USD718258S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD718258S1
USD718258S1 US29/431,064 US201229431064F USD718258S US D718258 S1 USD718258 S1 US D718258S1 US 201229431064 F US201229431064 F US 201229431064F US D718258 S USD718258 S US D718258S
Authority
US
United States
Prior art keywords
led package
view
package
led
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/431,064
Inventor
Theodore Lowes
Eric J. Tarsa
Sten Heikman
Bernd Keller
John A. Edmond
Jesse Reiherzer
Hormoz Benjamin
Christopher P. Hussell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51902178&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=USD718258(S1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/431,064 priority Critical patent/USD718258S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUSSELL, CHRISTOPHER P., REIHERZER, JESSE, EDMOND, JOHN A., BENJAMIN, Hormoz, HEIKMAN, STEN, KELLER, BERND, LOWES, THEODORE, TARSA, ERIC J.
Priority to TW102308472F priority patent/TWD165762S/en
Priority to TW102301478F priority patent/TWD159498S/en
Application granted granted Critical
Publication of USD718258S1 publication Critical patent/USD718258S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of the first embodiment of an LED package;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevation view of one side thereof;
FIG. 4 is a side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top perspective view of the second embodiment of an LED package;
FIG. 8 is a bottom perspective view thereof;
FIG. 9 is a front elevation view of one side thereof;
FIG. 10 is a side elevation view thereof;
FIG. 11 is a top plan view thereof; and,
FIG. 12 is a bottom plan view thereof.
In the drawings, the broken lines depict unclaimed subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an LED package, as shown and described.
US29/431,064 2012-09-02 2012-09-02 LED package Active USD718258S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/431,064 USD718258S1 (en) 2012-09-02 2012-09-02 LED package
TW102308472F TWD165762S (en) 2012-09-02 2013-03-01 Part of led package
TW102301478F TWD159498S (en) 2012-09-02 2013-03-01 Led package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/431,064 USD718258S1 (en) 2012-09-02 2012-09-02 LED package

Publications (1)

Publication Number Publication Date
USD718258S1 true USD718258S1 (en) 2014-11-25

Family

ID=51902178

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/431,064 Active USD718258S1 (en) 2012-09-02 2012-09-02 LED package

Country Status (2)

Country Link
US (1) USD718258S1 (en)
TW (2) TWD165762S (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD731302S1 (en) * 2013-10-29 2015-06-09 Ice Ip S.A. Package
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
USD739231S1 (en) * 2014-09-16 2015-09-22 Direct Pack, Inc. Container
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip

Non-Patent Citations (17)

* Cited by examiner, † Cited by third party
Title
Cree® XLamp® MC-E LEDs Product Info Sheets. 14 pages.
Decision of Registration from Japanese Design Patent Application No. 2013-004502, dated Jun. 24, 2014.
Decision of Registration from Japanese Design Patent Application No. 2013-025955. dated Jun. 24, 2014.
Design of Registration Notice from Japanese Patent Appl. No. 2012-030304. dated Jan. 21, 2014.
Examination and Search Report from Taiwanese Patent Appl. No. 103300731, dated Jul. 21, 2014.
Examination Report from Taiwanese Patent Appl. No. 102301478. dated Sep. 6, 2013.
Examination Report from Taiwanese Patent appl. No. 102308472. dated May 14, 2014.
First Office Action from Chinese Design Patent appl. No. 201330524820.7. dated Feb. 20, 2014.
First Office Action from Chinese Patent Appl. No. 201330052393.7. dated Jan. 9, 2014.
Letter of Examination Report from Taiwanese Patent appl. No. 101307391, dated Jun. 5, 2013.
Nichia Corporation LEDs, Models NSSM016G, NSSM227, NESM026X, NSSM026BB, NESM005A. 9 pages.
Notice of Allowance and Search Report for Taiwanese Patent Appl. No. 101307391, dated Oct. 15, 2013.
Notice of Issuance of Chinese Patent Appl. No. 201430021459.0. dated May 21, 2014.
Notice to Submit a Response from Korean Design Appl. No. 30-2012-0059744 dated Apr. 28, 2014.
Notice to Submit a Response from Korean Patent Appl. No. 30-2012-0059744, dated Nov. 26, 2013.
Office Action from Korean Patent Design Appl. No. 30-2013-0010610, dated Jul. 8, 2014.
U.S. Appl. No. 29/412,854, filed Mar. 2012, Leung, et al.

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD738832S1 (en) * 2006-04-04 2015-09-15 Cree, Inc. Light emitting diode (LED) package
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US11004890B2 (en) 2012-03-30 2021-05-11 Creeled, Inc. Substrate based light emitter devices, components, and related methods
USD731302S1 (en) * 2013-10-29 2015-06-09 Ice Ip S.A. Package
USD739231S1 (en) * 2014-09-16 2015-09-22 Direct Pack, Inc. Container
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package

Also Published As

Publication number Publication date
TWD159498S (en) 2014-03-21
TWD165762S (en) 2015-02-01

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