JP2016081940A - Board for mounting light emission element, light emission device and method of manufacturing light emission device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emission element mounting board which is suitable for mounting a light transmission element having a large heat quantity, induces no connection failure to the light emission element and no inclination of the light emission element, and further is suitable for formation of protection resin around the light emission element.SOLUTION: A light emission element mounting board on which a light emission element is mounted has a base material which is formed of insulation resin and has a first principal surface and a second principal surface at the opposite side to the first principal surface, a first conductor layer formed on the first principal surface of the base material, a second conductor layer formed on the second principal surface of the base material, a metal block penetrating through the first conductor layer, the base material and the second conductor layer, and a reflection layer having an opening portion in an area where the light emission element is mounted, and coating the first conductor layer. An end face at the first principal surface side of the metal block is a mounting pad of the light emission element.SELECTED DRAWING: Figure 1

Description

The present invention relates to a light-emitting element mounting substrate, a light-emitting device, and a method for manufacturing the light-emitting device.

Light emitting elements such as LED (light emitting diode) chips are used for backlighting of mobile phones and liquid crystal televisions. Such a light emitting element is used by being mounted on a light emitting element mounting member.
There are various types of light-emitting element mounting members, such as one in which terminal members are integrated by resin molding, one in which lead frames are bent, and further printed. There are those based on a wiring board. Among these, considering heat dissipation, miniaturization, cost, etc., a light emitting element mounting board based on a printed wiring board is often desired.

As a method for mounting a light emitting element such as an LED chip on a printed wiring board, surface mounting (flip chip mounting) can be mentioned. A surface-mount type light-emitting element does not require connection by a wire, and therefore requires a small area for mounting on a printed wiring board, contributing to downsizing of a board on which the light-emitting element is mounted.
A protective resin for protecting the light emitting element is provided around the light emitting element. In the case of white LED applications, the light emitting element is a blue LED chip, and a protective resin containing a yellow phosphor is provided around the light emitting element, so that blue light from the blue LED chip is applied to the yellow phosphor and white. I try to get light.

Patent Document 1 discloses a flip chip mounting substrate.
In this substrate, a terminal portion for mounting a flip chip is formed by punching a conductive material, and a punched conductive material embedded in an insulating substrate, connected to an end of the punched conductive material, and exposed to the surface of the insulating substrate. It consists of punched bumps.

JP 2002-170899 A

In recent years, there is a demand for light-emitting elements that emit light with high luminance, and researches for improving the luminance by arranging a plurality of LED chips in a modular manner and for improving the luminance of the LED chips themselves are progressing.
In order to arrange LED chips in a modular manner and improve luminance, LED chips are mounted on a light emitting element mounting substrate at a high density. The LED chip is known as a light emitting element that generates a small amount of heat. However, when the density is increased in this way, there is a problem that heat generation that cannot be ignored is generated. In addition, when the brightness of the LED chip itself is improved, there is a problem that heat generation that cannot be ignored similarly occurs.

In Patent Document 1, it is said that the punched bump is made of a low melting point material such as solder or conductive adhesive, and since it is such a material, bump formation by punching is possible.
However, when a light emitting element such as an LED chip that generates a large amount of heat is mounted on a substrate having a bump made of such a low melting point material, there is a problem that the mounted light emitting element comes off due to the heat generated by the light emitting element itself. A substrate having a bump made of such a low melting point material has a problem that it is not suitable for a substrate on which a light emitting element having a large amount of heat generation is mounted.

In addition, when multiple mounting pads are provided on the substrate, the mounting pads may not have the same height. When mounting a light emitting element such as an LED chip on the substrate, the mounting pads have the same height. Otherwise, there is a problem that the optical axis of the mounted light emitting element is inclined.
In addition, there is a concern that some mounting pads are not connected to the electrodes of the light emitting elements.

With regard to these problems, as in the technique described in Patent Document 1, when a connection using a low-melting-point material such as solder is performed, the low-melting-point metal works to alleviate the unevenness of the mounting pads. Therefore, even if the mounting pads are not exactly the same height, it does not matter so much.
However, as described above, a connection method using a low-melting-point material such as solder is not suitable for a substrate on which a light-emitting element that generates a large amount of heat is mounted. Therefore, if the connection method is changed to prevent heat generation, problems caused by uneven mounting pad height will become apparent.

In addition, in the case where the periphery of the light emitting element is to be sealed with a protective resin after the light emitting element is mounted, a process of covering the periphery of the light emitting element with a liquid resin and curing is performed. If it flows without staying in the surroundings, workability deteriorates. Therefore, it has been demanded that the liquid resin stays around the light emitting element.

The present invention has been made in view of such problems, and the object of the present invention is suitable for mounting a light emitting element with a large amount of heat generation, and does not cause poor connection with the light emitting element, and the mounted light emitting element. It is a light-emitting element mounting substrate that does not cause the inclination of the light-emitting element and that is suitable for forming a protective resin around the light-emitting element.

That is, the light emitting element mounting substrate of the present invention is a light emitting element mounting substrate on which a light emitting element is mounted,
A base material comprising an insulating resin and comprising a first main surface and a second main surface opposite to the first main surface;
A first conductor layer formed on the first main surface of the substrate;
A second conductor layer formed on the second main surface of the substrate;
A metal block penetrating the first conductor layer, the base material and the second conductor layer;
Having an opening in a region where the light emitting element is mounted, and having a reflective layer covering the first conductor layer,
The first main surface side end surface of the metal block is a mounting pad of a light emitting element.

In the light emitting element mounting substrate of the present invention, the first main surface side end surface of the metal block is a mounting pad of the light emitting element.
Unlike filled vias that are formed in the through-holes through a chemical process such as plating, the metal block does not have voids formed therein, and does not cause depressions or rises on the surface. Since no void is formed inside, high heat dissipation can be ensured.
If the end face on the first main surface side of the metal block is a mounting pad of the light emitting element, the heat generated from the light emitting element is immediately transmitted to the metal block. Therefore, the heat generated from the light emitting element is transmitted through the metal block to the opposite second side. It can escape to the main surface side.
Therefore, the light emitting element mounting substrate of the present invention is a substrate suitable for mounting a light emitting element having a large calorific value.

Moreover, in the light emitting element mounting substrate of this invention, the reflection layer which has an opening part and coat | covers a 1st conductor layer in the area | region which mounts a light emitting element is provided.
A light emitting element is mounted on the light emitting element mounting substrate of the present invention to form a light emitting device. For the purpose of protecting the light emitting device, the light emitting device is covered with a transparent cover. When the light emitting element emits light, most of the light is transmitted through the cover, but part of the light is reflected by the cover. When the reflective layer is formed like the light emitting element mounting substrate of the present invention, the reflected light can be reflected again.
Accordingly, the luminance can be increased.

