JP2010040802A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device having improved heat dissipation that is used as a strobe flash light source. <P>SOLUTION: The light-emitting device includes: a circuit board 24 having a pair of electrodes 22, 23 on an insulating substrate 21; at least one LED element 25 mounted on the circuit board 24; a sealing resin layer 27 for sealing the LED element 25 with resin; a pair of heat storage layers 28, 29 that abuts on portions of the pair of electrodes 22, 23 around the outer periphery of the sealing resin layer 27 and takes in heat generated from the LED element 25 for accumulation; and a transmitting cover 31 in a cap shape having an optical lens 31d. An LED element emitting blue light is used for the LED element 25, and the sealing resin layer 27 contains a YAG-based phosphor. Also, the heat storage layers 28, 29 are formed by solder. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention is based on LED (Light emitting
In particular, the present invention relates to a light emitting device used as a flash light source of a strobe.

Conventionally, many heat dissipation structures for suppressing the heat generation of LEDs have been proposed. For example, in Patent Document 1, as shown in FIG. 10, a through-hole 2 a is provided in a substantially central portion of an insulating circuit board 2 made of glass epoxy resin, and a high heat dissipation member 5 is provided there. The LED chip 6 is mounted on the high heat dissipation member 5.
The heat generated by the LED chip 6 is transmitted to the high heat radiating member 5 and is released to the printed circuit board 8 side.

Further, in Patent Document 2, as shown in FIG. 11, a pair of metal substrates 12 having a thermal conductivity of 50 W / m · K or more are provided across the insulating member 13 of the slit 12c, and bumps are provided on the upper surface 12a. The LED element 16 is flip-chip mounted, and a structure in which an underfill resin 17 is provided between the gap between the LED element 16 and the metal substrate 12 is shown.
The heat generated by the LED element 16 is transmitted to the metal substrate 12 to be radiated to the outside from the metal substrate 12 and the heat is also released from the pair of metal substrates 12 to the printed circuit board side.

JP 2005-64047 A JP 2003-218398 A

  In the structure described in Patent Document 1 described above, it is difficult to expand the heat dissipation surface area of the high heat dissipation member due to the limitation of the outer diameter size of the LED, and further improvement of heat dissipation characteristics at the time of high current pulse lighting There is a limit.

  The structure disclosed in Patent Document 2 is a structure using a metal substrate, and the structure using a metal substrate is suitable for high luminance and high output applications because of its excellent heat dissipation characteristics. However, this structure inevitably increases the material cost because a metal is used for the substrate. In addition, since a process of filling the slit portion with an insulating member is required, there is a problem that the manufacturing process increases and the manufacturing cost increases.

  The present invention has been made in view of the above-described problems, and the object of the present invention is to provide a light-emitting device that can suppress heat generation during high-current pulse lighting, obtain high brightness, and can be manufactured at low cost. Is to get.

  As a means for solving the problems, the light-emitting device according to claim 1 of the present invention is a light-emitting device using an LED element, and the light-emitting device is provided with a pair of electrodes on an insulating substrate. A circuit board; an LED element having at least one mounted on the circuit board; a sealing resin layer in which the LED element is sealed with a resin; and the pair of electrodes around the outer periphery of the sealing resin layer. It has a heat storage layer that takes in heat generated from the LED element by being in contact with each part and temporarily stores the heat.

When an LED element is used as a flash light source for a stroboscope for photography, pulse lighting is performed under application of a high current to output high luminance. However, since the amount of heat generated from the LED element at this time is large, the light emission efficiency is lowered by heat, and the luminance is not so high. Therefore, it is necessary to actively reduce the heat generated from the LED element.
Under the configuration of the first aspect of the present invention, the heat generated from the LED element is transmitted to the pair of electrodes, and is transmitted to the heat storage layer in contact with the pair of electrodes, and the heat storage layer is also heated. Is accumulated. Since the heat storage layer is provided around the sealing resin layer, that is, at the closest position of the LED element, the heat generated from the LED element is continuously transmitted to the heat storage layer in a short time. That is, heat can escape from the LED element quickly and heat generation of the LED element can be suppressed to a low level.

  The light emitting device according to claim 2 of the present invention is a light emitting device using an LED element, wherein the light emitting device includes a circuit board provided with a pair of electrodes on an insulating substrate, and the circuit board. An LED element on which at least one LED is mounted; a sealing resin layer in which the LED element is sealed with a resin; a base board on which a circuit board is mounted by providing a pair of electrodes on an insulating base; and the circuit A heat storage layer that is around the outer periphery of the substrate and contacts each of the pair of electrodes of the circuit board and a part of the pair of electrodes of the pedestal substrate to take in heat generated from the LED element and temporarily store the heat; It is characterized by having.

