TWI398026B - Light emitting element and light emitting module having the same - Google Patents

Description

Light-emitting element and its module

The invention relates to a package component of a light-emitting diode and a module thereof.

The light emitting diode (LED) in the photovoltaic element has the advantages of low power consumption, high brightness, small size and long service life, so it is considered to be the best light source for the new generation of green energy-saving lighting. In recent years, the development and improvement of the package structure of the light-emitting diode has been continuously improved to improve the light-emitting rate and service life of the light-emitting diode element.

A light-emitting diode package structure 100 is shown in FIG. 1A as a top view of the prior art and FIG. 1B is a cross-sectional view taken along line A to A' of FIG. 1A, which includes a transparent substrate 102, as shown in the prior art US Patent Publication No. US 2005/0012108. a groove 104. The transparent substrate 102 has a first surface 120 and a second surface 122 opposite to the first surface 120. The recess 104 is a functional area. The opposite sides of the functional area have an inclined surface 118A and an inclined surface 118B. A light-emitting diode die 106 can be placed at the bottom of the functional area. The metal layer 108A and the metal layer 108B cover the first surface 120 of the transparent substrate 102 and do not include the recess 104. A spacing is maintained between the metal layers to prevent electrical shorting. The electrode 110A is located on the metal layer 108A and the electrode 110B is located on the metal layer 108B as an external electrical connection of the LED package structure 100. The metal wire 112A and the metal wire 112B are electrically connected to the light-emitting diode die 106 and the metal layer 108A and the metal layer 108B. A transparent adhesive 114 is filled in the recess 104 and covers the LED die 106. Since the LED package 100 is a transparent substrate 102 and the encapsulant uses a transparent adhesive 114, the light generated by the LED die 106 is generated. The wire can directly penetrate the transparent substrate 102 and the transparent glue 114. In order to concentrate the light on a light exiting surface, that is, the second surface 122 of the transparent substrate 102, the reflective material 116 is mixed in the transparent adhesive 114 to increase the light reflection to increase the light extraction rate. The light-emitting diode package structure 100 has a design light ray 124 concentrated on a light-emitting surface, but the partial light rays 126 and 128 are also emitted through the two sides of the light-emitting diode package structure 100 and the top surface to reduce the light-emitting rate of the element.

In view of the above, the present invention provides a light-emitting element having a higher light-emitting rate and a module thereof, which further includes a function of double-sided light emission and high heat dissipation.

The present invention is a light-emitting element, a transparent substrate having a first surface, a second surface opposite to the first surface, and a side surface adjacent to the first surface and the second surface, a recess from the first The surface is disposed in the transparent substrate, and at least one pair of electrodes are located on opposite sides of the bottom surface of the recess and extend outwardly from the recess to the side of the transparent substrate, wherein the electrode further covers the transparent substrate A surface, at least one of the illuminating crystal grains is located on the groove, and a transparent glue covering the illuminating crystal grain.

The present invention further provides a light emitting device module comprising: a carrier plate having a plurality of component carrying regions, a plurality of light emitting components respectively disposed in the plurality of component carrying regions, a plurality of internal electrodes disposed on the carrier, and adjacent components carrying A plurality of internal electrodes are disposed between the regions, and the adjacent light-emitting elements located in the adjacent component carrying regions are electrically connected through the internal electrodes, and the plurality of external electrodes are electrically connected to the outside.

Compared with the prior art, the light-emitting element of the present invention can increase the light-emitting efficiency of the light-emitting element and accelerate the heat-dissipation speed of the light-emitting element. In addition, the carrier structure of the module is improved, and the light-emitting module with a predetermined light-emitting surface is also obtained.

