TWI304659B - Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device - Google Patents

Description

1. The present invention relates to a light-emitting element mounting substrate for mounting a light-emitting diode (hereinafter referred to as 5 LED) and a method of manufacturing the same, and mounting a light-emitting element on the substrate The packaged light-emitting element module, the method of manufacturing the same, the display device using the light-emitting element module, the illumination device, and the traffic signal. BACKGROUND OF THE INVENTION 10 Light-emitting device modules packaged by mounting a light-emitting element such as led

In order to miniaturize the package structure, the surface package type packet structure shown in Fig. 1 is used. The light-emitting element module is provided with a concave portion formed by a resin or ceramic substrate (4), and positive and negative electrodes 4 and 4 are disposed on the bottom surface of the concave portion, and the light-emitting element is electrically connected to one of the electrodes 4 by a conductive paste or the like. And I5 is fixed. The upper side of the light-emitting element 1 is electrically connected to the other electrode 4 by a wire 2 such as a gold wire. The electrodes 4, 4 are extended outside the substrate. After the light-emitting element 1 is mounted, the encapsulating resin 5 having a high light transmittance of 4, such as an epoxy resin, is filled in the concave portion to be hardened, and the light-emitting element is packaged. In particular, when it is white led, the light-emitting element is a blue LED, and a blue-emitting yellow-emitting phosphor is mixed in the encapsulating resin, and is similarly filled in the reflective concave portion. Further, the use of a plurality of light-emitting elements mounted on the same substrate has hitherto been made up of a dot matrix unit of a lighting device or a display device. In the material device, a plurality of light-emitting elements such as LEDs can be mounted, and a plurality of light-emitting elements are mounted on a Bolivia-reinforced epoxy resin substrate, and the product is molded into a body. A substrate for this 1,304,659 LED unit is disclosed in Patent Document 1. Such a LED unit has a structure in which a large number of bullet-type LEDs are mounted on the electronic substrate, or a configuration in which a plurality of surface mount type LEDs are mounted. In order to make this unit, it is necessary to make a shell-type silk wire type 5 LED, and connect it to an electronic substrate having an electronic circuit pattern as needed. Therefore, a two-stage product program of a bullet-type or surface-mount type of coffee and a LED unit to be composited is required. In recent years, in the manufacture of a light-emitting element module such as an LED unit, the light-emitting element is directly mounted on an electronic substrate. A method called substrate wafer soldering (10) ip on ad) has been the mainstream. This method has the advantages that the above-described half-product program is not required and the structure can be simplified because the light-emitting element is directly mounted. On the other hand, when a light-emitting element such as an LED is mounted on a substrate, it is necessary to have a packet structure having a reflecting cup portion which is a concave surface of the inclined reflecting surface in order to direct the light emitting direction toward the front. The shape of the reflecting cup portion also has a function of controlling the light-emitting state and maintaining the resin of the packaged light-emitting element. Further, with the high luminous intensity of the light-emitting element in recent years, it is extremely important to have a function of dissipating heat dissipation of the electronic substrate on which the light-emitting element is mounted. There is a clock in these requirements, as shown in Fig. 11, the structure of the substrate on which the insulating layer 7 is provided on the political hot metal 8 such as an aluminum plate or a copper plate 20 is the mainstream. The LED unit of FIG. 11 is configured such that an insulating layer 7 is disposed on the heat dissipating metal plate 8, and a plurality of electrodes 4 are disposed on the insulating layer 7, and the light emitting elements 1 ' & The electrode is electrically connected to the upper side of the light-emitting element ,, and the reflecting plate 6 having the plurality of holes having the inclined surface portion 6a is placed, and the light-emitting elements are placed 1304659 in the center of the concave portion, and the sealing resin 5 is filled in each hole. Hardened, and the light-emitting element 1 is packaged. Further, Fig. 12 is a plan view showing the state in which the light-emitting element is mounted on the substrate. This configuration is disclosed in Patent Document 2. Further, the image of the electrode at this time is shown in Fig. 13, and the structure of the electric circuit is shown in Fig. 14. Further, the light-emitting element module of the substrate wafer soldering method is generally produced through the following steps. 