimes referred to as an alumina substrate 101 ).

其次,如图18所示,使用银膏,利用丝网印刷法,在氧化铝基板101的另--面上形成变阻电极132、 134。 Next, as shown in FIG. 18, a silver paste by screen printing, the alumina substrate 101 on the other - varistor electrode forming surface 132, 134. 其次,以覆盖变阻电极132、 134的方式,将被加工为变阻组合物构成的陶瓷印刷电路板的变阻材料131压制积层在氧化铝基板101的另一面,使其暂时接合。 Secondly, as to cover the varistor electrodes 132, 134 of the embodiment, the other surface to be processed is a ceramic varistor material of the printed circuit board composed of varistor composition 131 is laminated pressing an alumina substrate 101, it is temporarily joined. 之后,使用银膏,利用丝网印刷形成变阻电极133后,进一步压制并积层变阻成分构成的陶瓷印刷电路板。 Thereafter, the silver paste by screen printing after forming a varistor electrode 133, is further pressed and laminated varistor ceramic component constituting the printed circuit board. 之后,将所述各变阻电极132、 133、 134 与变阻材料131在去除粘结剂后,在90(TC左右的烧制温度下进行烧制, 由此制作变阻器元件135。之后,如图19所示,在反射面109上涂布用于使LED芯片105 发出的光有效地反射的反射率高的银(Ag)膏,进行加热,从而在氧化铝基板101上形成反射膜110。尤其是,作为用于此的Ag膏,优选Ag树脂酸脂膏或Ag纳米膏等,在金属喷镀(metallization)后获得表面平滑性优良的反射面109的材料。而且,在反射膜110中使用铜膏 Then, after each of the varistor electrodes 132, 133, 134 and 131 in the varistor material after binder removal, and fired at the firing temperature of about TC (at 90, to prepare a varistor element 135. as As shown in FIG. 19, the reflective surface 109 is coated on the LED chip 105 for high reflectance of light reflected efficiently silver (Ag) paste emitted by heating, thereby forming a reflection film 110 is formed on an alumina substrate 101. in particular, as used herein Ag paste, grease or a resin acid preferably Ag nano Ag paste, a material is obtained having excellent surface smoothness of the reflective surface 109 after metallization (metallization). Further, the reflective film 110 using copper paste

时,在所形成的铜的表面进行镀银,由此可以形成良好的反射膜iio。 When, silver plating copper on the surface of the formed, thereby forming a good reflection film iio.

其次,如图20所示,通过印刷涂布Ag系膏或金(Au)系膏等导电膏,将用于连接以及作为端电极的布线图案102、 103金属喷镀在氧化铝基板101上。 Next, as shown in FIG. 20, a conductive paste based paste is applied by printing Ag-based paste or gold (Au), and a wiring pattern for connecting a terminal electrode, the metallization 102 103 101 alumina substrate. 在此,Ag系膏中包含Ag膏、Ag-Pt膏以及Ag-Pd 膏。 Here, Ag-based paste including Ag paste, Ag-Pt paste, and Ag-Pd paste. 而且,Au系膏中,包含Au-Pd膏以及Au-Pt膏。 Further, Au-based paste, paste containing Au-Pd and Au-Pt paste.

其次,作为第二步骤,将导热性优良的铝、铜等金属材料冲压加工为具有规定形状的散热板108。 Next, as a second step, the excellent thermal conductivity of aluminum, copper and other metallic material having a predetermined shape pressing process heat radiating plate 108.

其次,作为第三步骤,如图21所示,将所述散热板108压入贯通孔112的内部,或者使用粘合剂来接合而固定。 Next, as a third step, shown in Figure 21, the heat radiating plate 108 is pressed into the through hole 112 of the inside, it is fixed or bonded using an adhesive. 此时,因为用于散热板108的接合的粘合剂使导热性降低,所以优选使用散热性良好的导热孔、或芯片接合用导电粘合剂等。 At this time, since the heat radiating plate 108 for engaging the reduced thermal conductive adhesive, it is preferable to use a good thermal heat dissipation holes, with a conductive adhesive or die bonding and the like. 也可以使用将低熔点玻璃材料作为无机粘结剂的高温烧制型粘合剂。 May also be used low-melting-temperature firing glass-type adhesive material is an inorganic binder. 尤其,由钎焊进行接合在耐热冲击试验中可靠性高。 In particular, a high bonding reliability in thermal shock resistance test by soldering.

而且,散热板108使用铜时,在与氧化铝基板101之间,通过使用可进行化学胶结的粘合剂构成铝酸铜的尖晶石结构,可以提高耐热冲击特性。 Further, when the copper heat sink plate 108, and between the alumina substrate 101, by using a spinel structure may be chemically cementitious binder composed of copper aluminate, can improve the thermal shock properties.

其次,作为第四步骤,如图22所示,使用粘合剂104,将LED芯片105固定在散热板108的一面。 Next, as a fourth step, shown in Figure 22, using an adhesive 104, the LED chip 105 is fixed to one surface of the heat radiating plate 108.

