CN100433391C - 一种采用多孔金属材料作为散热装置的大功率发光二极管 - Google Patents
一种采用多孔金属材料作为散热装置的大功率发光二极管 Download PDFInfo
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- CN100433391C CN100433391C CNB2006101549401A CN200610154940A CN100433391C CN 100433391 C CN100433391 C CN 100433391C CN B2006101549401 A CNB2006101549401 A CN B2006101549401A CN 200610154940 A CN200610154940 A CN 200610154940A CN 100433391 C CN100433391 C CN 100433391C
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- metal material
- porous metal
- emitting diodes
- heat
- power light
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- 239000007769 metal material Substances 0.000 title claims abstract description 57
- 229910052782 aluminium Inorganic materials 0.000 claims description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 238000013461 design Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 4
- 229920002472 Starch Polymers 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- 239000008107 starch Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 8
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 9
- 230000010354 integration Effects 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101549401A CN100433391C (zh) | 2006-11-30 | 2006-11-30 | 一种采用多孔金属材料作为散热装置的大功率发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101549401A CN100433391C (zh) | 2006-11-30 | 2006-11-30 | 一种采用多孔金属材料作为散热装置的大功率发光二极管 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1964092A CN1964092A (zh) | 2007-05-16 |
CN100433391C true CN100433391C (zh) | 2008-11-12 |
Family
ID=38083054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101549401A Active CN100433391C (zh) | 2006-11-30 | 2006-11-30 | 一种采用多孔金属材料作为散热装置的大功率发光二极管 |
Country Status (1)
Country | Link |
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CN (1) | CN100433391C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9287440B2 (en) | 2010-04-05 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing a semiconductor device including through silicon plugs |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110065864A (ko) * | 2009-12-10 | 2011-06-16 | 주식회사 알란텀 | Led 냉각 장치 |
CN102368482B (zh) * | 2011-10-10 | 2013-06-19 | 李再林 | 多孔金属结构的高效散热器 |
CN102661524A (zh) * | 2012-05-02 | 2012-09-12 | 浙江全加好科技有限公司 | 一种设有金属散热装置的大功率led线条灯具 |
CN102705794A (zh) * | 2012-05-02 | 2012-10-03 | 浙江全加好科技有限公司 | 一种用于大功率led灯具的不规则多孔板金属散热装置 |
CN104197290A (zh) * | 2014-09-16 | 2014-12-10 | 合肥徽彩电子科技有限公司 | 一种led灯用泡沫金属散热器 |
CN104406074B (zh) * | 2014-11-28 | 2017-04-05 | 浙江晶日照明科技有限公司 | 一种集成式的led模块 |
CN108172554B (zh) * | 2018-03-27 | 2024-02-06 | 梧州三和新材料科技有限公司 | 一种高导热和高热辐射片及其制备方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0559092A1 (en) * | 1992-03-05 | 1993-09-08 | Texas Instruments Incorporated | Metal foam heat dissipator |
JPH08335652A (ja) * | 1995-06-09 | 1996-12-17 | Mitsubishi Materials Corp | パワーモジュール用基板及びその製造方法 |
JPH0951151A (ja) * | 1995-08-09 | 1997-02-18 | Mitsubishi Materials Corp | パワーモジュール用回路基板及びその製造方法 |
JP2002237556A (ja) * | 2001-02-09 | 2002-08-23 | Mitsubishi Electric Corp | パワー半導体装置 |
WO2002093644A2 (de) * | 2001-05-14 | 2002-11-21 | M.Pore Gmbh | Wärmetauscher |
US6631078B2 (en) * | 2002-01-10 | 2003-10-07 | International Business Machines Corporation | Electronic package with thermally conductive standoff |
CN1466782A (zh) * | 2001-08-28 | 2004-01-07 | ���µ繤��ʽ���� | 使用led的发光装置 |
CN1608326A (zh) * | 2001-12-29 | 2005-04-20 | 杭州富阳新颖电子有限公司 | 发光二极管及其发光二极管灯 |
DE102004021810A1 (de) * | 2004-05-03 | 2005-12-01 | Conti Temic Microelectronic Gmbh | Elektronisches Bauelement sowie Verfahren zur Herstellung eines elektronischen Bauelementes |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
-
2006
- 2006-11-30 CN CNB2006101549401A patent/CN100433391C/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0559092A1 (en) * | 1992-03-05 | 1993-09-08 | Texas Instruments Incorporated | Metal foam heat dissipator |
JPH08335652A (ja) * | 1995-06-09 | 1996-12-17 | Mitsubishi Materials Corp | パワーモジュール用基板及びその製造方法 |
JPH0951151A (ja) * | 1995-08-09 | 1997-02-18 | Mitsubishi Materials Corp | パワーモジュール用回路基板及びその製造方法 |
JP2002237556A (ja) * | 2001-02-09 | 2002-08-23 | Mitsubishi Electric Corp | パワー半導体装置 |
WO2002093644A2 (de) * | 2001-05-14 | 2002-11-21 | M.Pore Gmbh | Wärmetauscher |
CN1466782A (zh) * | 2001-08-28 | 2004-01-07 | ���µ繤��ʽ���� | 使用led的发光装置 |
CN1608326A (zh) * | 2001-12-29 | 2005-04-20 | 杭州富阳新颖电子有限公司 | 发光二极管及其发光二极管灯 |
US6631078B2 (en) * | 2002-01-10 | 2003-10-07 | International Business Machines Corporation | Electronic package with thermally conductive standoff |
DE102004021810A1 (de) * | 2004-05-03 | 2005-12-01 | Conti Temic Microelectronic Gmbh | Elektronisches Bauelement sowie Verfahren zur Herstellung eines elektronischen Bauelementes |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9287440B2 (en) | 2010-04-05 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing a semiconductor device including through silicon plugs |
US10049931B2 (en) | 2010-04-05 | 2018-08-14 | Taiwan Semicondutor Manufacturing Company, Ltd. | Method of manufacturing a semiconductor device including through silicon plugs |
US10497619B2 (en) | 2010-04-05 | 2019-12-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing a semiconductor device including through silicon plugs |
Also Published As
Publication number | Publication date |
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CN1964092A (zh) | 2007-05-16 |
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Effective date of registration: 20140410 Address after: Three 310030 Hangzhou Road, Zhejiang province Xihu District Xiyuan No. 10 Building 1, 4 floor West Patentee after: ZHEJIANG YUANTU INTELLIGENCE CONTROL SYSTEM CO., LTD. Address before: 1311, room 398, Dongfang communication building, No. Wensanlu Road, Xihu District, Zhejiang, Hangzhou, Patentee before: He Yongxiang |
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Address after: 310000 west side, 4th floor, building 1, No. 10, xiyuansan Road, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province Patentee after: ZHEJIANG YUANTU INTERCONNECTION TECHNOLOGY Co.,Ltd. Address before: 310030 west side, 4th floor, building 1, No.10 xiyuansan Road, Xihu District, Hangzhou City, Zhejiang Province Patentee before: ZHEJIANG YUANTU INTELLIGENCE CONTROL SYSTEM Co.,Ltd. |
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Address after: 310000 1st floor, building 5, No. 2, Xiyuan 8th Road, Xihu District, Hangzhou, Zhejiang Patentee after: Zhejiang Yuantu Technology Co.,Ltd. Address before: 310000 west side, 4th floor, building 1, No. 10, xiyuansan Road, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province Patentee before: ZHEJIANG YUANTU INTERCONNECTION TECHNOLOGY CO.,LTD. |
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