1. When the light-emitting element is made of silver paste on the electrode in the reflecting cup portion of the substrate, or when the electrode material of the light-emitting element is made of AuSn or the like, the connection of heating and vibration 10 is given, and the so-called eutectic mounting is adopted to electrically conduct. . Furthermore, the electrodes of the opposite pole are connected by wire bonding. Only one of the light-emitting elements having electrodes is wired to the positive and negative electrodes. Further, the light-emitting element having the electrode only on the surface of the mold may be connected by a chip which is formed of gold or the like by being placed on the electrode. 15 2. The encapsulating resin is filled in the reflecting cup portion, and is hardened by hardening or the like by heat curing or the like. When the produced light-emitting element module is a white LED module, the encapsulating resin before curing is mixed with the phosphor in advance. 3. A lens body made of resin, glass, or the like may be provided above the package resin and above the light-emitting element module as needed. On the other hand, when the light-emitting element is directly mounted on the substrate without providing the reflective cup portion, there is also a method of providing the electrode 12 on the flat substrate 11 on the electrode 12 as shown in FIG. The light-emitting element 9 and the wire 1 are mounted in the same manner as described above, and the package tree 1304659 grease 13 is molded by a transfer molding method, and the light-emitting element 9 and the wire are covered with a resin. However, in this method, the sealing resin 13 is not easily applied to the correct position due to the dimensional tolerance of the substrate, etc., and in the case of a white LED, since the phosphor is mixed with the encapsulating resin 13, the encapsulating resin 13 is used. When the shape is unstable, the light emitted from the light-emitting element 9 is deviated by the distance in the encapsulating resin 13 containing the phosphor, and the desired chromaticity is not easily controlled.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-332768 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2001-332769 No. 3 SUMMARY OF THE INVENTION The foregoing prior art has the following problems. In the surface-package type package structure, it is necessary to pass the electrodes through the inner portion of the substrate and to assemble the members by laminating them. Although the heat dissipation property of the Is laminated substrate or the nitrided substrate is sufficient, it is sufficient to form a reflecting cup shape, and the base material for reflecting the cup portion needs to be laminated on the substrate in the same manner as described above. In particular, when heat dissipation is important, it is needless to say that the material constituting the substrate is suitable from the viewpoint of thermal conductivity, and when the metal is used as the substrate, since it has electrical conductivity, it is necessary to perform insulation treatment between the electrode and the substrate. This insulating plate also becomes one of the elements in the laminated structure, and the structure is more complicated. The assembly of the base material for forming a reflecting cup portion is usually performed by an adhesive or heat and pressure, and the base material for forming the reflecting cup portion is caused by the low smoothness of the substrate or the uneven coating of the adhesive required for assembly. A gap is formed between the substrates, which is associated with the generation of bubbles when the encapsulating resin is subsequently added to the cup portion. When the package 1304659 • there is a bubble remaining in the resin, the light from the light-emitting element is largely scattered, and the extraction efficiency of the light of the light-emitting element is greatly reduced. Further, it is necessary to separately prepare a substrate for forming a reflecting cup portion which is separated from the substrate, and an additional step is required for assembly, which causes a problem of an increase in cost. In view of the above problems, the present invention provides a light-emitting element package substrate which is excellent in light extraction efficiency of a light-emitting element and can be produced at low cost, a method for manufacturing the same, a light-emitting element module in which a light-emitting element is mounted on the substrate, and a light-emitting element module thereof. The method, the display device, the illumination device and the traffic signal device of the light-emitting element module are used. In order to achieve the above object, the present invention provides a substrate for mounting a light-emitting element, which is provided with a thickness of 50 μm to 200 μm in a core metal surface provided with a reflecting cup portion for reflecting light emitted from a light-emitting element mounted in a certain direction.