KR20100093527A - Led package substrate and led package using the same - Google Patents

Abstract

The company provides LED package boards with excellent heat dissipation and can solve reliability, mass production, and cost issues simultaneously. The distance between the n-electrode 101 connected to the n-pole 105a of the LED element 105 and the p-electrode 102 connected to the p-pole 105b of the LED element 105 is 20-500 µm at the narrowest part. The ceramic 103 was filled in at least one part or all the said narrowest part in the range.

Description

LED package substrate and LED package using the same {LED package substrate and LED package using the same}

The present invention relates to a substrate of an LED package having an LED element and an LED package using the same.

Recently, in terms of energy saving, various power saving related products have been developed in each aspect. Low-power light-emitting diodes, or LEDs (Light Emitting Diodes), are one such product. In particular, the success of the development of blue LED devices enables the production of white LEDs, which is a move to adopt them in liquid crystal backlights or general lighting. This happened, and some products had already begun hiring.

As such a white LED, for example, in FIG. 1 of Patent Document 1, a blue LED element is mounted in a shell type LED package, and then encapsulated with a resin containing a phosphor, and the blue light of the LED element and light excited through the phosphor It is shown by synthesizing to obtain white color.

Such LED packages are already established as world standard package shapes and are widely distributed in the market because of their excellent mass production and cost. However, as the amount of heat generated from the LED device is greatly increased as the output of the LED device increases recently, the shell type package as described above cannot catch up with the heat dissipation level, and thus the luminous efficiency of the LED device caused by the temperature rise is greatly reduced. It is a problem.

To solve this heat dissipation problem, various modified LED packages have been proposed.

For example, Patent Document 2 discloses an LED package that uses a high thermal conductivity aluminum nitride as the package material, prints an electrode pattern on an aluminum nitride substrate, and obtains high heat dissipation by flip chip mounting of the LED element.

However, the LED package has a drawback that the price of the package is further increased since the process of printing the electrode pattern has difficulty in mass productivity and the cost is increased, as well as the use of expensive aluminum nitride as a raw material. In addition, in order to increase the output power of the current LED element, there are many problems to be improved, such as the heat dissipation ability of aluminum nitride is difficult to handle.

Patent Literature 3 also proposes an LED package in which a through hole formed in a substrate is filled with metal to form a heat dissipation via, and the LED element is flip-chip mounted thereon.

In such an LED package, although the specific name of a metal is not described in patent document 3, high heat dissipation can be obtained by using silver and copper as a filling metal. However, in practice, there is a drawback that, if silver or copper is infiltrated in the through-holes, the through-holes and these filler metals are peeled off by solidification shrinkage, and in the worst case, the filler metals fall off and are disconnected. In order to eliminate this drawback, it is necessary to fill in the through hole using the metal paste which mixed the powder of a filled metal and glass powder, and to sinter and solidify below the melting point of a metal component. However, this results in the incorporation of the glass component with respect to the metal component, so that the original thermal conductivity of the metal component cannot be exhibited. In the through-hole filling, screen printing is generally used, but in this case, there is a problem in that productivity and manufacturing cost are difficult.

Moreover, patent document 4 has shown the LED package which integrated the lead frame which mainly consists of copper, and the metal plate for heat dissipation through white heat dissipation resin. Such an LED package is not only excellent in terms of cost because it uses inexpensive copper as a raw material and can be manufactured without a complicated process, and good heat dissipation can be expected if the heat conductivity of the heat dissipating resin is sufficient. However, the thermal conductivity of the heat-dissipating resin is only about 10 W / m · K as in Patent Document 4, which is remarkably low compared to the thermal conductivity of the lead frame and the heat-dissipating metal plate. As a result, it becomes a resistance to heat transfer from the lead frame to the heat-dissipating metal plate. It is difficult to exhibit good heat dissipation. Furthermore, when the LED is used in a continuous lighting state for a long time because of the low heat resistance of the resin, it is also considered that the package temperature rises due to the heat dissipation problem and the resin is thermally deformed or degraded. Therefore, flip chip mounting, which has good heat dissipation efficiency but requires a narrow electrode gap, and which requires precision in the gap, is not suitable for this package structure.