The reflective layer has an opening, and a light emitting element is mounted in the opening.
When the light emitting element is mounted in the opening, a wall of the reflective layer stands around the light emitting element. Therefore, when the liquid resin is flowed around the light emitting element to cover the periphery of the light emitting element, the reflective layer serves as a dam to prevent the resin from flowing out of the opening, and the liquid resin is opened. Stay in the department. And since the circumference | surroundings of a light emitting element can be sealed with protective resin by hardening | curing resin which remained in the opening part, workability | operativity at the time of formation of protective resin can be improved.

In the light emitting element mounting substrate of the present invention, there are a plurality of first principal surface side end surfaces of the metal block in the same substrate surface, and the coplanarity of the virtual plane formed by the first principal surface side end surface is It is preferable to form a flat surface of 3 to 20 μm.

The fact that the coplanarity of the imaginary plane formed by the end face on the first main surface side of the metal block is in such a range means that the board has a plurality of mounting pads arranged at the same height. Therefore, when the light emitting element is mounted on the light emitting element mounting substrate of the present invention, since all the mounting pads are connected to the electrodes of the light emitting element, connection failure is prevented. Further, since the mounted light emitting element does not tilt, the problem that the optical axis of the light emitting element tilts does not occur.

In the light emitting element mounting substrate of the present invention, it is preferable that a taper is formed on the wall surface of the opening so that the opening area increases from the first main surface side to the outside of the base material.
When the opening is tapered, the light from the light emitting element hits the wall surface of the opening and is reflected, so that diffusion of light to the outside is prevented and the luminance of the light from the light emitting element can be increased.
In addition, when the liquid resin is stored in the opening, the resin is easily stored.

In the light emitting element mounting substrate of this invention, it is preferable that the metal plating layer is formed in the 1st main surface side end surface of the said metal block, and the 1st conductor layer surface.
When the metal plating layer is formed on the first main surface side end surface of the metal block and the surface of the first conductor layer, the first main surface side end surface of the metal block and the surface of the first conductor layer are formed by the metal plating layer. As a result, the metal block and the first conductor layer can be protected from corrosion.

In the light emitting element mounting substrate of the present invention, the metal plating layer is formed on the first main surface side end surface of the metal block and the surface of the first conductor layer on the outer periphery of the metal block and the first conductor layer. Further, it is preferable that the metal block is formed so as to be connected to the inner periphery of the fitting entrance.
In the light emitting element mounting substrate having such a configuration, the metal block and the first conductor layer are reliably connected by the metal plating layer. Therefore, it is possible to prevent energization from being stopped due to poor contact.

In the light emitting element mounting substrate of the present invention, it is preferable that a gold layer or a tin layer is formed on the outermost surface of the mounting pad formed of the end surface on the first main surface side of the metal block.
When the outermost surface of the mounting pad is a gold layer or a tin layer, it can be connected by forming a eutectic connection with the metal on the surface of the electrode of the light emitting element.
And since the material of the outermost surface of the mounting pad is not a low melting point metal such as solder, even if the light emitting element generates heat after mounting the light emitting element, the connection between the mounting pad and the electrode of the light emitting element will not be disconnected.
Therefore, it is suitable as a substrate on which a light-emitting element that generates a large amount of heat is mounted.

In the light emitting element mounting substrate of the present invention, the thickness of the reflective layer is preferably 2 to 10 times the thickness of the light emitting element.
That the thickness of the reflective layer is thicker than that of the light emitting element means that the height of the reflective layer serving as a dam is high. Therefore, even if a large amount of liquid resin is flowed to cover the periphery of the light emitting element, the resin is prevented from flowing out of the opening.

In the light emitting element mounting substrate of the present invention, the insulating resin is preferably polyimide.
When the insulating resin is polyimide, the insulating resin has both flexibility and insulating properties, so that the shape can be changed depending on the application while ensuring sufficient insulating properties.

In the light emitting element mounting substrate of the present invention, it is preferable that a layer made of titanium oxide or aluminum as a reflective material is formed on the wall surface of the opening.
Titanium oxide is a white pigment, and aluminum is also a highly reflective material. Therefore, when a layer made of titanium oxide or aluminum is formed on the wall surface of the opening, light is suitably reflected on the wall surface of the opening. Can do.

The light emitting device of the present invention is a light emitting device having a light emitting element mounted on a light emitting element mounting substrate,
A base material comprising an insulating resin and comprising a first main surface and a second main surface opposite to the first main surface;
A first conductor layer formed on the first main surface of the substrate;
A second conductor layer formed on the second main surface of the substrate;
A metal block penetrating the first conductor layer, the base material and the second conductor layer;
A reflective layer having an opening in a region where the light emitting element is mounted and covering the first conductor layer;
A light emitting element that is electrically connected to a mounting pad made of the first principal surface side end face of the metal block and is mounted in the opening;
And a light-transmitting protective resin for sealing the light-emitting element.

In the light emitting device of the present invention, the light emitting element is electrically connected to the mounting pad formed of the first main surface side end face of the metal block.
Since the light emitting element is connected to the mounting pad formed by the end face on the first main surface side of the metal block, the heat generated from the light emitting element can be released to the opposite second main surface side through the metal block.
A light emitting element is mounted in the opening of the reflective layer, and the light emitting element is sealed with a light-transmitting protective resin. With such a structure, the light-emitting element is protected by the protective resin, and light from the light-emitting element is irradiated to the outside through the light-transmitting protective resin.

In the light emitting device of the present invention, a plurality of first principal surface side end surfaces of the metal block exist in the same substrate surface, and a coplanarity of a virtual plane formed by the first principal surface side end surface is 3 to 20 μm. It is preferable to form a flat surface.
When the light emitting elements are mounted on the light emitting element mounting substrate by being connected to such mounting pads, since all the mounting pads are connected to the electrodes of the light emitting elements, connection failure is prevented. Further, since the mounted light emitting element does not tilt, the problem that the optical axis of the light emitting element tilts does not occur.

In the light emitting device of the present invention, it is preferable that a taper is formed on the wall surface of the opening so that the opening area increases from the first main surface side to the outside of the base material.
When the opening is tapered, the light from the light emitting element hits the wall surface of the opening and is reflected, so that diffusion of light to the outside is prevented and the luminance of the light from the light emitting element can be increased.

In the light emitting device of the present invention, it is preferable that a metal plating layer is formed on the first main surface side end surface and the first conductor layer surface of the metal block.
When the metal plating layer is formed on the first main surface side end surface of the metal block and the surface of the first conductor layer, the first main surface side end surface of the metal block and the surface of the first conductor layer are formed by the metal plating layer. As a result, the metal block and the first conductor layer can be protected from corrosion.

