JP7159343B2 - 配線基板、複合基板および電気装置 - Google Patents
配線基板、複合基板および電気装置 Download PDFInfo
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- JP7159343B2 JP7159343B2 JP2020555575A JP2020555575A JP7159343B2 JP 7159343 B2 JP7159343 B2 JP 7159343B2 JP 2020555575 A JP2020555575 A JP 2020555575A JP 2020555575 A JP2020555575 A JP 2020555575A JP 7159343 B2 JP7159343 B2 JP 7159343B2
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- wiring board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
Description
D・・・・・・・複合基板
E・・・・・・・枠部材
E1・・・・・・開口部
F、H・・・・・電気装置
G・・・・・・・電気素子
1・・・・・・・基材
1b・・・・・・外周縁
1c・・・・・・内側
1d・・・・・・突出部
1da・・・・・第1面
1dd・・・・・突出部の側面
1f・・・・・・ベース部
1fa・・・・・ベース周縁部
1faa・・・・ベース周縁部の表面
3a・・・・・・外部接続端子
3d・・・・・・素子用接続端子
3as・・・・・外部接続端子の側面
Claims (11)
- 基材が、該基材の一方側に外部に向けて突出する突出部を有しており、
前記基材の前記突出部の主面を第1面、前記基材の前記第1面とは反対側の面をおもて面としたときに、
該突出部は前記第1面の中央部が外周縁より盛り上がり、凸状に湾曲した形状であり、
前記第1面に複数の外部接続端子が配置されており、
前記突出部の前記中央部における前記基材の前記おもて面から前記第1面までの距離は、前記基材の前記おもて面から前記外部接続端子が前記突出部と接している位置までの距離よりも長い、配線基板。 - 前記おもて面に複数の素子用接続端子を有しており、前記外部接続端子の個々の面積は前記素子用接続端子の個々の面積よりも小さい、請求項1に記載の配線基板。
- 前記外部接続端子は、側面が凸状または凹状に湾曲している、請求項1または2に記載の配線基板。
- 前記外部接続端子の前記外周縁側の厚みは、前記突出部の前記第1面における前記中央部側に位置する内側の厚みよりも厚い、請求項1乃至3のうちいずれかに記載の配線基板。
- 前記基材における前記突出部を除く部分をベース部とし、該ベース部の前記突出部の外側の部分をベース周縁部としたときに、該ベース周縁部の表面から前記突出部の側面につながる部位が凹状に湾曲している、請求項1乃至4のうちいずれかに記載の配線基板。
- 前記基材は、前記おもて面に凹部および凸部のうちの少なくとも一方を有している、請求項2乃至5のうちいずれかに記載の配線基板。
- 請求項1乃至6のうちいずれかに記載の配線基板と、金属製の枠部材と、を備えており、該枠部材は、前記基材を平面視したときに、前記突出部の形状に相当する開口部を有しており、前記枠部材は、前記開口部が前記突出部を囲みつつ、該突出部の周囲を埋めるように配置されている、複合基板。
- 前記枠部材の表面と前記第1面とは面一である、請求項7に記載の複合基板。
- 前記枠部材は、前記開口部の周囲に、該周囲を囲む、溝部または壁部を有する、請求項7または8に記載の複合基板。
- 請求項1乃至6のうちいずれかに記載の配線基板のおもて面に電気素子を備えている、電気装置。
- 請求項7乃至9のうちいずれかに記載の複合基板を構成している配線基板のおもて面に電気素子を備えている、電気装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018210660 | 2018-11-08 | ||
JP2018210660 | 2018-11-08 | ||
PCT/JP2019/043616 WO2020095980A1 (ja) | 2018-11-08 | 2019-11-07 | 配線基板、複合基板および電気装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020095980A1 JPWO2020095980A1 (ja) | 2021-10-21 |
JP7159343B2 true JP7159343B2 (ja) | 2022-10-24 |
Family
ID=70612075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020555575A Active JP7159343B2 (ja) | 2018-11-08 | 2019-11-07 | 配線基板、複合基板および電気装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11778747B2 (ja) |
EP (1) | EP3879565A4 (ja) |
JP (1) | JP7159343B2 (ja) |
CN (1) | CN112970103A (ja) |
WO (1) | WO2020095980A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001068592A (ja) | 1999-08-30 | 2001-03-16 | Sanken Electric Co Ltd | 半導体素子用支持板、半導体装置及び半導体装置実装体 |
JP2005032787A (ja) | 2003-07-08 | 2005-02-03 | Murata Mfg Co Ltd | セラミック配線基板及びその製造方法 |
JP2007042848A (ja) | 2005-08-03 | 2007-02-15 | Kyocera Corp | 配線基板、電気素子装置並びに複合基板 |
JP2009139758A (ja) | 2007-12-07 | 2009-06-25 | Ngk Spark Plug Co Ltd | 光電気混載パッケージ、光電気混載モジュール |
