USD1000400S1 - Light emitting diode package - Google Patents
Light emitting diode package Download PDFInfo
- Publication number
- USD1000400S1 USD1000400S1 US29/779,119 US202129779119F USD1000400S US D1000400 S1 USD1000400 S1 US D1000400S1 US 202129779119 F US202129779119 F US 202129779119F US D1000400 S USD1000400 S US D1000400S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
- diode package
- view
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines shown in the drawings depict portions of the light emitting diode package that form no part of the claimed design.
Claims (1)
- The ornamental design for a light emitting diode package, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/779,119 USD1000400S1 (en) | 2021-04-16 | 2021-04-16 | Light emitting diode package |
TW111301994F TWD227754S (en) | 2021-04-16 | 2021-10-04 | Light emitting diode package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/779,119 USD1000400S1 (en) | 2021-04-16 | 2021-04-16 | Light emitting diode package |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1000400S1 true USD1000400S1 (en) | 2023-10-03 |
Family
ID=88149866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/779,119 Active USD1000400S1 (en) | 2021-04-16 | 2021-04-16 | Light emitting diode package |
Country Status (2)
Country | Link |
---|---|
US (1) | USD1000400S1 (en) |
TW (1) | TWD227754S (en) |
Citations (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6084679A (en) * | 1999-04-02 | 2000-07-04 | Advanced Micro Devices, Inc. | Universal alignment marks for semiconductor defect capture and analysis |
US20020036356A1 (en) * | 2000-09-28 | 2002-03-28 | Takayuki Teshima | Microstructure array, mold for forming a microstructure array, and method of fabricating the same |
US20050250291A1 (en) * | 2004-05-06 | 2005-11-10 | Pary Baluswamy | Methods for clearing alignment markers useable in semiconductor lithography |
US20090108281A1 (en) * | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
USD656906S1 (en) | 2008-01-10 | 2012-04-03 | Cree Hong Kong Limited | LED package |
US20120126257A1 (en) * | 2010-11-22 | 2012-05-24 | Jesse Colin Reiherzer | Light emitting devices and methods |
US8242514B2 (en) * | 2008-12-09 | 2012-08-14 | Samsung Led Co., Ltd. | Semiconductor light emitting diode |
USD675169S1 (en) * | 2011-12-13 | 2013-01-29 | Lextar Electronics Corp. | Multi-chip LED |
US8415260B2 (en) * | 2010-04-08 | 2013-04-09 | International Business Machines Corporation | Chip identification for organic laminate packaging and methods of manufacture |
USD691973S1 (en) | 2011-07-08 | 2013-10-22 | Cree, Inc. | Lamp packages |
USD698322S1 (en) * | 2012-07-05 | 2014-01-28 | Toyoda Gosei Co., Ltd. | Light emitting diode |
USD703348S1 (en) * | 2012-07-09 | 2014-04-22 | Cree, Inc. | Lamp package |
USD709041S1 (en) * | 2013-05-29 | 2014-07-15 | Lextar Electronics Corporation | Light emitting diode package |
USD709464S1 (en) | 2012-05-31 | 2014-07-22 | Cree, Inc. | Light emitting diode (LED) package |
USD711840S1 (en) | 2012-06-11 | 2014-08-26 | Cree, Inc. | LED package |
USD718258S1 (en) | 2012-09-02 | 2014-11-25 | Cree, Inc. | LED package |
US8901715B1 (en) * | 2013-07-05 | 2014-12-02 | Infineon Technologies Ag | Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking |
USD718725S1 (en) | 2013-08-01 | 2014-12-02 | Cree, Inc. | LED package with encapsulant |
TWD170851S (en) | 2013-12-30 | 2015-10-01 | 克里股份有限公司 | Portion of light emitting diode (led) package |
US20150311414A1 (en) * | 2014-04-23 | 2015-10-29 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Led carrier and manufacturing method thereof |
US20150311249A1 (en) * | 2014-04-23 | 2015-10-29 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Chip-scale packaged led device |
USD777122S1 (en) * | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
USD794583S1 (en) * | 2015-05-20 | 2017-08-15 | Citizen Electronics Co., Ltd. | Light emitting diode |
US20170243831A1 (en) * | 2016-02-18 | 2017-08-24 | Texas Instruments Incorporated | Visual identification of semiconductor dies |
US20180094799A1 (en) * | 2016-10-03 | 2018-04-05 | Luminus, Inc. | Color Tunable LED Assembly |
US20180286841A1 (en) * | 2017-03-21 | 2018-10-04 | Light to Form LLC | Variable Resistance LED Device and Method |
US20190164901A1 (en) * | 2018-04-02 | 2019-05-30 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Array substrate, chip on film, and alignment method |
US10439112B2 (en) * | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
US20190355783A1 (en) * | 2017-01-25 | 2019-11-21 | Solar Luce Co., Ltd. | Led module |
