JP2008060589A - Substrate for mounting light-emitting element and method for manufacturing the same, light-emitting element module and method for manufacturing the same, display units, lighting units, and traffic signal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting a light-emitting element that has superior efficiency in extracting light from a light-emitting element and can be manufactured at low cost and its manufacturing method, and to provide a light-emitting element module that is provided with the same and its manufacturing method, and display units, lighting units and traffic signals which have the light-emitting element module. <P>SOLUTION: The present invention provides a substrate for mounting a light-emitting element, that has a core metal 22 in which a reflective cup portion 28 for reflecting the light emitted from a light-emitting element 24 toward a predetermined direction is formed, and an enamel layer 23 that covers the surface of this core metal, with the thickness of the enamel layer being set within the range of 50 to 200 μm. Furthermore, it provides a light-emitting element module 20, which is constituted by mounting a light-emitting element on the substrate for mounting a light-emitting element and the light-emitting element is sealed by a transparent sealing resin 26. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting element mounting substrate for mounting a light emitting element such as a light emitting diode (hereinafter referred to as LED), a manufacturing method thereof, a light emitting element module in which the light emitting element is mounted on the substrate, and a manufacturing method thereof. The present invention relates to a display device, a lighting device, and a traffic signal device using the light emitting element module.

  Conventionally, in a light emitting element module in which a light emitting element such as an LED is mounted and packaged, in order to reduce the package structure, a surface mount type package structure as shown in FIG. 10 is used. In this light emitting element module, a concave portion is provided in a substrate 3 made of resin or ceramics, both positive and negative electrodes 4 and 4 are arranged on the bottom surface of the concave portion, and the light emitting element 1 is electrically connected to one of the electrodes via a conductive paste or the like. Connected and fixed. The upper side of the light emitting element 1 and the other electrode 4 are electrically connected by a wire bond 2 such as a gold wire. These electrodes 4 and 4 extend outside the substrate. After the light emitting element 1 is mounted, the concave portion is filled with a sealing resin 5 having a high light transmittance such as an epoxy resin and cured to seal the light emitting element 1. In particular, in the case of a white LED, the light emitting element is a blue LED, and a blue excitation yellow light emitting phosphor is mixed in a sealing resin, and is similarly filled in the reflective recess.

  Further, as a use for mounting a large number of light emitting elements on the same substrate, a dot matrix unit which is an illumination device and a display device has been generally used. In order to make it possible to mount a large number of light emitting elements such as LEDs, these devices are generally manufactured as a single product by mounting a large number of light emitting elements on a glass fiber reinforced epoxy resin substrate or the like. For example, Patent Document 1 discloses a substrate for this type of LED unit.

  As a conventional structure of this LED unit, a structure in which a large number of bullet-type LEDs are mounted on an electronic substrate or a form in which a large number of surface-mounted LEDs are mounted is taken. In order to manufacture this unit, a process of manufacturing a bullet-type or surface-mount type LED and electrically connecting it to an electronic board on which an electronic circuit pattern is manufactured by soldering is necessary. Become. Therefore, a two-stage product process of a bullet-type or surface-mount type LED and an LED unit in which it is combined is required.

  In recent years, in the manufacture of light-emitting element modules such as LED units, a manufacturing method called a chip-on-board method in which a light-emitting element is directly mounted on an electronic substrate is becoming mainstream. This has the advantage that the semi-finished product process as described above is not required and the structure can be simplified by mounting the light emitting element directly on the electronic substrate.

  On the other hand, when a light-emitting element such as an LED is mounted on a substrate, a package structure having a reflective cup portion that is a concave portion having a slope-like reflective surface is required in order to direct the light emission direction forward. Become. The shape of the reflection cup part also has a role of controlling the light emission state and holding a resin for sealing the light emitting element according to the design. Furthermore, with the recent increase in light emission intensity of light-emitting elements, it is important that the electronic substrate on which the light-emitting elements are mounted has a heat dissipation function.

