TWI566441B - Light emitting diode device and leadframe array for packaging light emitting diode - Google Patents

Light emitting diode device and leadframe array for packaging light emitting diode Download PDF

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TWI566441B
TWI566441B TW103112887A TW103112887A TWI566441B TW I566441 B TWI566441 B TW I566441B TW 103112887 A TW103112887 A TW 103112887A TW 103112887 A TW103112887 A TW 103112887A TW I566441 B TWI566441 B TW I566441B
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platform
bracket
bonding pad
emitting diode
bonding
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TW103112887A
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Chinese (zh)
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TW201539805A (en
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李皓鈞
林育鋒
蔡孟庭
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新世紀光電股份有限公司
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Priority to TW103112887A priority Critical patent/TWI566441B/en
Priority to CN201510163125.0A priority patent/CN104979459A/en
Publication of TW201539805A publication Critical patent/TW201539805A/en
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Publication of TWI566441B publication Critical patent/TWI566441B/en

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Description

發光二極體裝置及用於封裝發光二極體之支架陣列 Light-emitting diode device and bracket array for encapsulating light-emitting diode

本發明關於一種支架陣列,尤指一種用於封裝發光二極體之支架陣列及發光二極體裝置。 The invention relates to a stent array, in particular to a stent array and a light emitting diode device for encapsulating a light emitting diode.

發光二極體(Light Emitting Diode,LED)是一種半導體元件,由於發光二極體具有體積小、壽命長、耗電量小等特性,已普遍應用於各式各樣的照明裝置與電子裝置上。請參閱第1圖以及第2圖,第1圖為先前技術之發光二極體裝置1的側視示意圖,第2圖為第1圖中的支架模組10的俯視示意圖。如第1圖所示,發光二極體裝置1包含一支架模組10、一反射體12以及一發光二極體14。支架模組10包含二支架100,其中二支架100相互並排,且每一個支架100包含一固晶平台102。反射體12包覆支架模組10,且暴露出固晶平台102的部分上表面1020。發光二極體14係設置於固晶平台102之部分上表面1020上。 Light Emitting Diode (LED) is a kind of semiconductor component. Due to its small size, long life and low power consumption, the LED has been widely used in various lighting devices and electronic devices. . Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic side view of the prior art light-emitting diode device 1 , and FIG. 2 is a schematic plan view of the stent module 10 in FIG. 1 . As shown in FIG. 1 , the light-emitting diode device 1 includes a bracket module 10 , a reflector 12 , and a light-emitting diode 14 . The bracket module 10 includes two brackets 100, wherein the two brackets 100 are juxtaposed to each other, and each bracket 100 includes a fixed crystal platform 102. The reflector 12 encloses the stent module 10 and exposes a portion of the upper surface 1020 of the fixed crystal platform 102. The light emitting diode 14 is disposed on a portion of the upper surface 1020 of the die bonding platform 102.

如第1圖所示,每一個支架100更包含一接合墊106,自固晶平台102之下表面1022延伸出,其中接合墊106之高度h1等於固晶平台102之高度h2,且固晶平台102之外側邊1024與接合墊106間之垂直距離d1等於固晶平台102之內側邊1026與接合墊106間之垂直距離d2。當支架100縮小時,高度h1與垂直距離d1都會變小,使得反射體12與支架100在角落處的結合面積減少。此時,反射體12與支架100的結合強度也會降低,使得發光二極體裝置1之整體結構強度也跟著降低。 As shown in FIG. 1 , each of the brackets 100 further includes a bonding pad 106 extending from the lower surface 1022 of the bonding platform 102 , wherein the height h1 of the bonding pads 106 is equal to the height h2 of the bonding platform 102 , and the solid crystal platform The vertical distance d1 between the outer side edge 1024 of the 102 and the bond pad 106 is equal to the vertical distance d2 between the inner side edge 1026 of the die bonding platform 102 and the bond pad 106. When the bracket 100 is reduced, the height h1 and the vertical distance d1 are both reduced, so that the joint area of the reflector 12 and the bracket 100 at the corner is reduced. At this time, the bonding strength between the reflector 12 and the bracket 100 is also lowered, so that the overall structural strength of the light-emitting diode device 1 is also lowered.

