JP2008244421A - Light-emitting device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which has an improved light extraction efficiency, receives a slight influence on unevenness in the light distribution and the chrominance even if an element chip is mounted slightly offset from the desired mount position, and exhibits excellent heat dissipation. <P>SOLUTION: A package 20 has a support 30 from which the central section on the bottom of a cup projects upward than the peripheral section. A light-emitting element 10 is mounted at the center on the support. Electrically conductive members 61, 62 are formed on the peripheral section of the bottom of the cup, and electrically connected to electrodes of the light emitting element. A color conversion layer 90 covering the light-emitting element is formed on the support. A light-transmitting member 50 is filled in the cup so as to seal the light-emitting element, the color conversion layer, and the bottom of the cup. The color conversion layer is discontinued between the periphery on the support and the peripheral section on the bottom of the cup. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light-emitting device and a method for manufacturing the same, and more particularly to a light-emitting device having a structure in which a light-emitting output of a semiconductor light-emitting element is wavelength-converted by a color conversion layer and a method for forming a color conversion layer. It is what is done.

  As an example of a light-emitting device using a semiconductor light-emitting element, a light-emitting diode (LED) chip is accommodated inside a concave cup portion of a package, and a translucent member containing a fluorescent material for wavelength-converting the light emission output of the LED chip Some have a structure in which a cup portion is filled.

  When manufacturing such a light-emitting device, after mounting the LED chip on the bottom surface of the cup portion, a translucent member containing a fluorescent material is filled in the cup portion, and the fluorescent material is placed on the LED chip and the bottom surface of the cup portion. It is allowed to settle (see, for example, FIG. 1 in Patent Document 1). Alternatively, Patent Document 2 (FIG. 5) discloses a method of depositing a fluorescent material on an LED chip by spray coating. As shown in FIG. 1 of Patent Document 1, the distance to the cup inner wall on the bottom surface of the cup portion around the LED chip is the same as the wiring pattern and the LED formed in the peripheral region of the LED chip fixing portion on the bottom surface of the cup portion. Since a thin metal wire for electrical connection with the chip is connected by bonding, it is ensured for a long time.

  In such a light emitting device, the light emission output of the blue LED chip is converted into yellow light by the fluorescent material (for example, YAG) on the LED chip and the bottom of the cup portion, and white light that is a mixture of blue light and yellow light is output. To do. Here, the light conversion amount of the light emission output of the LED chip depends on the distance on the bottom surface of the cup part between the one end part of the LED chip and the inner wall of the cup.

  However, as described above, when the distance to the inner wall of the cup portion on the bottom surface of the cup portion around the LED chip is long, there is a problem that the light extraction efficiency is lowered. That is, the light emission output of the light emitting element proceeds so as to follow the color conversion layer, and part of the light output is reflected and absorbed by the bottom surface of the cup portion, so that the light extraction efficiency decreases.

  In addition, if the distance to the inner wall of the cup portion on the bottom surface of the cup portion around the LED chip is long, there is a problem that the effect on the color unevenness in the light distribution chromaticity is large when mounting deviation occurs during mounting of the LED chip. . That is, when a deviation occurs in the mounting position of the LED chip, the amount of unbalance of the fluorescent substance existing area around the LED chip increases, and the light conversion amount of the light emission output of the LED chip greatly differs around the LED chip. The effect on the color unevenness at the light chromaticity is increased.

  Also, the longer the distance from the bottom of the cup around the LED chip to the inner wall of the cup, that is, the greater the amount of YAG on the bottom of the cup from one end of the LED chip to the inner wall of the cup, the more blue the LED chip emits light. The output light is converted to yellow, and color unevenness with light emitted from other parts (for example, the upper surface of the LED chip) with a small amount of YAG occurs.

On the other hand, if the light-emitting device is simply mounted on a circuit board or the like at high density, the characteristics of each member of the light-emitting device deteriorate or fail due to heat generated when the LED chip emits light. Therefore, a light emitting device that is more excellent in heat dissipation and suitable for high density mounting is desired.
Japanese Patent Laying-Open No. 2006-245020 (FIG. 1) Japanese Patent Laying-Open No. 2003-318448 (FIG. 5)

  The present invention solves the above-described conventional problems, improves the light extraction efficiency, has little effect on color unevenness in the light distribution chromaticity even if a slight deviation occurs in the mounting position of the light emitting element, and An object of the present invention is to provide a light emitting device capable of providing excellent heat dissipation and a method for manufacturing the same.

  The light-emitting device of the present invention includes a pedestal for mounting a light-emitting element provided in a central region of the package so as to protrude upward from the peripheral region, a light-emitting element fixed to the upper surface of the pedestal, and a peripheral region of the package. A conductive member formed and electrically connected to the electrode of the light emitting element, a color conversion layer covering the light emitting element, and formed in the package so as to seal at least the light emitting element and the color conversion layer. And the protruding side surface of the pedestal is exposed from the color conversion layer.

  In the above light-emitting device, it is desirable that the color conversion layer is deposited substantially uniformly on the light-emitting element and on the outer periphery thereof on the upper surface of the pedestal. The color conversion layer may include a fluorescent material in which a part of the fluorescent material previously contained in the translucent member is deposited and deposited locally on the pedestal. Also good.

  The color conversion layer may be a mixture of a wavelength converting fluorescent member and a light diffusing member. In this case, it is desirable that the fluorescent member and the diffusing member are mixed almost uniformly. Further, the color conversion layer may be a layer in which the diffusion material layer and the fluorescent member layer overlap. In this case, it is desirable that the diffusion member layer and the fluorescent member layer overlap in this order.

  When a die bond member is used to fix the light emitting element to the upper surface of the pedestal, the die bond member covers a portion lower than the position where the light emitting layer of the light emitting element is exposed from the pedestal to the side surface of the light emitting element. It is preferable. Accordingly, when the color conversion layer is deposited on the portion where the die bonding member covers the side surface of the light emitting element, the color conversion layer is also disposed on the side surface of the light emitting layer of the light emitting element.

  The central part of the upper surface of the pedestal is recessed more than the outer peripheral part, and the light emitting element is placed in the recessed central part, and the color conversion layer is deposited thicker on the side part than the upper surface part of the light emitting element. May be. Here, it is desirable that the depression has a depth such that the light emitting layer of the light emitting element protrudes upward from the highest position of the upper surface of the pedestal.

  The translucent member includes a first translucent member containing a fluorescent material that covers the light emitting element on the upper surface of the pedestal, a second translucent member provided to cover the first translucent member, It may have.

  The package includes an insulating substrate having a through hole in a substantially central region, and a metal member inserted into the through hole of the insulating substrate and having an upper surface protruding from the upper surface of the insulating substrate, and the metal member serves as a pedestal. It may be.

  A method of manufacturing a light emitting device according to the present invention includes a pedestal for mounting a light emitting element provided in a central region of the package so as to protrude above a peripheral region, a light emitting element fixed to the upper surface of the pedestal, A conductive member formed in a peripheral region and electrically connected to an electrode of the light emitting element, a color conversion layer covering the light emitting element, and the package so as to at least seal the light emitting element and the color conversion layer When manufacturing a light-emitting device comprising a light-transmitting member formed on the light-transmitting member, the color conversion material previously contained in the light-transmitting member is allowed to settle and be deposited on the pedestal. The side surface of the pedestal is exposed from the color conversion layer by interrupting the color conversion material on the side surface of the pedestal.

  According to the light emitting device of the present invention, the light emission output of the light emitting element proceeds so as to follow the color conversion layer, but the color separation layer on the pedestal is separated between the outer peripheral portion on the pedestal and the peripheral region. As a result, light reflected and absorbed in the peripheral region can be eliminated, and the light extraction efficiency is improved.

  Further, the amount of light conversion by the color conversion layer for the light emission output of the light emitting element depends on the amount of the color conversion layer present on the pedestal. In this case, even if a slight shift occurs in the mounting position when mounting the light emitting element, the amount of the color conversion layer around the light emitting element is less unbalanced, and the influence on the color unevenness in the light distribution chromaticity can be reduced. Therefore, a high quality light emitting device can be realized. When the light emitting element is a blue light emitting element and the fluorescent material is YAG, a white light emitting device can be realized.

  When the color conversion layer covering the light emitting element is deposited substantially uniformly on the light emitting element and its peripheral portion on the pedestal, color unevenness such as blooming can be improved. The color conversion layer may include a fluorescent material in which a part of the fluorescent material previously contained in the translucent member is deposited and includes a fluorescent material locally formed on the pedestal. It may be a thing. In the latter case, for example, by using spray coating so that the fluorescent material covering the light emitting element is formed of a single particle layer, the light extraction efficiency is improved.

  When the color conversion layer covering the light-emitting element has a fluorescent member for wavelength conversion and a diffusion member for light diffusion mixed almost evenly, the light emission output of the light-emitting element is diffused almost evenly by the diffusion member, and light emission The output viewing angle can be further increased. In this case, when the fluorescent member and the diffusing member having the same particle size and specific gravity are used, the fluorescent member and the diffusing member are included in the translucent member in advance, so that the fluorescent member in the translucent member is obtained. And it becomes possible to form by diffusing and depositing the diffusion member almost simultaneously.

  The pedestal on which the light emitting element is placed may have a flat upper surface, but the light emitting element is placed on the central part where the central part of the upper surface is recessed relative to the peripheral part, and the fluorescent material is placed on the upper part of the light emitting element. Alternatively, the side portions may be deposited so as to be thicker. In this case, the depression at the center of the upper surface of the pedestal is face-up when the light emitting layer of the light emitting element has a depth that protrudes upward from the highest position of the upper surface of the pedestal (for example, about half the thickness of the light emitting element). Since the light emitting layer of the mounted light emitting element is located above the recessed portion, the light distribution range is widened.

  Further, a die bond member is used to fix the light emitting element on the pedestal. The die bond member covers the light emitting layer of the light emitting element from the pedestal to the side surface of the light emitting element, and a color conversion layer is formed on the upper part. Is deposited, there is little color unevenness and uniform output light can be obtained.

  By using a metal member for the pedestal, it is possible to efficiently heat the outside, and it is possible to easily realize a light emitting device with excellent heat dissipation and high reliability.

  According to the method for manufacturing a light emitting device of the present invention, when the light emitting device of the present invention is manufactured, the color conversion material previously contained in the translucent member is allowed to settle and deposited on the pedestal, and color conversion is performed on the side surface of the pedestal. It becomes possible to interrupt the substance and expose the side surface of the pedestal from the color conversion layer. Thereby, the light reflected and absorbed in the peripheral region of the pedestal can be eliminated, and the light extraction efficiency is improved. In addition, even if a slight shift occurs in the mounting position when mounting the light emitting element, the amount of the color conversion layer around the light emitting element is less unbalanced, and the influence on the color unevenness in the light distribution chromaticity can be reduced. A high-quality light-emitting device can be realized.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a light emitting device for embodying the technical idea of the present invention, and the present invention does not specify the light emitting device as follows. Further, the present specification by no means specifies the members shown in the claims as the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, and are merely explanations. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are configured by the same member and a plurality of elements are shared by one member. Conversely, the function of one member is a plurality of members. It can also be realized by sharing.

<First Embodiment>
FIG. 1 is a side sectional view schematically showing a light emitting device according to a first embodiment of the present invention. FIG. 2 is a perspective view schematically showing an appearance in a state where the cup portion, the color conversion layer, and the translucent sealing member of the package in FIG. 1 are omitted. FIG. 3 is a plan view schematically showing the bottom surface of the light emitting device of FIG. FIG. 4 is an enlarged view schematically showing a distribution state of the color conversion layer on the pedestal and the cup bottom surface in FIG.

  In the light-emitting device shown in FIGS. 1 to 4, the package 20 has a cup portion for accommodating the light-emitting element, and the central region of the bottom surface of the cup portion is higher than the peripheral region of the bottom surface of the cup portion as a base 30 for mounting the light-emitting element. Protruding to The light emitting element 10 is mounted on the center of the base 30 (the upper surface of the base 30), and is fixed, for example, via a die bond member (not shown). A color conversion layer 90 is formed so as to cover the light emitting element 10 on the pedestal 30. Conductive members 61 and 62 are formed on the peripheral region of the bottom surface of the cup portion, and the conductive members 61 and 62 are electrically connected to the electrodes of the light emitting element 10. In this example, the electrode of the light emitting element 10 and the conductive members 61 and 62 are connected by a thin metal wire (bonding wire) 70. The inside of the cup part is filled with a translucent member 50 so as to seal the light emitting element 10 on the pedestal, at least a part of the thin metal wire 70, and the bottom of the cup part.

