TWI490426B - Light emitting device - Google Patents

Light emitting device Download PDF

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TWI490426B
TWI490426B TW100127063A TW100127063A TWI490426B TW I490426 B TWI490426 B TW I490426B TW 100127063 A TW100127063 A TW 100127063A TW 100127063 A TW100127063 A TW 100127063A TW I490426 B TWI490426 B TW I490426B
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light
substrate
emitting
modules
layer body
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TW201305488A (en
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Tai An Hung
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Description

發光裝置Illuminating device

本發明是有關於一種發光模組,特別是指一種適於作為大面積的發光源的發光模組。The invention relates to a lighting module, in particular to a lighting module suitable as a large-area illumination source.

參閱圖1,目前的發光裝置1,若需要大面積範圍地發光,例如作為背光源,通常需要將多個發光模組11先全部排列整齊放置,接著分別將該每一發光模組11以打上金線、焊錫,或點銀膠等方式將彼此連結且電連接(圖1是以打上金線12表示),如此,當外界對該等發光模組11供電時,該等發光模組11則可整體向外發光,而得到大面積發光的發光裝置1。Referring to FIG. 1 , in the current illumination device 1 , if a large area of illumination is required, for example, as a backlight, it is generally required to arrange all of the plurality of illumination modules 11 in a neat manner, and then each of the illumination modules 11 is respectively labeled. Gold wires, solders, or silver dots are connected and electrically connected to each other (indicated by the gold wire 12 in FIG. 1). Thus, when the external light is supplied to the light-emitting modules 11, the light-emitting modules 11 are The light-emitting device 1 that emits light over a large area can be obtained by emitting light outward.

由圖1可看出,雖然利用多數個發光模組11彼此電連接後可製作出大面積的發光源,但由於該些發光模組11排列時,相鄰的兩發光模組11間必然存在著間隙13,而間隙13無法產生光,所以,在該發光裝置1發光時,該些間隙13都是不會發光的暗處,導致元件發光時會產生暗點,而使得整體發光的均勻度不佳;二來,因為該等發光模組11頂面的金線12,或是將該些發光模組11彼此電連接的焊錫等都是由不透光的材料構成,因此,造成該些發光模組11發出的光被分佈於該些發光模組11頂面的不透光材料遮蔽,而使該發光裝置1還具有發光亮度較低的缺點。It can be seen from FIG. 1 that although a plurality of light-emitting modules 11 are electrically connected to each other to form a large-area light-emitting source, since the light-emitting modules 11 are arranged, the adjacent two light-emitting modules 11 are necessarily present. The gap 13 is absent, and the gap 13 cannot generate light. Therefore, when the light-emitting device 1 emits light, the gaps 13 are dark places that do not emit light, which causes a dark spot to be generated when the component emits light, so that the uniformity of the overall illumination is achieved. Poorly; secondly, because the gold wires 12 on the top surface of the light-emitting module 11 or the solders electrically connecting the light-emitting modules 11 to each other are made of an opaque material, The light emitted by the light-emitting module 11 is shielded by the opaque material distributed on the top surface of the light-emitting modules 11, so that the light-emitting device 1 has the disadvantage of low luminance.

因此,本發明之目的,即在提供一種可以降低遮光率與增加光均勻度,並適用於大面積發光的發光裝置。Accordingly, it is an object of the present invention to provide a light-emitting device which can reduce the light-shielding rate and increase the light uniformity, and is suitable for large-area light emission.

於是,本發明的發光裝置,包含多數個彼此疊置排列的發光模組,該每一發光模組具有一供電導通的基板、一設置於該基板上並在供電時以光電效應產生光的作動單元,及一包括一設置於該作動單元上的透明電極的電極單元,且任兩相鄰的發光模組是將其中一發光模組的基板的部份區域疊置於另一相鄰的發光模組的電極單元的部份區域上而彼此電連接。Therefore, the light-emitting device of the present invention comprises a plurality of light-emitting modules arranged one above another, each of the light-emitting modules having a power-conducting substrate, an operation disposed on the substrate and generating light by photoelectric effect during power supply. a unit, and an electrode unit including a transparent electrode disposed on the actuating unit, and any two adjacent light emitting modules are stacked on another adjacent portion of the substrate of one of the light emitting modules Portions of the electrode units of the module are electrically connected to each other.