之后,作为第五步骤,使用引线接合装置,在LED芯片105与设置在布线图案102、 103上的电极焊盘部之间,利用金的引线106进行引线接合安装,由此使LED芯片105与电极焊盘部电连接。 Thereafter, as a fifth step, using the wire bonding apparatus, the LED chip 105 and 102 disposed between the electrode pad portion 103 on the wiring pattern, wire bonding mounting 106 using gold wire, and thereby the LED chip 105 electrically connecting the electrode pad portion. 此时,LED 芯片105与变阻器元件135并联连接。 In this case, LED chips 105 and 135 are connected in parallel with the varistor element. 利用所述电路结构,可以获得抗静电特性优良的LED部件。 With the circuit configuration, can obtain excellent antistatic properties of the LED component.

其次,作为第六步骤,通过涂敷透过性优良的丙烯酸树脂或环氧树脂等透明树脂107,可以制作图16所示的LED部件,其中透明树脂107发挥绝缘保护作用和使从LED芯片105发出的光会聚的透镜的作用。 Next, as a sixth step, by coating 107 can be produced in the LED component shown in FIG. 16 and the like excellent in transmission or an epoxy resin, an acrylic resin, a transparent, wherein the transparent resin 107 play a role of insulation and protection from the LED chip 105 converging lens action of light emitted. 此时,能够适当地选择粘度或涂布方法而使透明树脂107的形状成为规定的透镜形状。 In this case, the viscosity can be appropriately selected or the coating method of the shape of the transparent resin 107 becomes a predetermined lens shape. 而且,利用所述透明树脂107,可以具有实现布 Further, using the transparent resin 107 may have implemented cloth

线基板101与散热板108的接合加强的作用。 Engaging the line of action to strengthen the substrate 101 and the heat radiating plate 108.

如上所述,在搭载有LED芯片105的布线基板101的一部分上形成的贯通孔112的内部,配置导热性优良的散热板108,在布线基板101中内置变阻器元件135的同时,成为LED芯片105与变阻器元件135并联连接的结构,由此可以实现散热性与抗静电特性优良的表面安装型LED部件及其制造方法。 As described above, the internal portion is formed on the wiring substrate mounted LED chips 101 through 105 of hole 112, excellent thermal conductivity arranged radiator plate 108, the varistor element 135 at the same time built in the wiring substrate 101, the LED chip 105 becomes structural varistor element 135 connected in parallel, whereby excellent antistatic properties and heat dissipation surface mounting type LED element and a manufacturing method may be implemented. (第五实施方式) (Fifth Embodiment)

以下,参照附图说明本发明的第五实施方式中的LED部件。 The following describes a fifth embodiment of the present invention with reference to the LED components.

图23是用以说明本发明的第五实施方式中的表面安装型LED部件的结构的剖面图,图24是用以说明其他示例的剖面图。 FIG 23 is a sectional view for explaining a configuration of a fifth embodiment of the present invention, in the surface mounting type LED element, FIG. 24 is a cross-sectional view for explaining another example of FIG.

图23、图24中,本第五实施方式中的LED部件的结构与第四实施方式的明显不同之处是散热板108a、 108b的形状。 FIG 23, FIG 24, significantly different from the structure of the fourth embodiment of the present fifth embodiment is that the shape of the LED component radiator plate 108a, 108b of. 尤其明显的特征是在所述散热板108a、 108b上设置凹部,从而形成空穴结构。 Particularly evident feature is provided in the recess of the heat sink 108a, 108b, thereby forming a hole structure.

通过对铝、铜或银等导热性优良的金属进行成形加工而形成空穴结构,可以很容易地制作所述散热板108a、 108b。 By good thermal conductivity metal such as aluminum, copper or silver is formed by molding cavity structure can be easily produced the heat dissipation plate 108a, 108b. 在设置在所述散热板108a、 108b的空穴结构的底面,设置可以安装LED芯片105的空间。 Provided in the radiator plate 108a, 108b of the bottom surface of the hole structures, may be provided to mount the LED chip 105 space.

而且,在形成所述散热板108a、 108b的空穴结构的凹部的内周部, 使用模具而成形,或者利用抛光等设置锥面,且将所述锥面作为反射面109。 Further, in forming the heat dissipation plate 108a, the inner circumferential portion of the recessed portion 108b of the hole structures, and molded using a mold, or by polishing the tapered surface and the tapered surface 109 as a reflective surface. 将所述反射面109的锥面设为规定的倾斜角度,以此可以使搭载在空穴结构的底面的LED芯片105放射的光高效地会聚,或者使发光效率提高,且可以控制LED部件的发光状态。 The inclination angle of the tapered reflective surface 109 is set to the predetermined, this allows the bottom surface of the hole in the mounting structure of the LED chip 105 is radiated efficiently converging light, or to increase the luminous efficiency, and the LED may be controlled member light emission state.

此外,将在所述凹部内周部设置的锥形的反射面109的表面镜面化,以此可以更好地进行光的反射。 Further, in the mirrored surface of the conical reflecting surface 109 of the inner periphery of the recess portion is provided, in order to better reflect light.

而且,为了使LED芯片105的光更有效地反射,使用电镀或蒸镀 Further, in order to light the LED chip 105 is effectively reflected, plating or vapor deposition using

等薄膜形成技术,在反射面109的表面形成由更高反射率的材料构成的反射膜110,以此可以实现反射特性更高的LED部件。 And other thin film forming technique, a reflection film 110 made of a material having a higher reflectance at the surface of the reflective surface 109, in order to achieve higher reflection characteristics of the LED element.

