JP2011040488A - Light-emitting element-mounting substrate and light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting element-mounting substrate capable of solving problems of short-circuit due to conduction to a metal substrate and distortion of the metal substrate due to local temperature rise while enhancing the heat radiation to the metal substrate; and to provide a light-emitting device including a light-emitting element mounted on the same. <P>SOLUTION: The light-emitting element-mounting substrate for mounting a light-emitting element 30 having at least one electrode 32 on the bottom includes: a metal substrate 10; an insulating layer 16 formed on the metal substrate 10; and a feeding pattern 20a formed on the insulating layer 16. The metal substrate 10 has a conduction region 10a continuing with the feeding pattern 20a and a non-conduction region 10b insulated from the conduction region 10a by removing at least the circumference of the conduction region 10a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light-emitting element mounting substrate for mounting a light-emitting element such as a light-emitting diode chip and a light-emitting device having the light-emitting element mounted thereon, and is particularly useful for a light-emitting element panel of a low-power, light and thin lighting device. .

  Conventionally, ceramic substrates made of aluminum nitride or the like have been widely used as substrates for LED packages on which chip LEDs or the like are mounted because they are excellent in heat transfer, heat resistance, ultraviolet resistance, and the like. However, the ceramic substrate has a problem that it is inferior in mass productivity and manufacturing cost as compared with the resin substrate.

  Therefore, resin-made substrates for mounting LEDs have been developed, and several techniques for improving heat dissipation and heat transfer are known. For example, in Patent Document 1 below, a metal protrusion is formed on the upper surface of a metal substrate (metal base), and an insulating resin layer having the same height as the metal protrusion is formed around the metal protrusion, A light emitting element mounting substrate is known in which a heat radiation pattern is plated on the upper surface of the metal convex portion and a power feeding pattern is plated on the upper surface of the insulating resin layer so that the light emitting element can be mounted on the upper surface of the metal convex portion via the heat radiation pattern. .

  This substrate mainly assumes a form in which an electrode for wire bonding is provided on the upper surface and a light emitting element capable of radiating heat from the lower surface is mounted, but an electrode capable of reflow connection is provided on the lower surface. Different structures are known for mounting a light-emitting element that can dissipate heat downward through the substrate.

  For example, in Patent Document 2 below, as shown in FIG. 6, a pad facing two electrodes provided on the bottom surface of the light emitting element is provided on the upper surface of the insulating layer, and from the pad to a metal column penetrating the insulating layer, Further, a light emitting element mounting substrate having a structure capable of radiating heat from an adhesive layer to a metal substrate has been proposed.

Japanese Patent Laying-Open No. 2005-167086 JP 2004-282004 A

  However, in the substrate of Patent Document 2, the two metal pillars are electrically connected to each power supply pattern, and it is necessary to prevent a short circuit of the power supply pattern due to the conduction to the metal substrate. It was necessary to provide an insulating layer also serving as an adhesive. For this reason, there was a tendency for heat dissipation to the metal substrate to be insufficient due to the intervening insulating layer.

  On the other hand, when one electrode is provided on the bottom surface of the light emitting element and this is connected to the metal column, or when only one of the two electrodes is connected to the metal column, the metal substrate and the metal column are connected. There is no problem in doing itself. However, when the metal substrate is electrically connected to the power supply pattern, there is a problem that a short circuit occurs through the metal casing when the metal substrate is fixed to the metal casing. For this reason, the structure in which the metal substrate and the metal column are electrically connected should be basically avoided. As a result, it is inevitable that the heat radiation to the metal substrate becomes insufficient due to the interposition of the insulating layer.

  Furthermore, when heat is radiated to the metal substrate through the metal pillar, distortion (distortion) occurs in the metal substrate due to local temperature rise, etc., and the contact / heat transfer to the heat sink becomes uniform due to the distortion. There was a problem that decreased.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a light emitting element mounting substrate that can solve the problem of short circuit due to conduction to the metal substrate and distortion due to local temperature rise while improving heat dissipation to the metal substrate, and mounting the light emitting element on the substrate. An object of the present invention is to provide a light emitting device.

  The above object can be achieved by the present invention as described below.