珐琅 layer. In the substrate for mounting a light-emitting element of the present invention, a groove is preferably provided on the periphery of the bottom of the reflecting cup portion 15. Further, the present invention provides a light-emitting element module in which a light-emitting element is mounted on a substrate for mounting a light-emitting element of the present invention, and the light-emitting element is encapsulated with a transparent sealing resin. In the light-emitting element module of the present invention, the light-emitting element is preferably a white light-emitting diode that emits white light by mixing the phosphor in the package tree for 20 months. Moreover, the present invention provides a method of manufacturing a substrate for mounting a light-emitting element, wherein a reflective cup portion for reflecting light emitted from the mounted light-emitting element in a certain direction is formed at a predetermined position of the core metal, and then on the surface of the core metal After the coffin was applied, it was sintered to obtain a mounting substrate for a light-emitting element having a thickness of 50 μm to 200 μm in the surface of 1304659 of the core metal. In the method for producing a substrate for mounting a light-emitting element of the present invention, it is preferable to plate a material mainly composed of glass on the surface of the core metal, and then to sinter it. Further, the present invention provides a method of manufacturing a light-emitting element module, which is formed at a predetermined position of a core metal to form a reflecting cup portion for reflecting light emitted from a light-emitting element mounted in a direction, and then on a surface of the core metal After the coffin is applied, it is sintered, and a substrate for mounting a light-emitting element having a thickness of 50 μm to 200 μm in thickness is formed on the surface of the metal, and an electrode is formed on the surface of the substrate for mounting the light-emitting element. Then, a light-emitting element is mounted on the electrode at the central portion of the reflector cup portion, and each electrode is electrically connected to the light-emitting element. Then, the resin is filled and sealed in the reflector cup portion, and the light-emitting element is packaged to fabricate the light-emitting element module. In the method of manufacturing a light-emitting element module of the present invention, it is preferable to encapsulate the light-emitting element with a resin in which 15 phosphors are mixed. In the method of fabricating the light-emitting device module of the present invention, the light-emitting element is preferably a blue light-emitting diode, and the phosphor is a blue-excited yellow light-emitting phosphor. Further, the present invention provides a display device having the above-described light-emitting element module of the present invention. The present invention provides an illumination device comprising the above-described group of light-emitting elements of the present invention. The present invention provides a traffic signal device having the above-described light-emitting element module of the present invention. According to the present invention, since the reflecting cup portion on which the light element 1304659 is mounted is provided on the substrate for mounting the light emitting element, the substrate for forming the reflecting cup portion separate from the substrate can be formed on the substrate, and the substrate structure can be simplified. Inhibit the cost of group participation. Further, since the base material for the reflector cup which is separated from the substrate is not used, it is possible to prevent the bubbles from being mixed into the sealing resin, and it is possible to prevent the extraction efficiency of light from the light-emitting element from being lowered. Further, since the groove is formed on the periphery of the bottom portion of the reflecting cup portion, the glass is not melted and the bottom peripheral edge is rounded when the ruthenium layer is sintered, so that the portion of the light-emitting element can be secured at the center of the bottom portion. (10) Since the substrate for mounting a light-emitting element having a ruthenium layer on the surface of the core metal is used, the heat-emitting property is excellent, and the light-emitting intensity of the light-emitting element such as an LED can be improved. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an i-th embodiment of a light-emitting element module of the present invention. Fig. 2 is a cross-sectional view showing a third embodiment of the substrate of the present invention. Fig. 3 is a plan view showing a first embodiment of the substrate of the present invention. Fig. 4 is a cross-sectional view showing a second embodiment of the light-emitting element module of the present invention. Fig. 5 is a cross-sectional view showing a third embodiment of the light-emitting element module of the present invention. Fig. 6 is a cross-sectional view showing an essential part of an example of a reflecting cup portion having a groove. Figure 7 is a cross-sectional view of the main part of another example of a reflector cup having no grooves. The brother 8 is a cross-sectional view of the main part of the reflector cup made by your example. Fig. 9 is a cross-sectional view showing the main part of the reflecting cup portion which is rounded at the circumference of the crucible. Fig. 10 is a cross-sectional view showing a package structure of a light-emitting element, _, 1lJ. Fig. 11 is a cross-sectional view showing an example of a light-emitting element module of the & Figure 12 is a plan view showing an example of a conventional light-emitting element module. Figure 13 is a diagram showing the plane of the electrode structure of the conventional light-emitting element module