In view of these requirements, as shown in FIG. 11, a structure using a substrate in which an insulating layer 7 is provided on a heat radiating metal plate 8 such as an aluminum plate or a copper plate has become mainstream. In the LED unit shown in FIG. 11, an insulating layer 7 is provided on a heat radiating metal plate 8, a plurality of electrodes 4 are provided on the insulating layer 7, a light emitting element 1 is provided on these electrodes 4, and light is emitted from adjacent electrodes. The upper side of the element 1 is electrically connected by wire bonds 2, and the reflector 6 having a plurality of holes having slope portions 6a is placed so that each light emitting element 1 is located at the center of the recess, and each The hole is filled with a sealing resin 5 and cured to seal the light emitting element 1. FIG. 12 is a plan view of a state in which the light emitting element 1 is mounted on the substrate. This structure is disclosed in Patent Document 2, for example.
Further, FIG. 13 shows an electrode structure in this case, and FIG. 14 shows an electric circuit configuration.

Note that a light-emitting element module in a chip-on-board system is generally manufactured through the following steps.
1. When the light emitting element is made of silver paste on the electrode in the reflection cup portion of the substrate or the electrode material of the light emitting element is made of AuSn or the like, it is attached by connecting with heating and vibration, so-called eutectic. Continuity. Furthermore, it connects with the electrode of a counter electrode by a wire bond. A light-emitting element having electrodes only on one side is wire-bonded to both positive and negative electrodes. Furthermore, in a light emitting element having electrodes only on the mold surface, it can be connected via bumps made of gold or the like disposed on the electrodes by flip chip mounting.
2. The sealing resin is filled in the reflective cup portion, and is cured and molded in accordance with the curing method of the resin used, such as thermosetting or UV curing. When the light emitting element module to be produced is a white LED module, a phosphor is mixed in advance in the sealing resin before curing.
3. If necessary, a lens body made of resin, glass, or the like may be combined above the sealing resin and above the light emitting element module.

On the other hand, when the light emitting element is to be directly mounted on the substrate without providing the reflective cup portion, the electrode 12 is provided on the flat substrate 11 as shown in FIG. 15, and the light emitting element 9 and the wire are provided on the electrode 12. A method in which the bond 10 is mounted by the same method as described above, the sealing resin 13 is molded by a molding method such as transfer molding, and the light emitting element 9 and the wire bond 10 are resin-sealed is also conceivable. However, in this method, it is difficult to apply the sealing resin 13 at an accurate position due to problems such as dimensional tolerance of the substrate. Further, in the case of a white LED, a phosphor is mixed in the sealing resin 13, so If the shape is unstable, the distance that the light emitted from the light-emitting element 9 passes through the resin containing the phosphor will vary, making it difficult to control the required chromaticity.
JP 2001-332768 A JP 2001-332769 A

The prior art described above has the following problems.
In the surface mount type package structure, it is necessary to pass the electrode through the inside of the base material, and it is necessary to assemble the members by stacking them.
Conventional aluminum laminated substrates and aluminum nitride substrates can be said to have sufficient heat dissipation, but in order to produce a reflective cup shape, it is necessary to further laminate a base material for forming a reflective cup portion on the substrate in the same manner as described above. is there. In particular, when emphasizing heat dissipation, it is needless to say that it is appropriate to use metal as a material constituting the substrate from the viewpoint of thermal conductivity. However, when metal is used for the substrate, it also has conductive properties. Therefore, it is necessary to insulate the electrode and the base material, and this insulating plate also becomes an element in the laminated structure, which further complicates the structure.
Assembling of the base material for forming the reflective cup portion is usually performed by an adhesive or a hot press, but the reflective cup is not suitable for reasons such as low smoothness of the substrate or uneven application of the adhesive required for assembly. An air gap is generated between the part forming base material and the substrate, and then bubbles are generated when the sealing resin is put in the cup part. If bubbles remain in the sealing resin, light from the light emitting element is greatly scattered by the bubbles, and thus there is a problem in that the light extraction efficiency from the light emitting element is greatly reduced.
In addition, a substrate for forming the reflective cup portion is required separately from the substrate, and an extra process is required for assembly, which causes a problem of increasing costs.

  The present invention has been made in view of the above circumstances, and has a light emitting element mounting substrate that is excellent in light extraction efficiency from a light emitting element and can be produced at low cost, a method for manufacturing the same, and a light emitting element packaged by mounting the light emitting element on the substrate An object is to provide a module, a manufacturing method thereof, a display device using the light emitting element module, a lighting device, and a traffic signal.