  For example, a blue LED chip (die) is used as the light emitting element 10, and YAG90a, which is a fluorescent material, is used as the color conversion layer 90, for example. In this example, YAG90a is a part of YAG previously contained in the translucent member before the translucent member 50 is filled into the cup portion, and is deposited after the translucent member is deposited. is there. Here, YAG90a is interrupted between the outer peripheral part on the base 30 and the peripheral region of the cup part bottom face. That is, the pedestal has a portion exposed from the YAG 90a (color conversion layer) between the outer peripheral portion of the upper surface and the peripheral region of the package. YAG90a is deposited substantially uniformly on the pedestal 30 on the blue LED chip 10 and on the periphery thereof.

  In this example, the package 20 has a metal member for the pedestal 30 (a heat sink, hereinafter denoted by the same reference numeral 30 as the pedestal), and a plane having a substantially rectangular shape, and a through hole for penetrating the metal member in a substantially central region. And an insulating substrate 40. Then, the metal member 30 is inserted into the through hole so that the upper surface of the metal member 30 protrudes from the upper surface of the insulating substrate 40 to become the pedestal portion, and the metal member 30 and the inner wall of the through hole of the insulating substrate 40 are Bonding is performed using an adhesive member 80. YAG90a is also deposited in the gap between the inner surface of the through hole and the side surface of the metal member.

  In this example, the insulating substrate 40 has a groove portion 42 penetrating in a vertical direction on a pair of opposing side surfaces, and conductive members 61 and 62 are patterned on the surface, and the lower surface side of the insulating substrate 40 The lower surfaces of the conductive members 61 and 62 are substantially horizontal with the lower surface of the metal member 30.

  In the light emitting device according to the first embodiment, the light emission output of the blue LED chip 10 is converted into yellow light by the YAG 90a on the pedestal 30, and white light that is a mixed color of blue light and yellow light is output. Here, the light conversion amount by the YAG 90a with respect to the light emission output of the blue LED chip 10 is the YAG amount existing in a short distance section from one end of the LED chip 10 to the outer peripheral part on the base 30 around the LED chip 10. Dependent.

  In this case, since the YAG 90a is separated from the pedestal 30 and the peripheral region on the bottom surface of the cup portion, the light reflected and absorbed in the peripheral region on the bottom surface of the cup portion can be eliminated, and the light extraction efficiency is improved. improves.

  Further, even when the mounting position of the LED chip 10 is slightly shifted, there is little unbalance in the YAG amount in the section around the LED chip 10, and there is an unbalance in the light conversion amount by the YAG 90 around the LED chip 10. Therefore, the influence on the color unevenness in the light distribution chromaticity can be reduced, and a high-quality light-emitting device can be realized.

  Further, since the amount of YAG between the one end portion of the LED chip 10 and the outer peripheral portion on the pedestal 30 is small, there is no possibility that the blue light emission output light of the LED chip 10 is converted to yellow, and uniform color mixture light (white color) Light).

  Moreover, by using the metal member 30 for the pedestal 30, it is possible to efficiently heat the outside, to easily realize a high-quality light-emitting device with excellent heat dissipation, reliability and light extraction efficiency. Can do.

  Further, when manufacturing the light emitting device according to the first embodiment, the YAG 90a previously contained in the translucent member 50 is allowed to settle and deposited on the pedestal, and the YAG 90a is cut off on the side surface of the pedestal 30 so that the pedestal 30 Can be exposed from the YAG (color conversion layer) 90a. Thereby, the light reflected and absorbed in the peripheral region of the pedestal 30 can be eliminated, and the light extraction efficiency is improved. In addition, even if a slight shift occurs in the mounting position when mounting the LED chip 10, there is little unbalance in the amount of the color conversion layer around the LED chip 10 and there is little effect on the color unevenness in the light distribution chromaticity. Therefore, a high-quality light-emitting device can be realized.

  Hereafter, each structure of this embodiment is explained in full detail.

  (Insulating substrate 40) The insulating substrate 40 is a thin rectangular parallelepiped whose plane is substantially square, and a through hole is formed in the center in the thickness direction. The plane of the through hole is substantially square and rounded at the corners. The vertical cross section of the through hole has a substantially convex shape. However, the plane of the through hole can be circular, elliptical, or polygonal, and in particular, it is preferable that the shape is substantially the same as the plane (upper surface) of the pedestal 30. Further, on the opposite side surfaces of the insulating substrate 40, a groove portion 42 having a substantially rectangular planar shape and rounded inner corners is formed.

  A metal member 30 is inserted into the through hole of the insulating substrate 40 so as to close the through hole, and the light emitting element 10 is placed on the upper surface of the metal member 30. In addition, a plurality of conductive members 61 and 62 are formed on the upper surface of the insulating substrate 40 so as to surround the through holes. The conductive members 61 and 62 are continuous with the groove portion 42 and the lower surface of the insulating substrate 40. Is formed. Here, the shape and number of the insulating substrate 40, the through hole, and the groove 42 can be variously selected according to the purpose.

  As a material for the insulating substrate 40, a resin substrate, a hybrid substrate such as a glass epoxy substrate in which an inorganic substance is contained in an organic substance, an inorganic substrate such as a ceramic substrate, or the like can be used. In particular, when high heat resistance and high weather resistance are desired, it is preferable to use a hybrid substrate or an inorganic substrate.

In the light-emitting device of this embodiment, a plurality of light-emitting devices can be obtained at low cost by assembling and processing a plurality of other members on an insulating substrate, and forming the light-emitting device aggregates and then dividing them individually. . When a light emitting device requiring high contrast is formed, dark-colored insulation can be obtained by including Cr ₂ O ₃ , MnO ₂ , TiO ₂ , Fe ₂ O _3, etc. in the base material itself of the insulating substrate. It is preferable to use a conductive substrate.

  The main material of the ceramic substrate is preferably alumina, aluminum nitride, mullite or the like. A ceramic substrate is obtained by adding a sintering aid to these main materials and sintering. For example, 90 to 96% by weight of the raw material powder is alumina, and 4 to 10% by weight of viscosity, talc, magne, shea, calcia, silica, etc. are added as a sintering aid, and a temperature range of 1500 ° C. to 1700 ° C. 40-60% by weight of the ceramics sintered in the material and alumina, and 60-40% by weight of borosilicate glass, cordierite, forsterite, mullite, etc. are added as a sintering aid at 800 ° C. Examples thereof include ceramics sintered in a temperature range of ˜l200 ° C.

