KR20110045273A - Printed circuit board for package and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A printed circuit board for a package and manufacturing method thereof are provided to mount a light emitting device on a first metal layer functioning as a heat emitting layer, thereby enhancing heat emitting features. CONSTITUTION: A wiring board(100) is composed of a first metal layer(120), an insulating layer(130), and a second metal layer(140). A first cavity(110) is formed on the wiring board to mount a light emitting device. A reflective plate(300) forms a second cavity whose diameter is larger than the diameter of the first cavity. An adhesive sheet(200) is located between the wiring board and the reflective plate. The adhesive sheet forms a hole whose diameter is larger than the diameter of the first cavity.

Description

 Printed circuit board for package and manufacturing method thereof

The present invention relates to a printed circuit board for mounting a light emitting device (for example, LED chip) and a manufacturing method thereof.

In general, in order to mount an LED chip, which is one of light emitting devices, on a printed circuit board (PCB) consisting of a wiring layer, an insulating layer, and a heat dissipating layer, the LED chip is manufactured as an LED package, and each LED package is separately placed on the printed circuit board. (surface mount technology) is a technology that mounts an LED package on the surface (wiring layer) of a printed circuit board.

However, when the LED package is mounted on the printed circuit board using the SMT process, the heat dissipation efficiency decreases because heat generated from the LED chip passes through various thermal resistances in the process of being transferred to the lower heat dissipation layer of the printed circuit board. There is this.

Therefore, a COB (chip on board) structure for mounting the LED chip close to the lower heat dissipation layer has been proposed as a method for solving the above problems. In the COB structure, the LED chip is mounted on the insulating layer of the printed circuit board. As the heat resistance element is reduced while heat generated from the LED chip is transferred to the lower heat dissipation layer, the heat dissipation efficiency can be increased.

However, since the LED chip is mounted on the insulating layer, the COB structure also has a heat resistance element remaining due to the insulating layer, so that the heat dissipation efficiency is low, and the light extraction efficiency is also low because no reflective surface is provided to increase the light extraction efficiency. There is a problem.

Accordingly, there is a need for a technology related to a printed circuit board which can improve the light extraction efficiency while improving heat dissipation characteristics of the LED package by minimizing a heat resistance element when the LED chip is mounted on the printed circuit board.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a printed circuit board and a method of manufacturing the same, which can improve heat dissipation characteristics and / or light extraction efficiency of the light emitting device.

In order to solve the above problems, the present invention is a wiring board formed with a first cavity (cavity) for mounting a light emitting device; A reflection plate provided on the wiring board and having a second cavity having a diameter larger than that of the first cavity; And an adhesive sheet provided between the wiring board and the reflecting plate and having a hole having a diameter larger than that of the first cavity, wherein the wiring board includes: a first heat dissipating heat generated by the light emitting device; Metal layer; An insulation layer provided on the first metal layer; And a second metal layer provided on the insulating layer and having a circuit pattern formed thereon, wherein the first cavity is formed to penetrate from an upper surface of the second metal layer to a lower surface of the insulating layer. can do.

In addition, the present invention is a wiring board mounted with a light emitting device to achieve the above object; A reflection plate provided on the wiring board and having a cavity for protecting the light emitting device; And an adhesive sheet provided between the wiring board and the reflecting plate and having a hole having a diameter greater than or equal to the diameter of the cavity, wherein the wiring board comprises: a first heat dissipating heat generated by the light emitting device; Metal layer; An insulation layer provided on the first metal layer; And a second metal layer provided on the insulating layer and having a circuit pattern formed thereon, and the through hole penetrating through the first metal layer, the insulating layer, and the second metal layer is provided in the wiring board where the light emitting device is mounted. At least one or more formed through holes may be provided with another printed circuit board, wherein the through hole is plated or filled with a metal material that dissipates heat generated in the light emitting device.

On the other hand, the present invention is a) forming a circuit pattern on a wiring board laminated with a first metal layer, an insulating layer, a second metal layer, and a first cavity (cavity) for mounting a light emitting device from the upper surface of the second metal layer is insulated Forming through the bottom of the layer; b) forming a second cavity in the reflecting plate having a diameter larger than the diameter of the first cavity; c) forming holes in the adhesive sheet having a diameter larger than that of the first cavity; And d) arranging and bonding the adhesive sheet of step c) between the wiring board of step a) and the reflector plate of step b).