10 Brother 14 Figure toughness and circuit diagram of the known light-emitting component module. Fig. 15 is a cross-sectional view showing another example of the light-emitting element module of the prior art [implementation method]

In the following, the embodiment of the present invention will be described with reference to Fig. 4 . In the first embodiment of the present invention, the first embodiment shows a cross-sectional view of the τ bristles, and the second figure shows the illuminating 70 pieces for the same illuminating element nucleus. A cross-sectional view of a substrate (hereinafter referred to as a substrate) is used, and FIG. 3 is a plan view showing a different substrate. In the figures, reference numeral 20 is a light-emitting element mold, and 21 is a j-method substrate, 22 is a core metal, 23 is a ruthenium layer, 24 is a light-emitting element such as an LED, 25 is a wire, and 26 is an encapsulating resin. 27 is an electric 20 pole, 28 is a reflecting cup portion, 29a is a bottom portion, and 29b is a sloped portion. As shown in FIGS. 2 and 3, the substrate 21 of the present embodiment has a structure in which a plurality of surfaces of the core metal 22 of the reflecting cup portion 28 for reflecting the light emitted from the mounted light-emitting element 24 in a certain direction are provided in the vertical and horizontal directions. Set the thick layer to the range of 50μηι~200μηι. 12 1304659 Further, the light-emitting element module 20 of the present embodiment has the above-described ruthenium substrate 21 as shown in the first drawing, and is divided into a plurality of electrodes on the upper surface of the ruthenium substrate 21, and the electrode 27 is attached to each of the reflective cup portions. The light-emitting element 24 on the electrode 27 at the central portion of the bottom portion 29a of the μ, and the wire 25 for electrically connecting the upper side of each of the light-emitting elements 24 and the adjacent electric poles 27 are filled in the respective reflecting cup portions 28 to be hardened. The transparent encapsulating resin 26 of the light-emitting element 24 is encapsulated. The core metal 22 of the foregoing ruthenium substrate 21 can be made of various metal materials, and the material thereof is not limited, and it is preferably a low-cost and easy-to-process metal material such as low carbon steel or stainless steel. Further, in this example, the core metal 22 of the quadrangular plate shape 10 is used, and the shape of the core metal 22 is not limited thereto, and may be appropriately selected depending on the use of the light-emitting element module 20. The method of forming the reflecting cup portion 28 on the core metal 22 can be easily formed by cutting using a cutting tool such as a drill or grinding using a super-hard grindstone. The shape of the concave portion of the reflecting cup portion 28 formed is preferably in the shape of a flat bottom portion 29a and an inclined portion 29b which gradually enlarges from the periphery thereof. The material of the ruthenium layer 23 provided on the surface of the core metal 22 can be selected from materials mainly composed of glass which has been used for forming a metal surface on a metal surface. In the present invention, a is placed on the surface of the core metal 22, and the thickness of the layer 23 is 2 〇 in the range of 5 〇μηι to 200 μιη. When the thickness of the ruthenium layer 23 is less than 5 〇μηχ, cracks are generated in the ruthenium layer when the surface of the core metal 22 is sintered, and the metal inside is exposed to the outside, and the core metal 22 is lowered due to the insulation property. The long-term dependence of the emulsification specialization. Moreover, when the thickness of the j-method layer 23 exceeds 200 μm, there is still a possibility of cracking in the green enamel layer. 13 No. 95119604 application: invention description _ lane Shi Bai 7 7 rrpo correction, and dark in sintering, 3) It is a problem that the mounting space is reduced and the light-emitting element 24 cannot be mounted on the bottom portion 29a. In the present moxibustion, a layer 23 having a thickness of 5 〇 μm to 2 〇Ο μηι is formed on the surface of the core metal 22 to form a ruthenium layer 23 having excellent insulating properties and no cracks and uniformity. If the thickness of the ruthenium layer 23 is present, the original shape of the core metal 22 as the base material can be again exhibited, and the shape of the reflector cup portion 28 formed on the core metal 22 can again assume the original shape of the ruthenium layer 23. The electrode 27 provided on the upper surface of the substrate 21 is formed by a thick film of silver paste extending into the inside of the reflecting cup portion 28. The copper foil may also be press-formed and mounted in a counter-cup.