其次,说明图24所示的其他示例的LED部件的结构。 Next, another example of the configuration of the LED component 24 shown in FIG. 所述LED 部件的特征是,在以金属板作为散热板108b的同时利用模具成型形成爪部111。 The LED component is characterized in that a metal plate at the same time as a heat dissipation plate 108b is formed by molding the claw portion 111. 通过设置所述爪部111,可以在向布线基板101的贯通孔112 By providing the claw portion 111, the through hole may be 101 to 112 of the wiring substrate

插入散热板108b时,使插入的深度保持稳定在一定深度。 When inserted into the heat plate 108b, so that stable insertion depth at a certain depth. 此外,所述爪部111也可以具有如沿部一样的连续突起。 Further, the claw portion 111 may have the same section as viewed along the continuous protrusion. 如上所述,本第五实施方式中,通过在搭载有LED芯片105的散热板108a、 108b中使用金属材料等进行机械加工,就可以容易地形成空穴结构,并且也可以同时形成反射面109,利用所述结构,可以使LED部件小型化,同时可以实现生产率优良的LED部件。 As described above, the present fifth embodiment, by mounting the LED chip 105 of the heat dissipation plate 108a, 108b in a metal material or the like is machined, it is possible to easily form a hole structure, and may also be formed simultaneously reflecting surface 109 , with the structure, the size of the LED component, and can realize excellent productivity LED components.

此外,也可以使用导热性优良的陶瓷材料成形为所述散热板108a、 108b的形状,此时,除所述作用之外,可以实现耐热性更加优良的LED 部件。 In addition, excellent thermal conductivity may be used a ceramic material into a shape of the heat radiating plate 108a, 108b, in which case, in addition to the effect can be achieved with more excellent heat resistance, LED components.

(第六实施方式) (Sixth Embodiment)

以下,参照附图说明本发明的第六实施方式中的LED部件及其制造方法。 The following describes a method of manufacturing the LED member embodiment of a sixth embodiment of the present invention are shown.

图25是本第六实施方式中的LED部件的剖面图。 FIG 25 is a cross-sectional view of a sixth embodiment of the LED component. 本第六实施方式中的表面安装型LED部件的基本结构与图23所示的LED部件的结构大致相同,与第五实施方式的明显不同之处是散热板108c的材质。 LED component shown in FIG. 23 of the basic configuration of a sixth embodiment according to the present embodiment of the surface mounting type LED structural member is substantially the same, significantly different from the fifth embodiment is that the material of the heat radiating plate 108c.

所述散热板108c由包含导热性优良的金属填料的树脂构成。 The heat dissipation plate 108c formed of a resin containing a metal excellent in thermal conductivity filler. 作为金属填料,使用铜、铝、金、银等的金属粉末。 As the metal filler, a metal powder of copper, aluminum, gold, silver and the like. 使金属粉末与环氧树脂等混炼,以此制作树脂膏。 Metal powder and kneading an epoxy resin, thereby manufacturing a resin paste. 通过将含有所述金属填料的树脂膏填充在形成于布线基板101上的贯通孔112内部后,进行热固而形成散热板108c,同时能够进行所制作的散热板108c与布线基板101的接合, 因此可以实现生产率优良的LED部件。 By heat dissipation plate 108c of the resin paste containing a metal filler is filled in the inner through-hole 112 is formed on the wiring substrate 101, to form a solid heat, the heat radiating plate can be joined simultaneously 108c and the wiring board 101 is produced, excellent in productivity can be achieved LED components.

进而,通过代替所述金属填料而使用无机填料,除上述作用之外, 还可以获得绝缘性优良的LED部件。 Further, instead of using an inorganic filler by the metal filler, in addition to the above-described effect can also be obtained LED excellent insulating member. 并且,作为无机填料,使用氧化铝、氮化铝、碳化硅、氧化镁等,以此可以实现生产率优良的LED部件。 Further, as the inorganic fillers, alumina, aluminum nitride, silicon carbide, magnesia, etc., is excellent in productivity can be achieved in order to LED components. 即,所述散热板108c是在将添加有导热性良好的金属粉末或陶瓷粉末作为导热填料的树脂膏填充在布线基板101的贯通孔112的内部后,加热固化而形成的。 That is, the heat dissipation plate 108c is added with good thermal conductivity metal powder or a ceramic powder is used as the thermally conductive filler resin paste filled in the inner through-hole 112 of the wiring substrate 101, formed by heat curing. 关于除此以外的内容,因为具有与第五实施方式大致相同的结构所以省略说明。 Other than about the content, because the fifth embodiment has substantially the same configuration is omitted.

利用所述结构,可以在树脂膏的加热固化的同时进行布线基板101 与散热板108c的接合。 With the structure, the wiring substrate 101 may be bonded to the radiator plate 108c of the heat cured resin paste simultaneously. 而且,通过改变树脂膏的材料成分,可以控制布线基板101与散热板108C的膨胀系数。 Further, by changing the material composition of the resin paste can be controlled expansion coefficient of the wiring board 101 and the heat radiating plate of 108C.