Under the above configuration, the heat storage layer is provided around the outer periphery of the circuit board. The larger the volume of the heat storage layer, the greater the amount of heat that can be stored, which is preferable. The heat storage layer provided around the outer periphery of the circuit board can be formed with a desired volume without being limited by the size of the circuit board. That is, the heat storage layer can be formed with a volume sufficient to store heat generated from the LED element.
And the heat_generation | fever amount from a LED element can fully be taken in, and the heat_generation | fever of an LED element can be suppressed low.

  The light emitting device according to claim 3 of the present invention is characterized in that the light emitting device has a cap-shaped transparent cover provided with an optical lens.

  The light from the LED element is condensed by the optical lens of the cover to illuminate the subject to be photographed brightly. Moreover, the sealing resin layer and the heat storage layer are protected by having the cover, and effects such as damage prevention and alteration prevention can be obtained. In addition, the light emitting device can be combined into a compact shape.

  Further, the light emitting device according to claim 4 of the present invention is characterized in that the cap shape of the cover is composed of a head portion and a cylindrical portion, the optical lens is provided on the head portion, and the sealing resin layer The heat storage layer is disposed inside the cylindrical portion, and has a gap between the sealing resin layer and the heat storage layer and the cover.

Under this configuration, since the sealing resin layer and the heat storage layer are disposed inside the cylindrical portion of the cover and have a gap, the heat accumulated in the heat storage layer is in the cover because there is a gap, that is, an air layer. It is hardly transmitted. In addition, although heat is accumulated in the sealing resin layer, the heat is hardly transmitted to the cover because there is a gap. For this reason, the optical lens provided at the head of the cover can maintain the initial quality such as the lens shape without being affected by heat or the like.
In addition, since there is an air layer that forms a gap, the light emitted from the LED element is refracted and dispersion due to refraction occurs. For example, when the configurations described in claims 8 and 9 are adopted, the mixture of light having different emission colors is well mixed by the dispersion action.

  The light emitting device according to claim 5 of the present invention is characterized in that a reflective film is provided on the inner peripheral surface of the cylindrical portion of the cover.

  Under this configuration, light directed from the LED element toward the inner peripheral surface of the cylindrical portion of the cover is reflected by the reflective film. And it returns to the inside of a cylinder part or advances toward the optical lens side. For this reason, the amount of light passing through the optical lens increases. The light utilization efficiency is increased and the brightness is further increased.

  The light emitting device according to claim 6 of the present invention is characterized in that the optical lens of the cover is a Fresnel lens.

  Light passing through the Fresnel lens is converted into parallel light. For this reason, the amount of light incident on the subject is increased with less dispersed light, and a brighter illumination is obtained.

  The light emitting device according to claim 7 of the present invention is characterized in that the heat storage layer is made of solder.

  Although the thermal conductivity of the solder is lower than that of the electrode material, it conducts heat well. Moreover, since it melt | dissolves at low temperature, formation of a thermal storage layer is easy. Furthermore, since the adhesiveness with the electrode is good, peeling does not occur. It can be suitably applied as a material for the heat storage layer.

  Further, the light emitting device according to claim 8 of the present invention is characterized in that the LED element is a blue light emitting LED element, and the sealing resin layer is composed of a silicone resin containing a YAG phosphor. It is characterized by.

  White light is required for a strobe light source for photography. By using a blue light emitting LED element and containing a YAG phosphor in the sealing resin layer, white light can be obtained although it contains a slight blue component. In addition, the silicone resin used for the sealing resin layer does not deteriorate to ultraviolet rays or visible light, and has excellent light resistance. Moreover, since it is excellent also in moisture resistance, initial quality can be maintained over a long period of time. It is also soft and has excellent impact resistance.

  The light emitting device according to claim 9 of the present invention is characterized in that the LED element is a blue light emitting LED element and a red light emitting LED element, and the sealing resin layer is made of a silicone resin and a YAG phosphor. It consists of what was contained.

  When a red light emitting LED element is disposed in addition to a blue light emitting LED element, the blue component disappears and white light with high whiteness is obtained. Then, the color rendering properties and color reproducibility are improved, and the picture quality is improved.

  Further, the light emitting device according to claim 10 of the present invention is characterized in that the light emitting device according to any one of claims 1 to 9 is in contact with a pair of pin contacts provided on the housing side, and current is supplied from the pin contacts. It is characterized by receiving the supply of

The above configuration is not a structure in which the light emitting device is directly fixed to the mother board but a structure in which the light emitting device is conductively connected through a pin contact. By passing through an intermediate member such as a pin contact, heat is conducted to the intermediate member, so that heat is released quickly. In addition, the influence of heat on the motherboard on which various electronic components are mounted can be minimized.
In addition, the structure in which the conductive connection is made via the pin contact enables the light emitting device to be mounted in a narrow space, and thus is a preferable mounting structure in a casing having a high density of components.