In addition, the present invention is a printed circuit board having the above characteristics; And it may provide a light emitting device package comprising a light emitting device electrically connected to the printed circuit board.

Here, the luminous element may be defined as an element that converts electricity into light, and a preferable example may be an LED chip.

The printed circuit board of the present invention described above has a structure in which a light emitting device (for example, an LED chip) can be directly mounted on a first metal layer serving as a heat dissipation layer. In the case of manufacturing a package, it is possible to improve heat dissipation characteristics.

In addition, when the LED chip is used as a light emitting device, since a reflecting surface reflecting light generated from the LED chip is provided, when the light emitting device package using the printed circuit board, specifically, the LED package is manufactured, the light extraction efficiency is improved. It can increase.

In addition, since the printed circuit board of the present invention is manufactured by bonding the wiring board and the reflecting plate with an adhesive sheet, since the trench and / or the partition wall are provided so that the adhesive sheet component does not leak between the wiring board and the reflecting plate, the defective occurrence rate of the printed circuit board is reduced. It can be minimized.

Hereinafter, a printed circuit board and a manufacturing method thereof according to the present invention as described above will be described in detail with reference to the drawings.

[Printed Circuit Board of First Structure]

1 is a cross-sectional view of a printed circuit board according to a first structure of the present invention (includes an LED chip and a wire to represent an electrical connection state as an example of a light emitting device to help understand the description). .

Referring to FIG. 1, the printed circuit board according to the first structure of the present invention includes a wiring board 100, an adhesive sheet 200, and a reflecting plate 300.

The wiring board 100 includes a first metal layer 120, an insulating layer 130, and a second metal layer 140, and a first cavity 110, which is a space for mounting a light emitting device, is formed. The detailed description is as follows. The first metal layer 120 is provided at the bottom of the wiring board 100 to serve as a heat dissipation layer for dissipating heat generated from the light emitting device. The material used as the first metal layer 120 is not particularly limited as long as it has excellent heat transfer characteristics, and non-limiting examples may include copper (Cu), iron (Fe), aluminum (Al), and the like.

The insulating layer 130 is provided on the first metal layer 120 and serves to insulate the first metal layer 120 and the second metal layer 140. Examples of the material that can be used as the insulating layer 130 include ceramics, resins, composite materials, and the like, and among them, glass epoxy sheets impregnated with epoxy resins are preferably used. This is because the glass epoxy sheet is excellent in electrical and mechanical properties and at the same time flexible, so that the splitting does not occur when the first cavity 110 is formed in the wiring board 100, thereby easily forming the first cavity 110.

The second metal layer 140 is provided on the insulating layer 130, and serves as a wiring layer so that a current flows in the light emitting device to which the circuit pattern is formed and wire bonded. The material used as the second metal layer 140 is not particularly limited as long as the material has excellent electrical and heat transfer characteristics, such as the first metal layer 120. Examples of the second metal layer 140 include, but are not limited to, copper (Cu), iron (Fe), Aluminum (Al) etc. can be used.

Here, a zener diode 400 for preventing static electricity may be further provided in the second metal layer 140 serving as a wiring layer. The light emitting device (for example, LED chip) that is wire bonded to the circuit pattern formed on the second metal layer 140 is weak to static electricity, so when static electricity flows, the light emitting device is damaged and cannot operate. By providing the zener diode 400 which can be prevented in the second metal layer 140, the mounted light emitting device can be stably operated.

Meanwhile, a first cavity 110 is formed in the wiring board 100 to provide a space for mounting the light emitting device, and the printed circuit board of the present invention includes the wiring board 100 having the first cavity 110 formed thereon. When manufacturing the light emitting device package by using it can increase the heat radiation characteristics of the light emitting device package. That is, the first cavity 110 is formed to penetrate from the upper surface of the second metal layer 140 to the lower surface of the insulating layer 130. When the first cavity 110 is formed in this way, the light emitting device is the first metal layer 120. Since the heat generated from the light emitting device is directly discharged to the outside through the first metal layer 120 without the heat resistance element, the heat radiation characteristics of the light emitting device package can be improved. In addition, since the heat dissipation characteristics can be improved without considering the heat resistance element by the insulating layer 130, the insulating layer 130 having various materials and thicknesses may be used.