100‧‧‧Light emitting diode package structure

102‧‧‧Transparent substrate

104‧‧‧ Groove

106‧‧‧Light-emitting diode grains

108A, 108B‧‧‧ metal layer

110A, 110B‧‧‧ electrodes

112A, 112B‧‧‧Metal wire

114‧‧‧Sticky adhesive

116‧‧‧Reflective materials

118A, 118B‧‧‧ sloped surface

120‧‧‧ first surface

122‧‧‧ second surface

124‧‧‧Light

126‧‧‧Light

128‧‧‧Light

200‧‧‧Lighting elements

202‧‧‧Transparent substrate

204‧‧‧ Groove

206‧‧‧Lighting grain

210A, 210B‧‧‧ electrodes

212A, 212B‧‧‧Metal wire

214‧‧‧Sticky adhesive

218, 218A, 218B‧‧‧ side of the groove

220‧‧‧Fixed adhesive

222‧‧‧Fluorescent conversion materials

224A, 224B‧‧‧electrode separation zone

226A, 226B‧‧‧ fluorescent thin layer

228‧‧‧reflective layer

230‧‧‧ first surface

232‧‧‧ second surface

234‧‧‧ side

236‧‧‧Light

400‧‧‧Lighting element module

402‧‧‧ Carrier Board

404‧‧‧Lighting elements

406‧‧‧Internal electrodes

408‧‧‧External electrode

410‧‧‧Component bearing area

412‧‧‧Light

414‧‧‧篓空部

Figure 1A is a top plan view of a prior art; 1B is a cross-sectional view of a prior art A to A' tangential; FIG. 2A is a plan view of an embodiment of a light-emitting device of the present invention; FIG. 2B is a cross-sectional view taken along line B to B' of FIG. 2A; and FIG. 2C is a C to C' of FIG. 2D is another embodiment of the light-emitting element of the present invention; FIG. 2E is still another embodiment of the light-emitting element of the present invention; FIG. 2F is a light-emitting element of the present invention; FIG. FIG. 4A is a plan view of a light-emitting element module of the present invention; FIG. 4B is a cross-sectional view taken along line D to D' of FIG. 4A of the present invention; and FIG. 4C is another embodiment of the light-emitting element module of the present invention.

The direction of the invention discussed herein is a light-emitting element and a module. In order to thoroughly understand the present invention, detailed steps and compositions thereof will be set forth in the following description. Obviously, the implementation of the present invention is not limited to the specific details familiar to those skilled in the art of light-emitting elements and modules. On the other hand, well-known components or steps are not described in detail to avoid unnecessarily limiting the invention. The preferred embodiments of the present invention are described in detail below, but the present invention may be widely practiced in other embodiments, and the scope of the present invention is not limited by the scope of the following patents. .

2A is a plan view of an embodiment of the present invention, FIG. 2B is a cross-sectional view taken along line B to B′ of FIG. 2A, and FIG. 2C is a cross-sectional view taken along line C to C′ of FIG. 2A according to an embodiment of the present invention. . this The embodiment of the invention provides a light-emitting element 200 comprising: a transparent substrate 202 having a first surface 230, a second surface 232 opposite to the first surface 230, and a side 234 adjacent to the first surface 230 and the second surface 232 . A recess 204 is formed in the transparent substrate 202 from the first surface 230, and the shape of the recess 204 is not limited. The transparent substrate 202 may be a material such as cerium oxide (SiO2), tantalum nitride (Si3N4), transparent rubber, glass or sapphire. It should be noted here that the refractive index of the transparent substrate 202 must be smaller than the refractive index of the light-emitting diode in order to allow light to pass through the component. A pair of electrodes 210A and 210B are located on opposite sides of the bottom surface of the recess 204 and extend outwardly in opposite directions from the recess 204 to the side 234 of the transparent substrate 202. The electrodes 210A and 210B cover the first of the transparent substrate 202. Surface 230. As the electrodes 210A and 210B, a high reflectance metal such as nickel (Ni), silver (Ag), aluminum (Al), titanium (Ti), gold (Au), or platinum (Pt) or an alloy of the above metals can be used. At least one of the illuminating dies 206 is fixed to the bottom surface of the recess 204 by the fixing glue 220, and is electrically connected by the metal wires 212A and 212B, or electrically connected by bumps (not shown). The luminescent crystal 206 can be a light emitting diode or a laser diode. The fixing glue 220 can be made of epoxy or silicone. A transparent adhesive 214 is filled in the recess 204 and covers the luminescent die 206 to protect the die from being affected by the external environment. The transparent adhesive 214 is epoxy or silicone.

As shown in FIG. 2A, a pair of electrically opposite electrodes 210A and 210B extend from the sides of the bottom of the groove 204 in opposite directions along the groove side 218 to the side 234 of the transparent substrate 202 and cover the first surface 230. . The electrodes 210A and 210B further include electrode separation regions 224A and 224B to avoid electrical short circuit. In addition, the electrodes 210A and the electrodes 210B extend over the diametrically opposite two narrow sections of the groove side 218 and do not completely cover the groove side 218. Therefore, the light 236 generated by the illuminating die 206 is removed from the first surface 230. The bottom surface of the recess 204 also emits light from the second surface 232, and also enters the transparent substrate 202 via the recess side 218A and the recess side 218B which are not covered by the electrode 210A and the electrode 210B. The light entering the transparent substrate 202 is reflected by the electrode 210A and the electrode 210B coated on the side surface 234 of the transparent substrate 202 to the second surface 232, as shown in FIG. 2B and FIG. 2C. again The area of the electrode can cover more than 1/2 of the area of the light-emitting element, and also improve the heat dissipation function of the element.

Referring again to FIG. 2C, the second surface 232 and the groove sides 218A and 218B of the embodiment of the present invention may be a roughened surface or include a light-emitting rate of the microstructure-increasing element. The range of oblique angles of the groove sides 218A and 218B is not limited.

In the embodiment of the present invention, the fluorescent conversion material 222 may be further added to the transparent adhesive 214 or the fixing adhesive 220 to adjust the color of the light emitted by the component, for example, to generate white light or other desired colors. The fluorescent conversion material 222 may be yttrium aluminum garnet (YAG), yttrium aluminum garnet (TAG), sulfide, phosphate, oxynitride, silicate. The concentration of the material may be matched to the transparent adhesive 214 or the fixed adhesive 220 according to the final desired color of the component. Of course, it is also possible to add the fluorescent conversion material 222 to one of the transparent adhesive 214 or the fixing adhesive 220, so that the color of the component has a more heavy selection.

2D is another embodiment of the present invention, the transparent adhesive 214 and the fixing adhesive 220 do not contain any fluorescent conversion material 222, but the fluorescent conversion material 222 is formed into the fluorescent thin layers 226A and 226B covering the first surface 230 and On the second surface 232, the first wavelength light generated by the light emitting die 206 passes through the fluorescent thin layers 226A and 226B to excite the fluorescent conversion material 222 to form a second wavelength, while the first wavelength light and the second wavelength are not completely converted. The light is mixed to give the final desired luminescent color. The concentration or type of the fluorescent conversion material 222 disposed in the fluorescent thin layers 226A and 226B may be varied as needed.

2E is a different embodiment of the present invention. The difference from the embodiment of FIG. 2D is that the fluorescent thin layer 226A is replaced by a reflective layer 228 covering the first surface 230, and the fluorescent thin layer 226B is covered by the second surface 232. In this embodiment, the light 236 originally directed toward the first surface 230 is reflected by the reflective layer 228 to the second surface 232 to emit light. Furthermore, the light ray 236 is also reflected by the electrodes 210A and 210B covering the first surface 230 and the side surface 234 of the transparent substrate 202, so that the light is concentrated and the efficiency of light extraction is improved.

FIG. 2F is a different embodiment of the present invention. The difference from FIG. 2E is that the fluorescent conversion material 222 is distributed in the transparent adhesive 214 and the fixing adhesive 220, and the light 236 is reflected by the reflective layer 228 to the second surface 232 to emit light.

According to the above, the present invention provides a manufacturing process of a light-emitting element, which is briefly described in FIG. First, in step 302, a transparent substrate such as cerium oxide (SiO2), tantalum nitride (Si3N4), transparent rubber, glass or sapphire is provided, and the refractive index of the transparent substrate must be smaller than that of the crystal grains. The refractive index of the material.

Then, in step 304, a recess is formed on the transparent substrate, and the photoresist is completely coated on the first surface of the transparent substrate by centrifugal force by a photoresist coating machine to form a photoresist film by dry etching. . The photoresist film is then patterned by photolithography to form a mask such that the exposed portion is expected to be revealed. Then, the groove is etched by an inductively coupled plasma etcher (ICP), or the transparent substrate is etched by a chemical reaction solution with a certain ratio of the chemical solution to form a groove. The shape of the groove is not limited. In addition, a rough irregular surface is formed on the light-emitting surface of the light-emitting element and the side surface of the groove to improve the light-emitting rate of the element.

Next, in step 306, an electrode is formed on the recess and extends to a side of the transparent substrate and over the first surface of the transparent substrate. A pair of electrically opposite electrodes are formed on the predetermined position of the light-emitting element by electroplating, evaporation or sputtering, and the electrode separation area is left between the electrodes to avoid electrical short-circuit.

Next, in step 308, the fixing die is used to fix the die to the bottom of the groove. The fixing glue can be fixed to the bottom of the groove by using epoxy or silicone. Since the present invention is a transparent substrate, the light generated by the illuminating crystal grains can also be transmitted through the bottom of the groove, so that the mixing of the fluorescent conversion material in the fixing glue can change the color of the light emitted by the element.

Finally, in step 310, the transparent glue is filled in the recess and covers the die. Filling the transparent glue protects the light-emitting dies from the environment. If a fluorescent conversion material is added to the transparent glue, the color of the light-emitting elements can be changed. The fixing glue and the transparent glue can simultaneously add the fluorescent conversion material to make the light-emitting elements have the same color of light, and the fluorescent conversion materials of different colors can also be added to make the color of the light-emitting elements change.

The present invention further provides a light-emitting device module. Referring to FIG. 4A, a plan view of a light-emitting diode device module 400 of the present invention and FIG. 4B are a cross-sectional view taken along line D-D' of FIG. 4A. The carrier board 402 has a plurality of component carrying regions 410. The plurality of internal electrodes 406 are disposed on both sides of the component carrying region 410 and buried in the internal carrier 402, and the internal electrodes 406 of the adjacent component carrying regions 410 are electrically connected. The plurality of internal electrodes 406 extend bare to the carrier 402 to connect the external electrodes 408, and the plurality of light emitting elements 404 are located within the plurality of component carrying regions 410.

According to the above light emitting device module, the carrier 402 can be a ceramic substrate to improve the heat dissipation function of the module. The ceramic substrate may be a sheet-shaped low-temperature co-fired ceramic substrate in addition to the bulk substrate, and the electrode may be sintered at a high temperature together with the ceramic powder. The internal electrode 406 and the external electrode 408 embedded in the two sides of the component carrying area 410 may be L-shaped, and the advantages of such a shape may simultaneously match the position design of various electrodes of the light-emitting element or the position design of the external electrical connection. The L-shaped electrode has a large area and can also increase the speed at which the component dissipates heat. Of course, the electrodes can also be of any shape. As the electrode, a metal such as nickel (Ni), silver (Ag), aluminum (Al), titanium (Ti), gold (Au), or platinum (Pt) or an alloy of the foregoing metal can be used. Embodiments of the invention may be series, parallel or series-parallel modules, which may be designed according to requirements. Since the module embodiment of the present invention emits light on one side, the light ray 412 is emitted from the second surface 232 of the element, which does not satisfy the double-sided light-emitting characteristics of the light-emitting element embodiment of the present invention, and further provides another embodiment such as FIG. 4C.

4C is a double-sided light-emitting component module. The bottom of the component carrying area 410 is provided with a hollow portion 414, that is, the component carrying region 410 is vertically penetrated. When the light-emitting component 404 of the present invention is placed, the light-emitting component 404 is Both the first surface 230 and the second surface 232 can emit light, and at the same time, the effect of the two sides of the light is achieved. fruit.

The present invention has many advantages from the means and effects of the present invention. First, the present invention uses a transparent substrate to allow the light-emitting element to emit light on both sides, or to selectively emit light on one side. Therefore, when the light-emitting element is designed to emit light on both sides, the fluorescent conversion material can be formulated so that the color of the double-sided light is different, and the light-emitting effect of the component is increased. Moreover, in addition to being used as an electrode, a large-area metal layer can be used for light reflection to improve the single-sided light-emitting rate of the light-emitting element, and another function of the metal layer is the heat-dissipation path of the element, thereby improving the life of the element.

Obviously, many modifications and differences may be made to the invention in light of the above description. It is therefore to be understood that within the scope of the appended claims, the invention may be The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the claims of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the present invention should be included in the following patents. Within the scope.

200‧‧‧Lighting elements

202‧‧‧Transparent substrate

204‧‧‧ Groove

206‧‧‧Lighting grain

210A, 210B‧‧‧ electrodes

218‧‧‧ Groove side

224A, 224B‧‧‧electrode separation zone

Claims (11)

A light-emitting element comprising: a transparent substrate having a first surface, a second surface opposite to the first surface, and a side adjacent to the first surface and the second surface; a groove from the first surface Opening in the transparent substrate; at least one pair of electrodes are located on opposite sides of the bottom surface of the recess and extending outwardly from the recess and covering a peripheral side of the transparent substrate, wherein the electrode covers the transparent substrate a surface; at least one illuminating crystal grain is disposed on the groove; and a transparent glue covering the illuminating crystal grain, wherein the electrode covering the side of the periphery of the transparent substrate is used to illuminate the illuminating crystal grain toward the lateral direction of the transparent substrate Reflected toward the second surface and then emerged. A light-emitting element according to claim 1, wherein the second surface is provided with a plurality of microstructures. The illuminating element according to claim 1, further comprising at least one phosphor conversion material layer covering the first surface of the transparent substrate or the second surface opposite to the first surface. The light-emitting element according to claim 1, further comprising at least a layer of a fluorescent conversion material covering the first surface of the transparent substrate and the second surface opposite to the first surface. The light-emitting element according to claim 1, further comprising a fluorescent conversion material disposed in the transparent glue and the fixing glue or one of the transparent glue and the fixing glue. The illuminating element according to claim 1, further comprising at least one light reflecting layer covering the first surface of the transparent substrate or the second surface opposite to the first surface. The light-emitting element according to claim 5, wherein the fluorescent conversion material is yttrium aluminum garnet (YAG), yttrium aluminum garnet (TAG), sulfide, phosphate, oxynitride. Oxynitride, silicate. The light-emitting element according to claim 1, wherein the transparent substrate is cerium oxide (SiO2), tantalum nitride (Si3N4), transparent rubber, glass or sapphire. A light-emitting element module comprising: a carrier plate having a plurality of component carrying regions, and a plurality of light-emitting components according to any one of claims 1 to 8 are respectively disposed in a plurality of component carrying regions; The internal electrodes are disposed in the adjacent component carrying regions of the carrier, and the adjacent light emitting components in the adjacent component carrying regions are electrically connected through the internal electrodes; and the plurality of external electrodes are electrically connected to the outside. The light-emitting element module of claim 9, wherein the component carrying region further comprises another light-emitting hollow portion. The light emitting device module according to claim 9, wherein the carrier is a ceramic substrate.