The light-emitting element 24 is not particularly limited, and a semiconductor light-emitting element such as a led or a laser diode (LD) is preferably used. Further, the luminescent color of the light-emitting element 24 used in the present invention may be blue, green, red or other luminescent color, and a blue light-emitting semiconductor 15 element composed of a nitride-based compound semiconductor may be used and at least one portion may be absorbed. A white LED of the blue light and having a wavelength converted into a visible wave frequency domain phosphor (for example, a yttrium aluminum garnet phosphor activated by ruthenium) may be used. Further, the plurality of light-emitting elements 24 mounted in parallel on the ruthenium substrate 21 may be LEDs having the same illuminating color as those used for traffic signals, etc., and LEDs of different illuminating colors may be sequentially or randomly arranged as display devices. . Further, a plurality of blue LEDs, green LEDs, and red LEDs can be sequentially or randomly arranged on the large-area substrate 21 to constitute a display device using the lED. Alternatively, the light-emitting element 24 may be formed of a large-area planar illumination device by using a white LED and mounting a plurality of white LEDs on the large-sized slab substrate 21 in a vertical and horizontal direction. 14 Ϊ304659 The encapsulating resin 26 can be an epoxy-based thermosetting resin, an ultraviolet curable resin, or a thermosetting enamel resin having a high light transmittance. The wire 25 can be used with a gold wire or the like. This wire 25 is wired using a wire bonding device which has been used for connection of the light-emitting element 24 or the like. 5, the light emitting element module 20 is disposed on the 珐琅 substrate 21 for mounting

Since the reflecting cup portion 28 of the light-emitting element is formed, it is not necessary to separately form a reflecting cup portion forming substrate separate from the substrate, and the substrate structure can be simplified, and the cost of assembly can be suppressed. Further, since the substrate for the reflecting cup which is separated from the substrate is not used, it is possible to prevent the bubbles from being mixed into the sealing resin 26' and to prevent the extraction efficiency of light from the light-emitting element 24 from being lowered. Since the ruthenium substrate 21 having the ruthenium layer 23 provided on the surface of the core metal 22 is excellent in heat dissipation, the light-emitting intensity of the light-emitting element 24 such as an LED can be improved. Further, the structure of the ruthenium substrate 21 may be such that the electrode 24 is exposed to the upper surface of the substrate, and a resin for electrically insulating may be disposed in the exposed portion. Further, a lens body made of resin, glass or the like may be combined above the encapsulating resin 26 or above the light-emitting element module 2'. Fig. 4 is a cross-sectional view showing a second embodiment of the light-emitting element module of the present invention. In Fig. 4, reference numeral 3 is a light-emitting element module, 31 is a germanium substrate, 32 is a core metal, and 33 is a germanium layer, 34 For a light-emitting element such as 1^〇, ^ is a wire, 36 is an encapsulating resin '37 is an electrode, 38 is a reflecting cup portion, he is a bottom portion, and 39b is a bevel portion. 15 1304659 The light-emitting element module 3 of the present embodiment shows a structure in which the germanium substrate 31 for mounting the light-emitting element unit 34 is used, except for the shape of the germanium substrate 31 and the number of the light-emitting elements 34 mounted, In the same manner as the light-emitting element module 20 of the second embodiment, the illuminating element module 3, the core metal 32, the ruthenium layer 33, the light-emitting element 34, the wire 35, the encapsulating resin 36, and the electrode 37 are formed. The reflective cup portion 38 and the illuminating substrate 21, the core metal 22, the ruthenium layer 23, the light-emitting element 24, the wire 25, the encapsulating resin 26, the electrode 27, and the reflective cup constituting the light-emitting element module 20 of the above-described second embodiment The part 28 is configured in the same manner. The light-emitting element module 30 of the present embodiment can obtain the same effects as those of the light-emitting element module 20 of the above-described first embodiment.