JP2009147010A (ja) | 2007-12-12 | 2009-07-02 | Ricoh Co Ltd | 配線構造体 |
JP2009281962A (ja) | 2008-05-26 | 2009-12-03 | Kyocera Corp | 回路基板およびプローブ端子付き回路基板 |
JP2012182382A (ja) | 2011-03-02 | 2012-09-20 | Sekisui Chem Co Ltd | 半導体チップ、半導体パッケージおよび半導体パッケージの製造方法 |
Family Cites Families (13)
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JP3055483B2 (ja) * | 1997-01-24 | 2000-06-26 | 日本電気株式会社 | 混成集積回路 |
US6428749B1 (en) * | 1999-12-15 | 2002-08-06 | Hitachi, Ltd. | Advanced thermal gradient DNA chip (ATGC), the substrate for ATGC, method for manufacturing for ATGC, method and apparatus for biochemical reaction, and storage medium |
US7940532B2 (en) * | 2004-03-10 | 2011-05-10 | PEI-Genesis, Inc. | Power conversion device frame packaging apparatus and methods |
EP1873131B1 (en) * | 2005-04-21 | 2014-07-16 | Murata Manufacturing Co., Ltd. | Process for producing ceramic substrate |
JP2007005246A (ja) * | 2005-06-27 | 2007-01-11 | Sumitomo Electric Ind Ltd | 多孔質樹脂基材及び多層基板 |
JP5091674B2 (ja) * | 2005-06-29 | 2012-12-05 | 株式会社東芝 | 段差を有するセラミックス基板の製造方法 |
JP4788581B2 (ja) * | 2006-12-06 | 2011-10-05 | 株式会社村田製作所 | 複合基板 |
US20140340107A1 (en) * | 2013-05-17 | 2014-11-20 | Expert International Mercantile Corporation | Bga test socket |
KR20160046187A (ko) * | 2014-10-20 | 2016-04-28 | 삼성전자주식회사 | 안테나 구조 및 그 안테나 구조를 갖는 전자 장치 |
JP2018010158A (ja) * | 2016-07-13 | 2018-01-18 | パナソニック液晶ディスプレイ株式会社 | 表示装置及び表示装置の組み立て方法 |
JP6624456B2 (ja) * | 2016-09-21 | 2019-12-25 | カシオ計算機株式会社 | 防水キャップおよび電子機器 |
-
2019
- 2019-11-07 WO PCT/JP2019/043616 patent/WO2020095980A1/ja unknown
- 2019-11-07 US US17/291,214 patent/US11778747B2/en active Active
- 2019-11-07 CN CN201980073173.7A patent/CN112970103A/zh active Pending
- 2019-11-07 JP JP2020555575A patent/JP7159343B2/ja active Active
- 2019-11-07 EP EP19881622.5A patent/EP3879565A4/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068592A (ja) | 1999-08-30 | 2001-03-16 | Sanken Electric Co Ltd | 半導体素子用支持板、半導体装置及び半導体装置実装体 |
JP2005032787A (ja) | 2003-07-08 | 2005-02-03 | Murata Mfg Co Ltd | セラミック配線基板及びその製造方法 |
JP2007042848A (ja) | 2005-08-03 | 2007-02-15 | Kyocera Corp | 配線基板、電気素子装置並びに複合基板 |
JP2009139758A (ja) | 2007-12-07 | 2009-06-25 | Ngk Spark Plug Co Ltd | 光電気混載パッケージ、光電気混載モジュール |
JP2009147010A (ja) | 2007-12-12 | 2009-07-02 | Ricoh Co Ltd | 配線構造体 |
JP2009281962A (ja) | 2008-05-26 | 2009-12-03 | Kyocera Corp | 回路基板およびプローブ端子付き回路基板 |
JP2012182382A (ja) | 2011-03-02 | 2012-09-20 | Sekisui Chem Co Ltd | 半導体チップ、半導体パッケージおよび半導体パッケージの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3879565A4 (en) | 2022-07-27 |
EP3879565A1 (en) | 2021-09-15 |
CN112970103A (zh) | 2021-06-15 |
US20210410286A1 (en) | 2021-12-30 |
WO2020095980A1 (ja) | 2020-05-14 |
US11778747B2 (en) | 2023-10-03 |
JPWO2020095980A1 (ja) | 2021-10-21 |
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