That is, as shown in FIG. 6A, in the flip chip mounting, the n-pole 201a and the p-pole 201b of the LED element 201 are replaced by the n-electrode 202a and the p-electrode 202b of the LED package substrate 202. ), Heat is easily dissipated from the light emitting portion 201c of the LED element 201 through the LED package substrate 202, compared to the wire mounting by the wire W shown in FIG. 6 (b). This is excellent. However, in flip chip mounting, it is necessary to narrow the gap 202c between the n electrode 202a and the p electrode 202b in accordance with the n pole 201a and the p pole 201b of the LED element 201, and the precision thereof is strict. Since the LED package substrate is easily deformed and degraded by thermal deformation, flip chip mounting is not suitable.

In addition, all of the resins mentioned in Patent Document 4 are weak to short wavelength light, causing yellowing and deterioration due to light from the LED element and sunlight, and as a result, there are many disadvantages such as lowering the life of the package.

In order to spread LED as general lighting, it is necessary to satisfy reliability (weather resistance such as UV resistance, moisture resistance, heat resistance, mechanical strength, etc.), mass production, and cost in addition to heat dissipation. However, the LED package improved by focusing on all four elements such as deterioration in reliability, mass production, and cost as a result of improving the heat dissipation as mentioned above is not noticeable.

Patent Document 1: Japanese Patent No. 2927279 Patent Document 2: Japanese Patent Application Laid-Open No. 2004-207367 Patent Document 3: Japanese Patent Application Laid-Open No. 2002-289923 Patent Document 4: Japanese Patent Application Laid-Open No. 2007-173441

The problem to be solved by the present invention is to provide an LED package substrate and an LED package using the same that can simultaneously solve the problems of excellent heat dissipation and reliability, mass production, and cost.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the inventor of this application uses the ceramic which has favorable thermal conductivity as a material for electrodes, and mainly uses the metal which is comparatively cheap copper, and is excellent in strength and weather resistance rather than resin as a structural material, LED As the device mounting method, the package structure was examined under the flip chip mounting method which is advantageous for heat dissipation. As a result, we found that in the electrode pairs (n electrode and p electrode) with narrow electrode spacing that can be flip-chip mounted, various problems can be solved by filling ceramics between the electrode pairs. This led to the invention of the LED package substrate which has excellent heat dissipation and solves reliability, mass production, and cost problems at the same time.

The LED package board | substrate of this invention is a board | substrate of the LED package which mounts LED element, and the space | interval of the n electrode connected to the n pole of an LED element, and the p electrode connected to the p pole of an LED element is 20-500 at the narrowest part. It exists in the range of micrometers, and at least one part or all of the said narrowest part is filled with ceramic, It is characterized by the above-mentioned.

Thus, by limiting the distance between the n electrode and the p electrode to 20 ~ 500㎛ the LED element can be directly flip-chip mounted on the electrode, so that the distance between the LED heating portion and the electrode can be as short as possible, so that efficient heat dissipation can be achieved. It becomes possible. The n / p electrodes are firmly held by the thermal and mechanical stability of the filled ceramics by filling the ceramics between the n / p electrodes. As a result, the size of the electrode gap is maintained with high accuracy, and stable flip chip mounting that does not cause distortion or deformation on the n electrode and the p electrode is possible even when ultrasonic bonding of the LED element is performed, and at the same time, thermal deformation, light degradation, and moisture absorption deterioration. A highly reliable LED package can be obtained.

In addition, when the n / p electrode interval is less than 20㎛, it is difficult to charge the ceramic. On the other hand, when the n / p electrode interval is greater than 500 µm, flip chip mounting of conventional 350 µm square size LED elements becomes impossible, and even when a large 1 mm square size LED element is used, As the contact area with the LED elements or the contact areas with the electrodes of the solder bumps joining the electrodes becomes smaller, the amount of heat transfer from the LED elements to the electrodes is lowered, so that good heat dissipation cannot be performed.

In the present invention, the n electrode and the p electrode are preferably formed by a lead frame. As a result, non-uniformity between products at n / p electrode intervals is suppressed, thereby reducing the poor filling of the ceramic and at the same time, the automatic mounting of the LED element is facilitated. Furthermore, the manufacturing method can employ | adopt the process which was excellent in mass productivity, such as continuous press work, and can provide the LED package board excellent in mass productivity and cost.

The LED package substrate of the present invention is excellent in heat dissipation and can solve the problems of reliability, mass production, and cost at the same time, and thus is useful as a package for high power LED or lighting LED.