  As described above, the functions and effects of each invention have been described in detail. To sum up, it is possible to suppress heat generation during high-current pulse lighting and to obtain bright illumination with high brightness. Further, since the heat storage layer is simply provided on the circuit board or around the outer periphery of the circuit board, the structure is not complicated and the heat storage layer can be easily formed, so that the manufacturing cost can be reduced.

(First embodiment)
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. First, the light emitting device according to the first embodiment will be described with reference to FIGS. 1 is a cross-sectional view of a main part of the light emitting device according to the first embodiment of the present invention, FIG. 2 is a plan view when the cover of the light emitting device in FIG. 1 is removed, and FIG. 3 is a circuit in FIG. A perspective view of a substrate is shown. 4 is an explanatory diagram for explaining the operation and effect of the heat storage layer in FIG. 1. FIG. 4 (a) is a pulse waveform diagram to be applied, and FIG. 4 (b) is a schematic diagram showing fluctuations in the heating temperature of the LED element. The fluctuation curve figure shown automatically is shown.

The light-emitting device using the LED element of the present invention is a light-emitting device used as a flash light source for a photographic strobe mounted on a camera or the like. Since photography requires very bright illumination, a high-luminance light source is used. When an LED element is used as a flash light source of a strobe, a very high pulse current is passed to output a high luminance. For example, pulse lighting is performed for 1 to 1000 ms at a current 5 to 50 times the rated current during normal continuous lighting.
At this time, the amount of heat generated by the LED element becomes large, the light emission efficiency is lowered, and the luminance is lowered. Therefore, in order to obtain a required luminance, it is necessary to actively dissipate heat to suppress the heat generation amount.
The light emitting device of the first embodiment has a configuration applicable to a flash light source of a strobe, and the configuration will be described below.

In FIG. 1, reference numeral 21 denotes a substrate, and the substrate 21 is made of an insulating glass epoxy resin, a resin such as BT resin, or a ceramic.
22 and 23 are a pair of electrodes, 22 is an anode side electrode, and 23 is a cathode side electrode. The electrode 22 on the anode side is provided from the upper surface to the lower surface of the substrate 21 so as to be connected to the upper surface portion 22a, the side surface portion 22b (through hole surface), and the lower surface portion 22c, and the electrode 22 is configured by the connected electrodes. . Similarly, the cathode-side electrode 23 is connected to the upper surface portion 23a, the side surface portion 23b (through hole surface), and the lower surface portion 23c to form the electrode 23. In the present invention, a substrate 21 having a pair of electrodes 22 and 23 formed thereon is represented as a circuit board 24.

The material of the pair of electrodes 22 and 23 is selected from materials having low electrical resistivity and excellent electrical conductivity, and high thermal conductivity and excellent thermal conductivity. Examples of the material having both characteristics include metal materials such as Cu, Al, Ag, and Au metal, and at least one of these metal materials is used to form an electrode in a single layer or a return layer. In the present embodiment, Ni plating is performed on a Cu metal film, and an Au metal film is formed thereon by Au plating.
Furthermore, the formation area of the pair of electrodes 22 and 23 is designed to be large in order to actively dissipate the heat generated by the LED element. For example, as shown in FIG. 3, the upper surface portions 22a and 23a, the side surface portions 22b and 23b, the lower surface portion 22c (not shown in FIG. 3) of the pair of electrodes 22 and 23, and the width w of the 23c can be allowed. Is taking a big. Then, heat is diffused and transmitted over a wide area so that heat is actively dissipated.

Reference numeral 25 denotes an LED element. In the first embodiment, an LED element made of InGaN, which is a gallium nitride-based compound, is used, and blue light emitting short wavelength light is emitted. The LED element 25 is placed on the upper surface portion 23a of the cathode-side electrode 23 and fixed through soldering or the like.
The LED element 25 is connected to the upper surface portion 22a of the anode-side electrode 22 by a bonding wire 26 made of a gold wire.

Reference numeral 27 denotes a sealing resin layer. In the first embodiment, the sealing resin layer 27 is made of a silicone resin blended with a YAG phosphor at a ratio of 5 to 60% by weight. The YAG-based phosphor uses a phosphor having a chemical formula of Y ₃ AL ₅ O ₁₂ : Ce, and is excited by the short wavelength light of the LED element 25 to be wavelength-converted to emit a yellow emission color.
Then, the yellow emission color and the blue emission color from the LED 25 are mixed, and white light is emitted from the sealing resin layer 27.

  28 and 29 are heat storage layers. The heat storage layers 28 and 29 are a pair, the heat storage layer 28 is a heat storage layer provided on the upper surface portion 22 a of the electrode 22, and the heat storage layer 29 is a heat storage layer provided on the upper surface portion 23 a of the electrode 23. The heat storage layer 28 and the heat storage layer 29 are paired. The heat storage layer 28 is in contact with the electrode 22 and functions to temporarily store the heat conducted to the electrode 22. The heat storage layer 29 is in contact with the electrode 23 and functions to temporarily store the heat conducted to the electrode 23. Further, the heat storage layer 28 and the heat storage layer 29 (shown by hatching in FIG. 2 for the sake of clarity) are provided separately by providing a necessary gap so as not to contact each other. This is because the heat storage layers 28 and 29 are formed of conductive solder as will be described later, so that conduction between the heat storage layer 28 and the heat storage layer 29 is avoided. The pair of heat storage layers 28 and 29 are provided around the outer periphery of the sealing resin layer 27.

The heat storage layers 28 and 29 are formed with solder in the first embodiment. Solder is an alloy mainly composed of tin (Sn) and lead (Pb), and the thermal conductivity (depending on the ratio of Sn and Pb, the thermal conductivity is approximately 40 to 50 W / m · K) is a pair of electrodes. Although it is lower than 22 and 23, it conducts heat well. Solder is well bonded to the electrodes 22 and 23 made of a metal film, and is not bonded to resin.
Since the solder dissolves at a low temperature, the heat storage layers 28 and 29 can be easily formed by adhering to the electrodes 22 and 23 in a dissolved state and then curing.

The heat storage layers 28 and 29 are provided for the purpose of taking heat generated from the LED elements 25 and temporarily storing the heat. That is, it is provided for the purpose of serving as a buffer.
The larger the volume of the heat storage layers 28 and 29, the more heat is accumulated. Therefore, it is preferable that the heat storage layers 28 and 29 have a large area and a larger thickness. Therefore, the areas of the upper surface portions 22a and 23a of the pair of electrodes 22 and 23 are set large as shown in FIG. 3, and the heat storage layers 28 and 29 are formed thereon. However, as the thickness increases, the thickness of the light emitting element 20 is affected. Therefore, it is preferable to set an allowable range value that does not affect the thickness of the light emitting element 20.

  Reference numeral 30 denotes a resist film. The resist film 30 has a purpose of preventing the solder forming the heat storage layer from flowing into the side surface portions 22b and 23b of the pair of electrodes 22 and 23 provided in the through holes, and a surface of the cover 31 which will be described later with a flat surface at this portion. It is provided to improve the calm state. A masking tape or the like is used for the resist film 30.

Here, the operation and effect when the heat storage layers 28 and 29 are provided will be described with reference to FIG. In FIG. 4A, the vertical axis represents the current value (mA) in the applied pulse forward direction, the horizontal axis represents time (t), W represents the current waveform, and tm represents the application time.
In the case of performing pulse lighting, a current that is 5 to 50 times higher than the rated current for performing normal continuous lighting of the LED element is applied. For example, if the normal rated current is 20 mA, the applied current value is 100 mA at 5 times and 1 A at 50 times.
Further, the application time tm is appropriately set in the range of 1 to 1000 ms with relation to the applied current value. For example, the application time can be set to be long when the applied current value is low, and the application time can be set to be short when the applied current value is high.
Next, in FIG. 4B, the vertical axis indicates the heat generation temperature (° C), the horizontal axis indicates time (t), and A indicated by the solid line indicates the heat generation of the LED element when the heat storage layer is provided. A temperature variation curve, B indicated by a chain line, indicates a variation curve of the heat generation temperature of the LED element when no heat storage layer is provided. Both are schematically shown.

In FIG. 4B, when the B heat storage layer indicated by the chain line is not provided, when the pulse current is applied at the time t1, the heat generation temperature rises rapidly, and the rising curve gradually becomes gentle. This is presumed that the rising curve becomes gentle as heat begins to be conducted to the pair of electrodes and heat is released. When the application time tm ends, the curve enters a descending state and the temperature decreases.
On the other hand, when the A heat storage layer indicated by the solid line is provided, a rapid temperature rise is initially observed, but the rise also reaches a peak in the middle and enters a lowered state during the application time tm. And even if the application time tm is over, it continues to fall and returns to the temperature before application within a relatively short time. The temperature rise curve until heat begins to be conducted to the pair of electrodes is the same as that of B, but after conducting to the pair of electrodes, the heat is conducted from the electrode to the heat storage layer to the heat storage layer. Since heat is continuously taken in, it is estimated that the temperature curve changes from the rising state to the falling state during the application time tm.
As can be seen from (b) of FIG. 4, the presence of the heat storage layer suppresses the heat generation temperature of the LED element by being in the vicinity of the LED element. Return to the original temperature.