此外,如第2圖所示,固晶平台102之三側邊分別只具有向外突 出的單一接腳104。一般而言,支架100之材料為金屬(例如,銅),而反射體12之材料為高分子材料。反射體12係藉由轉注成型製程包覆部分固晶平台102與接腳104,使得反射體12與支架100透過接腳104結合在一起。然而,當發光二極體裝置1有小型化需求時,支架100便需隨之縮小,使得支架100與反射體12的接觸面積也會變小。此時,反射體12與支架100的結合強度便會降低,使得發光二極體裝置1之整體結構強度也跟著降低。 In addition, as shown in FIG. 2, the three sides of the solid crystal platform 102 have only outward protrusions. A single pin 104 is shown. Generally, the material of the stent 100 is a metal (for example, copper), and the material of the reflector 12 is a polymer material. The reflector 12 is coated with a portion of the die bonding platform 102 and the pins 104 by a transfer molding process such that the reflector 12 and the bracket 100 are coupled through the pins 104. However, when the light-emitting diode device 1 has a miniaturization requirement, the bracket 100 needs to be reduced accordingly, so that the contact area of the bracket 100 with the reflector 12 is also reduced. At this time, the bonding strength between the reflector 12 and the bracket 100 is lowered, so that the overall structural strength of the LED device 1 is also reduced.

本發明提供一種用於封裝發光二極體之支架陣列及發光二極體裝置,以解決上述之問題。 The invention provides a bracket array and a light emitting diode device for encapsulating a light emitting diode to solve the above problems.

根據一實施例,本發明之發光二極體裝置包含一支架模組、一反射體以及一發光二極體。支架模組包含二支架,二支架相互並排,每一個支架包含一固晶平台以及一接合墊,固晶平台包含一上表面及一下表面,且接合墊自固晶平台的下表面延伸出。接合墊之寬度小於固晶平台之寬度,且接合墊之高度大於固晶平台之高度。反射體包覆支架模組,且暴露出固晶平台的部分上表面。發光二極體跨接於二固晶平台之部分上表面上。 According to an embodiment, the LED device of the present invention comprises a bracket module, a reflector and a light emitting diode. The bracket module comprises two brackets, and the two brackets are arranged side by side. Each bracket comprises a solid crystal platform and a bonding pad. The solid crystal platform comprises an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. The width of the bonding pad is smaller than the width of the solid crystal platform, and the height of the bonding pad is greater than the height of the solid crystal platform. The reflector covers the stent module and exposes a portion of the upper surface of the solid crystal platform. The light emitting diode is connected across a portion of the upper surface of the two solid crystal platform.

較佳地,固晶平台之至少一側邊具有向外突出的至少二接腳。 Preferably, at least one side of the fixed crystal platform has at least two pins protruding outward.

較佳地,固晶平台之三側邊中的每一側邊分別具有向外突出的至少二接腳。 Preferably, each of the three sides of the fixed crystal platform has at least two legs protruding outward.

較佳地,固晶平台具有至少一孔洞,且至少部分孔洞被反射體所填充。 Preferably, the die bonding platform has at least one hole and at least a portion of the hole is filled by the reflector.

根據另一實施例,本發明之發光二極體裝置包含一支架模組、一反射體以及一發光二極體。支架模組包含二支架,二支架相互並排,每一個支架包含一固晶平台以及一接合墊,固晶平台包含一上表面及一下表面,且接合墊自固晶平台的下表面延伸出。接合墊之寬度小於固晶平台之寬度,固晶平台具有一外側邊以及一內側邊,且外側邊與接合墊間之垂直距離大於內側邊與接合墊間之垂直距離。反射體包覆支架模組,且暴露出固晶平台的部 分上表面。發光二極體跨接於二固晶平台之部分上表面上。 According to another embodiment, the LED device of the present invention comprises a bracket module, a reflector and a light emitting diode. The bracket module comprises two brackets, and the two brackets are arranged side by side. Each bracket comprises a solid crystal platform and a bonding pad. The solid crystal platform comprises an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. The width of the bonding pad is smaller than the width of the bonding platform. The bonding platform has an outer side and an inner side, and the vertical distance between the outer side and the bonding pad is greater than the vertical distance between the inner side and the bonding pad. The reflector covers the bracket module and exposes the portion of the solid crystal platform Part of the surface. The light emitting diode is connected across a portion of the upper surface of the two solid crystal platform.

較佳地,固晶平台之至少一側邊具有向外突出的至少二接腳。 Preferably, at least one side of the fixed crystal platform has at least two pins protruding outward.

較佳地,固晶平台之三側邊中的每一側邊分別具有向外突出的至少二接腳。 Preferably, each of the three sides of the fixed crystal platform has at least two legs protruding outward.

較佳地,固晶平台具有至少一孔洞,且至少部分孔洞被反射體所填充。 Preferably, the die bonding platform has at least one hole and at least a portion of the hole is filled by the reflector.