本發明之功效:利用複數個具有基板的發光模組彼此疊置並電連接而形成一可大面積發光的發光裝置,有效避免習知因相鄰發光模組之間的間隙造成整體發光不均勻的問題,而適於作為大面積的發光源。The effect of the invention is that a plurality of light-emitting modules with substrates are stacked on each other and electrically connected to form a light-emitting device capable of emitting light with a large area, thereby effectively avoiding the uniform uneven illumination caused by the gap between adjacent light-emitting modules. The problem is suitable as a large-area light source.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之二個較佳實施例的詳細說明中,將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.

在本發明被詳細描述之前,要注意的是,在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

參閱圖2、圖3,本發明發光裝置的一第一較佳實施例包含多數個彼此電連接,並可在接受電能時發光的發光模組2。Referring to Figures 2 and 3, a first preferred embodiment of the illumination device of the present invention comprises a plurality of illumination modules 2 that are electrically connected to each other and that emit light when receiving electrical energy.

該每一個發光模組2包括一基板21、一設置於該基板21上的作動單元22,及一遮覆該作動單元22的電極單元23。Each of the light-emitting modules 2 includes a substrate 21, an actuation unit 22 disposed on the substrate 21, and an electrode unit 23 covering the actuation unit 22.

詳細地說,該基板21整體可導電並與外界電導通,且包括一第一層體211,及一形成於該第一層體211上的第二層體212。較佳地,該基板21的第一層體211是選自包括銅、鐵、鉻、鎳,及其中之一組合的合金材料構成,並呈薄片狀。更佳地,該基板21是選自具有重量百分比不小於60%的鐵,重量百分比不小於15%的鉻,及重量百分比不小於8%的鎳,也就是俗稱的「白鐵」,所構成,該以白鐵為材料構成的基板21的導電性佳,且可延展成薄片狀。該基板21的第二層體212是以金屬為主要材料所構成,較佳地,是以鉬為材料構成於該第一層體211上。In detail, the substrate 21 is electrically conductive and electrically conductive to the outside, and includes a first layer body 211 and a second layer body 212 formed on the first layer body 211. Preferably, the first layer body 211 of the substrate 21 is made of an alloy material selected from the group consisting of copper, iron, chromium, nickel, and a combination thereof, and is in the form of a sheet. More preferably, the substrate 21 is selected from the group consisting of iron having a weight percentage of not less than 60%, chromium having a weight percentage of not less than 15%, and nickel having a weight percentage of not less than 8%, which is commonly known as "white iron". The substrate 21 made of white iron is excellent in electrical conductivity and can be stretched into a sheet shape. The second layer body 212 of the substrate 21 is made of a metal as a main material, and preferably is made of molybdenum as a material on the first layer body 211.

需說明的是,由於該第一層體211及該第二層體212皆是導體,因此該基板21整體皆導電;此外,由於以白鐵構成的第一層體211為可撓曲的薄片,而第二層體212是沈積於該第一層體211上的薄膜,故該基板21具有可撓曲的特性。It should be noted that since the first layer body 211 and the second layer body 212 are both conductors, the substrate 21 is electrically conductive as a whole; further, since the first layer body 211 made of white iron is a flexible sheet, The second layer body 212 is a film deposited on the first layer body 211, so that the substrate 21 has a flexible property.