In addition, through-holes 150 penetrating through the first metal layer 120, the insulating layer 130, and the second metal layer 140 may be further formed in the wiring board 100 to increase heat dissipation characteristics of the light emitting device package. That is, the through hole 150 serves as a thermal via for transferring heat existing in the first metal layer 120 to the second metal layer 140. Accordingly, not only the first metal layer 120 but also the second metal layer. 140 will also act as a heat dissipation layer to increase the heat dissipation efficiency.

Meanwhile, the through hole 150 may be plated or filled with a metal material through which electricity may flow. That is, the through-hole 150 is plated with a metal material or the inside is filled with a metal material, wherein the metal material used may be any material that can flow electricity, but is not limited to copper. (Cu) may be used. As such, when the through hole 150 is plated or filled with a metal material through which electricity may flow, the conductivity of the printed circuit board may be increased.

The adhesive sheet 200 is provided between the wiring board 100 and the reflecting plate 300 to bond the wiring board 100 and the reflecting plate 300 to a diameter larger than the diameter of the first cavity 110 formed on the wiring board 100. The hole 210 which has is formed. That is, when the wiring board 100 and the reflecting plate 300 are bonded to each other, the adhesive sheet 200 may have a first cavity so that a space for wire bonding the light emitting device may be provided in the second metal layer 140 of the wiring board 100. The hole 210 having a diameter larger than the diameter of 110 is formed. The diameter of the hole 210 only needs to be larger than the diameter of the first cavity 110, but the diameter of the second cavity 310 (to be described later, the second cavity at the position where the adhesive sheet 200 and the reflecting plate 300 contact each other). Greater than or equal to (310) based on diameter). Meanwhile, the material used as the adhesive sheet 200 is not particularly limited as long as it can bond the wiring board 100 and the reflecting plate 300, but it is preferable to use a glass epoxy sheet in a semi-cured state.

The reflective plate 300 is provided on the wiring board 100 (specifically, the upper portion of the adhesive sheet 200) and has a diameter larger than the diameter of the first cavity 110 formed in the wiring board 100. ) Is formed. Here, the second cavity 310 is formed to have a diameter larger than the diameter of the first cavity 110 to protect the light emitting device and the wire to be bonded to the first cavity 110, in this case, The second cavity 310 may be plated with a metal material to increase the extraction efficiency (light extraction efficiency) of the light emitted from the mounted light emitting device (eg, LED chip).

That is, the second cavity 310 may be provided with a reflective surface 311 in which an inner wall surface is plated with a metal material and reflects light emitted from the light emitting device. Here, the metal material to be plated is not particularly limited as long as it reflects light emitted from the light emitting device, but non-limiting examples may include copper (Cu), silver (Ag), gold (Au), aluminum (Al), and the like. .

Meanwhile, in order to further improve the reflectivity of the reflective surface 311 provided in the second cavity 310, the diameter of the second cavity 310 becomes smaller as the closer to the wiring board 100 so as to be inclined with the wiring board 100. It is preferably formed. If the second cavity 310 is formed to have a constant diameter (the second cavity 310 having a cylindrical shape), the reflected light may only move around in the second cavity 310 without being smoothly emitted to the outside. Accordingly, in order to smoothly emit the reflected light to the outside, the second cavity 310 may be formed to form the inclination angle α with the wiring board 100 (the second cavity 310 having an inverted truncated cone shape is formed). Here, the inclination angle α formed by the second cavity 310 and the wiring board 100 may be provided in a range of 15 ° 15α ≦ 90 °.

In addition, even if the second cavity 310 is not formed to be inclined, when the reflective surface 311 is provided, the reflective surface 311 may be plated to be inclined with the wiring board 100 to improve the reflectivity. In this case, the plated reflective surface 311 may be provided in one of cross-sections of straight lines (or diagonal lines), concave rounds, and convex rounds. Of course, the cross-section of the reflective surface 311 is formed by plating the reflective surface 311 after forming the second cavity 310 such that the cross-section of the second cavity 310 has any one of a straight line, a concave round, and a convex round. This form may be represented.