根據另一實施例,本發明之用於封裝發光二極體之支架陣列包含一框架、多個支架模組以及一反射體。每一個支架模組包含二支架,二支架相互並排,每一個支架包含一固晶平台以及一接合墊,固晶平台包含一上表面及一下表面,且接合墊自固晶平台的下表面延伸出。接合墊之寬度小於固晶平台之寬度,且接合墊之高度大於固晶平台之高度。支架模組以陣列的方式設置於框架中。反射體設置於框架內並包覆支架模組,且暴露出固晶平台的部分上表面。 According to another embodiment, the stent array for packaging a light-emitting diode of the present invention comprises a frame, a plurality of bracket modules, and a reflector. Each of the bracket modules includes two brackets, and the two brackets are arranged side by side. Each bracket includes a solid crystal platform and a bonding pad. The solid crystal platform includes an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. . The width of the bonding pad is smaller than the width of the solid crystal platform, and the height of the bonding pad is greater than the height of the solid crystal platform. The bracket modules are arranged in an array in the frame. The reflector is disposed in the frame and covers the bracket module and exposes a portion of the upper surface of the fixed crystal platform.

根據另一實施例,本發明之用於封裝發光二極體之支架陣列包含一框架、多個支架模組以及一反射體。每一個支架模組包含二支架,二支架相互並排,每一個支架包含一固晶平台以及一接合墊,固晶平台包含一上表面及一下表面,且接合墊自固晶平台的下表面延伸出。接合墊之寬度小於固晶平台之寬度,固晶平台具有一外側邊以及一內側邊,且外側邊與接合墊間之垂直距離大於內側邊與接合墊間之垂直距離。支架模組以陣列的方式設置於框架中。反射體設置於框架內並包覆支架模組,且暴露出固晶平台的部分上表面。 According to another embodiment, the stent array for packaging a light-emitting diode of the present invention comprises a frame, a plurality of bracket modules, and a reflector. Each of the bracket modules includes two brackets, and the two brackets are arranged side by side. Each bracket includes a solid crystal platform and a bonding pad. The solid crystal platform includes an upper surface and a lower surface, and the bonding pads extend from the lower surface of the fixed crystal platform. . The width of the bonding pad is smaller than the width of the bonding platform. The bonding platform has an outer side and an inner side, and the vertical distance between the outer side and the bonding pad is greater than the vertical distance between the inner side and the bonding pad. The bracket modules are arranged in an array in the frame. The reflector is disposed in the frame and covers the bracket module and exposes a portion of the upper surface of the fixed crystal platform.

綜上所述,本發明係增加接合墊之高度及/或增加固晶平台之外側邊與接合墊間之垂直距離,以增加反射體與支架在角落處的結合面積,進而增加整體結合強度。此外,支架之固晶平台之至少一側邊可具有向外突出的至少二接腳,以進一步增加反射體與支架的結合面積,進而增加結合強度。再者,本發明可於固晶平台上形成至少一孔洞,藉由填入孔洞中的反射體, 以進一步增加反射體與支架的咬合程度,進而增加結合強度。 In summary, the present invention increases the height of the bonding pad and/or increases the vertical distance between the outer side of the bonding platform and the bonding pad to increase the bonding area of the reflector and the bracket at the corner, thereby increasing the overall bonding strength. . In addition, at least one side of the solid crystal platform of the bracket may have at least two pins protruding outward to further increase the bonding area of the reflector and the bracket, thereby increasing the bonding strength. Furthermore, the present invention can form at least one hole in the fixed crystal platform by filling the reflector in the hole, In order to further increase the degree of occlusion of the reflector and the stent, thereby increasing the bonding strength.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

1、2‧‧‧發光二極體裝置 1, 2‧‧‧Lighting diode device

3‧‧‧支架陣列 3‧‧‧ bracket array

10、20、20'、20"、20'''‧‧‧支架模組 10, 20, 20', 20", 20'''‧‧‧ bracket modules

12、22‧‧‧反射體 12, 22‧‧‧ reflectors

14、24‧‧‧發光二極體 14, 24‧‧‧Lighting diodes

30‧‧‧框架 30‧‧‧Frame

32‧‧‧裁切線 32‧‧‧ cutting line

100、200‧‧‧支架 100, 200‧‧‧ bracket

102、202‧‧‧固晶平台 102, 202‧‧‧ solid crystal platform

104、204‧‧‧接腳 104, 204‧‧‧ feet

106、206‧‧‧接合墊 106, 206‧‧‧ joint pads

208‧‧‧孔洞 208‧‧‧ hole

1020、2020‧‧‧上表面 1020, 2020‧‧‧ upper surface

1022、2022‧‧‧下表面 1022, 2022‧‧‧ lower surface

1024、2024‧‧‧外側邊 1024, 2024‧‧‧ outside side

1026、2026‧‧‧內側邊 1026, 2026‧‧‧ inside side

h1、h2、H1、H2‧‧‧高度 H1, h2, H1, H2‧‧‧ height

d1、d2、D1、D2‧‧‧垂直距離 D1, d2, D1, D2‧‧‧ vertical distance

W1、W2‧‧‧寬度 W1, W2‧‧‧ width

A-A‧‧‧剖面線 A-A‧‧‧ hatching

第1圖為先前技術之發光二極體裝置的側視示意圖。 Figure 1 is a side elevational view of a prior art light emitting diode device.