每一發光模組2的該作動單元22整體呈薄膜(thin film)狀地設置於該基板21的表面,並在供電時發光;在該第一較佳實施例中,該作動單元22是用磊晶的方式於該基板21上形成n型傳導層(n-type cladding layer)、p型傳導層(p-type cladding layer)與一夾置於n、p型傳導層間的主動層(active layer)的發光二極體(LED)結構作說明(圖未個別標示出)。除此之外,其它包括例如有機發光二極體結構,或其它型態的發光模組2也都適用。The actuating unit 22 of each of the light-emitting modules 2 is integrally disposed on the surface of the substrate 21 in a thin film shape and emits light during power supply. In the first preferred embodiment, the actuating unit 22 is used. An epitaxial manner forms an n-type cladding layer, a p-type cladding layer, and an active layer sandwiched between the n- and p-type conductive layers on the substrate 21. The structure of the light-emitting diode (LED) is illustrated (not individually shown). In addition, other light-emitting modules 2 including, for example, an organic light-emitting diode structure, or other types are also applicable.

該每一發光模組2的電極單元23設置於該作動單元22上,並包括一與該作動單元22連結的透明電極231,該透明電極231呈薄膜狀地形成於該作動單元22相反於該基板21的表面,並遮覆該作動單元22的整個表面。該透明電極231以可透光的導電材料構成,例如金屬氧化物、極薄到微米尺寸的金屬薄膜等,並可供電流橫向均勻擴散;較佳地,該透明電極231為選自可透光的金屬氧化物構成,且該透明電極231的厚度約為1~2微米。由於該透明電極231的材料選擇為本技術領域者所知悉,因此,不再多加贅述。於本較佳實施例中,為了對應該作動單元22是發光二極體(LED)結構,因此,該透明電極231是選自銦錫氧化物(ITO)為構成材料。The electrode unit 23 of each of the light-emitting modules 2 is disposed on the actuating unit 22 and includes a transparent electrode 231 coupled to the actuating unit 22, and the transparent electrode 231 is formed in a film shape on the actuating unit 22 opposite to the The surface of the substrate 21 covers the entire surface of the actuating unit 22. The transparent electrode 231 is made of a light-transmissive conductive material, such as a metal oxide, a thin film of a very thin to micron size, and the like, and the current can be uniformly diffused laterally; preferably, the transparent electrode 231 is selected from the group consisting of light permeable. The metal oxide is formed, and the transparent electrode 231 has a thickness of about 1 to 2 μm. Since the material selection of the transparent electrode 231 is known to those skilled in the art, no further description is provided. In the preferred embodiment, in order to correspond to the operation of the unit 22 as a light-emitting diode (LED) structure, the transparent electrode 231 is selected from indium tin oxide (ITO) as a constituent material.

該每一發光模組2的電極單元23還包括一設置於該透明電極231上並與該透明電極231歐姆接觸的指叉形電極232。該指叉形電極232與該透明電極231相配合而可傳送來自外界的電能並供電導通。在圖3中,指叉形電極232是多數排列成排的長條,當然也可是該等長條彼此交錯的圖形,由於所能排列的方法眾多,且不為本發明的重點,故在此不再多加贅述。The electrode unit 23 of each of the light-emitting modules 2 further includes a finger-shaped electrode 232 disposed on the transparent electrode 231 and in ohmic contact with the transparent electrode 231. The finger-shaped electrode 232 cooperates with the transparent electrode 231 to transmit electrical energy from the outside and to supply power. In FIG. 3, the interdigitated electrodes 232 are a plurality of strips arranged in a plurality of rows. Of course, the strips are interlaced with each other. Since there are many methods for arranging the arrays, and are not the focus of the present invention, No more details.