On the other hand, according to the configuration and material of the reflector 300, the reflector 300 may serve to reflect the light emitted from the light emitting device even if the reflecting plate 311 is not provided. That is, the reflective plate 300 is a substrate made of metal on both sides of the first metal layer 120, the insulating layer 130, and the second metal layer 140, like the wiring board 100, and polyimide and epoxy without metal on both sides. A substrate made of only a resin, such as PET and a substrate made of a metal may be used. In this case, when the substrate made of only metal is used as the reflecting plate 300, the inner wall surface may be formed by only forming the second cavity 310. Since it is already made of metal, it is not necessary to provide the reflective surface 311 separately. However, when the substrate made of metal having low reflectance of light emitted from the light emitting device is used as the wiring board 300, the reflective surface 311 may be separately provided. Here, the material that can be used as a substrate made of only metal is not particularly limited, but non-limiting examples include copper (Cu), silver (Ag), gold (Au), aluminum (Al), iron (Fe), and the like. Can be.

Meanwhile, when the wiring board 100 and the reflecting plate 300 are bonded to the adhesive sheet 200, the second metal layer of the wiring board 100 may not leak out to the second cavity side 310 of the reflecting plate 300. A trench 141 may be formed at 140, and a barrier 320 may be further formed below the reflector 300, which will be described below with reference to FIGS. 2 to 4.

The adhesive sheet 200 disposed between the wiring board 100 and the reflecting plate 300 has flowability through a high temperature / high pressure pressing process, and the adhesive sheet component having flowability is the wiring board 100. The wiring board 100 and the reflecting plate 300 are bonded as they flow into the space between the circuit patterns formed on the second metal layer 140 and then harden.

However, as shown in FIG. 2, when the adhesive sheet 200 is pressed at a high temperature / high pressure, the adhesive sheet component having flowability flows into the space between the circuit patterns as well as the second cavity 310. If the adhesive sheet component leaks to the second cavity 310 side, the defective rate of the printed circuit board is increased. That is, when the adhesive sheet component leaks to the second cavity 310 side, the area where the light emitting device is wire-bonded is reduced, making it difficult to electrically connect the light emitting device, and the area of the reflective surface 311 of the second cavity 310 is also reduced to emit light. The reflectivity reflecting the light emitted from the device is also lowered, making it unsuitable for use as a printed circuit board.

Here, when the hole 210 is formed in the adhesive sheet 200, the diameter of the hole 210 may be larger than that of the second cavity 310 or the thickness of the adhesive sheet 200 may be thinned so that the adhesive sheet component may have a second cavity ( Leaving to the side 310 may be minimized, but if the diameter of the hole 210 is made too large or the thickness is too thin, the adhesive force of the wiring board 100 and the reflecting plate 300 may fall, so that the diameter or thickness of the hole 210 may be reduced. It is difficult to solve the problem just by controlling it.

3 and 4, however, the trench 141 stores the adhesive sheet component in the second metal layer 140 of the wiring board 100 so that the adhesive sheet component does not leak to the second cavity 310 side. Is further formed, and since the partition 320 is further formed below the reflective plate 300 to block the flow of the adhesive sheet component, the above-described problem may be prevented from occurring.

On the other hand, when the adhesive sheet component having flowability is first stored in the trench 141 and then blocks the adhesive sheet component overflowing from the trench 141 at the partition wall 320, the adhesive sheet component leaks to the second cavity 310 side most. Since it can be effectively prevented, the first cavity 110 formed in the wiring board 100 has the partition wall 320 formed in the lower portion of the reflective plate 300 rather than the trench 141 formed in the second metal layer 140 of the wiring board 100. It is preferable to form so as to be close to).