第2圖為第1圖中的支架模組的俯視示意圖。 Figure 2 is a top plan view of the bracket module in Figure 1.

第3圖為根據本發明第一實施例之用於封裝發光二極體之支架陣列的俯視示意圖。 3 is a top plan view of a stent array for encapsulating a light-emitting diode according to a first embodiment of the present invention.

第4圖為第3圖中的發光二極體裝置沿A-A線的剖面示意圖。 Fig. 4 is a schematic cross-sectional view of the light-emitting diode device of Fig. 3 taken along line A-A.

第5圖為根據本發明第二實施例之支架模組的俯視示意圖。 Figure 5 is a top plan view of a stent module in accordance with a second embodiment of the present invention.

第6圖為根據本發明第三實施例之支架模組的俯視示意圖。 Figure 6 is a top plan view of a stent module in accordance with a third embodiment of the present invention.

第7圖為根據本發明第四實施例之支架模組的俯視示意圖。 Figure 7 is a top plan view of a stent module in accordance with a fourth embodiment of the present invention.

請參閱第3圖以及第4圖,第3圖為根據本發明第一實施例之用於封裝發光二極體24之支架陣列3的俯視示意圖,第4圖為第3圖中的發光二極體裝置2沿A-A線的剖面示意圖。如第3圖所示,本發明之支架陣列3可用以同時封裝多個發光二極體24。 Referring to FIG. 3 and FIG. 4, FIG. 3 is a top plan view of a stent array 3 for encapsulating the LEDs 24 according to the first embodiment of the present invention, and FIG. 4 is a bipolar diagram of FIG. A schematic cross-sectional view of the body device 2 along the line AA. As shown in FIG. 3, the stent array 3 of the present invention can be used to simultaneously package a plurality of light-emitting diodes 24.

如第3圖與第4圖所示,支架陣列3包含一框架30、多個支架模組20以及一反射體22。每一個支架模組20包含二支架200,其中二支架200相互並排,每一個支架200包含一固晶平台202以及一接合墊206,且固晶平台202包含一上表面2020及一下表面2022。接合墊206自固晶平台202之下表面2022延伸出,其中接合墊206之寬度W1小於固晶平台202之寬度W2。此外,固晶平台202之三側邊中的每一側邊分別具有向外突出的接腳204。 As shown in FIGS. 3 and 4, the stent array 3 includes a frame 30, a plurality of stent modules 20, and a reflector 22. Each of the bracket modules 20 includes two brackets 200. The two brackets 200 are juxtaposed to each other. Each bracket 200 includes a fixed crystal platform 202 and a bonding pad 206. The fixed crystal platform 202 includes an upper surface 2020 and a lower surface 2022. The bond pad 206 extends from the lower surface 2022 of the die attach platform 202, wherein the width W1 of the bond pad 206 is less than the width W2 of the die attach platform 202. In addition, each of the three sides of the solid crystal platform 202 has an outwardly projecting pin 204.

於此實施例中,支架模組20可以陣列的方式設置於框架30中, 以同時封裝多個發光二極體24。相鄰的支架模組20係藉由接腳204互相連接。此外,外圍的支架模組20係藉由接腳204連接於框架30。 In this embodiment, the bracket module 20 can be disposed in the frame 30 in an array manner. The plurality of light emitting diodes 24 are simultaneously packaged. Adjacent bracket modules 20 are interconnected by pins 204. In addition, the peripheral bracket module 20 is coupled to the frame 30 by pins 204.

本發明可以金屬板片(例如,銅片)蝕刻出以陣列的方式設置於框架30中的支架模組20,框架30與支架模組20可以是一體成型。接著,反射體22再藉由轉注成型製程包覆支架模組20,其中反射體22之材料可為高分子材料(例如,環氧樹脂)或矽膠。此時,反射體22即設置於框架30內並包覆支架模組20,且暴露出固晶平台202的部分上表面2020。接著,再將每一個發光二極體24跨接於相鄰的二固晶平台202之部分上表面2020上,以對發光二極體24進行封裝。在完成封裝後,可沿第3圖所示之裁切線32進行裁切,以得到多個發光二極體裝置2。於此實施例中,每一個支架模組20的二支架200為對稱設置,且電性相異,發光二極體24藉由與電性相異的二支架200連接而發光。 In the present invention, the bracket module 20 disposed in the frame 30 in an array manner can be etched from a metal plate (for example, a copper plate), and the frame 30 and the bracket module 20 can be integrally formed. Then, the reflector 22 is further covered by the transfer molding process, wherein the material of the reflector 22 can be a polymer material (for example, epoxy resin) or silicone. At this time, the reflector 22 is disposed in the frame 30 and covers the bracket module 20 and exposes a portion of the upper surface 2020 of the fixed crystal platform 202. Then, each of the light-emitting diodes 24 is connected across a part of the upper surface 2020 of the adjacent two-solid crystal platform 202 to encapsulate the light-emitting diodes 24. After the package is completed, it can be cut along the cutting line 32 shown in FIG. 3 to obtain a plurality of light-emitting diode devices 2. In this embodiment, the two brackets 200 of each bracket module 20 are symmetrically disposed and electrically different, and the LEDs 24 are illuminated by being connected to the electrically different two brackets 200.

於此實施例中,接合墊206之高度H1大於固晶平台202之高度H2。此外,固晶平台202具有一外側邊2024以及一內側邊2026,其中外側邊2024與接合墊206間之垂直距離D1大於內側邊2026與接合墊206間之垂直距離D2。藉由增加接合墊206之高度H1及增加固晶平台202之外側邊2024與接合墊206間之垂直距離D1,本發明可有效增加反射體22與支架200在角落處的結合面積,進而增加整體結構的結合強度。需說明的是,本發明亦可僅增加接合墊206之高度H1或增加固晶平台202之外側邊2024與接合墊206間之垂直距離D1,視實際應用而定。 In this embodiment, the height H1 of the bonding pad 206 is greater than the height H2 of the die bonding platform 202. In addition, the die bonding platform 202 has an outer side 2024 and an inner side 2026. The vertical distance D1 between the outer side 2024 and the bonding pad 206 is greater than the vertical distance D2 between the inner side 2026 and the bonding pad 206. By increasing the height H1 of the bonding pad 206 and increasing the vertical distance D1 between the outer side 2024 of the bonding platform 202 and the bonding pad 206, the present invention can effectively increase the bonding area of the reflector 22 and the bracket 200 at the corner, thereby increasing The combined strength of the overall structure. It should be noted that the present invention may also increase the height H1 of the bonding pad 206 or increase the vertical distance D1 between the outer side 2024 of the bonding platform 202 and the bonding pad 206, depending on the practical application.

請參閱第5圖,第5圖為根據本發明第二實施例之支架模組20'的俯視示意圖。支架模組20'與上述的支架模組20的主要不同之處在於,支架模組20'之支架200之固晶平台202之至少一側邊具有向外突出的至少二接腳204。於此實施例中,固晶平台202之三側邊中的每一側邊分別具有向外突出的至少二接腳204,但不以此為限。舉例而言,固晶平台202之一側邊可具有向外突出的至少二接腳204,且固晶平台202之另二側邊可具有向外 突出的單一接腳204。此外,接腳204可等間距排列,如此每一接腳204可均勻受力,增加結構強度,但接腳204的間距設計不以此為限。第3圖與第4圖中的支架模組20可以第5圖中的支架模組20'替換。由於支架200之固晶平台202之至少一側邊具有向外突出的至少二接腳204,因此本發明可有效增加反射體22與支架200的結合面積,進而增加結合強度。需說明的是,第5圖中與第3、4圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。 Please refer to FIG. 5, which is a top plan view of a bracket module 20' according to a second embodiment of the present invention. The main difference between the bracket module 20 ′ and the bracket module 20 is that at least one side of the solid crystal platform 202 of the bracket 200 of the bracket module 20 ′ has at least two pins 204 protruding outward. In this embodiment, each of the three sides of the solid crystal platform 202 has at least two legs 204 protruding outwardly, but not limited thereto. For example, one side of the solid crystal platform 202 may have at least two pins 204 protruding outward, and the other two sides of the crystal substrate 202 may have outward A single pin 204 that protrudes. In addition, the pins 204 can be arranged at equal intervals, so that each of the pins 204 can be uniformly stressed to increase the structural strength, but the pitch design of the pins 204 is not limited thereto. The bracket module 20 of Figures 3 and 4 can be replaced by the bracket module 20' of Figure 5. Since at least one side of the solid crystal platform 202 of the bracket 200 has at least two pins 204 protruding outward, the present invention can effectively increase the bonding area of the reflector 22 and the bracket 200, thereby increasing the bonding strength. It should be noted that the components of the same reference numerals as those shown in the third and fourth figures in FIG. 5 have substantially the same principle of operation, and are not described herein again.