In the light emitting device of the present invention, the metal plating layer is formed on the first main surface side end surface of the metal block and the surface of the first conductor layer, and the metal formed on the outer periphery of the metal block and the first conductor layer. It is preferable that it is formed so as to connect the inner periphery of the block entrance.
With such a configuration, the metal block and the first conductor layer are reliably connected by the metal plating layer. Therefore, it is possible to prevent energization from being stopped due to poor contact.

In the light emitting device of the present invention, a gold layer or a tin layer is formed on the outermost surface of the mounting pad formed of the first main surface side end surface of the metal block, and the outermost surface of the electrode of the light emitting element is the gold layer or It is a tin layer, and it is preferable that the outermost gold layer or tin layer of the electrode of the light emitting element is electrically connected to the outermost gold layer or tin layer of the mounting pad.
With the above configuration, eutectic connection such as gold / gold, gold / tin, tin / gold, etc. is formed between the outermost surface of the mounting pad and the outermost surface of the electrode of the light emitting element, and the light emitting element and the light emitting element are mounted. The substrate can be connected. Since these eutectic connections are stable connections that do not come off due to the heat generated by the light emitting elements, a more reliable light emitting device is obtained.

In the light emitting device of the present invention, it is preferable that a phosphor layer is formed on the protective resin, or a phosphor is dispersed in the protective resin.
When a phosphor is present on or in the protective resin, the light emitting element is a blue LED, and a protective resin containing a yellow phosphor is provided around the light emitting element, so that blue light from the blue LED is converted into yellow fluorescent light. The color of light emission can be changed by the phosphor, as in the case of obtaining white light on the body.

In the light emitting device of the present invention, the insulating resin is preferably polyimide.
When the insulating resin is polyimide, the insulating resin has both flexibility and insulating properties, so that the shape can be changed depending on the application while ensuring sufficient insulating properties.

In the light emitting device of the present invention, it is preferable that a layer made of titanium oxide or aluminum as a reflecting material is formed on the wall surface of the opening.
Titanium oxide is a white pigment, and aluminum is also a highly reflective material. Therefore, when a layer made of titanium oxide or aluminum is formed on the wall surface of the opening, light is suitably reflected on the wall surface of the opening. Can do.

The light emitting device manufacturing method of the present invention is a method of manufacturing the light emitting device of the present invention, wherein after the light emitting element is mounted on the light emitting element mounting substrate, the reflection layer covering the first conductor layer is used as the dam. The opening is sealed with a light-transmitting protective resin so that the element is completely buried in the resin.

When a liquid resin is caused to flow around the light emitting element, the reflective layer serves as a dam to prevent the resin from flowing out of the opening, and the liquid resin stays around the light emitting element. Therefore, workability at the time of forming the protective resin can be improved.

In the method for manufacturing a light emitting device according to the present invention, it is preferable to further perform a step of supplying the phosphor from above the protective resin sealed in the opening.
In the method for manufacturing a light emitting device of the present invention, it is preferable to use a protective resin in which a phosphor is dispersed in a protective resin.
According to such a method, the phosphor can be supplied on or in the protective resin. And it becomes a light-emitting device which can be used for uses, such as white LED illumination using a blue LED chip.

FIG. 1 is a cross-sectional view schematically showing an example of a light emitting element mounting substrate of the present invention. FIG. 2 is a cross-sectional view schematically showing an example of the light emitting device of the present invention in which the light emitting element is mounted on the light emitting element mounting substrate of the present invention. FIG. 3 is a diagram schematically illustrating the operation of the reflective layer provided in the light emitting device of the present invention. 4A to 4C are plan views schematically showing an example of a light emitting element module using the light emitting element mounting substrate of the present invention. FIG. 5 is a diagram schematically showing the double-sided conductor substrate preparation step. FIG. 6 is a diagram schematically showing the hole forming step. Fig.7 (a) and FIG.7 (b) are figures which show an insertion process typically. 8A to 8C are diagrams schematically showing an example of the pattern forming process. FIG. 9 is a diagram schematically showing the pressing process. FIG. 10 is a diagram schematically showing the metal plating step. FIG. 11 is a diagram schematically showing the gold plating step. FIG. 12A and FIG. 12B are diagrams schematically showing an example of the reflective layer forming step. FIG. 13 is a cross-sectional view schematically showing another example of the light emitting device of the present invention. FIG. 14 is a cross-sectional view schematically showing another example of the light emitting device of the present invention.

Hereinafter, the light emitting element mounting substrate and the light emitting device of the present invention will be described in detail. However, the present invention is not limited to the following description, and can be appropriately modified and applied without departing from the scope of the present invention.

A light-emitting element mounting substrate and a light-emitting device of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view schematically showing an example of a light emitting element mounting substrate of the present invention.

As shown in FIG. 1, the light-emitting element mounting substrate 1 is made of an insulating resin, and includes a base 2 having a first main surface 11 and a second main surface 12 opposite to the first main surface 11; A first conductor layer 21 formed on the first main surface 11 of the substrate 2 and a second conductor layer 31 formed on the second main surface 12 of the substrate 2 are provided.

Although it does not specifically limit as insulating resin which comprises the base material 2, It is preferable that it is an insulating resin provided with a softness | flexibility. Examples of the constituent material of such an insulating resin include polyimide and glass epoxy. Among these, polyimide is preferable. When the insulating resin is polyimide, the insulating resin has both flexibility and insulating properties. Therefore, the shape can be changed according to the application while ensuring sufficient insulation.
Although the thickness of the base material 2 is not specifically limited, It is preferable that it is 30-70 micrometers.

Although the constituent material of the 1st conductor layer 21 and the 2nd conductor layer 31 is not specifically limited, It is preferable that they are copper, nickel, etc.
These constituent materials have good electrical conductivity and are suitable as conductors.
The thicknesses of the first conductor layer 21 and the second conductor layer 31 are not particularly limited, but are preferably thicker than the base material 2. Moreover, it is preferable that it is 10-300 micrometers.

As shown in FIG. 1, the light-emitting element mounting substrate 1 further includes a hole 50 that penetrates the first conductor layer 21, the base material 2, and the second conductor layer 31, and a metal block 60 that is fitted in the hole 50. I have.