From the above, the following can be said as the operation and effect of the present invention. The heat generated from the LED element 25 is transmitted to the upper surface portions 22a and 23a of the pair of electrodes 22 and 23 and is conducted from the upper surface portions 22a and 23a to the side surface portions 22b and 23b and the lower surface portions 22c and 23c and escapes. Further, the heat transmitted to the upper surface portions 22 a and 23 a is taken into the heat storage layers 28 and 29, and heat is accumulated in the heat storage layers 28 and 29.
The area of the pair of electrodes 22 and 23 is as large as possible as described above, and the volume of the heat storage layers 28 and 29 is set as large as possible. Moreover, it is provided around the sealing resin layer 27 located at a position closest to the LED element 25. Therefore, the heat generated from the LED element 25 is diffused and transmitted to the upper surface portions 22a and 23a of the pair of electrodes 22 and 23 having a large area at a high speed, and further, the heat storage layers 28 and 29 on the upper surface portions 22a and 23a. Heat is taken in at an earlier time, and heat is accumulated in the heat storage layers 28 and 29 to be stored.
That is, since the heat generated from the LED element 25 is continuously taken into the heat storage layers 28 and 29 at a high speed, an increase in heat in the LED element 25 is suppressed and a high light emission luminance can be obtained.

  The flash lighting of the camera is generally performed intermittently at irregular time intervals. The heat accumulated in the heat storage layers 28 and 29 is conducted to the electrodes 22 and 23 and dissipated in this intermittent time interval. And the heat accumulation of the heat storage layers 28 and 29 also disappears.

Next, 31 is a cover formed of acrylic resin or the like. The cover 31 has a cap shape and has a head portion 31a and a cylindrical portion 31b. An optical lens 31d is provided on the head portion 31a that faces the LED element 25. In the first embodiment, a Fresnel lens is formed to convert light passing through the optical lens 31d into parallel light.
The light passing through the Fresnel lens has less dispersed light and more parallel light. For this reason, a large amount of light becomes parallel light and is emitted toward the subject. Then, the amount of light hitting the subject increases and the illumination is brighter.

  The cover 31 is attached to the circuit board 24 by bonding and fixing the tip of the cylindrical part 31b to the outer peripheral edge of the circuit board 24 with a resin adhesive such as UV curable acrylic resin. The flat surface of the resist film 30 improves the settled state of the cover 31 and secures a strong adhesive fixing force.

  With the cover 31 attached, a gap (hollow part) 31c is provided between the cover 31 and the sealing resin layer 27 and the heat storage layers 28 and 29. By providing the gap 31c, the influence of heat from the sealing resin layer 27 and the heat storage layers 28 and 29 on the optical lens 31a is reduced. Although air exists in the gap 31c, the thermal conductivity of air is as small as 0.03 W / m · K. For this reason, the heat accumulated in the heat storage layers 28 and 29 is hardly transmitted to the cover 31. The optical lens 31a is not affected by heat and can retain the initial quality such as the lens shape. Further, since the gap 31c is provided, the light is refracted, the dispersed light is increased, and the light emission colors are mixed well.

  Reference numeral 101 denotes a pair of pin contacts. A pair of pin contacts 101 and the light emitting device 20 are brought into contact with each other to establish a conductive connection. Of the pair of pin contacts 101, a pulse forward current flows from one pin contact 101 to the anode-side electrode 22, and then flows to the LED element 25, and the LED element 25 is pulsed. In addition, a current flows from the LED element 25 to the cathode-side electrode 23, and a current flows to the other pin contact 101 in contact with the electrode 23.

The pin contact 101 in the first embodiment is a brass material plated with gold or the like, and has excellent conductivity and high thermal conductivity. In the structure in which conductive connection is made by contacting the pin contact, heat is also conducted to the pin contact, and heat dissipation is performed quickly. For this reason, it is possible to minimize the influence of heat on the motherboard on which various electronic components are mounted.
In addition, the structure in which the conductive connection is made via the pin contact enables the light emitting device to be mounted in a narrow space. It can be said that the mounting structure is suitable for a case having a high density of parts.

  By adopting the above configuration, heat generation can be suppressed low during high-current pulse lighting, and bright illumination with high luminance can be obtained. In addition, since the heat storage layer can be easily formed, the manufacturing cost can be reduced. Further, since the heat storage layer is housed in the cover, the light emitting device itself is finished in a compact shape.

  The first embodiment has been described using one LED element, but the number of LED elements is not limited to one. A plurality of them may be used to increase the luminance. Further, it is also possible to adopt a configuration in which white light is obtained by arranging three types of LED elements of red light emission, green light emission, and blue light emission R, G, and B.

