|
US6084679A
(en)
*
|
1999-04-02 |
2000-07-04 |
Advanced Micro Devices, Inc. |
Universal alignment marks for semiconductor defect capture and analysis
|
|
US6506623B2
(en)
*
|
2000-09-28 |
2003-01-14 |
Canon Kabushiki Kaisha |
Microstructure array, mold for forming a microstructure array, and method of fabricating the same
|
|
US20050250291A1
(en)
*
|
2004-05-06 |
2005-11-10 |
Pary Baluswamy |
Methods for clearing alignment markers useable in semiconductor lithography
|
|
US9070850B2
(en)
*
|
2007-10-31 |
2015-06-30 |
Cree, Inc. |
Light emitting diode package and method for fabricating same
|
|
USD615504S1
(en)
|
2007-10-31 |
2010-05-11 |
Cree, Inc. |
Emitter package
|
|
USD634863S1
(en)
|
2008-01-10 |
2011-03-22 |
Cree Hong Kong Limited |
Light source of light emitting diode
|
|
KR101123010B1
(en)
*
|
2008-12-09 |
2012-06-15 |
삼성엘이디 주식회사 |
semi-conductor light emitting device and manufacturing method thereof
|
|
US8415260B2
(en)
*
|
2010-04-08 |
2013-04-09 |
International Business Machines Corporation |
Chip identification for organic laminate packaging and methods of manufacture
|
|
US8624271B2
(en)
*
|
2010-11-22 |
2014-01-07 |
Cree, Inc. |
Light emitting devices
|
|
USD691973S1
(en)
|
2011-07-08 |
2013-10-22 |
Cree, Inc. |
Lamp packages
|
|
TWD157836S
(en)
|
2011-09-23 |
2013-12-11 |
克立公司 |
Lamp packages
|
|
USD675169S1
(en)
*
|
2011-12-13 |
2013-01-29 |
Lextar Electronics Corp. |
Multi-chip LED
|
|
TWD159849S
(en)
|
2012-03-30 |
2014-04-11 |
克里股份有限公司 |
Portion of a light emitting device (1)
|
|
USD709464S1
(en)
|
2012-05-31 |
2014-07-22 |
Cree, Inc. |
Light emitting diode (LED) package
|
|
US10439112B2
(en)
*
|
2012-05-31 |
2019-10-08 |
Cree, Inc. |
Light emitter packages, systems, and methods having improved performance
|
|
USD711840S1
(en)
|
2012-06-11 |
2014-08-26 |
Cree, Inc. |
LED package
|
|
USD698322S1
(en)
*
|
2012-07-05 |
2014-01-28 |
Toyoda Gosei Co., Ltd. |
Light emitting diode
|
|
USD703348S1
(en)
*
|
2012-07-09 |
2014-04-22 |
Cree, Inc. |
Lamp package
|
|
USD718258S1
(en)
|
2012-09-02 |
2014-11-25 |
Cree, Inc. |
LED package
|
|
USD709041S1
(en)
*
|
2013-05-29 |
2014-07-15 |
Lextar Electronics Corporation |
Light emitting diode package
|
|
US8901715B1
(en)
*
|
2013-07-05 |
2014-12-02 |
Infineon Technologies Ag |
Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking
|
|
USD718725S1
(en)
|
2013-08-01 |
2014-12-02 |
Cree, Inc. |
LED package with encapsulant
|
|
USD746240S1
(en)
|
2013-12-30 |
2015-12-29 |
Cree, Inc. |
LED package
|
|
US9412724B2
(en)
*
|
2014-04-23 |
2016-08-09 |
Lite-On Opto Technology (Changzhou) Co., Ltd. |
Chip-scale packaged LED device
|
|
CN105023987B
(en)
*
|
2014-04-23 |
2018-01-09 |
光宝光电(常州)有限公司 |
LED load bearing seats and its manufacture method
|
|
USD790486S1
(en)
|
2014-09-30 |
2017-06-27 |
Cree, Inc. |
LED package with truncated encapsulant
|
|
USD777122S1
(en)
*
|
2015-02-27 |
2017-01-24 |
Cree, Inc. |
LED package
|
|
USD786809S1
(en)
*
|
2015-05-20 |
2017-05-16 |
Citizen Electronics Co., Ltd. |
Light emitting diode
|
|
USD783547S1
(en)
|
2015-06-04 |
2017-04-11 |
Cree, Inc. |
LED package
|
|
US9899332B2
(en)
*
|
2016-02-18 |
2018-02-20 |
Texas Instruments Incorporated |
Visual identification of semiconductor dies
|
|
US10236420B2
(en)
*
|
2016-10-03 |
2019-03-19 |
Luminus, Inc. |
Color tunable LED assembly
|
|
WO2018139687A1
(en)
*
|
2017-01-25 |
2018-08-02 |
주식회사 에스엘네트웍스 |
Led module
|
|
US20180286841A1
(en)
*
|
2017-03-21 |
2018-10-04 |
Light to Form LLC |
Variable Resistance LED Device and Method
|
|
US10964644B2
(en)
*
|
2018-04-02 |
2021-03-30 |
Kunshan Go-Visionox Opto-Electronics Co., Ltd. |
Array substrate, chip on film, and alignment method
|
|
US11145689B2
(en)
*
|
2018-11-29 |
2021-10-12 |
Creeled, Inc. |
Indicia for light emitting diode chips
|
|
USD926714S1
(en)
*
|
2019-10-30 |
2021-08-03 |
Creeled, Inc. |
Light emitting diode package
|
