USD1000400S1 - Light emitting diode package - Google Patents

Light emitting diode package Download PDF

Info

Publication number
USD1000400S1
USD1000400S1 US29/779,119 US202129779119F USD1000400S US D1000400 S1 USD1000400 S1 US D1000400S1 US 202129779119 F US202129779119 F US 202129779119F US D1000400 S USD1000400 S US D1000400S
Authority
US
United States
Prior art keywords
light emitting
emitting diode
diode package
view
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/779,119
Inventor
Robert Wilcox
Sarah Trinkle
Kyle Damborsky
Colin Blakely
Ayush Tripathi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creeled Inc
Original Assignee
Creeled Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creeled Inc filed Critical Creeled Inc
Priority to US29/779,119 priority Critical patent/USD1000400S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BLAKELY, Colin, WILCOX, ROBERT, DAMBORSKY, Kyle, TRINKLE, SARAH, TRIPATHI, Ayush
Priority to TW111301994F priority patent/TWD227754S/en
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Application granted granted Critical
Publication of USD1000400S1 publication Critical patent/USD1000400S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of the light emitting diode package;
FIG. 2 is a top view of the light emitting diode package of FIG. 1 ;
FIG. 3 is a bottom view of the light emitting diode package of FIG. 1 ;
FIG. 4 is a side view of the light emitting diode package of FIG. 1 ;
FIG. 5 is an opposing side view of the light emitting diode package of FIG. 1 ;
FIG. 6 is an end view of the light emitting diode package of FIG. 1 ;
FIG. 7 is an opposing end view of the light emitting diode package of FIG. 1 ; and,
FIG. 8 is a bottom perspective view of the light emitting diode package of FIG. 1 .
The broken lines shown in the drawings depict portions of the light emitting diode package that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a light emitting diode package, as shown and described.
US29/779,119 2021-04-16 2021-04-16 Light emitting diode package Active USD1000400S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/779,119 USD1000400S1 (en) 2021-04-16 2021-04-16 Light emitting diode package
TW111301994F TWD227754S (en) 2021-04-16 2021-10-04 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/779,119 USD1000400S1 (en) 2021-04-16 2021-04-16 Light emitting diode package

Publications (1)

Publication Number Publication Date
USD1000400S1 true USD1000400S1 (en) 2023-10-03

Family

ID=88149866

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/779,119 Active USD1000400S1 (en) 2021-04-16 2021-04-16 Light emitting diode package

Country Status (2)

Country Link
US (1) USD1000400S1 (en)
TW (1) TWD227754S (en)