Unlike filled vias that are formed in through-holes through a chemical process such as plating, the metal block 60 does not have voids formed therein, and does not cause depressions or rises on the surface. Since voids are not formed inside, the heat transfer efficiency of the metal block 60 is not reduced, and heat dissipation can be ensured.
In addition, since the depression of the surface of the metal block 60 does not occur, the distance between the metal block 60 and the heat dissipating part provided on the mounted board such as a mother board on which the light emitting element mounting substrate 1 is mounted increases. Can be prevented. Thereby, the thermal resistance between a thermal radiation part and the metal block 60 can be made small. As a result, the heat dissipation efficiency of the light emitting element mounting substrate 1 can be increased.
In addition, since the surface of the metal block 60 does not swell, the surface of the metal block 60 on the back side of the light emitting element mounting substrate 1 (that is, the outermost layer on the second conductor layer 31 side) with respect to the mounted board. Can be arranged in parallel. That is, the light emitting element mounting substrate 1 can be disposed on the mounted board without the light emitting element mounting substrate 1 being inclined. Thereby, the optical axis of the light emitting element mounted on the light emitting element mounting substrate 1 can be stably maintained in a desired direction. Furthermore, since the surface of the metal block 60 does not rise or sink, the optical axis of the light emitting element can be stabilized when the light emitting element is mounted.

The constituent material of the metal block 60 is not particularly limited, but copper that is excellent in electrical conductivity and thermal conductivity is preferable.
The shape of the metal block 60 is not particularly limited, but is preferably a columnar shape with a flat bottom surface (surface). Examples of such a shape include a cylinder, a quadrangular column, a hexagonal column, and an octagonal column.

In the light emitting element mounting substrate 1, the metal block 60 is preferably electrically connected to at least one of the first conductor layer 21 and the second conductor layer 31. In this case, it is possible to obtain a light emitting element mounting substrate that can be more easily downsized. The metal block 60 may be electrically connected to both the first conductor layer 21 and the second conductor layer 31.

The first main surface side end surface 65 of the metal block 60 serves as a mounting pad for the light emitting element, on which the electrode of the light emitting element is disposed.
The mounting pad of the light emitting element may be a pad in which the first main surface side end surface 65 of the metal block 60 is the outermost surface of the pad, or on the first main surface side end surface 65 of the metal block 60. It may be a pad formed with a conductor layer.
In the light emitting element mounting substrate 1 shown in FIG. 1, the metal plating layer 70 and the gold plating layer 82 are formed on the first main surface side end surface 65 of the metal block 60, and the gold layer is formed on the outermost surface. It is a mounting pad.

A plurality of first main surface side end surfaces 65 of the metal block 60 exist in the same substrate surface. In FIG. 1, two metal blocks are shown, and two end faces 65 on the first main surface side of the metal block 60 are also shown.
And it is preferable that the coplanarity of the virtual plane which the 1st main surface side end surface 65 which exists in multiple places in the same board | substrate surface comprises is 3-20 micrometers.
The coplanarity of the virtual plane is the height of the end face on the first main surface side of the metal block when the height of the end face on the first main surface side of the metal block is measured by placing the light emitting element mounting substrate on the horizontal plane. Determined as the difference between the highest and lowest points.
The height of the first principal surface side end face of the metal block can be measured with a three-dimensional shape measuring apparatus or the like.

Moreover, when the conductor layer is formed on the 1st main surface side end surface of a metal block, the value which measured the height of the outermost surface (outermost surface of a mounting pad) of a conductor layer is the 1st of a metal block. The coplanarity of the virtual plane is calculated as the height of the main surface side end surface.

The fact that the coplanarity of the imaginary plane formed by the end face on the first main surface side of the metal block is in such a range means that the board has a plurality of mounting pads arranged at the same height. Therefore, when the light emitting element is mounted on the light emitting element mounting substrate, since all the mounting pads are connected to the electrodes of the light emitting element, connection failure is prevented. Further, since the mounted light emitting element does not tilt, the problem that the optical axis of the light emitting element tilts does not occur.

In the light emitting element mounting substrate 1 shown in FIG. 1, a metal plating layer 70 is formed on the first main surface side end surface 65 of the metal block 60 and the surface of the first conductor layer 21.
When the metal plating layer 70 is formed, the first main surface side end surface 65 of the metal block 60 and the surface of the first conductor layer 21 are protected by the metal plating layer 70. The conductor layer 21 can be protected from corrosion.
The metal plating layer 70 is preferably formed so as to cover the first main surface side end surface 65 of the metal block 60 and the surface 25 of the first conductor layer 21.
Although the metal block 60 is inserted into the hole 50, the metal block 60 may jump out of the hole 50 due to impact or the like.
However, when the metal plating layer 70 is formed so as to cover the first main surface side end surface 65 of the metal block 60 and the surface 25 of the first conductor layer 21, the metal plating layer 70 fixes the metal block 60. The metal block 60 can be made difficult to jump out of the hole 50.

The metal plating layer 70 is preferably made of at least one metal selected from the group consisting of nickel and silver.
When the metal plating layer 70 consists of these metals, the effect that there exists the metal plating layer 70 is exhibited suitably.
Moreover, the thickness of the metal plating layer 70 is not particularly limited, but is preferably 1.0 to 10 μm.

In the light emitting element mounting substrate 1, the metal plating layer 70 is formed on the first main surface side end surface 65 of the metal block 60 and the surface 25 of the first conductor layer 21, and the outer periphery 61 of the metal block 60 and the first conductor. The metal block 60 formed in the layer 21 is formed so as to be connected to the inner periphery 23 of the insertion port 22.
The positions of the outer periphery 61 of the metal block 60 and the inner periphery 23 of the insertion opening 22 of the metal block 60 formed in the first conductor layer 21 will be described in detail in the description of the insertion process of the method for manufacturing the light emitting element mounting substrate. explain.

In the light emitting element mounting substrate 1 shown in FIG. 1, a gold plating layer 82 as a gold layer is formed on the metal plating layer 70 on the outermost surface of the mounting pad including the first main surface side end surface 65 of the metal block 60. Is provided.
When the outermost surface of the mounting pad is a gold plating layer, gold can prevent oxidation of the metal plating layer.
Although the thickness of a gold plating layer is not specifically limited, It is preferable that it is 0.5-3.0 micrometers.

Further, a tin layer may be formed on the outermost surface of the mounting pad formed of the first main surface side end surface 65 of the metal block 60 in place of the gold layer. A light emitting element mounting substrate and a light emitting device having a tin layer will be described later.

Further, the light emitting element mounting substrate 1 includes an opening 40 in a region where the light emitting element is mounted, and includes a reflective layer 51 that covers the first conductor layer 21.
In this specification, “the reflective layer covers the first conductor layer” includes not only the mode in which the reflective layer directly covers the first conductor layer, but also the first layer formed on the first conductor layer. A mode in which a reflective layer covers the metal plating layer formed is also included.

The opening 40 is a region for mounting the light emitting element, and the outermost surface of the mounting pad (the gold plating layer 82 in FIG. 1) is exposed in the opening.
A taper is formed on the wall surface 42 of the opening 40 shown in FIG. 1 so that the opening area increases from the first main surface 11 side of the substrate 2 toward the outside (from the bottom to the top of FIG. 1). Being done.
When the opening is tapered, the light from the light emitting element hits the wall surface of the opening and is reflected, so that diffusion of light to the outside is prevented and the luminance of the light from the light emitting element can be increased.
In addition, when the liquid resin is stored in the opening, the resin is easily stored.