請參閱第6圖,第6圖為根據本發明第三實施例之支架模組20"的俯視示意圖。支架模組20"與上述的支架模組20的主要不同之處在於,支架模組20"之支架200之固晶平台202具有至少一貫穿固晶平台202的上表面與下表面的孔洞208。如第6圖所示,支架200之固晶平台202之四個角落具有四孔洞208,且孔洞208為圓形。第3圖與第4圖中的支架模組20可以第6圖中的支架模組20"替換。換言之,本發明可於固晶平台202上形成至少一孔洞208,藉由填充於孔洞208中的反射體22,以進一步增加反射體22與支架200的咬合強度,進而增加結合強度。於實際應用中,至少部分孔洞208被反射體22所填充即可增加反射體22與支架200的結合強度。較佳地,孔洞208可完全被反射體22所填滿。需說明的是,孔洞208的數量、位置以及形狀可根據實際應用來設計,不以第6圖所繪示之實施例為限。此外,第6圖中與第3、4圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。 Please refer to FIG. 6. FIG. 6 is a top plan view of a bracket module 20" according to a third embodiment of the present invention. The main difference between the bracket module 20" and the bracket module 20 is that the bracket module 20 The solid crystal platform 202 of the bracket 200 has at least one hole 208 extending through the upper surface and the lower surface of the solid crystal platform 202. As shown in Fig. 6, the four corners of the solid crystal platform 202 of the bracket 200 have four holes 208. The hole 208 is circular. The bracket module 20 in FIGS. 3 and 4 can be replaced by the bracket module 20" in FIG. In other words, the present invention can form at least one hole 208 on the die bonding platform 202, and the reflector 22 filled in the hole 208 can further increase the bite strength of the reflector 22 and the bracket 200, thereby increasing the bonding strength. In practical applications, at least a portion of the holes 208 are filled by the reflector 22 to increase the bonding strength of the reflector 22 to the bracket 200. Preferably, the aperture 208 can be completely filled by the reflector 22. It should be noted that the number, position and shape of the holes 208 can be designed according to practical applications, and are not limited to the embodiment shown in FIG. 6 . In addition, elements of the same reference numerals as those shown in FIGS. 3 and 4 have substantially the same principle of operation, and are not described herein again.

請參閱第7圖,第7圖為根據本發明第四實施例之支架模組20'''的俯視示意圖。支架模組20'''與上述的支架模組20"的主要不同之處在於,支架模組20'''之孔洞208為多邊形(例如,第7圖所示之方形)。需說明的是,第7圖中與第6圖中所示相同標號的元件,其作用原理大致相同,在此不再贅述。 Please refer to FIG. 7. FIG. 7 is a top plan view of a bracket module 20''' according to a fourth embodiment of the present invention. The main difference between the bracket module 20 ′′′ and the bracket module 20 ′′ described above is that the hole 208 of the bracket module 20 ′′′ is polygonal (for example, the square shown in FIG. 7 ). The components of the same reference numerals as those shown in FIG. 6 are substantially the same, and will not be described again.

綜上所述,本發明係增加接合墊之高度及/或增加固晶平台之外側 邊與接合墊間之垂直距離,以增加反射體與支架在角落處的結合面積,進而增加整體結合強度。此外,支架之固晶平台之至少一側邊可具有向外突出的至少二接腳,以進一步增加反射體與支架的結合面積,進而增加結合強度。再者,本發明可於固晶平台上形成至少一孔洞,藉由填入孔洞中的反射體,以進一步增加反射體與支架的咬合強度,進而增加整體結構的結合強度。 In summary, the present invention increases the height of the bonding pad and/or increases the outer side of the bonding platform. The vertical distance between the edge and the bonding pad increases the bonding area of the reflector and the bracket at the corner, thereby increasing the overall bonding strength. In addition, at least one side of the solid crystal platform of the bracket may have at least two pins protruding outward to further increase the bonding area of the reflector and the bracket, thereby increasing the bonding strength. Furthermore, the present invention can form at least one hole in the solid crystal platform, and fill the reflector in the hole to further increase the bite strength of the reflector and the bracket, thereby increasing the bonding strength of the overall structure.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

2‧‧‧發光二極體裝置 2‧‧‧Lighting diode device

3‧‧‧支架陣列 3‧‧‧ bracket array

20‧‧‧支架模組 20‧‧‧ bracket module

22‧‧‧反射體 22‧‧‧ reflector

24‧‧‧發光二極體 24‧‧‧Lighting diode

30‧‧‧框架 30‧‧‧Frame

32‧‧‧裁切線 32‧‧‧ cutting line

200‧‧‧支架 200‧‧‧ bracket

202‧‧‧固晶平台 202‧‧‧Solid crystal platform

204‧‧‧接腳 204‧‧‧ pins

2020‧‧‧上表面 2020‧‧‧ upper surface

A-A‧‧‧剖面線 A-A‧‧‧ hatching

Claims (17)

一種發光二極體裝置,包含:一支架模組,包含二支架,該二支架相互並排,每一該支架包含一固晶平台以及一接合墊,該固晶平台包含一上表面及一下表面,該固晶平台之至少一側邊具有向外突出的至少二接腳,且該接合墊自該固晶平台的該下表面延伸出,該接合墊之寬度小於該固晶平台之寬度,該固晶平台之至少一側邊具有向外突出的至少二接腳,且該接合墊之高度大於該固晶平台之高度;一反射體,包覆該支架模組,且暴露出該些固晶平台的部分該上表面;以及一發光二極體,跨接於該二固晶平台之部分該上表面上。 A light-emitting diode device comprises: a bracket module comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bonding pad, the solid crystal platform comprising an upper surface and a lower surface, At least one side of the die bonding platform has at least two legs protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, the width of the bonding pad being smaller than the width of the die bonding platform, the solid At least one side of the crystal platform has at least two legs protruding outward, and the height of the bonding pad is greater than the height of the solid crystal platform; a reflector covering the bracket module and exposing the solid crystal platform a portion of the upper surface; and a light emitting diode connected across the upper surface of the portion of the two solid crystal platforms. 如請求項1所述之發光二極體裝置,其中該固晶平台具有一外側邊以及一內側邊,該外側邊與該接合墊間之垂直距離大於該內側邊與該接合墊間之垂直距離。 The illuminating diode device of claim 1, wherein the die bonding platform has an outer side and an inner side, and a vertical distance between the outer side and the bonding pad is greater than the inner side and the bonding pad The vertical distance between the two. 如請求項1所述之發光二極體裝置,其中該固晶平台之三側邊中的每一側邊分別具有向外突出的至少二接腳。 The light-emitting diode device of claim 1, wherein each of the three sides of the fixed crystal platform has at least two pins protruding outwardly. 如請求項1所述之發光二極體裝置,其中該些接腳等間距排列。 The illuminating diode device of claim 1, wherein the pins are equally spaced. 如請求項1至2中任一項所述之發光二極體裝置,其中該固晶平台具有至少一孔洞,且至少部分該孔洞被該反射體所填充。 The light emitting diode device of any one of claims 1 to 2, wherein the die bonding platform has at least one hole, and at least a portion of the hole is filled by the reflector. 如請求項5所述之發光二極體裝置,其中該孔洞為圓形或多邊形。 The light-emitting diode device of claim 5, wherein the hole is circular or polygonal. 一種發光二極體裝置,包含:一支架模組,包含二支架,該二支架相互並排,每一該支架包含一固晶平台以及一接合墊,該固晶平台包含一上表面及一下表面,該固晶平台之至少一側邊具有向外突出的至少二接腳,且該接合墊自該固晶平台之該下表面延伸出,該接合墊之寬度小於該固晶平台之寬 度,該固晶平台具有一外側邊以及一內側邊,該外側邊與該接合墊間之垂直距離大於該內側邊與該接合墊間之垂直距離;一反射體,包覆該支架模組,且暴露出該些固晶平台的部分該上表面;以及一發光二極體,跨接於該二固晶平台之部分該上表面上。 A light-emitting diode device comprises: a bracket module comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bonding pad, the solid crystal platform comprising an upper surface and a lower surface, At least one side of the die bonding platform has at least two pins protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, and the width of the bonding pad is smaller than the width of the die bonding platform The solid crystal platform has an outer side and an inner side, and a vertical distance between the outer side and the bonding pad is greater than a vertical distance between the inner side and the bonding pad; a reflector covering the a bracket module exposing a portion of the upper surface of the solid crystal platform; and a light emitting diode bridging a portion of the upper surface of the two fixed crystal platforms. 如請求項7所述之發光二極體裝置,其中該固晶平台之三側邊中的每一側邊分別具有向外突出的至少二接腳。 The illuminating diode device of claim 7, wherein each of the three sides of the fixed crystal platform has at least two pins protruding outwardly. 如請求項7所述之發光二極體裝置,其中該些接腳等間距排列。 The illuminating diode device of claim 7, wherein the pins are equally spaced. 如請求項7所述之發光二極體裝置,其中該固晶平台具有至少一孔洞,且至少部分該孔洞被該反射體所填充。 The light emitting diode device of claim 7, wherein the die bonding platform has at least one hole, and at least a portion of the hole is filled by the reflector. 如請求項10所述之發光二極體裝置,其中該孔洞為圓形或多邊形。 The light emitting diode device of claim 10, wherein the hole is circular or polygonal. 一種用於封裝發光二極體之支架陣列,包含:一框架;多個支架模組,每一該支架模組包含二支架,該二支架相互並排,每一該支架包含一固晶平台以及一接合墊,該固晶平台包含一上表面及一下表面,該固晶平台之至少一側邊具有向外突出的至少二接腳,且該接合墊自該固晶平台的該下表面延伸出,該接合墊之寬度小於該固晶平台之寬度,該接合墊之高度大於該固晶平台之高度,該些支架模組以陣列的方式設置於該框架中;以及一反射體,設置於該框架內並包覆該些支架模組,且暴露出該些固晶平台的部分該上表面。 