US20200176507A1 (en) * | 2018-11-29 | 2020-06-04 | Cree, Inc. | Indicia for light emitting diode chips |
USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
-
2021
- 2021-04-16 US US29/779,119 patent/USD1000400S1/en active Active
- 2021-10-04 TW TW111301994F patent/TWD227754S/en unknown
Patent Citations (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6084679A (en) * | 1999-04-02 | 2000-07-04 | Advanced Micro Devices, Inc. | Universal alignment marks for semiconductor defect capture and analysis |
US20020036356A1 (en) * | 2000-09-28 | 2002-03-28 | Takayuki Teshima | Microstructure array, mold for forming a microstructure array, and method of fabricating the same |
US20050250291A1 (en) * | 2004-05-06 | 2005-11-10 | Pary Baluswamy | Methods for clearing alignment markers useable in semiconductor lithography |
US20090108281A1 (en) * | 2007-10-31 | 2009-04-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
USD671661S1 (en) | 2008-01-10 | 2012-11-27 | Cree Hong Kong Limited | LED package |
USD656906S1 (en) | 2008-01-10 | 2012-04-03 | Cree Hong Kong Limited | LED package |
US8242514B2 (en) * | 2008-12-09 | 2012-08-14 | Samsung Led Co., Ltd. | Semiconductor light emitting diode |
US8415260B2 (en) * | 2010-04-08 | 2013-04-09 | International Business Machines Corporation | Chip identification for organic laminate packaging and methods of manufacture |
US20120126257A1 (en) * | 2010-11-22 | 2012-05-24 | Jesse Colin Reiherzer | Light emitting devices and methods |
USD691973S1 (en) | 2011-07-08 | 2013-10-22 | Cree, Inc. | Lamp packages |
USD675169S1 (en) * | 2011-12-13 | 2013-01-29 | Lextar Electronics Corp. | Multi-chip LED |
USD709464S1 (en) | 2012-05-31 | 2014-07-22 | Cree, Inc. | Light emitting diode (LED) package |
US10439112B2 (en) * | 2012-05-31 | 2019-10-08 | Cree, Inc. | Light emitter packages, systems, and methods having improved performance |
USD711840S1 (en) | 2012-06-11 | 2014-08-26 | Cree, Inc. | LED package |
USD698322S1 (en) * | 2012-07-05 | 2014-01-28 | Toyoda Gosei Co., Ltd. | Light emitting diode |
USD703348S1 (en) * | 2012-07-09 | 2014-04-22 | Cree, Inc. | Lamp package |
USD718258S1 (en) | 2012-09-02 | 2014-11-25 | Cree, Inc. | LED package |
USD709041S1 (en) * | 2013-05-29 | 2014-07-15 | Lextar Electronics Corporation | Light emitting diode package |
US8901715B1 (en) * | 2013-07-05 | 2014-12-02 | Infineon Technologies Ag | Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking |
USD718725S1 (en) | 2013-08-01 | 2014-12-02 | Cree, Inc. | LED package with encapsulant |
USD746240S1 (en) | 2013-12-30 | 2015-12-29 | Cree, Inc. | LED package |
TWD170851S (en) | 2013-12-30 | 2015-10-01 | 克里股份有限公司 | Portion of light emitting diode (led) package |
US20150311414A1 (en) * | 2014-04-23 | 2015-10-29 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Led carrier and manufacturing method thereof |
US20150311249A1 (en) * | 2014-04-23 | 2015-10-29 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Chip-scale packaged led device |
USD790486S1 (en) | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
USD777122S1 (en) * | 2015-02-27 | 2017-01-24 | Cree, Inc. | LED package |
USD794583S1 (en) * | 2015-05-20 | 2017-08-15 | Citizen Electronics Co., Ltd. | Light emitting diode |
USD783547S1 (en) | 2015-06-04 | 2017-04-11 | Cree, Inc. | LED package |
US20170243831A1 (en) * | 2016-02-18 | 2017-08-24 | Texas Instruments Incorporated | Visual identification of semiconductor dies |
US20180094799A1 (en) * | 2016-10-03 | 2018-04-05 | Luminus, Inc. | Color Tunable LED Assembly |
US20190355783A1 (en) * | 2017-01-25 | 2019-11-21 | Solar Luce Co., Ltd. | Led module |
US20180286841A1 (en) * | 2017-03-21 | 2018-10-04 | Light to Form LLC | Variable Resistance LED Device and Method |
US20190164901A1 (en) * | 2018-04-02 | 2019-05-30 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Array substrate, chip on film, and alignment method |
US20200176507A1 (en) * | 2018-11-29 | 2020-06-04 | Cree, Inc. | Indicia for light emitting diode chips |
US11145689B2 (en) * | 2018-11-29 | 2021-10-12 | Creeled, Inc. | Indicia for light emitting diode chips |
USD926714S1 (en) * | 2019-10-30 | 2021-08-03 | Creeled, Inc. | Light emitting diode package |
Non-Patent Citations (3)
Title |
---|
Examination Report for Taiwanese Patent Application No. 110305363, dated Jan. 25, 2022, 6 pages. |
Examination Report for Taiwanese Patent Application No. 111301994, dated Sep. 30, 2022, 6 pages. |
Reasons for Rejection for Taiwanese Patent Application No. 110305363, dated Jul. 5, 2022, 5 pages. |
Also Published As
Publication number | Publication date |
---|---|
TWD227754S (en) | 2023-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |