CN102130278B - Package of light emitting diode - Google Patents
Package of light emitting diode Download PDFInfo
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- CN102130278B CN102130278B CN 201010615676 CN201010615676A CN102130278B CN 102130278 B CN102130278 B CN 102130278B CN 201010615676 CN201010615676 CN 201010615676 CN 201010615676 A CN201010615676 A CN 201010615676A CN 102130278 B CN102130278 B CN 102130278B
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- lead division
- emitting diode
- mould
- light
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Abstract
The invention relates to a package of a light-emitting diode, which comprises a light-emitting diode chip, a support for mounting the light-emitting diode chip and a die for mounting the support, wherein the support comprises a first leading-out part and a second leading-out part, a spacing interval is arranged between the first leading-out part and the second leading-out part, the widths at two ends of the spacing interval in the extension direction are larger than the middle width, the die comprises a filled part matched with the current status of the spacing interval, and the first leading-out part and the second leading-out part are mounted on two sides of the filled part of the die respectively; and a reinforcing part is upwards convexly arranged on the filled part of the die, and the reinforcing part is gradually upwards convex from the middle of the filled part to the two ends. As for the package of the light-emitting diode, the die adopts thermosetting resin to fill between the first leading-out part and the second leading-out part, thereby being capable of effectively preventing the phenomenon that the breakage occurs in a gap, reducing the thermal deformation of the die and effectively preventing the phenomena of low sticking force, yellowing and the like.
Description
Technical field
The present invention relates to a kind of LED package.
Background technology
Light-emitting diode utilizes its lighting function to can be used as a device for the back light unit at lighting apparatus, imageing sensor and display unit, photoflash lamp after through encapsulation.
General light-emitting diode is comprised of the support of light-emitting diode chip for backlight unit, diode installed chip and the mould of mounting bracket.Support comprises the first lead division, the second lead division that mutual isolation arranges, and the first lead division, the second lead division are connected with negative electrode with the anode of light-emitting diode respectively.After support is installed on the mould, fill thermoplastic resin phenylpropanolamine (Polyphthalamide) between the first lead division, the second lead division.But on this pattern, filling place of the first lead division, the second lead division is easy to divide or damaged phenomenon.In addition, light-emitting diode chip for backlight unit can produce a lot of heats when work, and the mould that is formed by thermoplastics such as phenylpropanolamine also easily causes thermal deformation.As time goes on thermoplastic resin easily causes the support adherence force to reduce, and xanthochromia etc. occurs, and whole LED package reliability is reduced.
Summary of the invention
An object of the present invention is to provide damaged LED package occurs between two supports of a kind of establishment.
For achieving the above object, the technical solution used in the present invention is:
A kind of LED package, comprise light-emitting diode chip for backlight unit, be used for installing described light-emitting diode chip for backlight unit support, be used for installing the mould of described support, described support comprises the first lead division, the second lead division, has spacing between described the first lead division and the second lead division, the width at described spacing two ends on its bearing of trend is greater than the width in the middle of it, described mould has the filling part that is complementary with described spacing shape, and described the first lead division, the second lead division are installed in respectively the filling part both sides of described mould.
Preferably, the material of described mould is thermosetting resin.Further preferably, described thermosetting resin is white.
Preferably, described spacing is shaped as Central Symmetry.
Preferably, the width of described spacing from both sides to the centre reduces gradually.
Preferably, offer concave part on the described support, described light-emitting diode chip for backlight unit is installed in the described concave part.
Another object of the present invention provides the mould that above-mentioned support is installed in a kind of LED package.
A kind of mould of LED package, described mould has the filling part that the spacing shape with described the first lead division, the second lead division is complementary, described the first lead division, the second lead division are installed in respectively the filling part both sides of described mould, and described filling part is protruding upward the reinforcement part.
Preferably, described reinforcement part is protruding upward gradually to two ends from the centre of described filling part.Further preferably, the cross section of described reinforcement part is triangular in shape.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
LED package of the present invention, mould employing thermosetting resin is formed on the filling between the first lead division and the second lead division, can effectively prevent this gap and damaged phenomenon occur, and reduce the thermal deformation of mould, effectively prevent the phenomenons such as the low and xanthochromia of adherence force.