  That is, the light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting a light emitting element having at least one electrode on the bottom surface, and includes a metal substrate, an insulating layer formed on the metal substrate, The power supply pattern formed on the insulating layer, and the metal substrate includes a conductive region that is electrically connected to the power supply pattern, and a non-conductive region that is insulated from the conductive region by removing at least the periphery of the conductive region. It is characterized by having.

  According to the light emitting element mounting substrate of the present invention, since the metal substrate has a conductive region that is electrically connected to the power feeding pattern and a non-conductive region that is insulated from the conductive region, only a part of the metal substrate is a conductive region. Therefore, for example, the problem of short circuit can be solved by using the non-conduction region when fixing the screw. In addition, heat can be transferred from the electrode of the light emitting element without unraveling the insulating layer with respect to the conductive region of the metal substrate, so that heat dissipation to the metal substrate is improved and the periphery of the conductive region is removed. Therefore, problems such as distortion due to local temperature rise can be solved. As a result, it is possible to provide a light emitting element mounting substrate capable of solving the problem of short circuit due to conduction to the metal substrate and distortion due to local temperature rise while improving heat dissipation to the metal substrate.

  In the above, a metal convex portion penetrating the insulating layer is provided in at least a part of the conductive region, and the power feeding pattern and the conductive region are conducted through the metal convex portion. preferable. By providing a metal convex portion penetrating the insulating layer, a light-emitting element from the power supply pattern to the conduction region through the metal convex portion in the wiring board having a simple structure in which the power supply pattern is provided on the surface of the insulating layer Heat can be transferred efficiently.

  Alternatively, the insulating layer is provided with an opening for mounting a light emitting element, and the feeding pattern is extended to the conduction region exposed from the opening, so that the feeding pattern and the conduction region are provided. It is preferable that they are conductive. In this case, the heat of the light emitting element can be transferred to the conduction region without going through the metal convex portion, and light reflection and directivity adjustment can be performed using the periphery of the opening.

  It is preferable that a plurality of the conductive regions are provided corresponding to the two electrodes on the bottom surface of the light emitting element. When there are a plurality of conduction regions, the effect of transferring the heat of the light-emitting element to the conduction region is greater than when there is a single conduction region.

  It is preferable that at least the periphery of the conductive region is removed by etching. In the case of being removed by etching, a plurality of substrates can be processed at once with simple equipment, which is more advantageous industrially.

  On the other hand, in the light emitting device of the present invention, a light emitting element having at least one electrode on the bottom surface is mounted on any of the light emitting element mounting substrates described above in a state where the electrode is in conduction with the power feeding pattern. It is characterized by that. According to the light emitting device of the present invention, since the light emitting element mounting substrate of the present invention having the above-described effects is used, the heat radiation to the metal substrate can be improved and the light emission efficiency can be increased, and the conduction to the metal substrate can be increased. The problem of distortion due to short circuit and local temperature rise can be solved.

  In the light emitting device of the present invention, a light emitting element having two electrodes on the bottom surface is mounted on any of the light emitting element mounting substrates described above in a state where the electrodes are electrically connected to the power feeding pattern. It is characterized by. According to this light-emitting device, in addition to the above-described effects, in particular, heat can be transferred from the two electrodes of the light-emitting element to the conduction region of the metal substrate.

  In the above, it is preferable that a heat sink is provided on the metal substrate, and a heat transfer material is interposed at least in the conduction region. If comprised in this way, the heat | fever of a light emitting element will be heat-transferred from a conduction area | region through a heat conductive material to a heat sink, and the heat dissipation effect of a light emitting element will become larger by utilizing the heat dissipation effect by a heat sink.

Sectional drawing which shows an example of the light emitting element mounting substrate of this invention Bottom view of the light-emitting element mounting substrate shown in FIG. The figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention The figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention Sectional drawing which shows the other example of the board | substrate for light emitting element mounting of this invention. Sectional drawing which shows the other example of the board | substrate for light emitting element mounting of this invention. Sectional drawing which shows the other example of the board | substrate for light emitting element mounting of this invention. The bottom view which shows the other example of the board | substrate for light emitting element mounting of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The light emitting element mounting substrate of the present invention is used for mounting a light emitting element 30 having at least one electrode 31, 32 on the bottom surface, as shown in FIG. In the present embodiment, an example in which the light emitting element 30 has two electrodes 31 and 32 on the bottom surface is shown. The light emitting element 30 and the light emitting device equipped with the light emitting element 30 will be described in detail later.

  As shown in FIG. 1, the light emitting element mounting substrate of the present invention includes a metal substrate 10, an insulating layer 16 formed on the metal substrate 10, and a power feeding pattern 20 a formed on the insulating layer 16. ing. In the present embodiment, an example is shown in which a metal convex portion penetrating the insulating layer 16 is formed by forming the interlayer connection portion 14 on the upper surface of the metal substrate 10 via the protective metal layer 12.

  The power supply pattern 20 a is a wiring pattern for supplying power to the light emitting element 30, and may have any shape as long as it can conduct to the light emitting element 30. For example, if it is in contact with a part of the upper surface of the interlayer connection portion 14 (metal convex portion), it is not necessary to cover the entire upper surface, and the electrodes 31 and 32 of the light emitting element 30 are soldered to the interlayer connection portion 14. It may be connected with.

  In the present invention, as shown in FIGS. 1 to 2, the metal substrate 10 is electrically connected to the power supply pattern 20 a, and the conductive region 10 a is electrically isolated from the conductive region 10 a by removing at least the periphery of the conductive region 10 a. And a region 10b. In the present embodiment, an example in which one metal convex portion corresponding to one electrode 32 of the light emitting element 30 and one conductive region 10a are provided. In this embodiment, a metal convex portion penetrating the insulating layer 16 is provided in at least a part of the conductive region 10a, and the power supply pattern 20a and the conductive region 10a are electrically connected through the metal convex portion. Yes.

  The shape of the conduction region 10a is not limited to a square, and may be any shape such as a rectangle, a circle, an ellipse, and a polygon. Around the conductive region 10a, a groove 10c reaching the insulating layer 16 is provided, and the non-conductive region 10b is insulated from the conductive region 10a.

The area in the lower surface of the conductive region 10a, depending on the size of the light emitting element 30, preferably 0.2~5cm ^2, 0.5~2cm ² is more preferable. Since the conduction region 10a is laminated and integrated with the insulating layer 16, it does not fall off even if the groove 10c is formed.

  The groove portion 10c can be formed by a cutting device such as a router or a dicer in addition to etching, but is preferably removed by etching. The width of the groove 10c is preferably 0.05 to 2 mm.

  Next, an example of a method for producing a light emitting element mounting substrate of the present invention will be described while touching materials to be used.

  (1) First, the columnar metal portion 14 is formed on the metal substrate 10. As shown in FIGS. 3A to 3C, the surface metal layer 4 laminated on the metal substrate 10 is selectively etched to form the columnar metal portion 14 at a position facing the electrode 32 of the light emitting element 30. The The surface metal layer 4 is laminated on the metal substrate 10 via another protective metal layer 2 that exhibits resistance during the etching. The protective metal layer 2 can be omitted. In this case, the columnar metal portion 14 can be formed on the metal substrate 10 by controlling the etching amount.

  As shown in FIG. 3A, a laminated plate SP in which a metal substrate 10, a protective metal layer 2, and a surface metal layer 4 for forming a columnar metal portion 14 are laminated is prepared. The laminated plate SP may be manufactured by any method, and for example, any of those manufactured using electrolytic plating, electroless plating, sputtering, vapor deposition, or a clad material can be used. Regarding the thickness of each layer of the laminated plate SP, for example, the thickness of the metal substrate 10 is 10 to 5000 μm, the thickness of the protective metal layer 2 is 1 to 20 μm, and the thickness of the surface metal layer 4 is 10 to 500 μm.

  The metal substrate 10 may be either a single layer or a laminated body, and any metal may be used as a constituent metal. For example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, and the like can be used. Of these, copper and aluminum are preferable from the viewpoint of thermal conductivity and electrical conductivity. With the structure including the metal substrate 10 with good heat dissipation as described above, the temperature rise of the light emitting element 30 can be prevented, so that a larger amount of drive current can be supplied and the amount of light emission can be increased.

  As the metal constituting the surface metal layer 4, copper, copper alloy, nickel, tin and the like can be usually used, and copper is particularly preferable from the viewpoint of thermal conductivity and electrical conductivity.

  As the metal constituting the protective metal layer 2, a metal different from the metal substrate 10 and the surface metal layer 4 is used, and another metal exhibiting resistance when etching these metals can be used. Specifically, when these metals are copper, another metal constituting the protective metal layer 2 is gold, silver, zinc, palladium, ruthenium, nickel, rhodium, lead-tin solder alloy, or nickel. -A gold alloy or the like is used. However, the present invention is not limited to the combination of these metals, and any combination with another metal exhibiting resistance when the metal is etched can be used. In the case where the protective metal layer 2 is not formed, the surface metal layer 4 which is another metal can be directly formed on the metal substrate 10.

  Next, as shown in FIG. 3B, the surface metal layer 4 is selectively etched using the etching resist M. Thereby, the columnar metal part 14 is formed at the mounting position of the light emitting element 30. The size of the columnar metal part 14 can be made smaller than the size of the light emitting element 30 to be mounted. For example, the diameter of the upper surface is 0.1 to 0.6 mm. The shape of the upper surface of the columnar metal portion 14 may be any of a square shape, a circular shape, and the like.

  As the etching resist M, a photosensitive resin, a dry film resist (photoresist), or the like can be used. In addition, when the metal substrate 10 is etched simultaneously with the surface metal layer 4, it is preferable to provide the mask material for preventing this on the lower surface of the metal substrate 10 (not shown).

  Examples of the etching method include etching methods using various etching solutions according to the types of each metal constituting the protective metal layer 2 and the surface metal layer 4. For example, when the surface metal layer 4 is copper and the protective metal layer 2 is the aforementioned metal (including a metal resist), a commercially available alkaline etching solution, ammonium persulfate, hydrogen peroxide / sulfuric acid, or the like can be used. After the etching, the etching resist M is removed.

  Next, as shown in FIGS. 3C and 3D, the exposed protective metal layer 2 is removed, but it is also possible to form the insulating layer 16 without removing it. The protective metal layer 2 can be removed by etching. Specifically, when the surface metal layer 4 is copper and the protective metal layer 2 is the above-mentioned metal, an acid-based etching solution such as nitric acid, sulfuric acid, or cyan is commercially available for solder removal. Etc. are preferably used.

  When the protective metal layer 2 exposed in advance is removed, the surface of the metal substrate 10 is exposed from the removed portion. In order to improve the adhesion between the surface and the insulating layer 16, surface treatment such as blackening treatment and roughening treatment is performed. It is preferable to carry out.

  (2) Next, the insulating resin material and the metal foil are laminated, and the convex portion A is formed on the surface. Below, the case where copper foil is used as metal foil is demonstrated. As shown in FIG. 3E, the insulating resin material and the copper foil are laminated and integrated to form the insulating layer 16 and the metal layer 19 simultaneously. The insulating resin material and the copper foil are heated and pressed by the pressing surface, and as shown in FIG. 3 (f), the convex portion A is formed at a position corresponding to the columnar metal portion 14, and the metal layer 19 is formed on the uppermost surface. A laminated body is obtained. At this time, it is preferable to arrange at least a sheet material that allows concave deformation between the press surface and the laminated body. Moreover, you may use the press surface which has a recessed part in the position corresponding to the columnar metal part 14. FIG.

  As another embodiment, an opening may be provided at a position corresponding to the columnar metal portion 14 of the insulating layer 16 and the metal layer 19, and this may be hot pressed. The opening can be formed with a drill or a punch. The size of the opening can be made slightly larger than the upper surface of the columnar metal part 14 or can be made smaller. When making it smaller than the upper surface of the columnar metal part 14, it is possible to remove this similarly to the convex part A.

  Various types of the above-mentioned insulating resin material and copper foil are commercially available, and any of them can be used. Further, the insulating resin material forming material and the copper foil forming material may be arranged separately. In this step, since the sheet material is deformed in a concave shape during the heat press due to the presence of the columnar metal portion 14, the corresponding convex portion A is formed in the laminate.

  As a heating press method, a heating / pressurizing apparatus (thermal laminator, heating press) or the like may be used. In this case, the atmosphere may be set to a vacuum (vacuum laminator or the like) in order to avoid air contamination. Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the insulating layer forming material and the metal layer forming material, but the pressure is preferably 0.5 to 30 MPa.

  As the insulating layer forming material, any material may be used as long as it is deformed at the time of lamination and solidified by heating or the like and has the heat resistance required for the wiring board. Specific examples include various reaction curable resins such as polyimide resins, phenol resins, and epoxy resins, and composites (prepregs) of the same with glass fibers, ceramic fibers, aramid fibers, and the like.