  In addition, a pair of heat storage layers 28 and 29 are provided because they are formed of conductive solder. If the material has an insulating property and a high thermal conductivity, the heat storage layers may be connected to one.

  In the first embodiment, the optical lens 31d has a Fresnel lens structure. However, the optical lens 31d is not limited to a Fresnel lens, and is not limited to a Fresnel lens. A convex lens having a condensing function, a concave lens, or an array structure of these lenses is used. It can be applied even if it is made in the same way.

(Second Embodiment)
Next, a light emitting device according to a second embodiment of the present invention will be described with reference to FIGS. 5 is a cross-sectional view of a main part of the light emitting device according to the second embodiment of the present invention, and FIG. 6 is a plan view of the light emitting device in FIG. 5 with the cover removed. In FIG. 5 and FIG. 6, components having the same specifications as the components in the first embodiment will be described with the same reference numerals.

  Comparing the light emitting device of the second embodiment with the light emitting device of the first embodiment described above, the light emitting device of the second embodiment uses two LED elements, and the reflective film is provided on the cover. Two points are greatly different from the light emitting device of the first embodiment. In the following, description will be made mainly on the different configuration.

  The light emitting device 40 in the second embodiment uses two LED elements as shown in FIG. The first LED element 25 is a blue light emitting LED element having the same specifications as the LED element used in the first embodiment. The second LED element 45 is a red light emitting LED element. The LED element 25 and the LED element 45 are attached to the upper surface portion 23a of the electrode 23 in parallel. The LED element 45 is connected to the upper surface portion 22 a of the electrode 22 through the bonding wire 26.

The sealing resin layer 27 has the same specifications as the sealing resin layer in the first embodiment described above. That is, it consists of a silicone resin blended with a YAG phosphor having a chemical formula of Y ₃ AL ₅ O ₁₂ : Ce in a proportion of 5 to 60% by weight.
The phosphor is excited by the short wavelength light of the LED element 25 that emits blue light, and the wavelength is converted to obtain a yellow emission color. And it mixes with the blue luminescent color from LED25, and white light is obtained.
However, since the white light is white light having a slight bluish component, in the second embodiment, the red light emitting LED element 45 is mounted together with the LED element 25, and the red light from the LED element 45 is mounted. The component light is mixed. Then, the color development of the bluish component is eliminated, and white light with high whiteness is obtained.
By adopting such a configuration, effects such as improved color rendering and improved color reproducibility can be obtained.

  The pair of heat storage layers 28 and 29 have the same specifications as the heat storage layer in the first embodiment described above. That is, it is formed with solder and is provided around the outer periphery of the sealing resin layer 27.

The cover 51 of the second embodiment uses a cover 31 having the same specifications as the cover configured in the first embodiment, and is provided with a reflective film 51e on the inner peripheral surface of the cylindrical portion 31b of the cover 31. The reflective film 51e is made of a metal film such as Al or Ag metal, and is formed by a method such as a vacuum deposition method or a sputtering method.
By providing the reflective film 51e on the inner peripheral surface of the cylindrical portion 31b, the light from the LED elements 25 and 45 incident on the inner peripheral surface is reflected by the reflective film 51e, and the reflected light is directed toward the optical lens 31d or Proceed toward the gap 31c. Thus, by providing the reflective film 51d, the amount of light passing through the optical lens 31d is increased, and the light use efficiency is increased. And bright illumination with high luminance can be obtained.

  With the above configuration, in addition to the heat dissipation effect described in the light emitting device of the first embodiment, white light with increased whiteness is obtained, and color rendering and color reproducibility are improved. In addition, brighter illumination can be obtained.

(Third embodiment)
Next, a light emitting device according to a third embodiment of the invention will be described with reference to FIGS. 7 is a cross-sectional view of the main part of the light emitting device according to the third embodiment of the present invention, and FIG. 8 is a plan view of the light emitting device in FIG. 7 with the cover removed. In FIG. 7 and FIG. 8, components having the same specifications as the components in the first embodiment will be described with the same reference numerals.

First, significant differences between the configuration of the light emitting device of the third embodiment and the configuration of the light emitting device of the first embodiment will be described with reference to FIG.
The first difference is that a pedestal substrate 64 in which a pair of electrodes 62 and 63 are provided on a pedestal 61 is newly provided, and the circuit board 24 of the first embodiment is mounted on the pedestal substrate 64. It is a point that has made.