  In order to achieve the above object, the present invention provides a hollow layer having a thickness of 50 μm to 200 μm on the surface of a core metal provided with a reflective cup portion that reflects light emitted from a mounted light emitting element in a predetermined direction. A light-emitting element mounting substrate is provided.

  The present invention also provides a light emitting element module, wherein the light emitting element is mounted on the light emitting element mounting substrate according to the present invention, and the light emitting element is sealed with a transparent sealing resin.

  In the light emitting element module of the present invention, the light emitting element is preferably a white light emitting diode that emits white light by mixing a phosphor in a sealing resin.

  Further, the present invention forms a reflective cup portion that reflects light emitted from the mounted light emitting element in a predetermined direction at a desired position of the core metal, and then applies a enamel material to the surface of the core metal and bakes it. Provided is a method for manufacturing a light emitting element mounting substrate, comprising: obtaining a light emitting element mounting substrate having a hollow metal layer having a thickness of 50 μm to 200 μm on a surface of a core metal.

  In the method for manufacturing a substrate for mounting a light-emitting element of the present invention, it is preferable that a hollow material mainly composed of glass is electrodeposited on the surface of the core metal and then baked.

  Further, the present invention forms a reflective cup portion that reflects light emitted from the mounted light emitting element in a predetermined direction at a desired position of the core metal, and then applies a enamel material to the surface of the core metal and bakes it. A light emitting device mounting substrate having a thickness of 50 μm to 200 μm provided on the surface of the core metal is manufactured, then electrodes are formed on the surface of the light emitting device mounting substrate, and then the center of the reflective cup portion A light emitting element is mounted on the electrode of each part, and each electrode and the light emitting element are electrically connected, and then the reflection cup part is filled with resin and cured, and the light emitting element is sealed to produce a light emitting element module. The manufacturing method of the light emitting element module characterized by the above-mentioned is provided.

  In the method for manufacturing a light emitting element module of the present invention, it is preferable to seal the light emitting element with a resin mixed with a phosphor.

  In the manufacturing method of the light emitting element module of this invention, it is preferable that a light emitting element is a blue light emitting diode and a fluorescent substance is a blue excitation yellow light emission fluorescent substance.

  The present invention also provides a display device having the above-described light emitting element module according to the present invention.

  Moreover, this invention provides the illuminating device which has the light emitting element module which concerns on this invention mentioned above.

  The present invention also provides a traffic signal device having the above-described light emitting device module according to the present invention.

According to the present invention, since the reflective cup portion for mounting the light emitting element is provided on the light emitting element mounting substrate, there is no need to manufacture the substrate for forming the reflective cup portion separately from the substrate on the substrate. The structure becomes simple, and the cost for assembly can be suppressed.
Moreover, by not using a base material for the reflective cup that is separate from the substrate, it is possible to prevent air bubbles from being mixed into the sealing resin, and it is possible to prevent a reduction in light extraction efficiency from the light emitting element.
In addition, since the groove is formed in the peripheral edge of the bottom portion of the reflective cup portion, the glass does not melt when the enamel layer is baked, and the peripheral edge of the bottom portion is not rounded, and a portion for mounting the light emitting element is secured in the center of the bottom portion .
Since the light emitting element mounting substrate provided with the enamel layer on the surface of the core metal is used, the heat dissipation is excellent, and the light emission intensity of a light emitting element such as an LED can be increased.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 3 are views showing a first embodiment of the present invention, FIG. 1 is a cross-sectional view of a light emitting element module, and FIG. 2 is a light emitting element mounting substrate (hereinafter, referred to as a light emitting element mounting substrate) used in the same light emitting element module. FIG. 3 is a plan view of the same enamel substrate. In these drawings, reference numeral 20 is a light emitting element module, 21 is a hollow substrate, 22 is a core metal, 23 is a hollow layer, 24 is a light emitting element such as an LED, 25 is a wire bond, 26 is a sealing resin, 27 is an electrode, Reference numeral 28 denotes a reflection cup portion, 29a denotes a bottom portion, and 29b denotes a slope portion.