  The insulating layer forming material of the insulating layer 16 is preferably made of a material having high thermal conductivity, and examples thereof include a resin containing a thermally conductive filler.

  The insulating layer 16 is preferably composed of a thermally conductive filler that is a metal oxide and / or a metal nitride and a resin (insulating adhesive). Metal oxides and metal nitrides are preferably excellent in thermal conductivity and electrically insulating. Aluminum oxide, silicon oxide, beryllium oxide, and magnesium oxide are selected as the metal oxide, and boron nitride, silicon nitride, and aluminum nitride are selected as the metal nitride. These can be used alone or in combination of two or more. . In particular, among the metal oxides, aluminum oxide can easily obtain an insulating adhesive layer having good electrical insulation and thermal conductivity, and can be obtained at low cost. Of these materials, boron nitride is preferable because it is excellent in electrical insulation and thermal conductivity and has a low dielectric constant.

  The resin constituting the insulating layer 16 includes a metal oxide and / or a metal nitride, but has a bonding strength with the metal substrate 10 (the protective metal layer 12 if present) in a cured state. Those which are excellent and do not impair the withstand voltage characteristics are selected. As such a resin, an epoxy resin, a phenol resin, a polyimide resin, and various engineering plastics can be used singly or as a mixture of two or more, and among them, an epoxy resin is excellent in bonding strength between metals. preferable. In particular, among epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, hydrogenated bisphenol A-type epoxy resins, hydrogenated, which have high fluidity and excellent mixing properties with the above metal oxides and metal nitrides. Bisphenol F type epoxy resin, triblock polymer having bisphenol A type epoxy resin structure at both ends, and triblock polymer having bisphenol F type epoxy resin structure at both ends are more preferable resins.

  The sheet material may be any material that allows concave deformation at the time of heating press, such as cushion paper, rubber sheet, elastomer sheet, nonwoven fabric, woven fabric, porous sheet, foam sheet, metal foil, and composites thereof. Can be mentioned. In particular, those that can be elastically deformed, such as cushion paper, rubber sheets, elastomer sheets, foam sheets, and composites thereof, are preferable.

  (3) The convex part A above the columnar metal part 14 is removed, and the columnar metal part 14 is exposed. As shown in FIG. 3G, the convex portion A is removed, the columnar metal portion 14 is exposed, and a flat surface B is formed. When removing the convex portion A, it is preferable to remove and flatten the metal layer 19 and the columnar metal portion 14 so that the height thereof coincides.

  As a method for removing the convex portion A, a method by grinding or polishing is preferable. A method using a grinding device having a hard rotating blade in which a plurality of hard blades made of diamond or the like are arranged in the radial direction of the rotating plate, a sander, a belt sander , A method using a grinder, a surface grinder, a hard abrasive molded article, or the like. When the grinding apparatus is used, the upper surface can be flattened by moving the hard rotary blade along the upper surface of the fixedly supported wiring board while rotating the hard rotary blade. Moreover, as a grinding | polishing method, the method of lightly grind | polishing by a belt sander, buff grinding | polishing, etc. is mentioned. When the protrusion A is formed on the laminate as in the present invention, it becomes easy to grind only that portion, and the entire flattening can be performed more reliably.

  (4) The metal foil (metal layer 19) is etched with a predetermined pattern. Further, as shown in FIG. 3H, the exposed columnar metal portion 14 and the metal layer 19 are metal-plated to form a metal-plated layer 20 before the process of etching the metal layer 19 with a predetermined pattern. . As the metal species for metal plating, for example, copper, silver, Ni and the like are preferable. Examples of the method for forming the metal plating layer 20 include a panel plating method in which a pattern is formed using an etching resist, a pattern plating method in which a pattern plating resist is used for plating, and the like.

  Next, as shown in FIGS. 4I to 4J, the metal plating layer 20 and the metal layer 19 are etched in a predetermined pattern using the etching resist M, thereby forming a power feeding pattern 20a. At that time, the metal substrate 10 is also etched at the same time to form the groove 10c, so that the conductive region 10a that is electrically connected to the power supply pattern 20a and at least the periphery of the conductive region 10a are removed and insulated from the conductive region 10a. A non-conducting region 10b can be formed.