Description of drawings
Accompanying drawing 1 is the plane graph of LED package of the present invention;
Accompanying drawing 2 is the cutaway view of LED package of the present invention;
Accompanying drawing 3 is the plane graph one of LED support part of the present invention;
Accompanying drawing 4 is the plane graph two of LED support part of the present invention;
Accompanying drawing 5 is mould schematic diagram of the present invention;
Accompanying drawing 6 is the partial schematic diagram of mould in the accompanying drawing 5.
Wherein: 1, LED package; 2, LED package; 100, light-emitting diode chip for backlight unit; 200, support; 210, the first lead division; 212, portion of terminal; 214, concave part; 215, spacing; 216, spacing; 220, the second lead division; 222, portion of terminal; 300, mould; 310, filling part; 320, reinforcement part; 410, wire; 420, wire.
Embodiment
The invention will be further described below in conjunction with drawings and Examples:
As shown in Figure 1, 2, 3, the LED package 1 of the present embodiment comprises light-emitting diode chip for backlight unit 100, support 200 and mould 300.Wherein: light-emitting diode chip for backlight unit 100 is engaged with N type semiconductor by P type semiconductor and forms, and produces light during from P type semiconductor to the N type semiconductor current emission; Support 200 comprises the first lead division 210 and the second lead division 220 that isolation arranges.
There is individual concave part 214 middle part of support 200, and as shown in Figure 2, the first lead division 210 is toward the recessed part of downside, and light-emitting diode chip for backlight unit 100 is installed in the concave part 214.In the present embodiment, the anode of light-emitting diode chip for backlight unit 100 and negative electrode correspond respectively to the first lead division 210 and the second lead division 220, somely in the anode of light-emitting diode chip for backlight unit 100 or the negative electrode lead to the first lead division 210, the first lead divisions 210 terminals by a wire 410 and form the portion of terminal 212 be connected with external circuitry; Light-emitting diode chip for backlight unit 100 another utmost points lead to the second lead division 220 by an other wire 420, the second lead division 220 terminals form the portion of terminal 222 that is connected with external circuitry, because the first lead division 210 and the second lead division 220 physical properties are isolated mutually, the anode of light-emitting diode chip for backlight unit 100 electrically separates with negative electrode.
The first lead division 210 and the 220 isolated settings of the second lead division form spacing 215,216 between the first lead division 210 and the second lead division 220.Width d1, the d3 at this spacing 215,216 two ends on its bearing of trend is greater than the width d2 in the middle of it.Spacing 215,216 shape are centrosymmetric images, namely from both ends to the middle cone (taper) are formed, and in other words, spacing 215,216 shape are to reduce gradually from both ends to the middle.As shown in Figure 3, wider in the middle of the Width at spacing 215 two ends, the axis of symmetry of its bearing of trend also forms symmetry, and more past centre is narrower; As shown in Figure 4, spacing 215 different its forms that are in spacing 216 and Fig. 3 are similar to curve.
The heat of sending on the light-emitting diode chip for backlight unit 100 effectively sheds at the concave part 214 by the first lead division 210.Mould 300 is the material of thermosetting resin (epoxy molding compound), and in order better to accomplish the light reflection, thermosetting resin interpolation silicon silica etc. makes it present white; Simultaneously, make the effect of LED package reach best at the light-emitting diode chip for backlight unit 100 coated resins of fluorescent material that comprise.
The mould of the LED package 2 of the present embodiment is that the white hot hardening resin is by compression forming, the thermosetting resin thermal endurance is more outstanding, adherence force to support 200 is also stronger, and, mould compared with the PPA material, light-emitting diode chip for backlight unit 100 heatings can be out of shape yet, and adherence force also can continue to keep, and significantly promotes 1 reliability effect of LED package; And the mould 200 that thermosetting resin forms can more effective inhibition to the effect of resin loss than the mould of PPA resin forming.
Yet thermosetting resin is more more outstanding than thermoplastic resin PPA heat-resistant quality and adherence force etc., but also larger than PPA hardness, and therefore damaged equally likely possibility is also higher.Width by spacing in the present embodiment diminishes from both ends to the middle gradually, suppresses the stress concentration phenomenon, makes the possibility of filling part 310 breakages of mould 200 less.In addition, the width of spacing directly affects filling part 310 and the first lead division 210, the second lead division 220 bonding areas under a stable condition, with reach filling part 310 and the first lead division 210, the second lead division 220 is pasted more firm.