而且,作为形成散热板108c的材料,叙述了将金属填料或无机填 Further, as a material for forming the heat radiating plate 108c, it describes a metal filler or inorganic filler

料混合在环氧树脂中使其固化的情况,但也可以代替环氧树脂,使用如玻璃粉这样的使用无机粘结剂的高温烧制型膏。 When the curable material mixing it in epoxy, but instead of an epoxy resin, a high temperature baking type paste using an inorganic binder such as glass frit.

如上所述,本第六实施方式所示的LED部件可以在搭载有LED 芯片105的布线基板101上形成生产率优良的散热板108c。 As described above, the sixth embodiment shown in this embodiment in the LED component may be mounted in an excellent heat dissipation plate 108c productivity of wiring substrate 101 on the LED chip 105. 与第五实施方式中所使用的散热板108a、 108b的制成品相比,散热板108c可使用丝网印刷形成于贯通孔112内。 The heat dissipation plate used in the fifth embodiment of 108a, 108b as compared to manufactured goods, the heat dissipation plate 108c may be formed in the through hole 112 using a screen printing. 因此,可以容易地对应于形状不同的贯通孔112。 Thus, it is possible to easily correspond to a different shape of the through hole 112. 因此,无须准备加工为各个尺寸的散热板108a、 108b, 可以在贯通孔112的形状的种类很多时,实现生产率的提高。 Thus, the processing need to be prepared for each size of the heat dissipation plate 108a, 108b, may be a lot of time, to achieve improved productivity in the type of shape of the through hole 112.

其次,使用图26说明其他示例的LED部件的结构。 Next, using FIG. 26 illustrates the structure of another example of the LED component. 所述LED部件,如图26所示,在由包含导热性优良的填料的树脂膏而构成的散热板108d的凹部的底面,具有平坦性与导热性更加良好的由金属或陶瓷材料而形成的散热板140。 The LED component shown in Figure 26, the bottom of the recess of the heat radiating plate by a resin paste comprising a filler having excellent thermal conductivity and 108d is constituted, is formed to have a flat and thermal conductivity more excellent metal or ceramic material heat radiating plate 140. 利用所述结构,可以使LED芯片105的安装面的平坦性提高,且有利于LED芯片105的大型化。 With the structure, the LED chip 105 to improve the flatness of the mounting surface, and is conducive to large-scale LED chip 105.

而且,散热板140中可以使用导热性优良的金、银、铝以及铜等金属材料,或氧化铝、氮化铝、碳化硅、氧化镁等陶瓷材料。 Further, the heat radiating plate 140 may be used in the excellent thermal conductivity of gold, silver, copper, aluminum, and a metal material, or aluminum oxide, aluminum nitride, silicon carbide, ceramic material such as magnesium oxide.

其次,使用图27〜图32说明图25所示的LED部件的制造方法。 Next, using FIG. 27~ 32 illustrates a method of manufacturing an LED element 25 shown in FIG.

首先,作为第一步骤,如图27所示,制作在任意位置形成有贯通孔112的布线基板101。 First, as a first step, as shown in FIG making a through hole 112 of the wiring substrate 10127 at an arbitrary position. 其次,如图28所示,利用与第四实施方式相同的方法,积层形成变阻电极132、 133、 134以及变阻材料131后, 通过烧制形成变阻器元件135。 Next, as shown in FIG, using the same method of the fourth embodiment, the laminate 28 is formed varistor electrodes 132, 133, 134, and 131 after the varistor, the varistor element 135 is formed by firing.

其次,如图29所示,印刷形成布线图案102、 103后,通过一起烧制,制作内置有变阻器元件135的布线基板101。 Next, as shown in FIG. 29, the printed wiring patterns is formed after the 102, 103, by firing together, making the wiring substrate 101 built varistor element 135.

其次,作为第二步骤,如图30所示,利用丝网印刷法,将含有铝、 铜或银等导热性优良的金属填料的树脂膏122填充在贯通孔112中。 Next, as a second step, shown in Figure 30, by screen printing, and the like containing aluminum, copper or silver metal excellent in thermal conductivity filler resin paste 122 is filled in the through hole 112.

其次,作为第三步骤,如图31所示,对含有填充的金属填料的树脂膏122进行加热固化,从而形成散热板108c,同时,接合散热板108c 与布线基板101。 Next, as a third step, shown in Figure 31, the metal paste 122 contains a resin filler is filled is heated and cured, thereby forming a heat dissipation plate 108c, at the same time, the heat radiating plate bonded substrate 101 and the wiring 108c. 作为用于此的金属填料优选导热性优良的金、银、铝、 铜等的金属粉末。 The metal filler is preferably gold, silver, aluminum, copper or the like excellent in thermal conductivity of the metal powder used for this. 进而,通过改变所述金属填料的含有率,可以设计规定的散热板108c。 Further, by changing the metal filler content, it can be designed to a predetermined heat dissipation plate 108c. 而且,除了金属填料之外,可以使用无机填料。 Further, in addition to the metal filler, an inorganic filler may be used. 作为无机填料, 使用氧化铝、氮化铝、碳化硅、氧化镁等导热性优良的陶瓷粉末,以此可以实现耐热性、耐湿性等优良的LED部件。 As the inorganic fillers, alumina, aluminum nitride, silicon carbide, excellent in thermal conductivity such as magnesium oxide ceramic powder may be implemented in order to heat resistance, moisture resistance and the like excellent in LED element.