1 shows a first embodiment of an LED package substrate according to the present invention, (a) is a plan view thereof, and (b) is an AA sectional view of (a).
FIG. 2 shows an example in which the LED package substrate shown in FIG. 1 is formed of a lead frame.
Fig. 3 shows a second embodiment of the LED package substrate according to the present invention, (a) is a plan view thereof, and (b) is a BB cross-sectional view of (a).
4 is a cross-sectional view showing a third embodiment of the LED package substrate according to the present invention.
Fig. 5 shows an example in which an LED element is flip-chip mounted on the LED package substrate according to the present invention, (a) is a plan view thereof, and (b) is a CC sectional view of (a).
6 shows a form in which an LED element is mounted on a substrate, (a) shows flip chip mounting, and (b) shows wire mounting.

In the LED package substrate of the present invention, a method of filling ceramics between n / p electrodes may be performed regardless of the means thereof. For example, insert molding or insert molding using a ceramic green body having thermoplasticity, melting or half It can fill by injection molding etc. using the ceramic raw material of a molten state.

In the case where the n electrode and the p electrode are formed by a lead frame, the lead frame can be produced by press working, electric discharge working, etching, or the like, but press working is most preferable in consideration of mass productivity and dimensional accuracy.

It is preferable that an electrode material is made into copper or a copper alloy whose thermal conductivity is 300 W / m * K or more. Specifically, when sufficient thermal conductivity and reliability are taken into consideration, an oxygen-free copper-based alloy having a copper content of 99.9% or more is preferable. Among these, an alloy containing 0.015 to 0.15% by mass of Zr or an oxygen-free oxygen of 99.9% or more with respect to oxygen-free copper having a purity of 99.9% or more. The alloy which added 0.10-0.15 mass% Sn with respect to copper is the most preferable. Thus, when an electrode is comprised from copper or a copper alloy whose thermal conductivity is 300 W / m * K or more, a large thermal conductivity can be obtained compared with the metal paste and aluminum nitride which mixed the glass component, and high heat dissipation effect can be acquired. Furthermore, since it is cheaper than metal paste or aluminum nitride, it is possible to provide an LED package substrate having a lower cost.

In addition, it is preferable to form an opening reflecting portion, a so-called reflector, on the LED element mounting surface of the LED package substrate of the present invention so as to surround the mounting portion of the LED element with the same material as the ceramic charged between the n / p electrodes. The reflector may be formed by a process different from the ceramic filling, but it is most preferable to simultaneously form the ceramic when the production lead time is taken into consideration. In addition, in order to improve the strength of the LED package substrate, a base made of an insulator may be formed on the surface opposite to the reflector formation surface (LED element mounting surface) of the LED package substrate. The material of the base may be any insulator, but preferably, the same material as that of the ceramic filling between the n / p electrodes is preferable. In particular, the ceramic filling, reflector formation, and base formation between the n / p electrodes are formed by insert molding. Performing at the same time can reduce the production lead time, which is very effective in two aspects: improving mass production and reducing cost. In addition, an additional reflector made of a material different from the reflector may be mounted on the reflector. Regardless of the material of the additional reflector, for example, the surface may be made of aluminum, aluminum plated or silver plated stainless steel, high whiteness ceramic, or the like.

Furthermore, in the present invention, it is preferable that the n / p electrode and the ceramic are directly bonded and integrated using a ceramic that can be baked at a firing temperature of 1050 ° C or lower as a ceramic. As a result, the n / p electrodes can be more firmly maintained, and the manufacturing process can be simplified to provide a highly reliable LED package substrate at low cost. As a ceramic which can be baked at a firing temperature of 1050 ° C. or lower, a material obtained by mixing 40% by volume or less of alumina, magnesia, or barium sulfate with borosilicate glass or borosilicate glass having a firing temperature of about 600 to 960 ° C. is most preferred. In addition, the ceramic material can be selected to have an appropriate thermal expansion coefficient according to the purpose or the thermal expansion coefficient of the electrode material. In addition, the direct joining method may be any means, but for example, a method of performing degreasing and integral firing after insert molding or out-insert molding using a ceramic green body imparting thermoplasticity by adding a binder, and melting or Anti-melting, injection molding, and the like to perform integration.

Furthermore, the ceramic is preferably 70% or more, and more preferably 85% or more in whiteness value determined by JIS P8148 (JIS 2001 edition) after the degree of firing. As a result, the light reflectance can be increased, thereby providing an LED package substrate having high light extraction efficiency.