  Such a ceramic substrate can take various shapes at the green sheet stage before firing. First, the green sheet, which is a base material before firing, is processed so that desired through holes and groove portions 42 are obtained, and in some cases, the green sheets are laminated in multiple layers. Next, the conductive member 60 is patterned in a desired place by using a paste-like material in which a refractory metal such as tungsten or molybdenum is contained in a resin binder in a desired place by a method such as screen printing. . By sintering the base material processed in this way, it is possible to obtain an insulating substrate in which the through hole, the groove 42 and the conductive members 61 and 62 are formed.

  The through hole formed in the insulating substrate 40 has a stepped inner surface, but can be formed by laminating and bonding insulating substrates having different hole sizes when viewed from the light emitting front side. The metal member 30 is positioned and joined to the intermediate plane 41 of the through hole. Here, among the insulating substrates to be laminated and bonded, the through hole of the upper insulating substrate is formed so that the opening width is increased upward, and the through hole of the lower insulating substrate is increased downward. When formed in this manner, the conductive member 61, 62 formed on the upper surface and the lower surface of the insulating substrate 40 and the side surface of the metal member 30 are held while the intermediate plane 41 serving as a positioning and bonding surface with the metal member 30 is held. Since the distance can be increased, a smaller light-emitting device can be obtained with high yield. -A through-hole whose opening width increases in a fixed direction can be formed by cutting using a cutting tool having a similar shape-a blade having a shape whose volume width increases in a fixed direction. Or it is possible to form by changing the contact angle with respect to the insulating substrate surface of the cutting tool used when forming a normal through-hole. Furthermore, a plurality of insulating substrates each having a through hole are laminated to form a stepped inner wall surface, and a molding die is pressed against the stepped inner wall surface to form a smooth surface. -An insulating substrate having a through-hole whose inner diameter increases in a fixed direction is also possible.

  The groove portion 42 penetrates from the upper surface to the lower surface of the insulating substrate 40, and is formed with two groove portions 42 each having a substantially rectangular planar shape and rounded inner corners. Conductive members 61 and 62 formed on the upper surface of the insulating substrate 40 are extended on the inner wall of each groove 42. The light emitting device configured as described above can be electrically connected to the outside through the inner wall of the groove portion 42, and the mountability of the light emitting device can be improved.

  (Metal member 30) The metal member 30 is inserted and fixed in a through hole provided in the insulating substrate 40, and the light emitting element 10 is placed on the upper surface. The upper surface of the metal member 30 protrudes from the upper surface of the insulating substrate 40, and preferably has a height difference of 0.05 mm or more, more preferably 0.1 mm or more. Further, it is preferable to have a recess (spacer) between the metal member 30 and the insulating substrate 40 on the upper surface side on which the light emitting element 10 is placed. Accordingly, the color conversion layer 90 disposed on the upper surface of the metal member 30 can be separated from the upper surface of the insulating substrate 40. In addition, on the lower surface side of the insulating substrate 40, if the lower surface of the metal member 30 is substantially horizontal with the lower surfaces of the conductive members 60 and 61 formed on the lower surface of the insulating substrate 40, the heat accumulated in the light emitting device is reduced. Rather than dissipating heat into the air on the surface of the light emitting device, it is possible to efficiently release heat to the wiring board on which the light emitting device is mounted, thereby suppressing an increase in temperature of the light emitting device. Further, it is preferable that the insulating substrate 40 has a second concave portion (a separation portion) between the insulating substrate 40 and the metal member 30 on the lower surface side. Accordingly, when the light emitting device is soldered and mounted, the solder (not shown) can be released to the concave portion, so that it is possible to prevent a short circuit between the conductive members 61 and 62.

  The metal member 30 is preferably partially joined to the through-hole of the insulating substrate 40, whereby it is possible to prevent each member from losing its physical properties due to thermal stress. The shape of the metal member 30 is not particularly limited as long as the metal member 30 has a thickness and a size that can provide a sufficient heat-drawing effect according to the power consumption of the light-emitting element 10 to be mounted. A large metal member 30 is preferable, and thus heat transferred from the light emitting element 10 on the upper surface side can be efficiently conducted to the lower surface. In particular, when the cross-sectional shape of the metal member 30 cut perpendicularly to the top surface is a substantially convex shape, the shape of the inner wall of the through hole is also a substantially convex shape, and the second top surface of the metal member 30 is penetrated. It is preferable to perform bonding with a flat surface in the hole, whereby a light-emitting device with high accuracy and high reliability can be obtained. Here, the material used for the metal member 30 is not particularly limited as long as it is a metal material mainly composed of a metal having excellent thermal conductivity, and copper, aluminum, magnesium, or the like can be suitably used. It is desirable to form a large number of anchors (not shown) on the upper surface of the metal member 30 for increasing the contact area with the die adhesive (die bond member).

  (Adhesive member 80) The material of the adhesive member 80 used for joining the metal member 30 and the inner wall of the through hole of the insulating substrate 40 is not particularly limited as long as it can be fixed, but contains the main component of the metal member 30. If the adhesive member 80 is used, the fixing strength can be increased. In particular, when a ceramic substrate is used, since the heat resistance is excellent, the metal member 30 can be fixed by hard soldering or eutectic bonding capable of high strength bonding. For example, silver brazing mainly using an alloy of silver and copper, brass brazing whose main material is an alloy of copper and zinc, aluminum brazing whose main material is aluminum, nickel brazing, or the like can be used. In particular, for joining the metal member 30 and the inner wall of the through hole of the insulating substrate 40, it is preferable that the metal member 30 is partially joined by an adhesive member containing the main component of the metal member 30, thereby insulating the metal member 30 from the insulation. Residual stress due to a difference in thermal expansion coefficient with the conductive substrate 40 can be relaxed.

  (Conductive members 61, 62) The conductive members 61, 62 formed on the insulating substrate 40 are a cathode electrode 61 and an anode electrode 62, and are formed continuously from the upper surface to the lower surface of the insulating substrate 40. Yes. The wiring pattern of the conductive members 61 and 62 can be appropriately changed depending on the number, type, size, and the like of the light emitting elements. The material of the conductive members 61 and 62 is not particularly limited as long as it has conductivity, and preferably has high thermal conductivity. Examples of such a material include tungsten, chromium, titanium, cobalt, molybdenum, and alloys thereof. Moreover, it is preferable that the outermost surface of the conductive member is covered with a member having a high reflectance with respect to light from the light emitting element to be mounted. Most of the conductive members 61 and 62 formed on the upper surface of the insulating substrate 40 are preferably covered with the translucent member 50, which can suppress deterioration of the light emitting device. In addition, it is preferable that an antioxidant film is formed on the conductive members 61 and 62 exposed on the surface.