  As shown in FIGS. 2 and 3, the enamel substrate 21 of the present embodiment has a core metal 22 in which a plurality of reflection cup portions 28 that reflect light emitted from the mounted light emitting element 24 in a predetermined direction are provided in the vertical and horizontal directions. The enamel layer 23 having a thickness in the range of 50 μm to 200 μm is provided on the surface.

  Further, as shown in FIG. 1, the light emitting element module 20 of the present embodiment includes the enamel substrate 21, the electrode 27 provided in a divided state on the upper surface of the enamel substrate 21, and the reflection cup portions 28. The light emitting element 24 mounted on the electrode 27 at the center of the bottom 29 a, the wire bond 25 electrically connecting the electrode 27 adjacent to the upper side of each light emitting element 24, and the reflection cup portions 28. And a transparent sealing resin 26 that is filled and cured to seal the light emitting element 24.

  The core metal 22 of the hollow substrate 21 can be manufactured using various metal materials, and the material is not limited, but a metal material that is inexpensive and easy to process, for example, low carbon steel, stainless steel or the like is preferable. In this example, the quadrangular plate-shaped core metal 22 is used, but the shape of the core metal 22 is not limited to this, and can be appropriately selected according to the use of the light emitting element module 20 or the like.

As a method of forming the reflective cup portion 28 on the core metal 22, it can be easily formed by cutting using a cutting tool such as a drill or polishing using a cemented carbide wheel.
The concave shape of the reflection cup portion 28 to be formed is preferably a shape having a flat bottom portion 29a and a slope portion 29b having an inclination gradually expanding upward from the peripheral edge thereof.

  The material of the enamel layer 23 provided on the surface of the core metal 22 can be selected from materials mainly made of glass used for forming an enamel layer on the metal surface. In the present invention, the enamel layer 23 provided on the surface of the core metal 22 has a thickness in the range of 50 μm to 200 μm. If the thickness of the enamel layer 23 is less than 50 μm, cracks may occur in the enamel layer when the core metal 22 is baked, and the internal metal core may be exposed to the outside, resulting in a decrease in insulation performance. The long-term reliability of the substrate is deteriorated due to oxidation of the core metal 22 or the like. In addition, if the thickness of the enamel layer 23 exceeds 200 μm, the enamel layer may also crack, and the enamel layer easily accumulates on the periphery of the bottom portion 29a during baking. There is a problem that can not be implemented. In the present invention, by forming the enamel layer 23 having a thickness in the range of 50 μm to 200 μm on the surface of the core metal 22, excellent insulation performance can be obtained, and a uniform enamel layer 23 without cracks can be formed. In addition, with the enamel layer 23, the shape of the core metal 22 serving as a base can be reproduced as it is, and the shape of the reflective cup portion 28 formed on the core metal 22 can also be reproduced as it is on the enamel layer 23.

  The electrode 27 provided on the upper surface of the hollow substrate 21 can be formed to extend to the inside of the reflective cup portion 28 with a thick film silver paste. It is also possible to press-mold a copper foil and mount it in a reflective cup.

  The light emitting element 24 is not particularly limited, but a semiconductor light emitting element such as an LED or a laser diode (LD) is preferably used. The light emitting color of the light emitting element 24 used in the present invention is not particularly limited, and may be blue, green, red, or any other light emitting color. Further, a blue light emitting semiconductor element made of a nitride compound semiconductor and the blue light emitting element 24 may be used. A white LED combined with a phosphor that absorbs at least part of the light of the system and converts the wavelength into light in the visible wavelength range (for example, yttrium, aluminum, garnet phosphor activated by cerium) may be used. In addition, the plurality of light emitting elements 24 mounted side by side on the enamel substrate 21 may be LEDs of the same light emitting color, for example, for traffic traffic lights or the like, or LEDs of different light emitting colors are sequentially or randomly selected. It is good also as arrange | positioning to a display apparatus. Furthermore, by arranging a large number of blue LEDs, green LEDs, and red LEDs sequentially or randomly on a large-area enamel substrate 21, a display device using LEDs can be configured. Further, a white LED is used as the light emitting element 24, and a large number of white LEDs are vertically and horizontally mounted on a large enamel substrate 21, whereby a large-area planar illumination device can be configured.