就前述該每一獨立的發光模組2而言,該發光模組2的可導電的基板21與該指叉形電極232相配合作而可接受外界的電能。當外界的電流經由該基板21與該電極單元23傳送至該發光模組2時,該透明電極231將電流橫向均勻擴散,再流至該作動單元22,該作動單元22將電能轉換成光能而發光,而發出的光線主要會朝向該透明電極231行進而向外界發光。For each of the independent light-emitting modules 2, the conductive substrate 21 of the light-emitting module 2 and the finger-shaped electrode 232 cooperate to receive external electric energy. When an external current is transmitted to the light emitting module 2 via the substrate 21 and the electrode unit 23, the transparent electrode 231 uniformly diffuses the current laterally and flows to the operating unit 22, and the operating unit 22 converts the electrical energy into light energy. The light is emitted, and the emitted light mainly travels toward the transparent electrode 231 to emit light to the outside.

此外,該些發光模組2是將任一發光模組2的基板21的部份區域與另一相鄰之發光模組2的電極單元23的指叉形電極232的部份區域彼此疊置,且由於是以疊置的方式連結,而同時遮覆該指叉形電極232下的透明電極231,並利用基板21與指叉形電極232都可導電的特性而令該些發光模組2可彼此無間隙的電連結。由於該些發光模組2彼此為無間隙的電連結,因此,不像習知,以多數個發光模組組成大面積發光裝置時,會因間隙而有暗點產生,導致發光不均勻的缺點;此外,由於該些發光模組2彼此是以可導電的基板21與相鄰的電極單元23電連接,因此,而也不需針對每一發光模組2進行額外的打線而可更簡化製程。In addition, the light-emitting module 2 overlaps a partial region of the substrate 21 of any of the light-emitting modules 2 with a partial region of the finger-shaped electrode 232 of the electrode unit 23 of another adjacent light-emitting module 2 And the light-emitting module 2 is configured to be connected in a stacked manner while covering the transparent electrode 231 under the finger-shaped electrode 232, and the substrate 21 and the finger-shaped electrode 232 are electrically conductive. Electrical connections can be made without gaps. Since the light-emitting modules 2 are electrically connected to each other without a gap, unlike conventional ones, when a large-area light-emitting device is composed of a plurality of light-emitting modules, dark spots are generated due to the gap, resulting in uneven illumination. In addition, since the light-emitting modules 2 are electrically connected to each other by the conductive substrate 21 and the adjacent electrode units 23, it is not necessary to perform additional wire bonding for each of the light-emitting modules 2, which simplifies the process. .

為使說明該等發光模組2重疊的方式更加簡易明瞭,茲將其中任兩相鄰的發光模組2的其中之一稱為發光模組2a,其中另一個與該發光模組2a相鄰的發光模組2稱為發光模組2b,該等發光模組2的連接態樣是將該發光模組2a、2b朝向同方向排列(該等發光模組2的基板21皆朝向下,該等發光模組2的電極單元23皆朝向上),且以該發光模組2a鄰近該發光模組2b的基板21表面的預定區域靠疊連結於該發光模組2b的電極單元23的指叉形電極232的預定區域上。由於該發光模組2b的指叉形電極232疊置於該發光模組2a的基板21下,因此該發光模組2b的透明電極231亦被該發光模組2a所遮覆,而使得該發光模組2a及該發光模組2b形成無間隙的重疊連接,並在連接的同時彼此形成電性上的串聯而彼此電連接。特別地,由於該第一較佳實施例的基板21可撓曲,因此任一發光模組2可撓曲並如圖3所示自然地疊置於相鄰的發光模組2的電極單元23表面。In order to clarify the manner in which the light-emitting modules 2 are superimposed, one of the two adjacent light-emitting modules 2 is referred to as a light-emitting module 2a, and the other one is adjacent to the light-emitting module 2a. The light-emitting module 2 is referred to as a light-emitting module 2b, and the light-emitting modules 2 are connected in such a manner that the light-emitting modules 2a, 2b are aligned in the same direction (the substrates 21 of the light-emitting modules 2 are all facing downwards, The electrode unit 23 of the light-emitting module 2 is facing upwards, and the finger of the electrode unit 23 of the light-emitting module 2b is connected to the predetermined area of the surface of the substrate 21 of the light-emitting module 2b. The predetermined area of the shaped electrode 232. The transparent electrode 231 of the light-emitting module 2b is also covered by the light-emitting module 2a, so that the light-emitting module 2b is disposed on the substrate 21 of the light-emitting module 2a. The module 2a and the light-emitting module 2b form a gap-free overlapping connection, and are electrically connected to each other while being connected to each other and electrically connected to each other. In particular, since the substrate 21 of the first preferred embodiment can be flexed, any of the light-emitting modules 2 can be flexed and naturally stacked on the electrode unit 23 of the adjacent light-emitting module 2 as shown in FIG. surface.