  The cathode electrode 61 and the anode electrode 62 continuously formed from the upper surface of the insulating substrate 40 to the groove 42 are formed to extend to the lower surface of the insulating substrate 40. The cathode electrode 61 and the anode electrode 62 formed on the lower surface of the insulating substrate 40 are formed so that the area increases from the groove portion 42 formed on the side surface of the insulating substrate 40 to the corner side of the insulating substrate 40. Has been.

  As a result, when the light emitting device of this embodiment is solder-mounted on the surface of a mounting wiring board (not shown), the solder is prevented from flowing and starting to the metal member 30 side, and is mounted with high reliability. be able to. Further, in the light emitting device of the present embodiment, two cathode electrodes 61 and two anode electrodes 62 are provided, but the cathode electrodes 61 and the anode electrodes are arranged in accordance with the circuit part shape of the wiring board. It is also possible to connect the 62 electrodes to each other on both lower sides of the insulating substrate 40 to form one by one.

  Since the upper surface of the metal member 30 on which the light emitting element 10 is placed protrudes from the upper surface of the insulating substrate 40, the light from the light emitting element 10 can be efficiently extracted to the outside. However, when the light emitting element 10, the metal member 30, and the like are sealed with the translucent member 50, the thermal stress applied to the translucent member 50 during manufacturing or light emission tends to concentrate on the light emitting element 10, and the light emission. There is a possibility that the joint between the element 10 and the other member is broken. Therefore, the angle formed by the upper surface of the metal member 30 and the outer peripheral surface of the translucent member 50 is preferably 90 degrees or less. Thereby, it is possible to suppress the thermal stress from concentrating on the light emitting element 10 arranged so as to protrude from the surroundings. In addition, the half-value angle of light from the translucent member 50 formed in this way is preferably larger than 90 degrees, so that uniform light can be obtained in a wide range and the light extraction efficiency is also improved. Since it is high, the temperature rise of the light emitting device can be suppressed.

(Light-Emitting Element 10) The light-emitting element 10 is obtained by forming a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, AlInGaN on a substrate as a light-emitting layer (not shown). Is used. Semiconductor structures include homostructures, heterostructures or double heterostructures with MIS junctions, PIN junctions or PN junctions. Various emission wavelengths can be selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal. The light emitting layer may have a single quantum well structure or a multiple quantum well structure which is a thin film in which a quantum effect is generated.

  When the light-emitting device is used outdoors, a gallium nitride-based compound semiconductor is preferably used as a semiconductor material capable of forming a high-luminance light-emitting element. In red, a gallium / aluminum / arsenic semiconductor or an aluminum / indium / gallium / phosphorous semiconductor is preferably used, but various semiconductors may be used depending on the application. When a gallium nitride compound semiconductor is used, a material such as sapphire, spinel, SiC, Si, ZnO or GaN single crystal is used for the semiconductor substrate. A sapphire substrate is preferably used to form gallium nitride with good crystallinity with high productivity.

  A plurality of light-emitting elements 10 can be used as appropriate, and various types of light-emitting devices can be realized depending on the combination of colors and the arrangement state. For example, various types such as a dot matrix and a linear shape can be selected, and as a result, a light emitting device having a very high mounting density and excellent heat dissipation can be obtained. Also, for use as a full color light emitting device for a display device, a red light emitting element with an emission wavelength of 610 nm to 700 nm, a green light emitting element with an emission wavelength of 495 nm to 565 nm, and an emission wavelength of 430 nm It is preferable to combine with a blue light emitting element having a wavelength of 490 nm.

  In addition, in the light emitting device of the present embodiment, in order to emit a mixed color light such as a white type using a fluorescent material, considering the complementary color relationship with the emission wavelength from the fluorescent material, deterioration of the translucent resin, etc. The emission wavelength of the light emitting element 10 is preferably 400 nm or more and 530 nm or less, and more preferably 420 nm or more and 490 nm or less. In order to further improve the excitation and emission efficiency of the light emitting element 10 and the fluorescent material, 450 nm or more and 475 nm or less are more preferable. Note that an LED having a main emission wavelength in an ultraviolet region shorter than 400 nm or a short wavelength region of visible light can be used in combination with a member that is relatively difficult to be deteriorated by ultraviolet rays. Further, the light emitting element 10 can be fixed to the upper surface of the metal member 30 through a support member having a conductive member wired on the surface or an auxiliary member called a submount.

(Die bond member not shown)
The die bond member is a member for fixing the light emitting element 10 and the metal member 30, and is not particularly limited as long as they can be bonded to each other. In particular, considering heat sinking, it is preferable to use an Ag paste, a carbon paste, an ITO paste, a metal bump, or the like for fixing the light emitting element 10 and the metal member 30. In particular, in the case of power-based light-emitting devices that generate a large amount of heat, use Au-Sn-based eutectic solder, which has a high melting point, so that the structural structure is unlikely to change at high temperatures and the mechanical properties are not significantly degraded. Further, it is preferable that the lower surface of the light emitting element 10 and the upper surface of the metal member 30 are partially joined. Thereby, light confinement inside the light emitting element 10 due to total reflection of light emitted from the lower surface of the light emitting element 10 by the die bonding member can be suppressed. This suppression of light confinement can not only improve the light extraction efficiency of the light emitting element 10, but also suppress the temperature rise of the light emitting device.

  (Translucent member 50) The translucent member 50 covers the upper surfaces of the light emitting element 10 and the insulating substrate 40, and protects the light emitting element 10 from external force or moisture from the external environment. Further, the light from the light emitting element 10 is efficiently emitted to the outside. Specific materials constituting such a translucent member 50 include epoxy resins, urea resins, silicone resins, modified epoxy resins, modified silicone resins, transparent resins and glass having excellent weather resistance such as polyamide. Etc. are preferably used. When the light emitting elements 10 are arranged at a high density, it is more preferable to use an epoxy resin, a silicone resin, or a combination of them in order to suppress joint breakage between members due to thermal shock. Further, the translucent member 50 may contain a diffusing agent in order to further increase the viewing angle. As a specific diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide or the like is preferably used. Moreover, an organic or inorganic coloring dye or coloring pigment can be contained for the purpose of cutting an undesired wavelength.