An array of brackets for encapsulating a light-emitting diode comprises: a frame; a plurality of bracket modules, each of the bracket modules comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bracket a bonding pad, the die bonding platform includes an upper surface and a lower surface, and at least one side of the die bonding platform has at least two pins protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, The width of the bonding pad is smaller than the width of the bonding platform, the height of the bonding pad is greater than the height of the bonding platform, the bracket modules are arranged in an array in the frame; and a reflector is disposed on the frame The bracket modules are covered and exposed to expose a portion of the upper surface of the solid crystal platform. 如請求項12所述之支架陣列,其中該固晶平台具有一外側邊以及一內側邊,該外側邊與該接合墊間之垂直距離大於該內側邊與該接合墊間之垂直距離。 The stent array of claim 12, wherein the die bonding platform has an outer side and an inner side, and a vertical distance between the outer side and the bonding pad is greater than a vertical distance between the inner side and the bonding pad distance. 一種用於封裝發光二極體之支架陣列,包含:一框架; 多個支架模組,每一該支架模組包含二支架,該二支架相互並排,每一該支架包含一固晶平台以及一接合墊,該固晶平台包含一上表面及一下表面,該固晶平台之至少一側邊具有向外突出的至少二接腳,且該接合墊自該固晶平台的該下表面延伸出,該接合墊之寬度小於該固晶平台之寬度,該固晶平台具有一外側邊以及一內側邊,該外側邊與該接合墊間之垂直距離大於該內側邊與該接合墊間之垂直距離,該些支架模組以陣列的方式設置於該框架中;以及一反射體,設置於該框架內並包覆該些支架模組,且暴露出該些固晶平台的部分該上表面。 An array of brackets for encapsulating a light emitting diode, comprising: a frame; a plurality of bracket modules, each of the bracket modules includes two brackets, the two brackets are juxtaposed to each other, each bracket includes a solid crystal platform and a bonding pad, the solid crystal platform includes an upper surface and a lower surface, the solid At least one side of the crystal platform has at least two legs protruding outward, and the bonding pad extends from the lower surface of the die bonding platform, the width of the bonding pad is smaller than the width of the die bonding platform, and the bonding platform Having an outer side and an inner side, the vertical distance between the outer side and the bonding pad is greater than the vertical distance between the inner side and the bonding pad, and the bracket modules are arranged in an array on the frame And a reflector disposed in the frame and covering the bracket modules and exposing a portion of the upper surface of the fixed crystal platforms. 一種發光二極體裝置,包含:一支架模組,包含二支架,該二支架相互並排,每一該支架包含一固晶平台以及一接合墊,該固晶平台包含一上表面及一下表面,該固晶平台之至少一側邊具有向外突出的至少二接腳,且該接合墊自該固晶平台的該下表面延伸出;一反射體,包覆該支架模組,且暴露出該些固晶平台的部分該上表面;以及一發光二極體,跨接於該二固晶平台之部分該上表面上。 A light-emitting diode device comprises: a bracket module comprising two brackets, the two brackets being side by side, each bracket comprising a solid crystal platform and a bonding pad, the solid crystal platform comprising an upper surface and a lower surface, At least one side of the solid crystal platform has at least two legs protruding outward, and the bonding pad extends from the lower surface of the die bonding platform; a reflector covering the bracket module and exposing the a portion of the upper surface of the solid crystal platform; and a light emitting diode spanning a portion of the upper surface of the two solid crystal platforms. 如請求項15所述之發光二極體裝置,其中該些接腳等間距排列。 The illuminating diode device of claim 15, wherein the pins are equally spaced. 如請求項15所述之發光二極體裝置,其中該固晶平台具有至少一穿孔,且該些穿孔被該反射體所填充。 The light emitting diode device of claim 15, wherein the die bonding platform has at least one perforation, and the perforations are filled by the reflector.
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WO2010073950A1 (en) * 2008-12-25 2010-07-01 昭和電工株式会社 Light-emitting device, light-emitting module, and method for manufacturing light-emitting device
CN202349889U (en) * 2010-11-29 2012-07-25 东莞市驰明电子科技有限公司 Hardware support for assembling LED lamp
CN202434566U (en) * 2011-12-21 2012-09-12 佛山市国星光电股份有限公司 Novel TOP light-emitting diode (LED) frame and TOP LED device manufactured by novel TOP LED frame

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WO2009051178A1 (en) * 2007-10-19 2009-04-23 Nippon Tungsten Co., Ltd. Led package substrate and led package using the same
WO2010073950A1 (en) * 2008-12-25 2010-07-01 昭和電工株式会社 Light-emitting device, light-emitting module, and method for manufacturing light-emitting device
CN202349889U (en) * 2010-11-29 2012-07-25 东莞市驰明电子科技有限公司 Hardware support for assembling LED lamp
CN202434566U (en) * 2011-12-21 2012-09-12 佛山市国星光电股份有限公司 Novel TOP light-emitting diode (LED) frame and TOP LED device manufactured by novel TOP LED frame

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