  The removal of the etching resist M may be appropriately selected according to the type of the etching resist M, such as chemical removal or peeling removal. For example, in the case of photosensitive ink formed by screen printing, it is removed with chemicals such as alkali.

  Further, as another manufacturing method, in the above description, an example in which the metal layer 19 is deformed into a convex shape by arranging a sheet material that allows concave deformation between the press surface and the stacked body is shown. However, in the present invention, by laminating a dry film resist on the upper surface of the metal layer 19, by performing pattern exposure and development, by forming a dry film resist having an opening above the columnar metal portion 14, It is also possible to deform the metal layer 19 into a convex shape when heated and pressed.

  The pad 20b and the power feeding pattern 20a are preferably plated with a noble metal such as gold, nickel, or silver in order to increase reflection efficiency. Also, a solder resist may be formed as in the case of a conventional wiring board, or solder plating may be partially performed.

  Next, the light emitting element 30 is mounted. That is, in the light emitting device, as shown in FIG. 1, the light emitting element 30 having at least one electrode 31, 32 on the bottom surface is provided on the light emitting element mounting substrate of the present invention, and the electrodes 31, 32 are the power feeding pattern 20a. It is mounted in a conductive state. Alternatively, the light-emitting device includes a light-emitting element having two electrodes 31 and 32 on the bottom surface mounted on the light-emitting element mounting substrate of the present invention in a state where the electrodes 31 and 32 are electrically connected to the power feeding pattern 20a.

  As a mounting method of the light emitting element 30, a method of connecting at least one electrode 32 of the light emitting element 30 to the upper surface of the power feeding pattern 20a by a solder 35 is preferable. When the light emitting element 30 having two electrodes on the bottom surface is used, it is preferable that the other electrode 31 is also connected to the power feeding pattern 20a by the solder 35. When the light emitting element 30 having one electrode on the bottom surface is used, for example, the connection between the other electrode and the power supply pattern 20a can be performed by wire bonding or the like. Note that the electrode 32 and the power feeding pattern 20a can be electrically connected by a conductive paste, an anisotropic conductive film, or the like.

  The light emitting element 30 only needs to have at least one electrode on the bottom surface, and is a light emitting diode chip (flip chip, bare chip) that emits light on the opposite side of the electrode formation surface, or a packaged surface mount type light emitting diode (chip). LED), semiconductor laser chip, and the like. As the light emitting diode chip having one electrode on the bottom surface, there are two types of the bottom surface of the cathode type and the anode type.

  In the light emitting device of the present invention, it is preferable that the metal substrate 10 is provided with a heat sink 40 and a heat conductive material 41 is interposed at least in the conduction region 10a, as indicated by phantom lines in FIG. Thereby, the heat of the light emitting element 30 can be efficiently transferred to the heat sink 40 via the conduction region 10a, and the heat dissipation effect can be further enhanced.

  As the heat transfer material 41, a heat transfer grease such as silicone grease or a heat transfer sheet in which a heat transfer material such as ceramics is filled in a resin having adhesiveness or adhesiveness can be used. The heat conductive material 41 may be provided at least in the conductive region 10a, or may be provided in the non-conductive region 10b or the entire substrate including them.

  As the heat sink 40, various types can be used according to required heat dissipation characteristics, and any of a fin type, a rib type, a post type, and the like may be used. Further, it may be combined with a fan or a heat pipe.

(Another embodiment)
(1) In the above-described embodiment, an example in which one metal convex portion corresponding to one electrode 32 of the light emitting element 30 and one conductive region 10a are provided is shown. In the present invention, FIG. As shown, it is preferable to provide two metal convex portions (columnar metal portions 14) corresponding to the two electrodes 31 and 32 of the light emitting element 30 and two conductive regions 10a. In the present invention, it is preferable that a plurality of conductive regions 10 a are provided in correspondence with the two electrodes 31 and 32 on the bottom surface of the light emitting element 30 as described above.

  In this case, at least the periphery of the entire two conductive regions 10a is removed, and a non-conductive region 10b insulated from the conductive region 10a is formed. Moreover, the boundary part of the two conduction | electrical_connection area | regions 10a is removed, and it will be in the state where both were insulated. In addition, you may form the non-conduction area | region 10b insulated from both between the two conduction | electrical_connection areas 10a.