  The translucent member 50 is made of a silicone resin or modified silicone, which is excellent in heat resistance and light resistance in order to contain a fluorescent material, and hardly undergoes coloring deterioration even when exposed to short wavelength high energy light including ultraviolet rays. It is preferable to be a resin, which suppresses the occurrence of color misregistration and color unevenness.

  (Color Conversion Layer 90, Fluorescent Material) The color conversion layer 90 converts light from the light emitting element 10, and it is more efficient to convert light from the light emitting element 10 to a longer wavelength. When a phosphor is used as the color conversion layer 90, a phosphor having an emission spectrum in yellow, red, green, and blue can be used by the excitation light of the light-emitting element 10, and yellow, which is an intermediate color thereof, A phosphor having an emission spectrum in blue green or orange can also be used. By using these phosphors in various combinations, light emitting devices having various emission colors can be manufactured.

When the light from the light-emitting element 10 is high-energy short-wavelength visible light, the color conversion layer 90 is Y ₃ Al ₅ O ₁₂ : Ce (Y _0.8 Gd _0.2 ), which is a seed of an aluminum oxide phosphor. _{3 Al 5 O 12: Ce,} Y 3 (Al 0.8 Ga 0.2) 5 O 12: Ce, (Y, Gd) 3 (Al, Ga) and YAG phosphor represented by the composition formula of the ₅ O _12, CA ₂ Si ₅ N ₈ phosphor is preferably used. In particular, the YAG: Ce phosphor emits yellow light which is a complementary color by partially absorbing blue light from the LED chip depending on its content, and thus a high-power light-emitting device that emits white mixed light Can be formed relatively easily. For example, the wavelength conversion is performed by irradiating a fluorescent material of Y ₃ Al ₅ O ₁₂ : Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce using a GaN-based compound semiconductor that emits blue light. A light emitting device that emits white light by a mixed color of light from the light emitting element 10 and light from the phosphor can be provided.

  (Others) The light-emitting device of the present embodiment can further include a Zener diode as a protection element of the LED chip. In this case, like the light emitting element 10, a Zener diode is placed on the surface of the conductive members 61 and 62, or the light emitting element 10 is placed on the upper surface of the Zener diode placed on the surface of the conductive member. You can also. Further, a recess can be formed on the upper surface side of the insulating substrate 40 to provide a space for accommodating and mounting a Zener diode.

  (Metal Fine Wire 70) The metal fine wire 70 is for electrically connecting the light emitting element 10 and the conductive members 61 and 62. The thin metal wire 70 is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrodes of the light emitting element 10. The thermal conductivity is preferably 0.01 cal / (S) (cm2) (° C / cm2) or more, more preferably 0.5 cal / (S) (cm2) (° C / cm2).

<Second Embodiment>
FIGS. 5A and 5B are diagrams schematically showing the cross-sectional shape of the pedestal in the light emitting device according to the second embodiment of the present invention, and the distribution state of the color conversion layer on the pedestal and on the bottom of the cup part. It is sectional drawing and an enlarged view. In the first embodiment described above, the upper surface of the metal member 30 is flat. However, in the second embodiment, as shown in FIG. 5, the central portion of the upper surface of the metal member 30a is more than the peripheral portion. The difference is that the light emitting element 10 is placed on the recessed central portion. In this case, the fluorescent material 90 a can be deposited so that the side surface portion is thicker than the upper surface portion of the light emitting element 10. That is, the fluorescent material 90a can be deposited so as to cover at least the side surface of the light emitting layer of the light emitting element 10 around the light emitting element 10 in the recessed portion. Accordingly, it is possible to suppress light emitted from the side surface of the light emitting layer of the light emitting element 10 from being emitted to the outside without being wavelength-converted, which is one of the causes of color unevenness in the conventional light emitting device.

  Further, the side surface of the recessed portion of the metal member 30 is preferably a reverse convex curved surface (conical shape) with respect to the opening surface of the recessed portion. Thereby, it is possible to deposit so as to cover the fluorescent material 90a up to the corner of the light emitting layer of the light emitting element 10 (the part where the upper surface and the side surface of the light emitting element 10 are in contact).

  The depression at the center of the upper surface of the metal member 30 has a depth (for example, about half of the thickness of the light emitting element 10) in which the light emitting layer of the light emitting element 10 protrudes upward from the highest position of the upper surface of the metal member 30. Since the light emitting layer of the light emitting element 10 mounted face-up is above the recessed portion, the light distribution range is widened.

<Third Embodiment>
FIG. 6 is a side cross-sectional view schematically showing a distribution state of the color conversion layer on the die bond member on the pedestal, on the pedestal, and on the bottom of the cup portion in the light emitting device according to the third embodiment of the present invention. In the third embodiment, the die bonding member 100 for fixing the LED chip 10 on the metal member is (1/2) or more and less than 1 of the die height on the side surface of the die as compared with the first embodiment described above. It is different in that it is formed so as to cover the range (for example, a resin fillet surface is formed on the side surface of the die).

  The position of the light emitting layer of the LED chip 10 depends on the type of die, but in the normal light emitting element 10, the light emitting layer is exposed at a position of 1/2 or more of the die height on the side surface of the die. In this example, the die-bonding member 100 extends so as to crawl up from the lower part of the die side surface to (1/2) or more of the die height and lower than the upper surface of the die.

  In other words, the die bonding member 100 used for fixing the LED chip 10 to the upper surface of the pedestal extends in the die height direction from the lower part of the die side surface and is lower than the position where the light emitting layer is exposed on the die side surface. It is preferable to cover the part. Thus, YAG90a is deposited also on the upper part of the portion covering the side surface of the LED chip 10, so that YAG90a is also disposed on the side surface of the light emitting layer of the light emitting element.

  In this way, even when it is necessary to reduce the YAG amount, the YAG 90a is continuously and sufficiently deposited to the periphery on the pedestal without being interrupted near the outer periphery of the upper surface of the LED chip 10 (for example, sedimented). ) Becomes possible. As a result, it is possible to perform color conversion continuously by continuously depositing YAG90a, and uniform output light can be obtained with little color unevenness. In addition, the die bond member 100 is preferably translucent, and can suppress light emitted from the side surface of the light emitting layer of the LED chip 10, thereby improving the light emission efficiency.

<Fourth Embodiment>
In the fourth embodiment, the YAG 90a is formed only on the pedestal 30 for mounting the light emitting element, and is not formed on the peripheral region on the bottom surface of the cup portion, compared to the first embodiment described above. Is different. As a method of locally forming YAG90a on the pedestal 30 in this way, for example, a method of depositing the fluorescent material 90a by spray coating as disclosed in the above-mentioned Patent Document 2 (FIG. 5) can be adopted. it can.