當外界電能經由頭、尾的發光模組2的透明電極231與基板21配合提供時(圖未示出),該等成排連接的發光模組2即作動而發光。由於該等發光模組2彼此成無間隙地重疊連結,而不會發生如目前的發光裝置的兩相鄰模組間的間隙所形成的暗點,也避免形成面光源亮度分佈不均,或是出現明、暗交替的情形;此外,由於該等發光模組2的基板21皆可撓曲,因此疊置所成的發光裝置仍可實質呈平板狀,而特別適合應用於例如顯示器背光源等的大面積光源。When the external electric energy is supplied through the transparent electrode 231 of the head and tail of the light-emitting module 2 and the substrate 21 (not shown), the light-emitting modules 2 connected in series are activated to emit light. Since the light-emitting modules 2 are overlapped with each other without gaps, dark spots formed by gaps between two adjacent modules of the current light-emitting device do not occur, and uneven distribution of brightness of the surface light source is also avoided, or In addition, since the substrate 21 of the light-emitting module 2 can be flexed, the stacked light-emitting devices can still be substantially flat, and are particularly suitable for application, for example, in display backlights. Large area light source.

特別要說明的是,該等發光模組2彼此以重疊的方式連結時,其中任一發光模組2的透明電極231沿該發光模組2延伸方向且未受遮覆(即裸露且不與其餘發光模組2的基板21連結)之區域的寬度W須不大於20毫米(mm),且該透明電極231的厚度不小於0.1微米(μm);較佳地,該寬度W須不大於10毫米(mm),該透明電極231的厚度不小於1微米(μm),如此,可令電流快速地橫向均勻擴散。In particular, when the light-emitting modules 2 are connected to each other in an overlapping manner, the transparent electrode 231 of any one of the light-emitting modules 2 extends along the direction in which the light-emitting module 2 extends and is not covered (ie, bare and does not The width W of the region where the substrate 21 of the remaining light-emitting module 2 is connected is not more than 20 millimeters (mm), and the thickness of the transparent electrode 231 is not less than 0.1 micrometer (μm); preferably, the width W is not more than 10 In the millimeter (mm), the thickness of the transparent electrode 231 is not less than 1 micrometer (μm), so that the current can be quickly and uniformly spread laterally uniformly.

此外,該等發光模組2排列連結的方式,亦可以視實際需要連接成頭尾相連的環形,或是例如波浪狀、弧形、多邊形....等,且彼此間的電性也可以透過基板21與電極單元23間少許變動而成並聯、或是部分串聯、部分並聯等,由於此等連接而成的態樣眾多,在此不再一一舉例說明。In addition, the manner in which the light-emitting modules 2 are arranged and connected may also be connected in a ring shape connected end to end according to actual needs, or may be, for example, a wave shape, an arc shape, a polygon shape, etc., and the electrical properties of each other may also be The substrate 21 and the electrode unit 23 are slightly changed in parallel to form a parallel connection, or a partial connection, a partial parallel connection, etc., and since such a connection is numerous, it will not be exemplified herein.