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6084679A (en) * 1999-04-02 2000-07-04 Advanced Micro Devices, Inc. Universal alignment marks for semiconductor defect capture and analysis
US20020036356A1 (en) * 2000-09-28 2002-03-28 Takayuki Teshima Microstructure array, mold for forming a microstructure array, and method of fabricating the same
US20050250291A1 (en) * 2004-05-06 2005-11-10 Pary Baluswamy Methods for clearing alignment markers useable in semiconductor lithography
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD656906S1 (en) 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
US20120126257A1 (en) * 2010-11-22 2012-05-24 Jesse Colin Reiherzer Light emitting devices and methods
US8242514B2 (en) * 2008-12-09 2012-08-14 Samsung Led Co., Ltd. Semiconductor light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
US8415260B2 (en) * 2010-04-08 2013-04-09 International Business Machines Corporation Chip identification for organic laminate packaging and methods of manufacture
USD691973S1 (en) 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD698322S1 (en) * 2012-07-05 2014-01-28 Toyoda Gosei Co., Ltd. Light emitting diode
USD703348S1 (en) * 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD709041S1 (en) * 2013-05-29 2014-07-15 Lextar Electronics Corporation Light emitting diode package
USD709464S1 (en) 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
USD711840S1 (en) 2012-06-11 2014-08-26 Cree, Inc. LED package
USD718258S1 (en) 2012-09-02 2014-11-25 Cree, Inc. LED package
US8901715B1 (en) * 2013-07-05 2014-12-02 Infineon Technologies Ag Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking
USD718725S1 (en) 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
TWD170851S (en) 2013-12-30 2015-10-01 克里股份有限公司 Portion of light emitting diode (led) package
US20150311414A1 (en) * 2014-04-23 2015-10-29 Lite-On Opto Technology (Changzhou) Co., Ltd. Led carrier and manufacturing method thereof
US20150311249A1 (en) * 2014-04-23 2015-10-29 Lite-On Opto Technology (Changzhou) Co., Ltd. Chip-scale packaged led device
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD794583S1 (en) * 2015-05-20 2017-08-15 Citizen Electronics Co., Ltd. Light emitting diode
US20170243831A1 (en) * 2016-02-18 2017-08-24 Texas Instruments Incorporated Visual identification of semiconductor dies
US20180094799A1 (en) * 2016-10-03 2018-04-05 Luminus, Inc. Color Tunable LED Assembly
US20180286841A1 (en) * 2017-03-21 2018-10-04 Light to Form LLC Variable Resistance LED Device and Method
US20190164901A1 (en) * 2018-04-02 2019-05-30 Kunshan Go-Visionox Opto-Electronics Co., Ltd. Array substrate, chip on film, and alignment method
US10439112B2 (en) * 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US20190355783A1 (en) * 2017-01-25 2019-11-21 Solar Luce Co., Ltd. Led module
US20200176507A1 (en) * 2018-11-29 2020-06-04 Cree, Inc. Indicia for light emitting diode chips
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6084679A (en) * 1999-04-02 2000-07-04 Advanced Micro Devices, Inc. Universal alignment marks for semiconductor defect capture and analysis
US20020036356A1 (en) * 2000-09-28 2002-03-28 Takayuki Teshima Microstructure array, mold for forming a microstructure array, and method of fabricating the same
US20050250291A1 (en) * 2004-05-06 2005-11-10 Pary Baluswamy Methods for clearing alignment markers useable in semiconductor lithography
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD671661S1 (en) 2008-01-10 2012-11-27 Cree Hong Kong Limited LED package
USD656906S1 (en) 2008-01-10 2012-04-03 Cree Hong Kong Limited LED package
US8242514B2 (en) * 2008-12-09 2012-08-14 Samsung Led Co., Ltd. Semiconductor light emitting diode
US8415260B2 (en) * 2010-04-08 2013-04-09 International Business Machines Corporation Chip identification for organic laminate packaging and methods of manufacture
US20120126257A1 (en) * 2010-11-22 2012-05-24 Jesse Colin Reiherzer Light emitting devices and methods
USD691973S1 (en) 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD709464S1 (en) 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
US10439112B2 (en) * 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD711840S1 (en) 2012-06-11 2014-08-26 Cree, Inc. LED package
USD698322S1 (en) * 2012-07-05 2014-01-28 Toyoda Gosei Co., Ltd. Light emitting diode
USD703348S1 (en) * 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD718258S1 (en) 2012-09-02 2014-11-25 Cree, Inc. LED package
USD709041S1 (en) * 2013-05-29 2014-07-15 Lextar Electronics Corporation Light emitting diode package
US8901715B1 (en) * 2013-07-05 2014-12-02 Infineon Technologies Ag Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking
USD718725S1 (en) 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD746240S1 (en) 2013-12-30 2015-12-29 Cree, Inc. LED package
TWD170851S (en) 2013-12-30 2015-10-01 克里股份有限公司 Portion of light emitting diode (led) package
US20150311414A1 (en) * 2014-04-23 2015-10-29 Lite-On Opto Technology (Changzhou) Co., Ltd. Led carrier and manufacturing method thereof
US20150311249A1 (en) * 2014-04-23 2015-10-29 Lite-On Opto Technology (Changzhou) Co., Ltd. Chip-scale packaged led device
USD790486S1 (en) 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD794583S1 (en) * 2015-05-20 2017-08-15 Citizen Electronics Co., Ltd. Light emitting diode
USD783547S1 (en) 2015-06-04 2017-04-11 Cree, Inc. LED package
US20170243831A1 (en) * 2016-02-18 2017-08-24 Texas Instruments Incorporated Visual identification of semiconductor dies
US20180094799A1 (en) * 2016-10-03 2018-04-05 Luminus, Inc. Color Tunable LED Assembly
US20190355783A1 (en) * 2017-01-25 2019-11-21 Solar Luce Co., Ltd. Led module
US20180286841A1 (en) * 2017-03-21 2018-10-04 Light to Form LLC Variable Resistance LED Device and Method
US20190164901A1 (en) * 2018-04-02 2019-05-30 Kunshan Go-Visionox Opto-Electronics Co., Ltd. Array substrate, chip on film, and alignment method
US20200176507A1 (en) * 2018-11-29 2020-06-04 Cree, Inc. Indicia for light emitting diode chips
US11145689B2 (en) * 2018-11-29 2021-10-12 Creeled, Inc. Indicia for light emitting diode chips
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Examination Report for Taiwanese Patent Application No. 110305363, dated Jan. 25, 2022, 6 pages.
Examination Report for Taiwanese Patent Application No. 111301994, dated Sep. 30, 2022, 6 pages.
Reasons for Rejection for Taiwanese Patent Application No. 110305363, dated Jul. 5, 2022, 5 pages.

Also Published As

Publication number Publication date
TWD227754S (en) 2023-10-01

Similar Documents

Publication Publication Date Title
USD902448S1 (en) Light emitting diode package
USD901060S1 (en) Housing for light emitting diodes
USD977703S1 (en) Light diffuser
USD970095S1 (en) Light diffuser
USD970094S1 (en) Light diffuser
USD910212S1 (en) Light bulb
USD976475S1 (en) Light diffuser
USD910887S1 (en) Light bulb
USD933281S1 (en) Under cabinet light
USD970093S1 (en) Light diffuser
USD930877S1 (en) 8 hole LED laser light
USD930213S1 (en) 6 hole LED laser light
USD945656S1 (en) LED lamp
USD926714S1 (en) Light emitting diode package
USD994999S1 (en) Leash
USD910211S1 (en) Light bulb
USD910888S1 (en) Light bulb
USD900355S1 (en) Optical module with at least one light emitting diode (LED)
USD982445S1 (en) Grooved container
USD955626S1 (en) Light fixture
USD919130S1 (en) Optical module with LED emitting white-colored light
USD1000400S1 (en) Light emitting diode package
USD965196S1 (en) Light
USD1013926S1 (en) Light fixture
USD966208S1 (en) Light emitting diode

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY