TWI757532B - 半導體裝置 - Google Patents

半導體裝置 Download PDF

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Publication number
TWI757532B
TWI757532B TW107128124A TW107128124A TWI757532B TW I757532 B TWI757532 B TW I757532B TW 107128124 A TW107128124 A TW 107128124A TW 107128124 A TW107128124 A TW 107128124A TW I757532 B TWI757532 B TW I757532B
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Taiwan
Prior art keywords
conductive layer
layer
oxide semiconductor
thin film
wiring
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TW107128124A
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English (en)
Chinese (zh)
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TW201921494A (zh
Inventor
山崎舜平
秋元健吾
小森茂樹
魚地秀貴
二村智哉
笠原崇廣
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日商半導體能源研究所股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136204—Arrangements to prevent high voltage or static electricity failures
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Shift Register Type Memory (AREA)
  • Bipolar Transistors (AREA)
  • Noodles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
TW107128124A 2008-09-19 2009-09-16 半導體裝置 TWI757532B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008241645 2008-09-19
JP2008-241645 2008-09-19

Publications (2)

Publication Number Publication Date
TW201921494A TW201921494A (zh) 2019-06-01
TWI757532B true TWI757532B (zh) 2022-03-11

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Family Applications (7)

Application Number Title Priority Date Filing Date
TW107128124A TWI757532B (zh) 2008-09-19 2009-09-16 半導體裝置
TW104100539A TWI569424B (zh) 2008-09-19 2009-09-16 顯示裝置
TW101126261A TWI467698B (zh) 2008-09-19 2009-09-16 顯示裝置
TW098131225A TWI478306B (zh) 2008-09-19 2009-09-16 顯示裝置
TW105135727A TWI641118B (zh) 2008-09-19 2009-09-16 顯示裝置
TW112133517A TW202403881A (zh) 2008-09-19 2009-09-16 半導體裝置
TW110118378A TWI815122B (zh) 2008-09-19 2009-09-16 半導體裝置

Family Applications After (6)

Application Number Title Priority Date Filing Date
TW104100539A TWI569424B (zh) 2008-09-19 2009-09-16 顯示裝置
TW101126261A TWI467698B (zh) 2008-09-19 2009-09-16 顯示裝置
TW098131225A TWI478306B (zh) 2008-09-19 2009-09-16 顯示裝置
TW105135727A TWI641118B (zh) 2008-09-19 2009-09-16 顯示裝置
TW112133517A TW202403881A (zh) 2008-09-19 2009-09-16 半導體裝置
TW110118378A TWI815122B (zh) 2008-09-19 2009-09-16 半導體裝置

Country Status (6)

Country Link
US (6) US9196633B2 (enExample)
JP (11) JP5091209B2 (enExample)
KR (3) KR101273913B1 (enExample)
CN (3) CN103400838B (enExample)
TW (7) TWI757532B (enExample)
WO (1) WO2010032619A1 (enExample)

Families Citing this family (60)