Shown in Fig. 5,6, in the present embodiment, the filling part 310 of mould 200 extends upward reinforcement part 320, and reinforcement part 320 is protruding gradually to two ends from the centre of filling part 310, and the madial wall between Thickness Ratio filling part 310 both sides of mould 200 is thick.Because reinforcement part 320 forms with outstanding form on filling part 310, bear together reinforcement part 320 when filling part 310 is stressed, in addition, compared with filling part 310 inboards, filling part 310 both sides are higher with the possibility that be full of cracks occurs because of external impact, so reinforcement part 320 is to protruding in filling part 310 both sides.
In addition, reinforcement part 320 is higher than the installation site of the first lead division 210 and the second lead division 220, exists with discontiguous form.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with technique can understand content of the present invention and according to this enforcement, can not limit protection scope of the present invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (5)
1. LED package, comprise light-emitting diode chip for backlight unit, be used for installing the support of described light-emitting diode chip for backlight unit, be used for installing the mould of described support, described support comprises the first lead division, the second lead division, has spacing between described the first lead division and the second lead division, it is characterized in that: the width at described spacing two ends on its bearing of trend is greater than the width in the middle of it, described spacing be shaped as Central Symmetry, the width of described spacing from both sides to the centre reduces gradually, described mould has the filling part that is complementary with described spacing shape, described the first lead division, the second lead division is installed in respectively the filling part both sides of described mould.
2. LED package according to claim 1, it is characterized in that: the material of described mould is thermosetting resin.
3. LED package according to claim 2 is characterized in that: described thermosetting resin is white.
4. LED package according to claim 1, it is characterized in that: offer concave part on the described support, described light-emitting diode chip for backlight unit is installed in the described concave part.
5. the mould of a LED package as claimed in claim 1, it is characterized in that: described mould has and described the first lead division, the filling part that the spacing shape of the second lead division is complementary, described the first lead division, the second lead division is installed in respectively the filling part both sides of described mould, described filling part is protruding upward the reinforcement part, described reinforcement part is protruding upward gradually to two ends from the centre of described filling part, the cross section of described reinforcement part is triangular in shape, and described reinforcement part is higher than the installation site of described the first lead division and the second lead division.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010615676 CN102130278B (en) | 2010-12-31 | 2010-12-31 | Package of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010615676 CN102130278B (en) | 2010-12-31 | 2010-12-31 | Package of light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102130278A CN102130278A (en) | 2011-07-20 |
| CN102130278B true CN102130278B (en) | 2013-04-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010615676 Active CN102130278B (en) | 2010-12-31 | 2010-12-31 | Package of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102130278B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767189A (en) * | 2004-09-20 | 2006-05-03 | 帝希欧有限公司 | High brightness led with anti-static discharge impact protection funciton |
| CN101752352A (en) * | 2008-12-08 | 2010-06-23 | 瑞莹光电股份有限公司 | Light emitting diode package and production method thereof |
| CN101828275A (en) * | 2007-10-19 | 2010-09-08 | 日本钨合金株式会社 | LED package substrate and LED package using the same |
| CN201946628U (en) * | 2010-12-31 | 2011-08-24 | 昆山琉明光电有限公司 | Light emitting diode package and its mould |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3546812B2 (en) * | 1999-10-07 | 2004-07-28 | 株式会社デンソー | Surface mount type light emitting diode |
| KR100616679B1 (en) * | 2005-05-11 | 2006-08-28 | 삼성전기주식회사 | A side view type led package |
| KR100780236B1 (en) * | 2006-04-27 | 2007-11-27 | 삼성전기주식회사 | Light emitting diode package |
| JP2011508416A (en) * | 2007-12-24 | 2011-03-10 | サムソン エルイーディー カンパニーリミテッド． | Light emitting diode package |
-
2010
- 2010-12-31 CN CN 201010615676 patent/CN102130278B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1767189A (en) * | 2004-09-20 | 2006-05-03 | 帝希欧有限公司 | High brightness led with anti-static discharge impact protection funciton |
| CN101828275A (en) * | 2007-10-19 | 2010-09-08 | 日本钨合金株式会社 | LED package substrate and LED package using the same |
| CN101752352A (en) * | 2008-12-08 | 2010-06-23 | 瑞莹光电股份有限公司 | Light emitting diode package and production method thereof |
| CN201946628U (en) * | 2010-12-31 | 2011-08-24 | 昆山琉明光电有限公司 | Light emitting diode package and its mould |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2001-177160A 2001.06.29 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102130278A (en) | 2011-07-20 |
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