  (2) In the above-described embodiment, a metal convex portion that penetrates the insulating layer is provided in at least a part of the conductive region, and the power feeding pattern and the conductive region are conducted through the metal convex portion. In the present invention, as shown in FIG. 6, the insulating layer 16 is provided with an opening 16a for mounting the light emitting element 30, and the conductive region 10a exposed from the opening 16a is provided. The power supply pattern 20a may be extended so that the power supply pattern 20a and the conduction region 10a are electrically connected.

  In such a case, the light emitting element mounting substrate is formed by stacking and integrating the insulating layer forming material on which the opening 16a has been formed and the metal substrate 10 together by heat pressing, and then forming the power feeding pattern 20a by pattern plating. It can be manufactured by a forming method or the like.

  Also in this embodiment, the power supply pattern 20a only needs to be partly in contact with the conduction region 10a. For example, the electrodes 31, 32 of the light emitting element 30 are soldered to the conduction region 10a instead of the power supply pattern 20a. 35 may be connected.

  (3) In the above-described embodiment, the example in which the metal substrate 10 is formed on the lowermost surface and the wiring layer has a single-layer structure is shown. However, the present invention provides a lower wiring layer, A multilayer wiring board having two or more wiring layers may be used. Details of a method for forming a conductive connection structure between wiring layers in that case are described in International Publication No. WO 00/52977, and any of these can be applied.

  (4) In the above-described embodiment, an example in which the light emitting element has two electrodes on the bottom surface is shown. However, in the present invention, the light emitting element 30 may have one electrode 32 on the bottom surface. In this case, for example, the connection between the other electrode 31 and the power feeding pattern 20a can be performed by wire bonding or the like. For wire bonding, a fine metal wire such as gold can be used, and the wire can be connected by a method using ultrasonic waves and heating together.

  (5) In this invention, after mounting a light emitting element on a board | substrate or after forming a reflector, you may coat | cover or seal the surface using the light-resistant film of 1 layer or multiple layers. As the light-resistant film, a resin composition containing a fluororesin and a methacrylic ester resin can be used.

  Examples of the fluororesin include homopolymers and copolymers of polyvinylidene fluoride, polytetrafluoroethylene, polychlorotrifluoroethylene, polyhexafluoropropylene, and polyvinyl fluoride. The methacrylic ester resin refers to a homopolymer of methyl methacrylate (MMA), a copolymer of a monomer copolymerizable with methyl methacrylate, a blend of polymethyl methacrylate and acrylic rubber, or the like. Examples of the copolymerizable monomer include methacrylic acid esters having 2 to 4 carbon atoms, acrylate esters having 1 to 8 carbon atoms such as butyl acrylate, styrene, α-methylstyrene, acrylonitrile, acrylic acid, and the like. Examples include ethylenically unsaturated monomers.

A phosphor may be contained in at least one layer constituting the light-resistant film. As the phosphor, YAG: Ce phosphor in which the activator cerium is introduced into the phosphor matrix yttrium aluminate, and the activator europium is introduced into the phosphor matrix strontium barium silicate (Sr, Ba) ₂ SiO ₄ : Eu. There are oxide phosphors such as phosphors, nitride phosphors such as α-sialon phosphors and β-sialon phosphors, and zinc sulfide activated by copper, copper, aluminum, and magnesium. The particle size of the phosphor can vary within a wide range, for example, within a range of 0.001 to 20 μm. Since light scattering can increase in direct proportion to the particle size, particles on the order of 1-2 μm or less are preferred, and particles on the order of 0.01-0.4 μm or less are more desirable.

  Moreover, an ultraviolet absorber, antioxidant, a dispersing agent, a coupling agent, etc. can also be used for at least 1 layer which comprises a light-resistant film.

  (6) In the present invention, as shown in FIG. 7, a dam 201 having a reflector function may be formed around the columnar metal portion 14. The dam 201 is bonded to the upper surface of the power feeding pattern 20a with an adhesive 202. The dam 201 can be formed by applying a dam-shaped hole to an Al plate having a predetermined thickness. The reflective surface of the dam 202 can be further plated with Ni, Ag, Cu, or the like. The inside of the dam 201 can be covered with a transparent resin, a fluorescent color resin, or the like. Furthermore, a convex transparent resin lens can be provided above the surface. Since the transparent resin lens has a convex surface, light can be efficiently emitted upward from the substrate. The transparent resin lens may be colored.