The constituent material of the reflective layer 51 is not particularly limited, but is preferably an insulating layer containing titanium oxide as a pigment, and more preferably a solder resist layer containing titanium oxide in the pigment.
Titanium oxide is a white pigment, and the reflective layer 51 containing titanium oxide can suitably reflect light. Therefore, the effect of having the reflective layer 51 can be achieved.
Further, when the reflective layer 51 is a solder resist layer containing titanium oxide in the pigment, in addition to the above effects, it also functions as a solder resist.

A layer made of titanium oxide or aluminum as a reflective material may be formed on the wall surface 42 of the opening 40. The layer made of titanium oxide or aluminum is not shown in FIG.

The thickness of the reflective layer 51 is not particularly limited, but is preferably 2 to 10 times the thickness of the light emitting element. A specific value of the thickness is preferably 50 to 300 μm.

FIG. 2 is a cross-sectional view schematically showing an example of the light emitting device of the present invention in which the light emitting element is mounted on the light emitting element mounting substrate of the present invention.

The light emitting device 100 includes a light emitting element 110 mounted on a light emitting element mounting substrate 1 and the light emitting element 110 is sealed with a light-transmitting protective resin 120.
As the light emitting element 110, a surface mount type LED (light emitting diode) chip, LD (laser diode) chip, or the like can be used.
When mounting a surface-mount type light emitting element, all the mounting pads are suitably connected to the electrodes of the light emitting element by aligning the heights of the mounting pads of the light emitting element mounting substrate.
That is, by setting the coplanarity of the virtual plane formed by the first main surface side end surface 65 of the metal block 60 existing in a plurality of locations on the same substrate surface to 3 to 20 μm, the surface mount type light emitting device Can be suitably implemented.
In addition, since the mounting density of the surface-mount light-emitting element can be increased, the luminance of light emitted from the light-emitting device can be increased when a plurality of light-emitting elements are mounted on the light-emitting element mounting substrate.

The electrode 111 of the light emitting element 110 is electrically connected to a mounting pad formed of the first main surface side end surface 65 of the metal block 60. In the light emitting element mounting substrate 1 shown in FIG. 1, a gold plating layer 82 is formed on the outermost surface of the mounting pad, and the gold plating layer 82 and the electrode 111 of the light emitting element 110 are connected.
As an electrode of a light emitting element, that whose outermost surface is a gold layer or a tin layer is preferable.
The electrode 111 of the light emitting element 110 shown in FIG. 2 shows only the outermost gold layer.
2 is an example in which the gold layer on the outermost surface of the mounting pad and the gold layer on the outermost surface of the electrode of the light emitting element are electrically connected.
As for the connection between the gold layer and the gold layer, it is preferable that the gold layer on the outermost surface of the mounting pad and the gold layer on the outermost surface of the electrode of the light emitting element are rubbed with each other by an ultrasonic wave and a new surface is formed.
By such connection, a eutectic connection can be formed between the outermost surface of the mounting pad and the outermost surface of the electrode of the light emitting element, and the light emitting element and the light emitting element mounting substrate can be connected.
Since such a connection has higher heat resistance than a connection using a low-melting-point metal such as solder, it is suitable as a connection for mounting a light-emitting element that generates a large amount of heat.

The protective resin 120 is a resin layer that is formed and sealed so as to cover the light emitting element 110.
The protective resin is preferably a light transmissive transparent resin, and examples thereof include an epoxy resin and a silicone resin.

It is preferable that a phosphor layer is formed on the protective resin, or that the phosphor is dispersed in the protective resin.
The phosphor can be arbitrarily selected according to the type of the light emitting element to be used and the necessary light color. As an example, a yellow or yellow-green phosphor for obtaining white light using a blue LED (for example, YAG: Ce ³⁺ , (Sr, Ca, Ba) SiO ₄ : Eu ²⁺ , β-Sialon: Eu ^2+, etc.) Is mentioned.

The protective resin 120 is disposed so as to cover the light emitting element 110 in the opening 40 and does not protrude outside the opening 40. When forming the protective resin 120, it is preferable to form the protective resin so that a liquid resin for forming the protective resin does not flow out of the opening.

FIG. 3 is a diagram schematically illustrating the operation of the reflective layer provided in the light emitting device of the present invention.
As shown in FIG. 2, the light emitting element 110 is usually mounted on the light emitting element mounting substrate 1 to form the light emitting device 100.
For the purpose of protecting the light emitting device 100, the light emitting device 100 is covered with a transparent cover 7.
As shown in FIG. 3, in the light emitting device 100 including the reflective layer 51, when the light emitting element 110 emits light, most of the light is transmitted through the cover 7. It is reflected (in FIG. 3, the direction of the arrow indicates the traveling direction of light, and the thickness of the arrow indicates the amount of light). When the reflective layer 51 that covers the first conductor layer is formed like the light emitting element mounting substrate 1, the reflected light can be reflected again. Accordingly, the luminance can be increased.
The constituent material of the cover 7 is not particularly limited, but is preferably acrylic resin (PMMA), polycarbonate (PC), glass or the like.

Next, a light emitting element module using a light emitting device in which a light emitting element is mounted on the light emitting element mounting substrate of the present invention will be described.
4A to 4C are plan views schematically showing an example of a light emitting element module using the light emitting element mounting substrate of the present invention.
In the light emitting element module 401 shown in FIG. 4A, a plurality of openings are formed in the light emitting element mounting substrate 1, and the gold plating layer 82 which is the outermost surface of the mounting pad is exposed from each opening. In addition, the light emitting elements 110 are respectively mounted thereon.
Although not shown, the light emitting element 110 is sealed with a protective resin.
That is, the light emitting device 100 includes a plurality of light emitting elements 110, and the light emitting element module 401 includes the light emitting device 100 on which a plurality of light emitting elements 110 are mounted.
In the light emitting element module 402 shown in FIG. 4B, one light emitting element 110 is mounted on the light emitting element mounting substrate 1 having one opening to form the light emitting device 100. A plurality of light emitting devices 100 each having one light emitting element 110 mounted on the light emitting element mounting substrate 1 are arranged in a row to form a light emitting element module 402.
In the light-emitting element module 403 shown in FIG. 4C, a plurality of light-emitting devices 100 each having one light-emitting element 110 mounted on the light-emitting element mounting substrate 1 are arranged in a lattice pattern, as in FIG. Yes.
As shown in FIGS. 4A to 4C, the light emitting element 110 is modularized using the light emitting element mounting substrate 1, whereby the density of the light emitting elements 110 can be increased and the luminance can be improved. be able to.
Among these, a light emitting element including a light emitting device 100 in which a plurality of openings 40 are formed in the light emitting element mounting substrate 1 and a plurality of light emitting elements 110 are mounted, as shown in FIG. Module 401 is preferred.