In the present invention, after the n / p electrode and the ceramic are integrated, it is preferable to perform plating treatment with a metal based on silver or aluminum on at least the surface of the n / p electrode exposed to the atmosphere. As a result, the light reflectance can be increased, thereby providing an LED package substrate having high light extraction efficiency, and at the same time suppressing surface oxidation of the n / p electrode, thereby providing a highly reliable LED package substrate. In addition, when the above-described plating treatment is performed before the n / p electrode and the ceramic are integrated, a chemical reaction between the plating material and the n / p electrode made of copper or copper alloy occurs during the heating at the time of integrating, thereby lowering the light reflectance. Since the change of an electrode shape arises and the utility as an LED package board | substrate falls, it is preferable to perform plating process after integration.

Furthermore, in the present invention, the heat sink is preferably coupled to the n / p electrode so as to transfer heat to improve heat dissipation. The coupling mode includes (1) thermally coupling a heat sink to at least one of the n / p electrodes, (2) thermally coupling a separate heat sink to the n / p electrodes, and (3) n / p. The heat sink can be thermally coupled to one of the electrodes with an insulating layer interposed therebetween. The thermal conductivity of the insulating layer used in the above (3) is preferably 300 W / m · K or more in order to increase the heat dissipation efficiency. As the insulating layer material, for example, graphite sheet, carbon nanotube composite plastic or the like which has been insulated There is this. In addition, the installation position of a heat sink is not restrict | limited, if it is thermally coupled, For example, it can be mounted in an electrode outer lead part or an electrode back surface (opposite surface to LED element mounting surface).

By using the above-described LED package substrate of the present invention as a substrate, it is possible to provide an LED package which is excellent in heat dissipation and can solve the problems of reliability, mass production, and cost at the same time.

<Examples>

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Example 1

1 shows a first embodiment of an LED package substrate according to the present invention, (a) is a plan view thereof, and (b) is an A-A cross-sectional view of (a). In addition, Figure 1 (b) shows an enlarged view of the LED device mounted on the LED package.

The LED package substrate 100 shown in FIG. 1 has a structure in which an electrode pair of an n-electrode 101 and a p-electrode 102 is provided as a basic type of the present invention and a ceramic 103 is filled in the narrowest part thereof.

Such an LED package substrate 100 can be produced using the lead frame 104 as shown in FIG. 2.

Specifically, first, a metal plate made of copper or a copper alloy having a thermal conductivity of 300 W / m · K or more is processed by press working to obtain a lead frame 104 having the n electrode 101 and the p electrode 102. At this time, the interval between the narrowest portions of the n-electrode 101 and the p-electrode 102 is in the range of 20 to 500 µm. Finally, if the interval between the narrowest portions is in the range of 20 to 500 µm, for example, the interval After forming 500 micrometers or more, you may use the method of deforming the lead frame 104 so that it may become in the range of 20-500 micrometers. In this embodiment, only the case where the narrowest portion of the n / p electrode pair is one is shown. However, two or more narrowest portions may be formed to mount several LED elements. Furthermore, the ceramic 103 is filled with the n / p electrode narrowest part of this lead frame 104, and it is individualized, and it is set as an LED package board | substrate. In addition, the method of filling the ceramics is irrespective of the means thereof. For example, it can be filled by insert molding or the like.

The LED element 105 is flip-chip mounted on the LED package substrate 100 as shown in Fig. 1B. Specifically, the n-pole 105a of the LED device 105 is connected to the n-pole 101 of the LED package substrate 100 with the solder bumps 106 interposed therebetween, and the LED-electrode 105 is connected to the p-electrode 102. The p-pole 105b of () is connected via the solder bump 106. Although the whole image of the LED package which mounts the LED element 105 is not shown, it has a structure which resin-sealed the LED element 105 as usual.

In addition, although the ceramic 103 is filled in the center part of the n / p electrode narrowest part in FIG. 1 (b), the charging position is not limited to this, You may fill in the upper part, lower part, or all of the n / p electrode narrowest part. If the ceramic 103 is filled in part or the entirety of the n / p electrode narrowest portion, and the mounting of the LED element 105 is not impaired, the n / p electrode narrowest portion may be charged beyond the n / p electrode narrowest portion. You may fill in the space | interval of other n / p electrodes.

[Example 2]

Fig. 3 shows a second embodiment of the LED package substrate according to the present invention, (a) is a plan view thereof, and (b) is a B-B cross sectional view of (a). In addition, Figure 3 (b) also shows the LED element mounted in the LED package.

This embodiment is formed of the same material as the ceramic 103 filled with the aperture reflecting portion, that is, the reflector 107, between the n / p electrodes so as to surround the mounting portion of the LED element 105 of the LED package substrate 100, Furthermore, the base 110 is formed of the same material as that of the ceramic 103 on the surface opposite to the LED element 105 mounting surface.