此外,优选在所述树脂膏122中使用固化收縮少的材料。 Further, preferably less curing shrinkage of the resin paste material 122. 而且, 被加热固化的树脂膏122也可以利用机械加工形成为如图31所示的散热板108c的形状。 Further, the heat-curing resin paste 122 may be formed in the shape shown in FIG. 31 108c radiator plate by machining. 并且,此时的散热板108c的形状可以具有与第五实施方式中所说明的散热板108a相同的功能。 And, at this time the shape of the heat dissipation plate 108c may have the same function as in the fifth embodiment described heat dissipation plate 108a.

之后,作为第四步骤,如图32所示,使用粘合剂104,将LED芯片105固定在散热板108c的凹部底面。 Thereafter, as a fourth step, shown in Figure 32, using an adhesive 104, the recess bottom surface of the LED chip 105 is fixed to the heat radiating plate 108c.

其次,作为第五步骤,使用引线接合装置,在设置于布线图案102、 103的一部分的焊盘部与LED芯片105之间,利用金的引线106进行引线接合,从而使其电连接。 Next, as a fifth step, using the wire bonding apparatus, disposed between a portion of the wiring pattern 102, the pad portion 103 of the LED chip 105, 106 by wires gold wire bonding, so that it is electrically connected. 此时,LED芯片105与变阻器元件135 并联连接。 In this case, LED chips 105 and 135 are connected in parallel with the varistor element.

其次,作为第六步骤,为了发挥保护LED芯片105与引线106的作用、以及发挥对发出的光进行会聚的透镜的作用,使用透过性优良的透明树脂107进行涂敷。 Next, as a sixth step, in order to play the role of protecting the LED chip 105 and the lead 106, and the role of condensing light emitted by the lens, is coated using a transparent resin excellent in permeability 107. 如此,可以制作表面安装型LED部件。 Thus, it is possible to produce a surface mount LED component.

如上所述,本第六实施方式中,可以在搭载有LED芯片105的布线基板101上以高生产率形成散热板108c,且可以实现小型化的抗静电特性优良的表面安装型LED部件及其制造方法。 As described above, the sixth embodiment according to the present embodiment may be mounted in the wiring substrate 101 on the LED chip 105 to the heat radiating plate 108c is formed with high productivity, and can achieve excellent antistatic properties miniaturization surface mounting type LED element and a manufacturing method. (第七实施方式) (Seventh Embodiment)

以下,参照附图说明本发明的第七实施方式中的LED部件及其制造方法。 The following describes a method of manufacturing the LED member embodiment of a seventh embodiment of the present invention are shown.

图33是本第七实施方式中的LED部件的剖面图,图34〜图38是用以说明其制造方法的剖面图。 FIG 33 is a cross-sectional view of an LED component according to the seventh embodiment, FIG. 34~ FIG. 38 is a sectional view for explaining a method of manufacturing thereof.

图33中,本第七实施方式中的表面安装型LED部件的基本结构与图25所示的LED部件的结构大致相同。 33, the structure of the LED component shown in FIG basic configuration of a seventh embodiment according to the present embodiment of the surface mounting type LED element 25 is substantially the same. 与图25所示的LED部件的明显不同之处是,LED芯片105的安装方法并非引线接合法,而是倒装法的LED芯片105a的倒装焊接法。 Member of the LED 25 shown in FIG significant difference is, the LED chip mounting method 105 is not wire bonding, but flip-chip LED chip 105a of the flip chip bonding method. 因此,本第七实施方式中的LED部件中,散热板108e与布线图案102、 103必须电绝缘。 Accordingly, the present seventh embodiment of the LED component, the heat dissipation plate 108e and the wiring patterns 102, 103 must be electrically insulating. 因此, 例如,在用金属制作散热板108e时,优选在散热板108e的表层形成薄的绝缘膜。 Thus, for example, in the production of the heat radiating plate 108e with a metal, preferably a thin insulating film formed in the surface of the heat radiating plate 108e. 在形成于散热板108e上的布线图案102、 103的焊盘部分,安装倒装型LED芯片105a。 In the pad portion is formed on the wiring pattern on the radiator plate 108e 102, 103, and mounting a flip chip type LED 105a. 而且,利用以具有优良的导热性的无 Further, in a non-use having excellent thermal conductivity

机填料作为主要成分,并在其中添加低熔点玻璃粉的绝缘材料构成所 Filler as a main component, the low melting point glass frit added thereto and an insulating material constituting

述散热板108e,以此可以形成绝缘性优良的散热板108e。 Said radiator plate 108e, thereby excellent insulation can be formed radiator plate 108e. 作为无机填料,优选以氧化铝、氮化铝、碳化硅、氧化镁等作为无机粘结剂,利用有机载体,将硼系、铋系或锌系等的硅化物的低熔点玻璃绝缘膏化后的物质烧制而形成。 As the inorganic filler, preferably alumina, aluminum nitride, silicon carbide, magnesium oxide, etc. as an inorganic binder, an organic vehicle, boron-based, bismuth-based or zinc-based low melting glass such as a silicide of the insulating paste firing the formed material. 如此,通过使用绝缘膏,可以高效地填充到各种形状的贯通孔112中,从而可以实现生产率优良的LED部件。 Thus, by using the insulating paste, can be efficiently filled in the through hole 112 of various shapes, which can achieve excellent productivity LED components. 并且, 在具有所述良好的绝缘性的散热板108e上,形成布线图案102、 103, 可以凸点焊接倒装型LED芯片105a。 And, having the good insulation of the heat radiating plate 108e, a wiring pattern 102, 103, solder bumps may be flip-chip type LED chip 105a.