Fig. 5 is a cross-sectional view showing a light-emitting device module according to a second embodiment of the present invention. Reference numeral 40 in Fig. 5 denotes a light-emitting element module, 41 is a germanium substrate, 42 is a core metal, 43 is a germanium layer, and 44 is a layer. For a light-emitting element such as an LED, 45 is 15 lines '46 is an encapsulating resin' 47 is an electrode, 48 is a reflecting cup portion, 49a is a bottom portion, and 49b is a bevel portion. The light-emitting element module 40 of the present embodiment is configured in the same manner as the light-emitting element module 20 of the first embodiment except that the substrate 41 is provided on the periphery of the bottom portion 49a of the reflector cup portion 48. The green module substrate 41, the core metal 42, the light-emitting element 44, the wire 45, the encapsulating resin 46, the electrode 47, and the reflective cup portion 48 of the element module 4〇2〇 constitute the first embodiment The illuminating substrate 21, the core metal 22, the j 琅 layer 23, the light-emitting element 24, the wire 25, the encapsulating resin 26, the electrode 27, and the reflecting cup portion 28 of the light-emitting element module 20 are similarly configured. 16 1304659 'When the WI is used as the interface substrate 41 of the reflective cup portion 48, the core metal 42 is coated with the material - and the surface of the burnt metal 42 is _ layer 43, and when the sintering is performed, the glass body is temporarily before sintering. Melting and flowing, so that the bottom of the cup is rounded, and depending on the situation, it is impossible to ensure the smoothness of mounting the light-emitting element 44, and it can be used in the present embodiment, and the substrate 4 is provided with the groove 50 on the periphery of the bottom. The glass volume is stored in the groove at the bottom of the bottom, while the other bottom. M9a can maintain a flat state. At the bottom, he is provided with a portion other than the groove %. The portion of the light-emitting element 44 is mounted, and the area is appropriately adjusted to ensure the flat portion for mounting the light-emitting element. In the present embodiment, the same effect as that of the first embodiment described above can be obtained, and since the groove 5〇 is formed on the periphery of the bottom portion 49a of the reflecting cup portion 48, the crucible layer is 43 inches, and the glass is not made. By melting and rounding the periphery of the bottom portion 49a, it is ensured that the portion of the light-emitting element 44 is mounted at the center of the bottom portion, and the yield can be improved. Fig. 6 shows an example of a reflecting cup portion having a groove, in this example, 15 The reflecting cup portion 51 is configured such that a groove 54 is formed between the bottom portion 52 and the inclined surface portion 53. When the surface is the same surface, the convex portion 55 is provided on the periphery of the bottom portion 52. In this configuration, the groove 54 is provided and the periphery of the bottom portion 52 is disposed. The convex portion 55 prevents the molten glass from flowing into the groove 54. Fig. 7 shows another example of the reflecting cup portion having the groove. In the present example 20, the reflecting cup portion 56 has a structure at the bottom portion 57 and the inclined portion. Each of the 58 spaces is provided with a groove 59 which is gradually deepened toward the outer side of the bottom portion 57. In the groove 59 of the shape, since the molten glass is easily transported away from the bottom portion 57, the effect of preventing the circumference of the bottom portion 27 from being rounded can be improved. In addition, a groove is formed on the periphery of the bottom of the reflecting cup portion. Once without 1713046595