Specifically, first, a metal plate made of copper or a copper alloy having a thermal conductivity of 300 W / m · K or more is processed by press working to obtain an electrode pair in which the narrowest portion of the n / p electrode is formed within a range of 20 to 500 µm. Thereafter, the green body of the ceramic 103 is filled between the electrode pairs at a temperature of 1050 ° C. or lower and 70% or more at a whiteness value determined by JIS P8148 (JIS 2001 edition). A reflector 107 having a reflecting surface 107a is formed to surround the LED mounting portion by using a green body of ceramic made of the same material as 103. The reflecting surface 107a of this reflector 107 can be formed in arbitrary inclination angle and shape according to the objective. Furthermore, the base 110 formed of the same material as the ceramic 103 is formed on the surface opposite to the LED element 105 mounting surface. In addition, an opening 111 for joining the n / p electrode and the heat sink can be formed in this expectation if necessary.

The LED package substrate precursor thus obtained is plated with silver or aluminum on the surfaces of the n-electrode 101 and the p-electrode 102 exposed after degreasing and sintering to form the LED package substrate 100. In addition, when sintering, in order to prevent shrinkage cracking of a ceramic, you may employ | adopt the non-shrinkage sintering method which carries out sintering under load. At the time of plating treatment, after performing an optimal base metal plating for the purpose of improving glossiness, hardness, etc., you may finish silver plating or aluminum plating.

Example 3

4 is a cross-sectional view showing a third embodiment of the LED package substrate according to the present invention.

This embodiment thermally couples a heat sink to the n / p electrode of the LED package substrate to further improve heat dissipation.

In the example of FIG. 4A, the heat sink 108a is directly bonded to the lower surface (opposite side of the LED element mounting surface) of the p-electrode 102. The joining method may be any method as long as the electrode and the heat sink are thermally coupled. Examples thereof include a welding method such as laser welding and soldering, an adhesive method using a high thermal conductivity adhesive, and the like.

In the example of FIG. 4B, the heat sink 108b is directly bonded to the bottom surface of the n electrode 101 and the heat sink 108c is directly bonded to the bottom surface of the p electrode 102, respectively. As the joining method, a welding method, a bonding method, or the like can be used as described above.

In the example of FIG. 4C, the heat sink 108d is joined to the lower surface of the n electrode 101 and the p electrode 102 with an insulating layer 109 having a thermal conductivity of 300 W / m · K or more therebetween. . Any method may be used as long as the n / p electrode, the insulating layer, and the heat sink are bonded together, for example, an ultrasonic welding method or an adhesive method using a high thermal conductive adhesive.

The LED package substrate 100 obtained in this manner exhibits the greatest effect when the LED element 105 is flip-chip mounted as shown in FIG. 5, and the generated heat is efficiently heatsinked along the path of the arrow in the figure. 108b, 108c. In addition, the specific form of flip chip mounting is as described with reference to FIG.

In addition, the light generated from the LED element 105 includes the surface of the plated n / p electrodes 101 and 102, the surface of the ceramic 103 having a whiteness of 70% or more, and the reflecting surface 107a of the reflector 107. It is efficiently reflected by this, and it becomes an LED package board | substrate with favorable light extraction efficiency. In addition, since the LED package substrate 100 is made of metal and ceramic, the skew and deformation of the n / p electrodes 101 and 102 at the time of mounting the LED element 105 are suppressed, and further, the LED element 105 A highly reliable LED package substrate can be obtained without deformation due to generated heat, deterioration due to short wavelength light or deterioration due to atmospheric humidity. Moreover, since the lead frame method can be employ | adopted as described in FIG. 2, the manufacturing method which is excellent in mass productivity, such as continuous press work, is attained, and it is very useful also in terms of cost.

Although not shown in the figure, the LED element 105 was flip-chip mounted on the LED package substrate 100 obtained as described above, and the LED element 105 was sealed with a silicone resin mixed with phosphors to form an LED package.