[Method of Manufacturing Printed Circuit Board of First Structure]

A method of manufacturing a printed circuit board having a first structure including the wiring board 100, the adhesive sheet 200, and the reflecting plate 300 described above will now be described with reference to FIG. 5. Here, in the manufacture of the wiring board 100, the adhesive sheet 200 and the reflecting plate 300, it does not matter which one to manufacture first, but for convenience, the wiring board 100 → the reflecting plate 300 → the adhesive sheet 200 to be described in order. do.

a) Wiring board manufacturing step

After preparing the wiring board 100 stacked with the first metal layer 120, the insulating layer 130, and the second metal layer 140, the circuit pattern and the first cavity 110 are formed on the prepared wiring board 100. Here, the circuit pattern is formed by etching the second metal layer 140 of the wiring board 100. In addition, the first cavity 110 is formed to penetrate from the upper surface of the second metal layer 140 to the lower surface of the insulating layer 130, but the method of forming the first cavity 110 is not particularly limited, but is not limited thereto. For example, it may be formed using a laser or a drill.

However, when the first cavity 110 is formed using a laser, a desmear process of removing the residue so that the residue of the insulating layer 130 does not remain on the bottom surface of the first cavity 110 (chemical Process of dissolving and removing the insulating layer material using a chemical), and in the case of using a drill, penetrates only to the insulating layer 130 when the first cavity 110 is formed and the first metal layer 120 is damaged. Be careful not to.

Meanwhile, the method may further include forming a trench 141 for storing the adhesive sheet component when the circuit pattern is formed in the second metal layer 140 of the wiring board 100. Here, the method of forming the trench 141 in the second metal layer 140 is the same as the method (etching) of forming a circuit pattern. At this time, the shape of the trench 141 may have a rectangular or arbitrary shape as well as the circle shown in FIG. 4 (see the plan view).

In addition, in the manufacture of the wiring board 100, a step of forming a through hole 150 penetrating through the first metal layer 120, the insulating layer 130, and the second metal layer 140 in order to increase electrical conduction and heat transfer efficiency may be performed. It includes more. The through hole 150 may be formed by using a drill method, and a plurality of through holes 150 may be formed so that electricity and heat of the first metal layer 120 may be smoothly transferred to the second metal layer 140.

In this case, the order of forming the circuit pattern, the first cavity 110, the trench 141, and the through hole 150 in the wiring board 100 is not determined, and may be arbitrarily determined in consideration of the manufacturing process. You can.

b) Reflector manufacturing step

A second cavity 310 having a diameter larger than the diameter of the first cavity 110 is formed on the prepared reflector plate 300. Here, the method of forming the second cavity 310 is not particularly limited, but may be formed using a drill as a non-limiting example. In addition, the reflective plate 300 may be selected from a resin substrate (for example, a copper foil laminate) made of metal on both sides, such as the wiring board 100, a substrate made of resin without metal on both sides, and a substrate made of metal only. have.

On the other hand, after forming the second cavity 310 on the reflecting plate 300, in order to increase the light extraction efficiency of the light emitting device (for example, LED chip), the inner wall surface is plated with a metal material to provide a reflecting surface 311 It may further comprise the step. In this case, as a method of plating a metal material, an electroless plating or an electroplating (electroplating) method may be applied. The metal material to be plated is not particularly limited, but copper (Cu) may be used as a non-limiting example. In addition, in order to improve the reflectivity of the reflective surface 311, aluminum (Al), gold (Au), silver (Ag), or the like may be additionally plated on the reflective surface 311 plated with a metal material.

In addition, in order to increase the light extraction efficiency of the light emitting device, the second cavity 310 having the reflective surface 311 may be formed to be inclined with the wiring board 100 as the diameter thereof decreases as the wiring board 100 is closer to the wiring board 100. In this case, the method of forming the second cavity 310 to be inclined with the wiring board 100 may be formed using a drill bit having a flat bottom surface and an inclined side surface.