As the sealing resin 26, an epoxy thermosetting resin, an ultraviolet curable resin, a thermosetting silicon resin, or the like having a high light transmittance is used.
A gold wire or the like is used as the wire bond 25. The wire bond 25 can be bonded using a wire bonding apparatus conventionally used for connecting the light emitting element 24 and the like.

Since the light emitting element module 20 described above is provided with the reflective cup portion 28 for mounting the light emitting element on the enamel substrate 21, there is no need to produce a reflective cup portion forming base material separately from the substrate on the substrate, The substrate structure is simplified, and the costs associated with assembly can be suppressed.
Moreover, by not using a base material for the reflective cup that is separate from the substrate, it is possible to prevent air bubbles from being mixed into the sealing resin 26, and it is possible to prevent a reduction in light extraction efficiency from the light emitting element 24.
Since the hollow substrate 21 provided with the hollow layer 23 on the surface of the core metal 22 is used, the heat dissipation is excellent, and the light emission intensity of the light emitting element 24 such as an LED can be increased.

In the structure of the hollow substrate 21, the electrode 24 is exposed on the upper surface of the substrate. However, a resin or the like for electrical insulation may be disposed on the exposed portion.
Further, a lens body made of resin, glass or the like may be combined above the sealing resin 26 or above the light emitting element module 20 as necessary.

  FIG. 4 is a cross-sectional view of a light emitting device module according to the second embodiment of the present invention. In FIG. 4, reference numeral 30 denotes a light emitting device module, 31 denotes a hollow substrate, 32 denotes a core metal, 33 denotes a hollow layer, and 34 denotes a hollow layer. A light emitting element such as an LED, 35 is a wire bond, 36 is a sealing resin, 37 is an electrode, 38 is a reflective cup portion, 39a is a bottom portion, and 39b is a slope portion.

The light emitting element module 30 of this embodiment shows a structure using a hollow substrate 31 for mounting the light emitting element 34 alone, and the first embodiment is different except that the shape of the hollow substrate 31 and the number of light emitting elements 34 mounted are different. The light-emitting element module 20 is the same as the light-emitting element module 20. Are the same as the enamel substrate 21, the core metal 22, the enamel layer 23, the light emitting element 24, the wire bond 25, the sealing resin 26, the electrode 27, and the reflection cup portion 28 that constitute the light emitting element module 20 according to the first embodiment. Can be configured.
The light emitting element module 30 of this embodiment can obtain the same effects as the light emitting element module 20 according to the first embodiment.

  FIG. 5 is a cross-sectional view of a light emitting element module according to a third embodiment of the present invention. In FIG. 5, reference numeral 40 denotes a light emitting element module, 41 denotes a hollow substrate, 42 denotes a core metal, 43 denotes a hollow layer, and 44 denotes a hollow layer. A light emitting element such as an LED, 45 is a wire bond, 46 is a sealing resin, 47 is an electrode, 48 is a reflection cup portion, 49a is a bottom portion, and 49b is a slope portion.

  The light emitting element module 40 of the present embodiment is the same as the light emitting element module 20 according to the first embodiment, except that a hollow substrate 41 provided with grooves 50 on the periphery of the bottom 49a of the reflective cup portion 48 is used. The enamel substrate 41, the core metal 42, the enamel layer 43, the light emitting element 44, the wire bond 45, the sealing resin 46, the electrode 47, and the reflection cup portion 48 constituting the light emitting element module 40 are the light emitting element according to the first embodiment. The enamel substrate 21, the core metal 22, the enamel layer 23, the light emitting element 24, the wire bond 25, the sealing resin 26, the electrode 27, and the reflection cup portion 28 that constitute the module 20 can be configured similarly.

  When the enamel substrate 41 having the reflective cup portion 48 is manufactured, the enamel layer 43 is fixed to the surface of the core metal 42 by applying the enamel material to the core metal 42 and baking. However, when the baking is performed, the glass body is baked. Before, it melts temporarily and flows, so that the peripheral edge of the bottom of the cup becomes round, and in some cases, there is a possibility that a smooth surface on which the light emitting element 44 is mounted cannot be secured. In the present embodiment, by using the hollow substrate 41 provided with the groove 50 at the periphery of the bottom portion 49a, the glass body accumulates in the groove at the periphery of the bottom portion, and the other bottom portion 49a can maintain a flat state. A portion other than the groove 50 of the bottom 49a is a portion for mounting the light emitting element 44, and by making the area appropriate, a flat portion for mounting the light emitting element can be secured.