Example 4

As a comparison between the LED package substrate of the present invention and the conventional LED package substrate, (X) the LED package substrate shown in Fig. 5, wherein the electrodes 101 and 102 are made of copper having a thermal conductivity of 394 W / mK. In addition, the ceramic 103 has 85% whiteness, (Y) The LED package substrate shown in Fig. 6 (a), wherein the material of the substrate 202 has a thermal conductivity of 170 W / mK and 35% of white. Aluminum nitride, the electrodes 202a and 202b made of silver containing 30% by mass of glass component, (Z) The LED package substrate shown in FIG. 6 (b), wherein the material of the substrate 202 is a thermal conductivity 170W / mK and also made of aluminum nitride having a whiteness of 35%, starting with a size of 10 mm, a copper electrode thickness of 0.3 mm, a silver electrode thickness of 10 μm, and an aluminum nitride substrate thickness of 0.3 mm. ). In order to make the comparison between (X), (Y), and (Z) fair, the heat sinks 108b and 108c of (X) and (X) are not shown in the drawings but are not shown in the drawings. The same shape is also equipped with a heat sink made of the same material. In addition, the reflector 107 shown in FIG. 5 did not mount this. Moreover, sealing of the LED element by resin was not performed in order to measure the temperature of an LED element surface. Further, (X) and (Y) are flip chip mounting, and (Z) is wire mounting, and the LED device of the same type and same size is mounted, a light emission test is performed by applying a current of 20 mA, and the surface of the LED element is carried out by thermography. The temperature was measured. As a result of measuring each LED element surface temperature when the surface temperature of an LED element became constant, it was (X) 38 degreeC, (Y) 52 degreeC, and (Z) 121 degreeC. These results indicate that (X) is 2.6 times longer for (Y) and 315 times longer for (Z) from Arrenius' law, or (X) is the LED device when designed for the same lifetime. It has been shown that can be mounted at a higher density, the superiority of the present invention was confirmed. Also, when the light extraction efficiency was compared by the measurement of the radiation flux by the integrating sphere, the radiation flux was (X) 14.88mW, (Y) 12.78mW, and (Z) 10.89mW, respectively, so that (X) is Highest.

As described above, by using the LED package substrate according to the present invention, high heat dissipation, high reliability, easy mass production, and low cost of the LED package are progressed, and in addition to the LED lighting device in which the LED elements are mounted at a high density, three color LED elements are used as pixels. It can be used suitably for small projectors that can be used by connecting to LED color TVs and USB ports, and furthermore, it can greatly contribute to the market spread of their products.

100 LED package board 101 n electrode
102 p-electrode 103 ceramic
104 Lead Frame 105 LED Element
105a n-pole 105b p-pole
106 Solder Bump 107 Reflector (Opening Reflector)
107a reflective surface 108a to 108d heat sink
109 Insulation Layer 110 Expectation
111 opening 201 LED element
201a n-pole 201b p-pole
201c Light Emitting Part 202 LED Package Board
202a n electrode 202b p electrode
202c electrode gap

Claims (12)

A substrate of an LED package on which an LED element is mounted, wherein an interval between an n electrode connected to the n pole of the LED element and a p electrode connected to the p pole of the LED element is within the range of 20 to 500 μm at the narrowest part. LED package substrate in which a ceramic is filled in at least part or all of said narrowest part. The LED package substrate of claim 1, wherein the n electrode and the p electrode are formed by a lead frame. The LED package substrate according to claim 1 or 2, wherein the n electrode and the p electrode are made of copper or a copper alloy having a thermal conductivity of 300 W / m · K or higher. The LED package substrate according to any one of claims 1 to 3, wherein an opening reflecting portion is formed so as to surround the mounting portion of the LED element, and the opening reflecting portion is formed of the same material as the ceramic. The LED package substrate according to any one of claims 1 to 4, wherein the ceramic is a ceramic that can be baked at a firing temperature of 1050 ° C or lower. The LED package substrate according to any one of claims 1 to 5, wherein the ceramic has a whiteness of 70% or more specified in JIS P8148 (JIS 2001 edition). The LED package substrate according to any one of claims 1 to 6, wherein the n electrode and the p electrode and the ceramic are directly bonded to each other to form a single body. The LED package substrate according to any one of claims 1 to 7, wherein at least a part of the surfaces of the n- and p-electrodes are plated with a metal based on silver or aluminum. The LED package substrate according to any one of claims 1 to 8, wherein a heat sink is coupled so that heat is transferred to at least one of the n electrode and the p electrode. The LED package substrate according to any one of claims 1 to 8, wherein separate heat sinks are coupled to the n electrode and the p electrode so as to be electrically heated. The LED package substrate according to any one of claims 1 to 8, wherein the n-electrode and the p-electrode are coupled to each other to form a heat sink and an electric heat with an insulating layer having a thermal conductivity of 300 W / m · K or more therebetween. An LED package using the LED package substrate as described in any one of Claims 1-11 as a board | substrate.

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