利用如上所述的结构,可以实现小型化的LED部件,所述LED 部件可以通过有效的安装步骤而获得生产率的提高。 Using the structure as described above, can be miniaturized LED member, the LED component can be obtained by effectively improving the productivity of the installation procedure.

其次,使用图34〜图38说明本第七实施方式中的LED部件的制造方法。 Next, using FIG. 34~ 38 illustrates a seventh embodiment of the present method for manufacturing an LED member embodiment.

首先,作为第一步骤,如图34所示,在布线基板101的任意位置形成贯通孔112,与第六实施方式相同,在布线基板101的另一面积层形成变阻电极132、 133、 134以及变阻材料131,由此制作内置有变阻器元件135的布线基板101。 First, as a first step, shown in Figure 34, the through hole 112 is formed at an arbitrary position of the wiring substrate 101, the same as the sixth embodiment, 132, the electrode 133 is formed on the other area of ​​the varistor layer wiring substrate 101, 134 and a varistor material 131, thereby making built varistor element 135 substrate 101 wiring.

其次,作为第二步骤,如图35所示,利用丝网印刷法,将氮化铝或碳化硅等导热性优良的无机填料作为主要成分的绝缘膏123填充在贯通孔112中。 Next, as a second step, shown in Figure 35, a screen printing method, silicon carbide, aluminum nitride, or the like excellent in thermal conductivity of the inorganic filler as a main component an insulating paste 123 filled in the through hole 112. 用于绝缘膏123的无机填料,可以使用氧化铝、氮化铝、碳化硅、氧化镁等导热性优良的陶瓷粉末,可以实现耐热性、耐湿性等耐久特性优良的LED部件。 The inorganic filler used for the insulating paste 123 can be used aluminum oxide, aluminum nitride, silicon carbide, magnesium oxide ceramic powder having excellent thermal conductivity, heat resistance can be realized, excellent in durability and moisture resistance characteristics of the LED component.

之后,作为第三步骤,固化或烧制所填充的绝缘膏123来制作散热板108,同时,将所制作的散热板108与布线基板101接合。 Thereafter, as a third step, curing or firing the filled insulating paste 123 to make the heat dissipation plate 108, while the engagement of the heat radiating plate 108 produced and the wiring board 101. 此外, 作为所述绝缘膏123,优选使用固化收縮小或烧制收縮小的材料。 Further, as the insulating paste 123, preferably using a curing or firing shrinkage low shrink material.

其次,如有必要,将固化或烧结后的绝缘膏123机械加工形成为如图36所示的散热板108e的形状。 Then, if necessary, an insulating paste 123 machined after curing or sintering heat radiating plate is formed into the shape as shown in FIG. 36 108e. 通过形成为此时的散热板108e的形状,可以具有与第六实施方式中所说明的散热板108c相同的功能。 By adopting the shape of the heat dissipation plate 108e in this case, it may have the same functionality as in the sixth embodiment described heat dissipation plate 108c.

之后,作为第四步骤,如图37所示,使用导电膏,利用丝网印刷法或薄膜技术形成布线图案102、 103。 Thereafter, as a fourth step, shown in Figure 37, using a conductive paste by screen printing method or a thin film technique to form a wiring pattern 102, 103. 于此,布线图案102、 103形成在布线基板101以及散热板108e上。 Thereto, the wiring pattern 102, 103 formed on the wiring substrate 101 and the heat radiating plate 108e. 在散热板108e上,布线图案102、103形成为可以与倒装用LED芯片105a进行凸点焊接的焊盘电极的形 On the heat radiating plate 108e, 102, 103 are formed to form a wiring pattern pad electrode bump bonding may be performed using the LED chip 105a and the flip

状的图案。 Shaped pattern.

其次,作为第五步骤,如图38所示,使用形成在LED芯片105a 上的金凸点136,利用凸点安装将LED芯片105a固定在散热板108e 的凹部底面。 Next, as a fifth step 38, the gold bumps 136 on the LED chip 105a is formed by the bumps 105a mounted in the fixing recess bottom surface 108e of the heat radiating plate LED chip.

如此,使用金凸点136进行凸点焊接来电连接LED芯片105a与设置在布线基板101的布线图案102、 103的一部分的凸点焊盘部。 Thus, bumps 136 of gold bump bonding to electrically connect the LED chip 105a is provided with bump pads 102, 103 of a portion of the wiring pattern of wiring substrate 101 on. 此时,LED芯片105a与变阻器元件135并联连接。 In this case, LED chips 105a and varistor element 135 are connected in parallel.