  In the present embodiment, the same effect as that of the first embodiment described above is obtained, and the groove 50 is formed at the periphery of the bottom 49a of the reflecting cup portion 48. Therefore, when the enamel layer 43 is baked, the glass melts and the bottom The peripheral edge of 49a is not rounded, and a portion for mounting the light emitting element 44 is secured in the center of the bottom, so that the yield can be improved.

  FIG. 6 is a view showing an example of a reflective cup portion with a groove. In this example, the reflective cup portion 51 forms a groove 54 between the bottom portion 52 and the slope portion 53 and protrudes to the periphery of the bottom portion 52. The portion 55 is provided. In this structure, the groove 54 is provided, and the convex portion 55 is provided on the periphery of the bottom portion 52, whereby the molten glass can be prevented from flowing into the groove 54.

  FIG. 7 is a diagram showing another example of the grooved reflection cup portion. In this example, the reflection cup portion 56 is gradually deeper between the bottom portion 57 and the slope portion 58 toward the outside of the bottom portion 57. The groove 59 having such a shape is provided. In the groove 59 having such a shape, the molten glass is likely to be accumulated away from the bottom portion 57, so that the effect of preventing the periphery of the bottom portion 57 from being rounded can be enhanced.

  In addition, if it is a method of forming a groove in the bottom peripheral edge of the reflective cup part, if the thickness of the enamel layer is not appropriate, the enamel layer flows locally at the time of baking, and the enamel layer tends to be dented. In the case of producing with silver paste, since it is liquid before application, it is possible to continuously ensure electrical continuity even in the groove portion.

  As the core metal, a low carbon steel plate having a length of 50 mm, a width of 50 mm, and a thickness of 1 mm was used. By drilling the surface of this steel plate, three recesses in the length and width direction were formed so that a total of nine recesses were evenly arranged. The dimensions of the bottom surfaces of these recesses were 1 mm in diameter, 0.5 mm in depth, and inclined portions were formed at an angle of 45 °.

  A glass powder for forming an enamel layer is dispersed in a dispersion medium so that the distance between the core substrate and the aluminum plate as the counter electrode of the core metal is 15 mm, and the metal plate and the aluminum plate are dispersed. It was immersed in the medium. Further, a glass powder was electrodeposited on the surface of the core metal by applying a DC voltage between the core metal and the aluminum plate with the metal plate serving as a cathode side. Then, the enamel substrate was produced by baking in air | atmosphere and forming the enamel layer which consists of glass on the surface of a core metal. The electrode was produced by applying a silver paste on the enamel layer and firing it.

  The application of glass powder was adjusted so that the thickness of the enamel layer was changed to produce enamel substrates shown in Table 1.

  As can be seen from the results in Table 1, when the thickness of the enamel layer on the substrate is 50 μm or more, no crack occurs on the substrate. On the other hand, if the thickness is 50 μm or less, a crack occurs in a part of the enamel layer, and the internal metal core is exposed to the outside. In this case, there is a concern about deterioration of long-term reliability of the substrate due to deterioration of insulating performance, oxidation of the core metal, or the like. A location where a crack occurs is likely to occur in the shoulder 61 portion of the reflective cup portion 60 shown in FIG.

Next, LEDs were mounted on the enamel substrates of Examples 1 to 3 and Comparative Examples 1 and 2 described above.
The results are shown in Table 2. The LED was evaluated using a blue LED (emission center wavelength λ = 460 nm) made of InGaN having a length of 300 μm, a width of 300 μm, and a thickness of 200 μm.

  From the results of Table 2, in Comparative Example 2, the light emitting element could not be mounted at 2 out of 9 places. The reason for this is that, when the cross section is observed, the substrate shape of the bottom peripheral edge 62 of the recess is rounded as shown in FIG. 9, and the area of the flat part on which the light emitting element can be mounted is reduced. Conceivable. The reason for this shape is considered to be the result that the raw glass powder melted and flowed and accumulated when the enamel layer was baked. If the enamel layer has a thickness of 200 μm or less, it can be said that a sufficient region for mounting the light emitting element is secured.