參閱圖4,本發明發光裝置的一第二較佳實施例與該第一較佳實施例相似,其不同處在於該每一發光模組2的基板21包括一絕緣的第一層體213、一形成於該第一層體213並貫穿第一層體213的穿孔214、一填覆滿該穿孔214且可導電的連接體215,及一形成於第一層體213其中一表面並與該連接體215電連接的第二層體212。該第一層體213是選自例如聚酯、壓克力、聚碳酸酯等絕緣塑膠材料構成;該連接體215是選自銅、鋁等導電性佳的金屬材料,該第二層體212則是選自金屬元素、合金金屬、金屬氧化物等導電性佳的材料構成。Referring to FIG. 4, a second preferred embodiment of the illuminating device of the present invention is similar to the first preferred embodiment, except that the substrate 21 of each of the illuminating modules 2 includes an insulating first layer body 213, a through hole 214 formed in the first layer body 213 and penetrating through the first layer body 213, a conductive body 215 filling the through hole 214, and a surface formed on the first layer body 213 and The second layer body 212 electrically connected to the connector 215. The first layer body 213 is made of an insulating plastic material selected from, for example, polyester, acryl, polycarbonate, etc.; the connecting body 215 is a metal material selected from copper, aluminum, etc., and the second layer body 212 is electrically conductive. It is made of a material having good conductivity such as a metal element, an alloy metal, or a metal oxide.

較佳地,該第二層體212以鉬為主要材料所構成,而具備導電的特性。Preferably, the second layer body 212 is made of molybdenum as a main material and has electrical conductivity.

藉由將任一發光模組2的連接體215疊置並連結於另一相鄰的發光模組2的電極單元23的指叉形電極232的預定區域上,亦可以形成電連接而在供電時發光,並在發光時不會產生兩相鄰發光模組2間的間隙所形成的暗點,而可發出大面積且均勻的面型光。The electrical connection can also be formed by stacking the connection body 215 of any of the light-emitting modules 2 and connecting it to a predetermined area of the finger-shaped electrode 232 of the electrode unit 23 of another adjacent light-emitting module 2. When the light is emitted, the dark spots formed by the gaps between the two adjacent light-emitting modules 2 are not generated when the light is emitted, and a large-area and uniform surface light can be emitted.

參閱圖5,需說明的是,本發明發光裝置的該第一、二較佳實施例的任一發光模組2的基板21中疊置於相鄰發光模組2的電極單元23的區域的厚度小於同一發光模組2的基板21未疊置於相鄰發光模組2的電極單元23的厚度(圖5是以該第一較佳實施例為例)。再詳細地說,疊置於相鄰電極單元23上的基板21較未疊置於相鄰電極單元23的基板21是削減部份厚度,進而可降低整體發光裝置因為基板21的高度所造成的側向遮光問題,且可進一步提升該發光裝置整體的平整度,也可經由任一發光模組2的基板21形成厚度差的相對位置供相鄰發光模組2的疊置位置作界定而可更為精確。Referring to FIG. 5, it is to be noted that the substrate 21 of any one of the first and second preferred embodiments of the light-emitting device of the present invention is stacked on the substrate 21 of the adjacent light-emitting module 2 The substrate 21 having a thickness smaller than that of the substrate 2 of the same light-emitting module 2 is not stacked on the thickness of the electrode unit 23 of the adjacent light-emitting module 2 (FIG. 5 is an example of the first preferred embodiment). In detail, the substrate 21 stacked on the adjacent electrode unit 23 is thinner than the substrate 21 not stacked on the adjacent electrode unit 23, thereby reducing the overall light-emitting device due to the height of the substrate 21. The problem of the lateral light-shielding problem can further improve the flatness of the light-emitting device as a whole, and the relative position of the thickness difference can be formed through the substrate 21 of any of the light-emitting modules 2 for the overlapping positions of the adjacent light-emitting modules 2 to be defined. More precise.