Such light emitting element modules 401, 402, and 403 can be suitably used for, for example, a backlight of a liquid crystal display panel, a lighting device, and the like.

Next, an example of a method for producing the light emitting element mounting substrate of the present invention will be described with reference to the drawings.

(1) Double-sided conductor board preparation process FIG. 5 is a diagram schematically showing the double-sided conductor board preparation process.
First, as shown in FIG. 5, the first main surface 11 of the substrate 2 made of an insulating resin and provided with a first main surface 11 and a second main surface 12 opposite to the first main surface 11. A double-sided conductor substrate 5 having a first conductor layer 21 formed thereon and a second conductor layer 31 formed on the second main surface 12 is prepared.
Since the materials constituting the base material 2, the first conductor layer 21, and the second conductor layer 31 are the same as those described in the description of the light emitting element mounting substrate, the description thereof is omitted.

(2) Hole Formation Process FIG. 6 is a diagram schematically showing the hole formation process.
Next, as shown in FIG. 6, a hole 50 penetrating the first conductor layer 21, the base material 2, and the second conductor layer 31 is formed. At this time, the first conductor layer 21 is formed with the fitting inlet 22 which is the inlet of the hole 50.
A method for forming the hole 50 is not particularly limited, and a press, a drill, a laser, or the like can be used.

(3) Insertion Process FIGS. 7A and 7B are diagrams schematically showing the insertion process.
Next, as shown in FIG. 7A, the metal block 60 is inserted into the hole 50.
The metal block 60 is preferably inserted into the hole 50 from the insertion opening 22 on the first conductor layer 21 side.
When the metal block 60 is inserted into the hole 50, as shown in FIG. 7B, the first conductor layer 21, the base material 2, and the second conductor layer 31 are attached to the metal block 60 as the metal block 60 is inserted. It may be pulled and depressed.
Therefore, a gap is likely to be generated between the inner periphery 23 of the insertion port 22 of the metal block 60 formed in the first conductor layer 21 and the outer periphery 61 of the metal block 60.
It is preferable to fill this gap in the subsequent metal plating step.

In the above (2) hole forming step and (3) insertion step, it is preferable to form a plurality of holes 50 and insert a plurality of metal blocks 60 therein.
By using metal blocks having the same dimension (height), the coplanarity of the imaginary plane formed by the first main surface side end surface of the metal block is a flat surface controlled within a predetermined range. It is preferable to do.
Moreover, it is preferable to perform said (3) insertion process simultaneously with forming the hole 50 in said (2) hole formation process.
In such a method, the hole 50 can be formed by one operation, and the metal block 60 can be inserted into the hole 50. Therefore, the light emitting element mounting substrate can be efficiently manufactured.

(4) Pattern formation process Next, pattern formation is performed.
8A to 8C are diagrams schematically showing an example of the pattern forming process.
As shown in FIG. 8A, an etching resist 91 is formed on the first conductor layer 21, the metal block 60, and the second conductor layer 31.
Next, as shown in FIG. 8B, the portions of the first conductor layer 21 and the second conductor layer 31 where the etching resist 91 is not formed are removed by etching.
Thereafter, the etching resist 91 is removed as shown in FIG. An arbitrary pattern can be formed by such a method.
Examples of the etchant include sulfuric acid-hydrogen peroxide aqueous solution, persulfate aqueous solution such as ammonium persulfate, ferric chloride, cupric chloride, hydrochloric acid and the like. Moreover, you may use the mixed solution containing a cupric complex and an organic acid as etching liquid.

(5) Pressing Process FIG. 9 is a diagram schematically showing the pressing process.
Next, as shown in FIG. 9, the metal on the surface 25 of the first conductor layer 21 is pressed by pressing the double-sided conductor substrate 5 on which the metal block 60 is inserted using a mold 92 having a predetermined shape. The position of the surface of the block 60 (first main surface side end surface 65 of the metal block) is controlled.

(6) Coining Step Next, coining is performed to improve the flatness of the surface 25 of the first conductor layer 21 and the first main surface side end surface 65 of the metal block 60.
When the flatness of the surface 25 of the first conductor layer 21 and the first main surface side end surface 65 of the metal block is increased by coining, the mountability of the light emitting element can be improved. Furthermore, when the flatness of the surface 25 of the first conductor layer 21 and the first main surface side end surface 65 of the metal block 60 is high, the optical axes of the light emitting elements are aligned, and the luminance can be increased.
Moreover, the position of the main surface side end surface 65 of the metal block 60 can be controlled by coining.
Coining is a method for improving the flatness of a portion to which pressure is applied by causing internal plastic deformation by partially applying pressure.
It is preferable that the coplanarity of the imaginary plane formed by the end face on the first main surface side of the metal block is a flat surface controlled within a predetermined range by the pressing step and the coining step.

(7) Metal Plating Process FIG. 10 is a diagram schematically showing a metal plating process.
Next, as shown in FIG. 10, a metal plating step for forming a metal plating layer 70 on the surface of the first conductor layer 21 is performed.
When the metal plating layer 70 is formed, the surface of the first conductor layer 21 is protected by the metal plating layer 70, and the first conductor layer 21 can be protected from corrosion.

In the metal plating step, it is preferable to perform metal plating using at least one metal selected from the group consisting of nickel and silver.
When the gold plating layer is formed in a later step by using the metal plating layer as the nickel plating layer, the connectivity between the first conductor layer and the gold plating layer can be improved by the nickel plating layer.

Further, in the metal plating step, the metal block 60 is formed on the outer periphery 61 of the metal block 60 and the first conductor layer 21 so as to cover the first main surface side end face 65 of the metal block 60 and the surface 25 of the first conductor layer 21. It is preferable to form the metal plating layer 70 so as to connect the inner periphery 23 of the fitting opening 22 of the metal block 60 formed.

When the metal plating layer 70 is formed so as to cover the first main surface side end face 65 of the metal block 60 and the surface 25 of the first conductor layer 21, the metal plating layer 70 fixes the metal block 60, and the metal block 60 has holes. 50 can be made difficult to jump out.
Further, as described in the description of the insertion process, a gap may be generated between the inner periphery 23 of the fitting inlet 22 of the metal block 60 formed in the first conductor layer 21 and the outer periphery 61 of the metal block 60. is there.
Therefore, when the metal plating layer 70 is formed so as to connect the outer periphery 61 of the metal block 60 and the inner periphery 23 of the insertion opening 22 of the metal block 60 formed in the first conductor layer 21, the metal block 60 and the first conductor layer are formed. 21 can be securely connected to the metal plating layer 70. Therefore, it is possible to prevent energization from being stopped due to poor contact.