  Thus, the inside of the dam 201 can be covered (sealed) with the transparent resin, and the transparent resin lens can be provided to constitute the light emitting element package or the light emitting element panel. The light emitting element package generally has a package configuration in which one light emitting element is mounted on a substrate on which a wiring pattern is formed. The light emitting element package is mounted on a circuit board. A light emitting element panel generally has a configuration in which a plurality of light emitting elements are mounted on a substrate on which a wiring pattern is formed.

  (7) In the present invention, as shown in the bottom views of FIGS. 8A to 8C, various forms of conductive regions 10 a and non-conductive regions 10 b can be formed on the metal substrate 10. FIG. 8A shows an example in which two conductive regions 10a are formed corresponding to four light emitting elements 30 mounted on a rectangular substrate. The conductive region 10a is divided into eight sections as a whole, and a groove 10c is formed around the conductive region 10a so as to be insulated from the non-conductive region 10b.

  FIG. 8B is an example in which one conductive region 10a is formed for each of the three light emitting elements 30 mounted on the circular substrate. The conductive region 10a is divided into three sections, and a groove portion 10c is formed around each of them to be insulated from the non-conductive region 10b.

  FIG. 8C shows an example in which two conductive regions 10a are formed corresponding to the three light emitting elements 30 mounted on the hexagonal substrate. The conductive region 10a is divided into six sections as a whole, and a groove 10c is formed around the conductive region 10a so as to be insulated from the non-conductive region 10b.

  (8) In the above-described embodiment, the example in which the light emitting element mounting substrate is configured by the light emitting element mounting and the electrode has been described. However, in the present invention, other electronic circuits may be formed on the same substrate. . For example, it is preferable to form a drive circuit for a light emitting diode. In this case, wiring, lands, pads for bonding, pads for electrical connection to the outside, etc. are patterned in the periphery of the substrate, particularly in the corner and the vicinity thereof, and components such as chip capacitors, chip resistors and printing resistors, A transistor, a diode, an IC, or the like may be provided.

DESCRIPTION OF SYMBOLS 10 Metal substrate 10a Conduction area | region 10b Non-conduction area | region 12 Protective metal layer 14 Columnar metal part (metal convex part)
16 Insulating Layer 16a Opening 20 Metal Plated Layer 20a Power Supply Pattern 30 Light Emitting Element 31 Electrode 32 Electrode 35 Solder 40 Heat Sink 41 Heat Transfer Material A Convex B B Flat Surface

Claims (8)

A light emitting element mounting substrate for mounting a light emitting element having at least one electrode on a bottom surface,
A metal substrate, an insulating layer formed on the metal substrate, and a power feeding pattern formed on the insulating layer,
The metal substrate is a light-emitting element mounting substrate having a conductive region that is electrically connected to a power feeding pattern and a non-conductive region that is insulated from the conductive region by removing at least the periphery of the conductive region.   The metal convex part which penetrates the said insulating layer is provided in the at least one part area | region of the said conduction | electrical_connection area | region, The said pattern for electric power feeding and the conduction | electrical_connection area | region are conducted through the metal convex part. Light-emitting element mounting substrate.   The insulating layer is provided with an opening for mounting a light emitting element, and the power feeding pattern extends to the conductive region exposed from the opening, so that the power feeding pattern and the conductive region are electrically connected. The light-emitting element mounting substrate according to claim 1.   The light emitting element mounting substrate according to claim 1, wherein a plurality of the conductive regions are provided corresponding to the two electrodes on the bottom surface of the light emitting element.   The substrate for mounting a light emitting element according to claim 1, wherein at least the periphery of the conductive region is removed by etching.   6. A light emitting device, wherein a light emitting element having at least one electrode on a bottom surface is mounted on the light emitting element mounting substrate according to claim 1 in a state where the electrode is electrically connected to the power feeding pattern.   6. A light emitting device comprising: a light emitting element mounting substrate according to claim 1, wherein a light emitting element having two electrodes on a bottom surface is mounted in a state where the electrodes are electrically connected to the power feeding pattern.   The light emitting device according to claim 6 or 7, wherein a heat sink is provided on the metal substrate, and a heat transfer material is interposed at least in the conduction region.

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