參閱圖6,本發明發光裝置第一、二較佳實施例發光裝置還可包含一設置於該等發光模組2上的擴光膜3,使該等作動單元22產生的光先經過該等透明電極231,再透過該擴光膜3後,而令光更均勻且柔和地向外發光;圖6是以圖所示的第一較佳實施例的發光裝置再增加擴光膜3為例作說明。特別地,也可直接在該等發光模組2上覆蓋一層薄膜狀的擴光膜3,同樣可達到柔化光源的功效。Referring to FIG. 6 , the light-emitting device of the first and second preferred embodiments of the present invention may further include a light-expanding film 3 disposed on the light-emitting modules 2, such that the light generated by the actuating units 22 passes through the first light. The transparent electrode 231 is further transmitted through the light-expanding film 3 to make the light emit light more uniformly and softly. FIG. 6 is an example of the light-emitting device of the first preferred embodiment shown in FIG. Give instructions. In particular, it is also possible to directly cover the light-emitting modules 2 with a film-like light-expanding film 3, which can also achieve the effect of softening the light source.

綜上所述,本發明發光裝置利用多數個基板21的發光模組2疊置成一可大面積、無發光模組間的間隙所形成的暗點,且可均勻發光的發光裝置,而適合應用於作為顯示器的背光源或大面積發光看板等,故確實能達成本發明之目的。In summary, the illuminating device of the present invention utilizes the illuminating modules 2 of the plurality of substrates 21 to be stacked into a dark spot formed by a gap between the large-area and non-light-emitting modules, and can uniformly emit light, and is suitable for application. As a backlight of a display or a large-area illuminating kanban, it is indeed possible to achieve the object of the present invention.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

2‧‧‧發光模組2‧‧‧Lighting module

2a‧‧‧發光模組2a‧‧‧Lighting module

2b‧‧‧發光模組2b‧‧‧Lighting Module

21‧‧‧基板21‧‧‧Substrate

211‧‧‧第一層體211‧‧‧ first layer

212‧‧‧第二層體212‧‧‧Second layer

213‧‧‧第一層體213‧‧‧ first layer

214‧‧‧穿孔214‧‧‧Perforation

215‧‧‧連接體215‧‧‧Connector

22‧‧‧作動單元22‧‧‧Operating unit

23‧‧‧電極單元23‧‧‧Electrode unit

231‧‧‧透明電極231‧‧‧Transparent electrode

232‧‧‧指叉形電極232‧‧‧Finger-shaped electrode

3‧‧‧擴光膜3‧‧‧Expanding film

W‧‧‧寬度W‧‧‧Width

圖1是一剖視示意圖,說明目前發光裝置的多數個發光模組彼此間存在間隙;圖2是一立體圖,說明本發明發光裝置一第一較佳實施例的一發光模組;圖3是一剖視示意圖,說明本發明發光裝置一第一較佳實施例;圖4是一剖視示意圖,說明本發明發光裝置一第二較佳實施例;圖5是一剖視示意圖,說明本發明發光裝置疊置於相鄰的電極單元上的基板的厚度小於較未疊置於相鄰電極單元上的基板的厚度;及圖6是一剖視示意圖,說明本發明發光裝置還包含一擴光膜。1 is a schematic cross-sectional view showing a plurality of light-emitting modules of a light-emitting device having a gap therebetween; FIG. 2 is a perspective view showing a light-emitting module of a first preferred embodiment of the light-emitting device of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a cross-sectional view showing a second preferred embodiment of a light-emitting device of the present invention; FIG. 5 is a cross-sectional view showing the present invention. The thickness of the substrate on which the illuminating device is stacked on the adjacent electrode unit is smaller than the thickness of the substrate which is not stacked on the adjacent electrode unit; and FIG. 6 is a schematic cross-sectional view showing that the illuminating device of the present invention further comprises a light-expanding device membrane.