Next, the second difference is that the pair of heat storage layers 68 and 69 are provided around the outer periphery of the circuit board 24, and the pair of electrodes 22 and 23 of the circuit board 24 and the pair of electrodes 62 and 63 of the base board 64. It is the point which has comprised with each, and it has comprised.
The pair of heat storage layers 68 and 69 are made of solder, and the pair of heat storage layers 68 and 69 also serve to fix the circuit board 24 and the base board 64. Although not shown, the contact surfaces of the pair of electrodes 22 and 23 of the circuit board 24 and the pair of electrodes 62 and 33 of the base substrate 64 (in FIG. 7, the contact surfaces of the electrodes 22 and 62, and The contact surface between the electrode 23 and the electrode 63 is also provided with solder.
In the first embodiment described above, the heat storage layer is arranged around the outer periphery of the sealing resin layer on the circuit board. However, in the third embodiment, the circuit is not around the outer periphery of the sealing resin layer. The structure provided around the outer periphery of the substrate is taken.

  Next, the third difference is that the cover 71 is attached to the outer peripheral edge of the base substrate 64. The cover 71 has a configuration in which a reflective film 71e is provided on a part of the inner peripheral surface of the cylindrical portion 71b and the inner surface of the head portion 71a.

Hereinafter, the component specifications of the different configurations will be described. The pedestal 61 constituting the pedestal substrate 64 is made of a resin such as crow epoxy resin or BT resin, and uses a flat plate having a flat surface.
The pair of electrodes 62 and 63 formed on the pedestal 61 are formed using a metal material such as Cu, Al, Ag, or Au metal having low electrical resistivity and high thermal conductivity. In the third embodiment, the same material as the pair of electrodes 22 and 23 of the circuit board 24 is used. The pair of electrodes 62 and 63 are connected to the upper surface, side surface (through hole surface), and lower surface of the pedestal 61, and are formed to have the same width as the pair of electrodes 22 and 23 of the circuit board 24. Yes.

The circuit board 24 and the pair of electrodes 22 and 23 constituting the circuit board 24 are the same as the component specifications of the first embodiment, and the description thereof is omitted.
The same applies to the LED element 25 and the bonding wire 26.

  The sealing resin layer 67 is made of a silicone resin containing a YAG phosphor similarly to the sealing resin layer in the first embodiment. In the third embodiment, the sealing resin layer 67 is provided on the entire upper surface of the circuit board 24. ing. The anti-corrosion effect by reducing the exposed area of the pair of electrodes 22 and 23 of the circuit board 24, the effect of increasing the amount of wavelength-converted light in the phosphor, and the like are achieved.

The pair of heat storage layers 68 and 69 are formed with solder. By providing around the outer periphery of the circuit board 24, the thickness of the heat storage layers 68 and 69 can be increased, and the volume of the heat storage layers 68 and 69 can be increased. As described in the first embodiment, the heat storage layer takes in the heat generated from the LED elements and temporarily stores the heat. The greater the volume of the heat storage layer, the greater the amount of heat that can be captured and stored. As a result, the heat dissipation speed of the LED element is also increased, and the temperature rise of the LED element is suppressed.
The heat storage layer in the first embodiment described above is provided on the circuit board. The configuration in which the heat storage layer is provided on the circuit board has a limit in volume because the heat storage layer cannot be made too thick. However, since the configuration provided around the outer periphery of the circuit board can be formed in a desired thickness, the volume can be increased.

  In FIG. 7, reference numeral 70 denotes a resist film. The resist film 70 is provided to block the through hole surface, prevent the solder of the heat storage layers 68 and 69 from flowing in, and improve the state of attachment of the cover 71.

The cover 71 is made of a transparent acrylic resin or the like. A head 71a and a cylinder 71b are provided, and an optical lens 71d is provided on the head 71a. The optical lens 71d is a Fresnel lens.
The cover 71 is provided with a reflective film 71e on the inner peripheral surface of the cylindrical portion 71b and a part of the head 71a (a surface excluding the surface of the optical lens 71d). The light use efficiency is increased by preventing light from leaking from the cylindrical portion 71b of the cover 71, and a large amount of light is emitted from the surface of the optical lens 71d to increase the luminance.
The cover 71 is fixed to the outer peripheral edge of the base substrate 64. In the fixed state, a gap (hollow part) 71c is provided between the heat storage layers 68 and 69 and the sealing resin layer 67 and the cover 71. The clearance 71c prevents heat from being transmitted to the cover 71 so much that the optical lens can be prevented from being thermally deformed. In addition, since light is refracted and light is dispersed, color mixing is performed well.

With the above configuration, the volume of the heat storage layers 68 and 69 can be increased, the area of the heat transfer medium can be increased by adding the area of the pair of electrodes 62 and 63 of the base substrate 64, and the like. Temperature rise can be suppressed.
Although not shown, the light emitting device 60 comes into contact with a pair of pin contacts disposed on the housing side, and is connected to be connected to be driven.