(8) Gold plating process FIG. 11 is a diagram schematically showing the gold plating process.
Next, a gold plating layer 82 is formed on the metal plating layer 70 at a position corresponding to the first main surface side end surface 65 of the metal block 60 to obtain a mounting pad having a gold layer formed on the outermost surface.

When the metal plating layer 70 is formed using nickel in the metal plating step, an oxide film is formed on the surface of the metal plating layer 70, and the electrical connection between the mounting pad and the electrode of the light emitting element tends to be deteriorated. .
Therefore, by using a mounting pad having a gold layer formed on the outermost surface, connectivity with the electrode of the light emitting element is improved.

The removal of the nickel oxide film can be carried out using a commonly used nickel oxide film remover. A conventionally known reagent can be used as the nickel oxide film removing agent.
The gold plating is preferably performed using an electroless gold plating solution.

(9) Reflective Layer Forming Step FIGS. 12A and 12B are diagrams schematically showing an example of the reflective layer forming step.
As shown in FIG. 12A, the reflective layer 51 is formed so as to cover the first conductor layer (in the drawing, the metal plating layer 70 on the first conductor layer 21).
The material of the reflective layer is preferably an insulating layer containing titanium oxide as a pigment, and more preferably a solder resist layer containing titanium oxide in the pigment. When the reflective layer is a solder resist layer, the reflective layer can be formed by a known method for forming a solder resist layer.
FIG. 12A shows a reflective layer 51 as a solder resist layer.
Next, as shown in FIG. 12B, an opening 40 is formed.
As a method for forming the opening, an opening forming method using a laser can be used. When the reflection layer is burned out using a laser to form the opening 40, the laser irradiation range and the number of pulses are adjusted so that the wall surface 42 of the opening 40 is outside the first main surface side of the substrate. A taper can be formed so that the opening area becomes larger toward.
Moreover, the reflective layer in which the opening is formed can also be formed by a printing method in which a portion where the opening is formed is masked and ink (resist) to be the reflective layer is printed.
In this case, the taper can be formed by adjusting the viscosity of the ink.

By such a method, it is possible to form a reflective layer that has an opening in the region where the light emitting element is mounted and covers the first conductor layer.
In addition, it is preferable to determine the thickness of the reflective layer so that the thickness of the reflective layer is 2 to 10 times the thickness of the light emitting element to be mounted.
Moreover, you may form the layer which consists of titanium oxide or aluminum as a reflecting material in the wall surface of an opening part.
The light emitting element mounting substrate of this invention can be manufactured according to the said process.

The light emitting device manufacturing method of the present invention is a method of manufacturing the light emitting device of the present invention, wherein after the light emitting element is mounted on the light emitting element mounting substrate, the reflection layer covering the first conductor layer is used as the dam. The opening is sealed with a light-transmitting protective resin so that the element is completely buried in the resin.

The light-emitting element 110 is mounted on the light-emitting element mounting substrate 1, and the opening is made of a light-transmitting protective resin so that the light-emitting element 110 is completely buried in the resin by using the reflective layer 51 covering the first conductor layer as a dam The light emitting device 100 of the present invention as shown in FIG. 2 can be manufactured by filling and sealing the opening 40.
When the light emitting element is mounted on the light emitting element mounting substrate, it is preferable that the outermost surface of the mounting pad and the outermost surface of the electrode of the light emitting element are rubbed with each other by ultrasonic waves to form a new surface.
In the light emitting device 100 shown in FIG. 2, the outermost gold layer (gold plating layer 82) of the mounting pad and the outermost gold layer of the electrode 111 of the light emitting element 110 are rubbed together by ultrasonic waves to form a new surface. Has been.
By such connection, a eutectic connection can be formed between the outermost surface of the mounting pad and the outermost surface of the electrode of the light emitting element, and the light emitting element and the light emitting element mounting substrate can be connected.
When the opening is filled with a light-transmitting protective resin, the opening is sealed by pouring a liquid resin so that the light emitting element is completely buried in the resin using the reflective layer as a dam.
By using the dam as the reflective layer, the resin is prevented from flowing out of the opening, and the liquid resin stays around the light emitting element. Therefore, workability at the time of forming the protective resin can be improved.

As the protective resin, those obtained by dispersing a phosphor in the protective resin can be used. By using such a protective resin, the opening can be filled with the protective resin in which the phosphor is dispersed.
Moreover, after sealing an opening part with protective resin, the process of supplying fluorescent substance from the protective resin sealed to the opening part may be further performed, and a fluorescent substance layer may be formed on protective resin.
Through the above process, the light-emitting device of the present invention can be manufactured.

In the light emitting element mounting substrate of the present invention, it is preferable that a gold layer or a tin layer is formed on the outermost surface of the mounting pad formed of the end surface on the first main surface side of the metal block.
In the light emitting device of the present invention, a gold layer or a tin layer is formed on the outermost surface of the mounting pad formed of the end surface on the first main surface side of the metal block, and the outermost surface of the electrode of the light emitting element is gold. It is preferable that the gold layer or tin layer on the outermost surface of the electrode of the light emitting element is electrically connected to the gold layer or tin layer on the outermost surface of the mounting pad.
Although the case where the gold layer is formed on the outermost surface of the mounting pad and the outermost surface of the electrode of the light emitting element is the gold layer has already been described, other examples of combinations will be described below.

FIG. 13 is a cross-sectional view schematically showing another example of the light emitting device of the present invention.
A light emitting device 200 shown in FIG. 13 includes the light emitting element mounting substrate 1 shown in FIG. 1, and the outermost surface of the electrode 112 of the light emitting element 110 is a tin layer.
In the light emitting element mounting substrate 1, since the gold plating layer 82 is formed on the outermost surface of the mounting pad, the gold plating layer 82 and the tin layer of the electrode 112 of the light emitting element 110 are electrically connected.
The connection between the gold layer and the tin layer is preferably made by bringing the gold layer on the outermost surface of the mounting pad and the tin layer on the outermost surface of the electrode of the light emitting element into contact with each other with an ultrasonic wave so as to bring out a new surface.