On the other hand, the second cavity 310 may further include the step of forming a partition 320 to block the flow of the adhesive sheet component on the reflective plate 300 is formed. Here, the method of forming the partition wall 320 under the reflective plate 300 may vary depending on which substrate is used as the reflective plate 300. That is, when the above-mentioned two-sided resin substrate made of metal is used as the reflecting plate 300, the partition wall 320 may be formed by leaving the partition 320 part when the metal on both sides is removed by etching. In addition, when using a substrate made of resin only as the reflecting plate 300, the lower portion of the reflecting plate 300 is a metal material (for example, copper (Cu), silver (Ag), gold (Au), aluminum (Al), etc.) The partition wall 320 may be formed by plating with. In addition, when a substrate made of only metal is used as the reflector 300, the partition 320 may be formed by etching the lower portion of the reflector 300, leaving only the partition 320.

c) adhesive sheet manufacturing step

A hole 210 having a diameter larger than the diameter of the first cavity 110 is formed in the prepared adhesive sheet 200. Here, the method of forming the hole 210 is not particularly limited, but may be formed using a laser or a drill as a non-limiting example.

d) adhesion step

After the adhesive sheet 200 is disposed between the manufactured wiring board 100 and the reflecting plate 300, the adhesive sheet 200 is pressed at a high temperature / high pressure to bond the wiring board 100 to the reflecting plate 300. At this time, the pressing temperature, pressure and time is preferably adjusted appropriately according to the adhesive sheet 200 used.

[Printed Circuit Board of Second Structure]

FIG. 6 is a cross-sectional view of a printed circuit board according to a second structure of the present invention, including an LED chip and a wire for representing an electrical connection state as an example of a light emitting device to help understand the description. .

Referring to FIG. 6, the printed circuit board according to the second structure of the present invention includes a wiring board 500, an adhesive sheet 600, and a reflecting plate 700.

The wiring board 500 includes a first metal layer 510, an insulating layer 520, and a second metal layer 530, and the first metal layer 510 and the insulating layer 520 where the light emitting device is mounted. And at least one through hole 540 penetrating through the second metal layer 530, which will be described in detail below. However, the description of the material and the role used as the first metal layer 510, the insulating layer 520, and the second metal layer 530 is as follows. The first metal layer 120 and the insulating layer in the printed circuit board of the first structure. 130 and the second metal layer 140 are the same as the description thereof will be omitted.

In the printed circuit board of the second structure, the light emitting device is mounted on the surface of the second metal layer 530 in the wiring board 500. In this case, the heat generated from the light emitting device is smoothly provided as the first metal layer 510 serving as a heat dissipation layer. As shown in FIG. 6, the first metal layer 510, the insulating layer 520, and the second metal are disposed in a place where the light emitting device (for example, an LED chip) is mounted (specifically, below the place where the LED chip is mounted). At least one through hole 540 penetrating the metal layer 530 is formed.

Here, the through hole 540 formed where the light emitting device is mounted is plated or filled with a metal material that dissipates heat generated from the light emitting device. The metal material used to plate or fill the through hole 540 is particularly Although not limited, copper (Cu) may be used as a non-limiting example.

As such, when a light emitting device package is manufactured using a printed circuit board including a wiring board 500 having at least one through hole 540 formed therein, the heat generated from the light emitting device can be efficiently dissipated. Therefore, the heat dissipation characteristics of the light emitting device package can be improved.

On the other hand, the through-hole 540 formed in the wiring board 500 may be formed in other portions (for example, the corner side of the printed circuit board) other than the place where the light emitting device is mounted, such a through-hole formed in the other portion The hole 540 serves to facilitate electrical conduction of the printed circuit board, thereby increasing the conductivity of the printed circuit board.

The adhesive sheet 600 is provided between the wiring board 500 and the reflecting plate 700 to bond the wiring board 500 and the reflecting plate 700, and is equal to or larger than the diameter of the cavity 710 formed in the reflecting plate 700 to be described later. A hole 610 having a diameter is formed. In this case, the material used as the adhesive sheet 600 is not particularly limited as long as it can bond the wiring board 500 and the reflecting plate 700, but it is preferable to use a glass epoxy sheet in a semi-cured state.

The reflecting plate 700 is provided on the wiring board 500 (specifically, the upper portion of the adhesive sheet 600), and the light emitting device mounted on the second metal layer 530 of the wiring board 500 and the wire to be bonded. A cavity 710 is formed to protect and increase light extraction efficiency of a light emitting device (for example, an LED chip). That is, in order to increase the extraction efficiency (light extraction efficiency) of the light emitted from the mounted light emitting device, the cavity 710 may be plated with a metal material (the reflection surface 711 is formed), and the wiring board 500 It may be formed to make an inclination (α '), the description thereof is the same as the description of the reflecting plate 300 and the second cat 310 in the printed circuit board of the first structure will be omitted.