其次,作为第六步骤,为了发挥保护LED芯片105a的作用以及作为对发出的光进行会聚的透镜的作用,涂敷透过性优良的透明树脂107。 Next, as a sixth step, in order to function to protect the LED chip 105a as well as the effect of light emitted by the converging lens, is applied through a transparent resin excellent in 107. 所形成的透明树脂107覆盖在整个LED芯片105a以及在布线图案102、 103上的相当于LED芯片105a与布线基板101的连接部的部分。 The transparent resin 107 is formed to cover the entire portion of the LED chip 105a and the wiring patterns 102, 103 on the LED chip 105a corresponds to the connecting portion 101 of the wiring substrate.

利用以上所说明的工艺,可以制作图33所示的表面安装型LED 部件。 Using the process described above, can be prepared FIG surface mounting type LED member 33 shown.

而且,图39所示的LED部件是本第七实施方式的其他示例的LED 部件的剖面图。 Moreover, LED component shown in FIG. 39 is a cross-sectional view of an LED component according to another exemplary embodiment of the seventh embodiment. 所述LED部件的特征是没有在散热板108f上设置凹部。 Wherein the LED component is not provided on the heat radiating plate recessed portion 108f. 图39所示的LED部件适用于LED芯片105a的照射光照射到大角度范围的情况。 Light irradiation is shown in FIG. 39, the LED component applied to the LED chip 105a of a large incident angle range.

如上所述,本第七实施方式中,可以利用倒装安装来安装LED芯片105a,并且可以在布线基板101上形成生产率高的散热板108e、 108f, 从而可以实现小型化LED部件。 As described above, the seventh embodiment of the present embodiment may be utilized to mount the LED chip is flip-chip mounted 105a, and a high productivity can be formed of the heat dissipation plate 108e, 108f on the wiring substrate 101, thereby enabling miniaturization of the LED component.

产业上的可利用性 The availability of the industry

根据本发明,可以形成将搭载有LED芯片的导热性优良的散热板接合到设置于布线基板上的贯通孔内部的结构,以此有效地发散LED 芯片发光时产生的热。 According to the present invention, it can be formed when the heat generated in the LED chip is mounted excellent thermal conductivity is joined to the heat radiating plate is provided inside the through-hole wiring board structure, in order to effectively dissipate LED chip. 而且,通过内置变阻器元件,本发明适用于高亮度的LED部件及其制造法方面,所述高亮度的LED部件可以在有效地利用LED芯片的安装面积的同时,减少LED芯片105因电涌或静电等而造成的不良情况。 Moreover, by the built-in varistor element, aspect of the present invention is applicable to high-brightness LED components and a manufacturing method of the high-brightness LED components can be effectively utilized while the mounting area of ​​the LED chip, the LED chip 105 by reducing surges or such as static electricity caused by adverse circumstances.

Claims (22)