10 15

When the thickness of the ruthenium layer is appropriate, the local layer of Wangfa Township flows during sintering and the sag is easily formed by the green enamel layer. When the electrode is made of silver paste, it is continuous because it is liquid before coating. Ensure electrical continuity. The core metal is a low carbon steel plate with a length of 50 mm, a width of 5 〇, and a thickness of imm. On the surface of the steel sheet, three recesses of three totals are arranged in a vertical and horizontal direction by a drill. The dimensions of the bottom surface of the recesses are fine, depth 〇5 mm, and 45. The angle forms an inclined portion. The glass frit for forming the bead layer is disposed in a dispersing medium, and the core substrate and the counter electrode of the core metal are disposed so as to be immersed in the dispersion. Further, between the core metals and the domains, the metal plate is placed on the cathode side, and a direct current is applied to the metal surface. Then, it is sintered in the atmosphere, and a bead layer made of glass is formed on the surface of the core metal, and the bead substrate is formed by coating a silver paste on a ruthenium layer and then sintering it. The coating of the glass powder was adjusted to vary the thickness of the layer to the substrate shown in Table 1. Licheng

20 thickness 18 1304659 No. 95119604 Shen Qi Zhai Qin said that the painting is very changed page 9^p9 correction

In the year of the year, when the madness was replaced by the negative i '~J degree on the 7th, a part of the enamel layer was cracked, and the inner metal was exposed to the outside. At this time, there is a possibility that the long-term reliability of the substrate is lowered due to a decrease in insulation performance and oxidation of metal. The crack is easily generated in the portion of the shoulder 61 of the reflecting cup portion 60 shown in Fig. 8. 5 Next, LEDs were mounted on each of the first to third embodiments and the first to second comparative examples.

The results are shown in Table 2. Further, the LED was evaluated using a blue LED (light-emitting center wavelength λ = 460 ηηη) composed of hGaN having a length of 300 μm, a width of 300 μm, and a thickness of 200 μm. 1〇[Table 2] Thickness on the substrate (μιη) Thickness of the bottom surface portion of the concave portion (μχη) Thickness of the conductive layer on the bottom surface portion of the concave portion (μιη) Installation of the light-emitting element First embodiment 50 52 30 No problem Second embodiment 97 98 31 No problem Third embodiment 210 200 28 No problem First comparative example 30 34 30 No problem Second comparative example 300 320 20 There are two places where the installation cannot be confirmed. As can be seen from the results of Table 2, in the second comparative example, 9 places There are 2 places where the light-emitting elements cannot be installed. The reason for this is that when the cross section is observed, the shape of the substrate on the peripheral edge 62 of the bottom surface of the concave portion is rounded as shown in Fig. 9, and the area where the flat portion of the light-emitting element 15 can be mounted is reduced. The reason for this shape is that when the tantalum layer is sintered, the glass powder of the raw material is melted and flows and accumulated. If it is a layer having a thickness of 200 μm or less, it is possible to secure a sufficient area for mounting the light-emitting element. According to the present invention, it is possible to provide a light-emitting element package substrate which is excellent in light extraction efficiency of a light-emitting element, and which can be produced at low cost, and a method of manufacturing the same, and a light-emitting element module in which a light-emitting element is mounted on the substrate and a method of manufacturing the same The display device, the illumination device and the traffic signal of the light-emitting element module are used. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a first embodiment of a light-emitting element module of the present invention. Fig. 2 is a cross-sectional view showing a first embodiment of the substrate of the present invention. Fig. 3 is a plan view showing a first embodiment of the substrate of the present invention.

Fig. 4 is a cross-sectional view showing a second embodiment of the light-emitting element module of the present invention. Fig. 5 is a cross-sectional view showing a third embodiment of the light-emitting element module of the present invention. Fig. 6 is a cross-sectional view showing an essential part of an example of a reflecting cup portion having a groove. 15 Figure 7 shows the main part of another example of a reflector cup with a groove

Fig. 8 is a cross-sectional view showing the main part of a reflecting cup portion produced by the embodiment. Fig. 9 is a cross-sectional view showing the main part of the reflecting cup portion where the bottom circumference is rounded. Fig. 10 is a cross-sectional view showing a conventional light-emitting element package structure. 20 Fig. 11 is a cross-sectional view showing an example of a conventional light-emitting element module. Fig. 12 is a plan view showing an example of a conventional light-emitting element module. Figure 13 is a plan view showing the electrode structure of a conventional light-emitting element module. Figure 14 is a circuit diagram of a conventional light-emitting element module. 20 1304659 Fig. 15 is a cross-sectional view showing another example of a conventional light-emitting element module.