Meanwhile, when the wiring board 500 and the reflecting plate 700 are bonded to the adhesive sheet 600, the second metal layer 530 of the wiring board 500 does not leak to the cavity side 710 of the reflecting plate 700. A trench 531 may be formed in the reference numeral), and a barrier 720 may be further formed in the reflective plate 700. The description thereof will be omitted as it is the same as described in the printed circuit board of the first structure.

[Method of Manufacturing Printed Circuit Board of Second Structure]

In the method of manufacturing a printed circuit board having a second structure including the wiring board 500, the adhesive sheet 600, and the reflecting plate 700 described above, the method of manufacturing the adhesive sheet 600 and the reflecting plate 700 may include the first method. It is the same as the method of manufacturing the adhesive sheet 200 and the reflective plate 300 of the printed circuit board of the structure. In addition, the method of adhering the manufactured wiring board 500 and the reflecting plate 700 is also the same as described in the printed circuit board of the first structure, and thus will be omitted.

However, the wiring board 500 includes at least one through hole penetrating the first metal layer 510, the insulating layer 520, and the second metal layer 530 at the place where the light emitting device is to be mounted (specifically, the lower side of the mounting place). After the 540 is formed, the through hole 540 is plated or filled with a metal material capable of dissipating heat. In this case, a method of forming the through hole 540 is not particularly limited, but may be formed using a drill as a non-limiting example. Of course, the through-hole 540 formed in addition to the place where the light emitting device is to be mounted to perform the electrical conducting role can also be formed using a drill. The method of forming the circuit pattern and the trench 531 on the wiring board 500 other than the above is the same as described in the printed circuit board of the first structure, and thus the description thereof will be omitted.

On the other hand, the present invention can provide a light emitting device package including a printed circuit board of the first structure or the second structure described above. That is, the present invention can provide a light emitting device package including a printed circuit board of the first structure or the second structure and a light emitting device electrically connected to the printed circuit board.

Here, the light emitting device connected to the printed circuit board of the first structure or the second structure of the present invention is not particularly limited, but in the case of an LED chip, since the light emitting device has the greatest effect in terms of light extraction efficiency and light extraction efficiency, An example is preferably an LED chip. In this case, the LED chip connected to the printed circuit board is preferably used having a thickness smaller than the thickness of the printed circuit board of the first structure or the second structure. The LED chip is electrically connected to the printed circuit board of the first structure or the second structure by a wire bonding operation.

Meanwhile, when the printed circuit board having the first structure is used to wire-bond the light emitting device and the printed circuit board to protect the light emitting device and the wire, the first cavity 110 and the second cavity 310 have a second structure. When using a printed circuit board of the cavity 710 is sealed with a resin, the sealed form may be in the form of a dome so as to perform a plane or lens role.

In addition, when the LED chip is mounted among the light emitting devices using the printed circuit board of the first structure, the thickness of the wiring board 100 is larger than the thickness of the LED chip, and then the LED chip is mounted on the first cavity 110. One cavity 110 is filled with a phosphor (F), and the second cavity 310 is filled with a transparent resin (R), a light emitting device package, that is, a LED package (for example, a white LED package) showing a variety of colors ) May be implemented (see FIG. 7).

When the LED package is implemented as described above, the phosphor F may be uniformly filled in the first cavity 110, and even if a small amount of phosphor F is used (filling the phosphor F up to the second cavity 310). If the color is not displayed, the phosphor (F) usage is reduced.) Since the LED package can display the desired color, the LED package can be economically implemented.

In addition, after the LED chip is mounted in the first cavity 110, the fluorescent material F is filled in the first cavity 110 and the second cavity 310, and the transparent resin R which performs the lens role thereon is sealed. LED packages may be implemented (see FIG. 8).

As described above, the detailed description of the present invention has been made by the accompanying drawings and the embodiment, but the above-described embodiment has only been described with reference to a preferred example of the present invention, the present invention is limited to the above embodiment only It should not be understood that the scope of the present invention is to be understood by the claims and equivalent concepts described below.