  In addition, after the first translucent member including the fluorescent material 90a is disposed (dropped) on the base so as to cover the light emitting element 10, the first translucent member is further covered so as to cover the first translucent member. A method in which two translucent members are filled can also be employed. However, in this embodiment, it is assumed that there is no interface between the first translucent member and the second translucent member. For example, after semi-curing the dropped first translucent member (or without semi-curing), the second translucent member is dropped to cure the first and second translucent members. Is possible.

  Further, the first translucent member containing the fluorescent material 90a can be disposed by stencil printing or screen printing as disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-223750 (FIG. 3). When such a printing method is applied to a package having a reflector portion around the light emitting element mounting portion, in order to prevent the mask used in printing from interfering with the reflector, It is preferable that the upper surface and the mounting surface of the light emitting element mounting portion have substantially the same height.

<Fifth Embodiment>
As shown in FIG. 7, in the fifth embodiment, an insulating substrate 40a having no cup portion is used as compared with the first embodiment described above, and the translucent member 50 includes the light emitting element 10, the color. The difference is that the conversion layer 90 and the fine metal wire 70 are formed on the upper surface of the insulating substrate 40a. As a result, the same effects as those of the first embodiment can be obtained, and the distribution range of the light emitting device can be further expanded.

<Sixth Embodiment>
The sixth embodiment is different from the first embodiment described above in that the metal member 30 and the insulating substrate 40 are provided by the same member (not shown). Examples of the material of such a member include aluminum oxide (alumina), aluminum nitride (AlN), glass epoxy resin, and the like.

  As a result, the same effects as those of the first embodiment can be obtained, and the manufacturing process of the light emitting device can be simplified.

<Seventh Embodiment>
FIG. 8 is a side sectional view schematically showing a distribution state of the diffusing member included in the light transmissive member in the light emitting device according to the seventh embodiment of the present invention. In the seventh embodiment, when the diffusing member is contained in the translucent member 50 in the first embodiment or the other embodiments described above, the translucent light is larger in particle size and smaller in specific gravity than the fluorescent member. A diffusive diffusion agent (such as alumina or silica) is premixed in the translucent member 50 almost uniformly. As a result, the fluorescent member (YAG90a in this example) in the translucent member 50 is settled, and the diffusing part agent is dispersed in the translucent member 50 almost uniformly. Further, by shortening the curing time of the translucent member 50 than usual, the translucent member 50 is cured before the diffusion agent is completely settled. The diffusion agent 91 is in a state of being distributed almost evenly. Accordingly, the light emission output of the light emitting element 10 is diffused by the diffusion member 91, and the viewing angle of the light emission output can be further increased.

<Eighth Embodiment>
FIG. 9 is a side sectional view schematically showing the distribution state of the fluorescent member and the diffusing member included in the color conversion layer on the pedestal, focusing on the periphery of the light emitting element portion in the light emitting device according to the eighth embodiment of the present invention. It is. In the eighth embodiment, a translucent diffusing agent (such as alumina or silica) is previously contained in the translucent member 50 together with the fluorescent member in the first embodiment or the other embodiments described above, and stirring is performed. Carry out so that it is almost evenly mixed. In this case, if the fluorescent member and the diffusing member having the same particle size and specific gravity are used, the fluorescent member and the diffusing member in the translucent member sink almost simultaneously and are almost equal when the translucent member is filled. To deposit. Thus, the color conversion layer in which the fluorescent member (YAG90a in this example) and the diffusing member 91 are almost uniformly mixed is formed so as to cover the light emitting element (blue LED chip in this example) 10 on the flat surface of the pedestal 30. Is done. Accordingly, the light emission output of the light emitting element 10 is diffused by the diffusion member, and the viewing angle of the light emission output can be further increased.

  Desirably, the diffusing member 91 is selected from materials and shapes that have good wettability with respect to the translucent member 50. Thereby, the diffusing member 91 is easily settled, and it is possible to obtain a state in which the diffusing member 91 is more uniformly mixed with the fluorescent member 90a.

<Ninth Embodiment>
FIG. 10 is a side sectional view schematically showing a distribution state of the fluorescent member layer and the diffusing member layer on the pedestal, focusing on the periphery of the light emitting element portion in the light emitting device according to the ninth embodiment of the present invention. In the ninth embodiment, a translucent diffusing agent (such as alumina or silica) is previously contained in the translucent member 50 together with the fluorescent member in the first embodiment or other embodiments described above. carry out. In this case, when a member having a specific gravity greater than that of the fluorescent member is used as the diffusing member, the diffusing member in the light transmitting member settles down and accumulates below the fluorescent member when the light transmitting member is filled. Thus, the light emitting element (blue LED chip in this example) 10 is formed to be covered on the flat surface of the pedestal 30 in a state where the diffusion member 91 layer and the fluorescent member (YAG90 in this example) are sequentially stacked. The Therefore, the light emitting element 10 covered with the diffusing member 91 is approximately a point light source, and the luminance and viewing angle of the light emission output can be further increased.

  Note that the structure shown in FIG. 10 is not limited to the above-described process. First, a layer of the diffusion member 91 is deposited as in the case where the YAG 90a is locally formed on the pedestal in the fourth embodiment described above. It can also be realized later (or without semi-curing) and then by depositing a layer of fluorescent material (YAG90 in this example).

<Tenth Embodiment>
FIG. 11 is a side sectional view schematically showing the distribution state of the fluorescent member layer and the diffusing member layer on the pedestal, focusing on the periphery of the light emitting element portion in the light emitting device according to the tenth embodiment of the present invention. In the ninth embodiment, a translucent diffusing agent (such as alumina or silica) is previously contained in the translucent member 50 together with YAG90a in the above-described first embodiment or other embodiments. To do. In this case, when a member having a specific gravity smaller than that of the fluorescent member is used as the diffusing member, the diffusing member in the light transmitting member settles and deposits above the fluorescent member when the light transmitting member is filled. Accordingly, the light emitting element (blue LED chip in this example) 10 is formed to be covered on the flat surface of the base 30 in a state where the layer of the fluorescent member (YAG90 in this example) and the layer of the diffusion member 91 overlap in this order. The Therefore, the viewing angle of the light emission output can be further increased.