It is sectional drawing which shows 1st Embodiment of the light emitting element module of this invention. It is sectional drawing which shows 1st Embodiment of the enamel substrate of this invention. It is a top view which shows 1st Embodiment of the enamel substrate of this invention. It is sectional drawing which shows 2nd Embodiment of the light emitting element module of this invention. It is sectional drawing which shows 3rd Embodiment of the light emitting element module of this invention. It is principal part sectional drawing which shows an example of a reflective cup part with a groove | channel. It is principal part sectional drawing which shows another example of a reflective cup part with a groove | channel. It is principal part sectional drawing of the reflective cup part produced in the Example. It is principal part sectional drawing of the reflective cup part with which the bottom part periphery was rounded. It is sectional drawing which illustrates the conventional light emitting element package structure. It is sectional drawing which shows an example of the conventional light emitting element module. It is a top view which shows an example of the conventional light emitting element module. It is a top view which shows the electrode structure of the conventional light emitting element module. It is an electric circuit diagram of the conventional light emitting element module. It is sectional drawing which shows another example of the conventional light emitting element module.

Explanation of symbols

  20, 30, 40 ... light emitting element module, 21, 31, 41 ... enamel substrate (light emitting element mounting substrate), 22, 32, 42 ... core metal, 23, 33, 43 ... enamel layer, 24, 34, 44 ... Light emitting element, 25, 35, 45 ... wire bond, 26, 36, 46 ... sealing resin, 27, 37, 47 ... electrode, 28, 38, 48, 51, 56, 60 ... reflective cup part, 29a, 39a, 49a, 52, 57 ... bottom, 29b, 39b, 49b, 53, 58 ... slope, 50, 54, 59 ... groove.

Claims (11)

  A light emitting device characterized in that a hollow layer having a thickness in a range of 50 μm to 200 μm is provided on a surface of a core metal provided with a reflective cup portion that reflects light emitted from a mounted light emitting device in a predetermined direction. Mounting board.   A light emitting element module, wherein the light emitting element is mounted on the light emitting element mounting substrate according to claim 1, and the light emitting element is sealed with a transparent sealing resin.   The light-emitting element module according to claim 2, wherein the light-emitting element is a white light-emitting diode that emits white light by mixing a phosphor in a sealing resin.   A reflective cup portion that reflects light emitted from the mounted light emitting element in a predetermined direction is formed at a desired position of the core metal, and then enamel material is applied to the surface of the core metal and baked to the surface of the core metal. A method for manufacturing a light emitting element mounting substrate, comprising: obtaining a light emitting element mounting substrate provided with a hollow layer having a thickness in a range of 50 μm to 200 μm.   The method for manufacturing a substrate for mounting a light-emitting element according to claim 4, wherein an enamel material mainly composed of glass is electrodeposited on the surface of the core metal and then baked.   A reflective cup portion that reflects light emitted from the mounted light emitting element in a predetermined direction is formed at a desired position of the core metal, and then enamel material is applied to the surface of the core metal and baked to the surface of the core metal. A light emitting element mounting substrate provided with a hollow layer having a thickness in the range of 50 μm to 200 μm is manufactured, then an electrode is formed on the surface of the light emitting element mounting substrate, and then on the electrode at the center of the reflective cup portion A light emitting element is mounted, and each electrode and the light emitting element are electrically connected, and then the reflection cup portion is filled with resin and cured, and the light emitting element is sealed to produce a light emitting element module. Manufacturing method of light emitting element module.   The method for manufacturing a light emitting element module according to claim 6, wherein the light emitting element is sealed with a resin mixed with a phosphor.   8. The method of manufacturing a light emitting element module according to claim 7, wherein the light emitting element is a blue light emitting diode, and the phosphor is a blue excited yellow light emitting phosphor.   A display device comprising the light emitting element module according to claim 2.   The illuminating device which has a light emitting element module of Claim 3.   A traffic signal having the light emitting element module according to claim 2.

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