1 is a cross-sectional view of a printed circuit board according to a first structure of the present invention.

2 to 4 are reference diagrams for explaining a printed circuit board according to the first structure of the present invention.

5 is a flowchart illustrating a method of manufacturing a printed circuit board according to the first structure of the present invention.

6 is a cross-sectional view of a printed circuit board according to a second structure of the present invention.

7 and 8 are reference diagrams for explaining the light emitting device package of the present invention.

<Description of Major Symbols in Drawing>

100, 500: wiring board

120, 510: heat dissipation layer 130, 520: insulation layer 140, 530: wiring layer

200, 600: Adhesive Sheet

300, 700: Reflector

400: Janner Diode

Claims (12)

A wiring board having a first cavity for mounting the light emitting device; A reflection plate provided on the wiring board and having a second cavity having a diameter larger than that of the first cavity; And It includes an adhesive sheet provided between the wiring board and the reflecting plate, the hole is formed having a diameter larger than the diameter of the first cavity, The wiring board, A first metal layer for radiating heat generated by the light emitting device; An insulation layer provided on the first metal layer; And A second metal layer provided on the insulating layer and having a circuit pattern formed thereon; The first cavity is formed to penetrate from the upper surface of the second metal layer to the lower surface of the insulating layer. The method of claim 1, Printed circuit board, characterized in that the inner surface of the second cavity is provided with a reflective surface plated with a metal material that reflects the light of the light emitting device. The method of claim 1, The second cavity is smaller in diameter as the closer to the wiring board is inclined on the wiring board, characterized in that the printed circuit board. The method of claim 1, And a trench for storing the adhesive sheet component so that the adhesive sheet component does not leak to the second cavity side when the second metal layer is adhered to the wiring board and the reflecting plate. The method of claim 1, A printed circuit board further comprising a barrier to block the flow of the adhesive sheet component so that the adhesive sheet component does not leak to the second cavity side when the wiring board and the reflective plate are attached to the lower portion of the reflective plate. The method of claim 1, The second metal layer is a printed circuit board, characterized in that further provided with a zener diode (Zener diode) for preventing static electricity. a) forming a circuit pattern on a wiring board laminated with the first metal layer, the insulating layer, and the second metal layer, and penetrating a first cavity for mounting the light emitting device from an upper surface of the second metal layer to a lower surface of the insulating layer; Forming to; b) forming a second cavity having a diameter larger than the diameter of the first cavity in the reflecting plate; c) forming holes in the adhesive sheet having a diameter larger than that of the first cavity; And and d) arranging and bonding the adhesive sheet of step c) between the wiring board of step a) and the reflective plate of step b). A wiring board on which the light emitting element is mounted; A reflection plate provided on the wiring board and having a cavity for protecting the light emitting device; And It includes an adhesive sheet provided between the wiring board and the reflecting plate, the hole is formed having a diameter greater than or equal to the diameter of the cavity, The wiring board, A first metal layer for radiating heat generated by the light emitting device; An insulation layer provided on the first metal layer; And A second metal layer provided on the insulating layer and having a circuit pattern formed thereon; At least one through hole penetrating the first metal layer, the insulating layer, and the second metal layer is formed in the wiring board where the light emitting device is mounted. The through hole is a printed circuit board, characterized in that the plated or filled with a metal material that radiates heat generated by the light emitting device. The method of claim 8, The second metal layer, a printed circuit board further comprises a trench (trench) for storing the adhesive sheet component so that the adhesive sheet component does not leak to the cavity side when the wiring board and the reflective plate is bonded. The method of claim 8, The lower portion of the reflective plate is a printed circuit board further comprises a barrier (barrier) to block the flow of the adhesive sheet component so that the adhesive sheet component does not leak to the cavity side when the wiring board and the reflective plate is bonded. The printed circuit board of any one of claims 1 to 6 and 8 to 10; And Light emitting device package comprising a light emitting device electrically connected to the printed circuit board. The printed circuit board of any one of claims 1 to 6; And Including a light emitting device electrically connected to the printed circuit board, The first cavity is filled with a phosphor, the second cavity is filled with a resin, characterized in that the light emitting device package.

Images