  In the above configuration, the pair of heat storage layers 68 and 69 provided around the outer periphery of the circuit board 24 are provided on both the left and right sides of the circuit board 24 as shown in FIG. It is also possible to adopt a configuration in which the heat storage layer forming region is increased around the outer periphery of the circuit board 24 as in the application example.

(Application examples)
The example shown in FIG. 9 is an application example in which the heat storage layer provided around the outer periphery of the circuit board is provided with an increased area. In the figure, the heat storage layer 68 extends to both the left and right sides and the upper and lower sides of the circuit board 24 in a pair. 69 is provided.
This is because the heat storage layers 68 and 39 having this configuration can be formed by widening the pair of electrodes 62 and 63 of the base substrate 64.
In this configuration, the volume of the heat storage layers 68 and 69 is increased and the area of the pair of electrodes 62 and 63 provided on the pedestal 61 is also increased, so that the effect is further promoted.

It is principal part sectional drawing of the light-emitting device which concerns on 1st Embodiment of this invention. It is a top view when the cover of the light-emitting device in FIG. 1 is removed. It is a perspective view of the circuit board in FIG. 4A and 4B are explanatory diagrams for explaining the operation and effect of the heat storage layer, in which FIG. 4A is a pulse waveform diagram to be applied, and FIG. 4B is a fluctuation schematically showing fluctuations in heat generation temperature of the LED element. FIG. It is principal part sectional drawing of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a top view when the cover of the light-emitting device in FIG. 5 is removed and viewed. It is principal part sectional drawing of the light-emitting device which concerns on 3rd Embodiment of this invention. It is a top view when the cover of the light-emitting device in FIG. 7 is removed. It is a top view which shows the application example of the structure of the thermal storage layer of the light-emitting device which concerns on 3rd Embodiment. It is principal part sectional drawing of the light emitting diode shown by patent document 1. FIG. It is principal part sectional drawing of the surface mount type light emitting diode shown by patent document 2. FIG.

Explanation of symbols

20, 40, 60 Light emitting device 21 Substrate 22, 23, 62, 63 Electrode 22a, 23a Upper surface portion 22b, 23b Side surface portion 22c, 23c Lower surface portion 24 Circuit substrate 25, 45 LED element 26 Bonding wire 27, 67 Sealing resin layer 28, 29, 68, 69 Thermal storage layer 30, 70 Resist film 31, 51, 71 Cover 31a, 71a Head part 31b, 71b Cylinder part 31c, 71c Gap 31d, 71d Optical lens 51e, 71e Reflective film 61 Base 64 Base substrate 101 Pin contact

Claims (10)

  A light-emitting device using an LED element, wherein the light-emitting device is a circuit board in which a pair of electrodes is provided on an insulating substrate, at least one LED element mounted on the circuit board, and the LED element is a resin A sealing resin layer sealed with, and a heat storage layer around the outer periphery of the sealing resin layer and in contact with a part of the pair of electrodes to take in heat generated from the LED element and temporarily store the heat, A light emitting device comprising:   A light-emitting device using an LED element, wherein the light-emitting device is a circuit board in which a pair of electrodes is provided on an insulating substrate, at least one LED element mounted on the circuit board, and the LED element is a resin A sealing resin layer sealed in step 1, a base board on which an insulating base is provided with a pair of electrodes to mount the circuit board, the pair of electrodes on the circuit board around the outer periphery of the circuit board, and the circuit board A light-emitting device comprising: a heat storage layer that comes into contact with a part of the pair of electrodes of the base substrate and takes in heat generated from the LED elements and temporarily stores the heat storage layer.   The light-emitting device according to claim 1, wherein the light-emitting device has a cap-shaped transmissive cover provided with an optical lens.   The cap shape of the cover includes a head portion and a cylinder portion, the optical lens is provided on the head portion, the sealing resin layer and the heat storage layer are disposed inside the cylinder portion, and the sealing The light emitting device according to any one of claims 1 to 3, wherein a gap is provided between the stop resin layer and the heat storage layer and the cover.   The light-emitting device according to claim 4, wherein a reflective film is provided on an inner peripheral surface of the cylindrical portion of the cover.   5. The light emitting device according to claim 3, wherein the optical lens of the cover is a Fresnel lens.   The light-emitting device according to claim 1, wherein the heat storage layer is made of solder.   5. The LED element according to claim 1, wherein the LED element is a blue light emitting LED element, and the sealing resin layer is made of a silicone resin containing a YAG phosphor. Light emitting device.   The LED elements are a blue light emitting LED element and a red light emitting LED element, and the sealing resin layer is made of a silicone resin containing a YAG phosphor. The light emitting device according to any one of the above.   10. The light emitting device according to claim 1, wherein the light emitting device is in contact with a pair of pin contacts provided on the housing side and is supplied with current from the pin contacts.

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