FIG. 14 is a cross-sectional view schematically showing another example of the light emitting device of the present invention.
A light emitting device 300 shown in FIG. 14 includes a light emitting element mounting substrate 101 different from the light emitting element mounting substrate 1 shown in FIG.
In the light emitting element mounting substrate 101, the nickel plating layer as the metal plating layer 70 in FIG. 1 is not formed, and the tin layer 72 is formed on the outermost surface of the mounting pad composed of the first main surface side end surface 65 of the metal block 60. Is formed.
The tin layer 72 is formed on the first main surface side end face 65 of the metal block 60 and the surface 25 of the first conductor layer 21, and the metal block 60 formed on the outer periphery 61 of the metal block 60 and the first conductor layer 21. It is formed so as to connect with the inner periphery 23 of the insertion opening 22.
The outermost surface of the electrode 111 of the light emitting element 110 is a gold layer.
Therefore, the outermost tin layer 72 of the mounting pad and the gold layer of the electrode 111 of the light emitting element 110 are electrically connected.
The connection between the tin layer and the gold layer is preferably made by bringing the tin layer on the outermost surface of the mounting pad and the gold layer on the outermost surface of the electrode of the light emitting element into contact with each other by an ultrasonic wave so as to bring out a new surface.

Since the connection between the gold layer and the tin layer and the connection between the tin layer and the gold layer in the light emitting device shown in FIGS. 13 and 14 are higher in heat resistance than the connection using a low melting point metal such as solder, the heat generation amount is large. It is suitable as a connection when a light emitting element is mounted.

DESCRIPTION OF SYMBOLS 1,101 Light emitting element mounting board | substrate 2 Base material 5 Double-sided conductor board 7 Cover 11 1st main surface 12 2nd main surface 21 1st conductor layer 22 Insertion opening 23 Inner periphery 25 The surface of 1st conductor layer 31 Second conductor layer 40 Opening 42 Opening wall surface 50 Hole 51 Reflective layer 60 Metal block 61 Perimeter of metal block 65 First main surface side end surface 70 of metal block Metal plating layer 72 Tin layer 82 Gold plating layer 91 Etching Resist 92 Mold 100, 200, 300 Light-emitting device 110 Light-emitting element 111 Light-emitting element electrode (the outermost surface is a gold layer)
112 Light-emitting element electrode (the outermost surface is a tin layer)
120 Protective resin 401, 402, 403 Light emitting element module

Claims (21)

A light-emitting element mounting substrate on which a light-emitting element is mounted,
A base material comprising an insulating resin and comprising a first main surface and a second main surface opposite to the first main surface;
A first conductor layer formed on the first main surface of the substrate;
A second conductor layer formed on the second main surface of the substrate;
A metal block penetrating the first conductor layer, the base material and the second conductor layer;
Having an opening in a region where the light emitting element is mounted, and having a reflective layer covering the first conductor layer;
The light emitting element mounting substrate, wherein the first main surface side end face of the metal block is a mounting pad of the light emitting element. A plurality of first main surface side end surfaces of the metal block are present on the same substrate surface, and a flat surface having a coplanarity of 3 to 20 μm in a virtual plane formed by the first main surface side end surface is formed. The light emitting element mounting substrate according to claim 1. The light emitting element mounting substrate according to claim 1, wherein a taper is formed on a wall surface of the opening so that an opening area increases from the first main surface side to the outside of the base material. The light emitting element mounting substrate according to any one of claims 1 to 3, wherein a metal plating layer is formed on an end surface on the first main surface side of the metal block and a surface of the first conductor layer. The metal plating layer is formed on the first main surface side end face of the metal block and the surface of the first conductor layer, and the outer periphery of the metal block and the inner periphery of the fitting opening of the metal block formed in the first conductor layer. The light emitting element mounting substrate according to claim 4, wherein the light emitting element mounting substrate is formed so as to be connected to each other. The light emitting element mounting substrate according to any one of claims 1 to 5, wherein a gold layer or a tin layer is formed on an outermost surface of a mounting pad formed of an end surface on the first main surface side of the metal block. The light emitting element mounting substrate according to claim 1, wherein a thickness of the reflective layer is 2 to 10 times a thickness of the light emitting element. The light-emitting element mounting substrate according to claim 1, wherein the insulating resin is polyimide. The light emitting element mounting substrate according to claim 1, wherein a layer made of titanium oxide or aluminum as a reflecting material is formed on a wall surface of the opening. A light emitting device in which a light emitting element is mounted on a light emitting element mounting substrate,
A base material comprising an insulating resin and comprising a first main surface and a second main surface opposite to the first main surface;
A first conductor layer formed on the first main surface of the substrate;
A second conductor layer formed on the second main surface of the substrate;
A metal block penetrating the first conductor layer, the base material and the second conductor layer;
A reflection layer having an opening in a region where the light emitting element is mounted and covering the first conductor layer;
A light-emitting element that is electrically connected to a mounting pad formed of the first main surface side end face of the metal block and is mounted in the opening;
A light-emitting device comprising: a light-transmitting protective resin that seals the light-emitting element. A plurality of first main surface side end surfaces of the metal block are present in the same substrate surface, and a flat surface having a coplanarity of 3 to 20 μm of a virtual plane formed by the first main surface side end surface is formed. The light-emitting device according to claim 10. The light emitting device according to claim 10 or 11, wherein a taper is formed on the wall surface of the opening so that the opening area increases from the first main surface side to the outside of the base material. The light emitting device according to any one of claims 10 to 12, wherein a metal plating layer is formed on an end surface on the first main surface side of the metal block and a surface of the first conductor layer. The metal plating layer is formed on the first main surface side end face of the metal block and the surface of the first conductor layer, and the outer periphery of the metal block and the inner periphery of the fitting opening of the metal block formed in the first conductor layer. The light emitting device according to claim 13, wherein the light emitting device is formed so as to be connected to each other. A gold layer or a tin layer is formed on the outermost surface of the mounting pad consisting of the end surface on the first main surface side of the metal block, and the outermost surface of the electrode of the light emitting element is a gold layer or a tin layer. The light emitting device according to any one of claims 10 to 14, wherein an outermost gold layer or tin layer of an electrode of a light emitting element is electrically connected to the outermost gold layer or tin layer. The light emitting device according to claim 10, wherein a phosphor layer is formed on the protective resin, or a phosphor is dispersed in the protective resin. The light emitting device according to claim 10, wherein the insulating resin is polyimide. The light emitting device according to claim 10, wherein a layer made of titanium oxide or aluminum as a reflecting material is formed on a wall surface of the opening. A method for manufacturing the light emitting device according to claim 10,
After mounting the light-emitting element on the light-emitting element mounting substrate, the reflective layer covering the first conductor layer is used as a dam, and the opening is filled with a light-transmitting protective resin so that the light-emitting element is completely buried in the resin. A method of manufacturing a light emitting device, wherein the opening is sealed. The method for manufacturing a light emitting device according to claim 19, further comprising a step of supplying a phosphor from above the protective resin sealed in the opening. The method for manufacturing a light-emitting device according to claim 19, wherein the protective resin is made by dispersing a phosphor in the protective resin.

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