1.一种LED部件,包括: 设置有贯通孔和变阻器元件的布线基板; 收纳在所述贯通孔的内侧的散热板; 安装在所述散热板上的LED芯片; 电连接所述LED芯片与所述布线基板的连接部;和覆盖所述LED芯片与所述连接部的透明树脂, 在所述散热板的安装所述LED芯片的面上,形成有与所述布线基板连接的布线图案, 所述变阻器元件与所述LED芯片并联连接。 An LED component, comprising: a wiring substrate provided with a through-hole and the varistor element; housed inside the heat dissipation plate through hole; a LED chip mounted on the heat radiating plate; and electrically connecting the LED chip a wiring connection portion of the substrate; and covering the LED chip and the connecting portion of the transparent resin, is mounted on a surface of the LED chip of the heat dissipation plate is formed with a wiring pattern connected to the wiring board, the varistor element is connected in parallel with the LED chip.
2. 根据权利要求1所述的LED部件,所述布线图案具有用于安装所述LED芯片的电极焊盘,所述散热板通过烧制以导热性填料为主要成分且以低熔点玻璃为无机粘结剂的绝缘膏而形成。 2. The LED component of claim 1, wherein the wiring pattern has an electrode pad for mounting the LED chip, a heat dissipation plate by firing in a heat conductive filler as a main component and a low melting point inorganic glass an insulating adhesive paste is formed.
3. 根据权利要求1所述的LED部件,所述散热板的厚度比所述布线基板的厚度薄,且所述LED芯片配置在由所述散热板与所述布线基板形成的凹部。 3. The LED component of claim 1 wherein the thickness of the heat radiating plate is thinner than the thickness of the wiring substrate and the LED chip disposed in the recess formed by the heat radiating plate wiring board.
4. 根据权利要求3所述的LED部件,所述贯通孔的内周部设置有锥面。 4. LED component according to claim 3, the inner peripheral portion of the through hole is provided with a tapered surface.
5. 根据权利要求4所述的LED部件,进一步包括设置在所述内周部的锥形表面的反射膜。 5. LED component according to claim 4, further comprising a reflection film disposed on the inner circumferential surface of the tapered portion.
6. 根据权利要求1所述的LED部件,在所述散热板的一部分设置有凹部,且所述凹部的内周部的壁面为锥形。 6. LED component according to claim 1, a recess is provided in a portion of the heat radiating plate, and the inner circumferential wall surface of the recess portion is tapered.
7. 根据权利要求6所述的LED部件,进一步包括设置在所述散热板的内周部的所述壁面上的反射膜。 7. LED component according to claim 6, further comprising a reflection film disposed on the inner circumferential wall surface portion of the heat radiating plate.
8. 根据权利要求1所述的LED部件,具有接合所述散热板与所述布线基板的导电性粘合剂。 8. LED component according to claim 1, having a conductive adhesive joining the heat radiating plate and said wiring board.
9. 根据权利要求1所述的LED部件,其特征在于:所述散热板的热导率高于所述布线基板的热导率。 9. LED component according to claim 1, characterized in that: the thermal conductivity of the heat radiating plate is higher than the thermal conductivity of the wiring board.
10. 根据权利要求1所述的LED部件,所述散热板为金属,在所述散热板的形成有所述布线图案的面上,形成有绝缘膜。 10. LED component according to claim 1, said heat dissipation plate is a metal, forming the surface of the heat dissipation plate has a wiring pattern, an insulating film is formed.
11. 根据权利要求1所述的LED部件,所述散热板为陶瓷。 11. LED component according to claim 1, said heat dissipation plate is a ceramic.
12. 根据权利要求1所述的LED部件,所述散热板为含有金属填料的树脂,在所述散热板的形成有所述布线图案的面上,形成有绝缘膜。 12. LED component according to claim 1, said heat dissipation plate is a resin containing a metal filler, is formed in the surface of the heat dissipation plate has a wiring pattern, an insulating film is formed.
13. 根据权利要求12所述的LED部件,所述金属填料是从铜、铝、 银以及金中选择的至少一个。 13. LED component according to claim 12, wherein the filler is selected from metallic copper, aluminum, silver, and gold, at least one.
14. 根据权利要求1所述的LED部件,所述散热板是含有无机填料的树脂。 14. LED component according to claim 1, said heat dissipation plate is a resin containing an inorganic filler.
15. 根据权利要求14所述的LED部件,所述无机填料是从氧化铝、 氮化铝、碳化硅以及氧化镁中选择的至少一个。 15. LED component according to claim 14, the inorganic filler is selected from alumina, aluminum nitride, silicon carbide, and at least one of magnesium oxide.
16. 根据权利要求1所述的LED部件,所述变阻器元件由含有ZnO、 Bi203、 Sb203的材料构成,且ZnO的含有率为80wt。 16. LED component according to claim 1, said varistor element containing ZnO, Bi203, Sb203 the material, the content ratio of ZnO and 80wt. /。 /. 以上。 the above.
17. 根据权利要求1所述的LED部件,所述LED芯片与内置有所述变阻器元件的布线基板通过倒装法连接。 17. A LED component according to claim 1, the LED chip and the wiring board with built the varistor element is connected by a flip-chip.
18. —种LED部件的制造方法,包括:第一步骤,在布线基板上形成变阻器元件与贯通孔;第二步骤,在所述贯通孔的内部填充绝缘膏,所述绝缘膏以导热性填料为主要成分且以低熔点玻璃为无机粘结剂;第三步骤,通过烧制所述填充的绝缘膏形成散热板,且接合所述散热板与所述布线基板;第四步骤,在所述散热板的一面上形成具有用于安装LED芯片的电极焊盘的布线图案;第五步骤,将所述LED芯片凸点接合在所述电极焊盘上,以此并联连接所述LED芯片与所述变阻器元件;以及第六步骤,使用透明树脂埋设所述LED芯片。 18. - Method for manufacturing kinds of LED components, comprising: a first step of forming through holes in the varistor elements on the wiring substrate; a second step, inside the through hole filled with an insulating paste, the insulating paste to the thermally conductive filler as a main component and the low melting point glass in the inorganic binder; a third step, by firing the insulating paste filling the heat radiating plate is formed, with the printed circuit board and the radiator plate joined; a fourth step, the heat dissipation plate formed on one surface of a wiring pattern has an electrode pad for mounting the LED chip; a fifth step of the LED chip is bump-bonded on the electrode pad, thereby the LED chip connected in parallel with the said varistor element; and a sixth step of using the LED chip is embedded transparent resin.
19. 根据权利要求18所述的LED部件的制造方法,所述第一步骤中,在所述贯通孔的内周部形成锥形的反射面。 19. A method of producing an LED component according to claim 18, the first step, a conical reflecting surface formed in the inner circumferential portion of the through hole.
20. 根据权利要求19所述的LED部件的制造方法,所述第一步骤中,在所述反射面的表面进一步形成反射膜。 20. The method of manufacturing a LED component according to claim 19, in the first step, the reflective film is further formed on a surface of the reflective surface.
21. 根据权利要求18所述的LED部件的制造方法,所述第二步骤中,在所述散热板的一面形成凹部,在所述凹部的内周部形成锥形反射面。 21. The method of manufacturing a LED component according to claim 18, said second step, said heat dissipation plate is formed on one surface of the concave portion, a tapered inner peripheral portion of the reflecting surface of the concave portion.
22. 根据权利要求21所述的LED部件的制造方法,所述第二步骤中,在所述反射面的表面进一步形成反射膜。 22. A method of producing an LED component according to claim 21, in the second step, the reflection film is further formed on a surface of the reflective surface.
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