1...light-emitting element 2...wire 3...substrate 4...electrode 5···encapsulation resin 6...reflector 6a...beveled surface 7...insulating layer 8...heat-dissipating metal plate 9...light-emitting element 10...wired ll···substrate 12 ^ ·Electrical & 13...Encapsulation resin 20...Light-emitting element 21... 法法乡板22...core metal 23... 法法乡24...light-emitting element 25...wire 26...packaging resin 27...electrode 28...reflecting cup portion 29b ... slanted surface 30... illuminating element 31... 珐琅 substrate 32... core metal 33... 琅 琅 layer 34... illuminating element 35... Threading 36... encapsulating resin 37... electrode 38... reflecting cup portion 39a... bottom 39b... slanting surface 40... illuminating Element 41... 法法乡板42···core metal 43...珐琅 layer 44...light-emitting element 45...wire 46...packaging resin 47...electrode 48...reflecting cup portion 49a...bottom 49b...beveled surface 29a···bottom 21

Claims (1)

1304659 Application No. 95119604 Application for Patent Replacing Page 97.07.29 Amendment 10, Patent Application Range: July, July, ^Repair (more} replacement page 丨1. A substrate for mounting a light-emitting element, which is provided with a mounting device The surface of the core metal surface of the reflective cup portion, which is reflected by the light-emitting element, is disposed in a range of 50 μm to 200 μm, and the substrate for mounting the light-emitting element according to the first aspect of the invention, wherein the reflection is The bottom of the cup has a groove at the periphery. 3. A light-emitting element module in which a light-emitting element is mounted on a substrate for mounting a light-emitting element according to claim 1 or 2, and the light-emitting element is encapsulated with a transparent sealing resin. 4. The light-emitting device module according to claim 3, wherein the light-emitting element is a white light-emitting diode that emits white light by mixing a phosphor in the sealing resin. 5. A method of manufacturing a substrate for mounting a light-emitting element, wherein a reflective cup portion for reflecting light emitted from the mounted light-emitting element in a predetermined direction is formed at a predetermined position of the core metal, and then coated on a surface of the core metal. After the material is sintered, a substrate for mounting a light-emitting element having a green enamel layer having a thickness of 50 μm to 20 μm is provided on the surface of the core metal. 6. The method of producing a substrate for mounting a light-emitting element according to the fifth aspect of the invention, wherein the glass-based coffin is plated on the surface of the core metal, and then sintered. 7. A method of manufacturing a light-emitting element module, wherein a reflective cup portion for reflecting light emitted from a mounted light-emitting element in a certain direction is formed at a predetermined position of a core metal, and then a coffin is coated on a surface of the core metal After sintering, a substrate for mounting a light-emitting element having a thickness of 22 1304659 50 μm 2 to 2 μm μm is formed on the surface of the core metal, and then an electrode is formed on the surface of the substrate for mounting the light-emitting element. Then, a light-emitting element is mounted on the electrode at the central portion of the reflector cup portion, and each electrode is electrically connected to the light-emitting element. Then, the resin is filled and sealed in the reflector cup portion, and the light-emitting element is packaged to fabricate the light-emitting element module. 8. The method of manufacturing a light-emitting element module according to claim 7, wherein the light-emitting element is encapsulated by a resin mixed with a phosphor. The method of manufacturing a light-emitting element module according to claim 8, wherein the light-emitting element is a blue light-emitting diode, and the phosphor is a blue-excited yellow light-emitting phosphor. 10_-Type II shows X, which is a light-emitting component module with a towel. 11. A lighting device, which is a light-emitting component module of the patent application. I2. One (four) "machine, there are (four) phase 3 of the illuminating element 23