2...發光模組2. . . Light module

2a...發光模組2a. . . Light module

2b...發光模組2b. . . Light module

21...基板twenty one. . . Substrate

211...第一層體211. . . First layer

212...第二層體212. . . Second layer

22...作動單元twenty two. . . Actuating unit

23...電極單元twenty three. . . Electrode unit

231...透明電極231. . . Transparent electrode

232...指叉形電極232. . . Finger fork electrode

W...寬度W. . . width

Claims (5)

一種發光裝置,包含:多數個彼此疊置排列的發光模組,該每一發光模組具有一供電導通的基板、一設置於該基板上並在供電時以光電效應產生光的作動單元,及一包括一設置於該作動單元上的透明電極的電極單元,且任兩相鄰的發光模組是將其中一發光模組的基板的部份區域疊置於另一相鄰的發光模組的電極單元的部份區域上而彼此電連接,該每一發光模組的基板包括一第一層體,及一疊置於該第一層體上且位於該第一層體與該作動單元間的第二層體,其中,該第一層體與相鄰發光模組疊置區域的厚度小於未與相鄰發光模組疊置區域的厚度,並由具有重量百分比不小於60%的鐵,重量百分比不小於15%的鉻,及重量百分比不小於8%的鎳的不銹鋼材料所構成,且具有可撓性,該第二層體的構成材料為金屬,可供電流均勻擴散。 A light-emitting device comprising: a plurality of light-emitting modules arranged one above another, each light-emitting module having a power-conducting substrate, an actuating unit disposed on the substrate and generating light by photoelectric effect during power supply, and An electrode unit including a transparent electrode disposed on the actuating unit, and any two adjacent light emitting modules are stacked on a portion of the substrate of one of the light emitting modules in another adjacent light emitting module a portion of the electrode unit is electrically connected to each other, the substrate of each of the light emitting modules includes a first layer body, and a stack is disposed on the first layer body and located between the first layer body and the actuation unit The second layer body, wherein the thickness of the overlapping area of the first layer body and the adjacent light emitting module is smaller than the thickness of the area not overlapped with the adjacent light emitting module, and the iron has a weight percentage of not less than 60%. It is composed of a stainless steel material having a weight percentage of not less than 15% and a nickel content of not less than 8% by weight, and has flexibility. The second layer body is made of a metal material for uniform current diffusion. 依據申請專利範圍第1項所述之發光裝置,其中,該每一發光模組的電極單元還包括一設置於該透明電極表面的指叉形電極,且任兩相鄰的發光模組是將其中一發光模組的基板的部份區域與另一相鄰的發光模組的指叉形電極歐姆接觸而彼此電連接。 The illuminating device of the first aspect of the invention, wherein the electrode unit of each of the illuminating modules further comprises a finger-shaped electrode disposed on the surface of the transparent electrode, and any two adjacent illuminating modules are A portion of the substrate of one of the light-emitting modules is in ohmic contact with the finger-shaped electrodes of another adjacent light-emitting module and is electrically connected to each other. 依據申請專利範圍第1項所述之發光裝置,其中,每一發光模組的基板的第二層體以鉬為主要材料所構成。 The illuminating device according to claim 1, wherein the second layer of the substrate of each of the illuminating modules is made of molybdenum as a main material. 依據申請專利範圍第1項所述之發光裝置,其中,該透 明電極的厚度不小於0.2微米。 According to the illuminating device of claim 1, wherein the illuminating device The thickness of the bright electrode is not less than 0.2 μm. 依據申請專利範圍第1項所述之發光裝置,還包含一遮覆該等發光模組頂面而供光均勻發出的擴光膜。 The illuminating device according to claim 1, further comprising a light-expanding film covering the top surface of the illuminating module for uniformly emitting light.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239078B (en) * 2002-03-28 2005-09-01 Seiko Epson Corp Semiconductor device and the manufacturing method thereof, photoelectric device, liquid crystal display, and electronic machine
TWI304659B (en) * 2004-11-19 2008-12-21 Fujikura Ltd Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239078B (en) * 2002-03-28 2005-09-01 Seiko Epson Corp Semiconductor device and the manufacturing method thereof, photoelectric device, liquid crystal display, and electronic machine
TWI304659B (en) * 2004-11-19 2008-12-21 Fujikura Ltd Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device

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