  The structure shown in FIG. 11 is not limited to the above-described process. First, in the fourth embodiment, as in the case where the YAG 90a is locally formed on the pedestal, first, the fluorescent member (YAG 90 in this example) is used. This can also be realized by depositing and semi-curing the layer (or without semi-curing) and then depositing the layer of diffusion member 91.

  Hereinafter, an embodiment of a light emitting device according to the present invention will be described with reference to FIGS. Needless to say, the present invention is not limited to the following examples.

  The light-emitting element 10 is made of a nitride-based semiconductor that emits blue light, has a pair of positive and negative electrodes on the upper surface, uses a rectangular parallelepiped die whose planar shape is substantially square, and has a Au-Zn in advance on the lower surface. A eutectic material consisting of is partially applied. After the emissive element 10 thus treated is eutectic bonded onto the silver plating of the metal member 30 of the cup-type package 20, the conductive member formed on each electrode of the emissive element 10 and the upper surface of the insulating substrate 40 61 and 62 are electrically joined by a thin metal wire 70. Then, the translucent member 50 mixed with YAG is filled in the cup portion, and YAG90a is allowed to settle.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the invention described in the claims, and these are also included in the scope of the present invention. Needless to say.

  The light emitting device of the present invention includes a lighting device, a backlight of a liquid crystal display screen of a mobile phone, a character display board used indoors and outdoors such as a full color large video device, various sensors such as a line sensor, a light source such as an indicator, etc. Can be used.

1 is a side cross-sectional view schematically showing a light emitting device according to a first embodiment of the present invention. The perspective view which shows an external appearance roughly in the state which abbreviate | omitted the cup part, color conversion layer, and translucent sealing member of the package in FIG. FIG. 2 is a plan view schematically showing a bottom surface of the light emitting device of FIG. 1. The enlarged view which shows roughly the distribution state of the color conversion layer on the base in FIG. 1, and a cup part bottom face. The sectional side view and enlarged view which show roughly the distribution state of the color conversion layer on the base in the light-emitting device which concerns on the 2nd Embodiment of this invention, and a cup part bottom face. The sectional side view which shows roughly the distribution state of the color conversion layer on the base and cup part bottom face in the light-emitting device which concerns on the 3rd Embodiment of this invention. The sectional side view which shows roughly the distribution state of the color conversion layer on the base in the light-emitting device which concerns on the 5th Embodiment of this invention, and an insulated substrate. The sectional side view which shows roughly the distribution state of the diffusion member contained in the translucent member in the light-emitting device which concerns on 7th Embodiment. The sectional side view which shows roughly the distribution state of the fluorescent member and diffusion member which are contained in the color conversion layer on a base paying attention to the periphery of the light emitting element part in the light-emitting device which concerns on 8th Embodiment. The sectional side view which shows roughly the distribution state of the fluorescence member layer and diffusion member layer on a base paying attention to the periphery of the light emitting element part in the light-emitting device which concerns on 9th Embodiment. The sectional side view which shows roughly the distribution state of the fluorescence member layer and diffusion member layer on a base paying attention to the light emitting element part periphery in the light-emitting device which concerns on 10th Embodiment.

Explanation of symbols

10 ... Light emitting element (LED chip), 20 ... Package, 30 ... Base for mounting light emitting element, metal member (heat sink), 40 ... Insulating substrate, 42 ... Groove, 50 ... Translucent member, 61 ... Conductive Conductive member (cathode electrode), 62 ... conductive member (anod electrode), 70 ... fine metal wire, 80 ... adhesive member, 90 ... color conversion layer (fluorescent substance), 90a ... YAG.

Claims (12)

A light-emitting element mounting base provided in the central region of the package so as to protrude upward from the peripheral region;
A light emitting element fixed to the upper surface of the pedestal;
A conductive member formed in a peripheral region of the package and electrically connected to an electrode of the light emitting element;
A color conversion layer covering the light emitting element;
A translucent member formed in the package so as to seal at least the light emitting element and the color conversion layer,
The protruding side surface of the pedestal is exposed from the color conversion layer.   The light emitting device according to claim 1, wherein the color conversion layer is deposited substantially uniformly on the light emitting element and an outer peripheral portion thereof on an upper surface of the pedestal.   3. The light emitting device according to claim 1, wherein the color conversion layer includes a fluorescent material in which a part of the fluorescent material previously included in the translucent member is deposited and deposited. A die bond member is used to fix the light emitting element on the upper surface of the pedestal,
The die bond member covers a portion lower than the position where the light emitting layer of the light emitting element is exposed from the pedestal to the side surface of the light emitting element,
The color conversion layer is also deposited on an upper part of a portion where the die bonding member covers the side surface of the light emitting element, and is also disposed on a side surface of the light emitting layer of the light emitting element. The light emitting device according to any one of the above.   The central portion of the upper surface of the pedestal is recessed from the outer peripheral portion thereof, the light emitting element is placed on the recessed central portion, and the color conversion layer is a side surface portion from the upper surface portion of the light emitting element. The light-emitting device according to claim 1, wherein a thicker one is deposited.   The light emitting device according to claim 5, wherein the depression has a depth such that a light emitting layer of the light emitting element protrudes upward from a highest position on an upper surface of the pedestal.   The light emitting device according to claim 1, wherein the color conversion layer is locally deposited on an upper surface of the pedestal.   The translucent member includes a first translucent member including a fluorescent material that covers the light emitting element on an upper surface of the pedestal, and a second translucent member provided to cover the first translucent member. The light-emitting device according to claim 1, further comprising: The package includes an insulating substrate having a through hole in a substantially central region, and a metal member inserted into the through hole of the insulating substrate and having an upper surface protruding from the upper surface of the insulating substrate. The light emitting device according to claim 1, wherein the light emitting device is the pedestal.   The light emitting device according to claim 1, wherein the color conversion layer is a mixture of a wavelength converting fluorescent member and a light diffusing member.   11. The color conversion layer according to claim 10, wherein a fluorescent member and a diffusing member, each having a particle diameter and a specific gravity that are included in advance in the translucent member, are deposited and deposited. Light-emitting device.   A pedestal for mounting the light emitting element provided in the central region of the package so as to protrude above the peripheral region, a light emitting element fixed to the upper surface of the pedestal, and formed in the peripheral region of the package, A conductive member electrically connected to the electrode; a color conversion layer covering the light emitting element; and a translucent member formed in the package so as to at least seal the light emitting element and the color conversion layer; When manufacturing a light-emitting device comprising: To expose the side surface of the pedestal from the color conversion layer.

Images