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KR101762112B1 (ko) 2008-09-19 2017-07-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정표시장치
EP2172804B1 (en) 2008-10-03 2016-05-11 Semiconductor Energy Laboratory Co, Ltd. Display device
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KR101944656B1 (ko) * 2009-06-30 2019-04-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제조 방법
KR101476817B1 (ko) 2009-07-03 2014-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 트랜지스터를 갖는 표시 장치 및 그 제작 방법
KR101759504B1 (ko) 2009-10-09 2017-07-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 표시 장치 및 이를 포함한 전자 기기
CN102576174B (zh) * 2009-10-09 2018-02-23 株式会社半导体能源研究所 液晶显示装置及包括该液晶显示装置的电子设备
CN102640041A (zh) * 2009-11-27 2012-08-15 株式会社半导体能源研究所 液晶显示装置
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JP5744366B2 (ja) 2010-04-12 2015-07-08 株式会社半導体エネルギー研究所 液晶表示装置
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CN104851810B (zh) * 2010-04-23 2018-08-28 株式会社半导体能源研究所 半导体装置的制造方法
KR101872927B1 (ko) * 2010-05-21 2018-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101845480B1 (ko) * 2010-06-25 2018-04-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP5846789B2 (ja) 2010-07-29 2016-01-20 株式会社半導体エネルギー研究所 半導体装置
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KR101976212B1 (ko) * 2011-10-24 2019-05-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
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JP6259575B2 (ja) * 2012-02-23 2018-01-10 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR102113160B1 (ko) * 2012-06-15 2020-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
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CN102891183B (zh) * 2012-10-25 2015-09-30 深圳市华星光电技术有限公司 薄膜晶体管及主动矩阵式平面显示装置
TWI703723B (zh) * 2012-11-28 2020-09-01 日商半導體能源研究所股份有限公司 顯示裝置
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JP6254834B2 (ja) 2012-12-06 2017-12-27 株式会社半導体エネルギー研究所 半導体装置
KR20220145922A (ko) 2012-12-25 2022-10-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102241249B1 (ko) 2012-12-25 2021-04-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 저항 소자, 표시 장치, 및 전자기기
TWI611566B (zh) * 2013-02-25 2018-01-11 半導體能源研究所股份有限公司 顯示裝置和電子裝置
WO2014163116A1 (ja) * 2013-04-03 2014-10-09 旭硝子株式会社 有機エレクトロルミネッセンス装置
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KR102207563B1 (ko) * 2013-10-29 2021-01-27 삼성디스플레이 주식회사 유기 발광 표시장치 및 유기 발광 표시장치의 제조 방법
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CN114185216B (zh) 2015-02-12 2025-03-28 株式会社半导体能源研究所 显示装置
US9958993B2 (en) 2015-06-30 2018-05-01 Synaptics Incorporated Active matrix capacitive fingerprint sensor with 1-TFT pixel architecture for display integration
US10325131B2 (en) 2015-06-30 2019-06-18 Synaptics Incorporated Active matrix capacitive fingerprint sensor for display integration based on charge sensing by a 2-TFT pixel architecture
US9946375B2 (en) 2015-06-30 2018-04-17 Synaptics Incorporated Active matrix capacitive fingerprint sensor with 2-TFT pixel architecture for display integration
US9880688B2 (en) 2015-08-05 2018-01-30 Synaptics Incorporated Active matrix capacitive sensor for common-mode cancellation
CN108780621B (zh) * 2016-03-31 2020-07-31 夏普株式会社 有源矩阵基板的制造方法
JP6776060B2 (ja) * 2016-08-29 2020-10-28 株式会社ジャパンディスプレイ 表示装置
CN106338870A (zh) * 2016-11-10 2017-01-18 深圳市华星光电技术有限公司 一种静电防护电路及液晶显示器
US10216972B2 (en) 2017-01-13 2019-02-26 Synaptics Incorporated Pixel architecture and driving scheme for biometric sensing
US10430633B2 (en) 2017-01-13 2019-10-01 Synaptics Incorporated Pixel architecture and driving scheme for biometric sensing
TWI633681B (zh) * 2017-06-09 2018-08-21 美商晶典有限公司 微發光二極體顯示模組的製造方法
CN110718150B (zh) * 2019-10-10 2022-07-26 云谷（固安）科技有限公司 一种卷曲式柔性显示装置
CN110828579B (zh) 2019-10-29 2021-08-03 深圳市华星光电半导体显示技术有限公司 背沟道蚀刻型结构有源层为igzo的tft器件及其制作方法
CN111308796A (zh) * 2020-03-31 2020-06-19 成都中电熊猫显示科技有限公司 显示面板及显示面板的制作方法
US20250306489A1 (en) 2024-03-27 2025-10-02 Fujifilm Business Innovation Corp. Electrostatic charge image developing toner, electrostatic charge image developer, toner cartridge, process cartridge, image forming apparatus, and image forming method

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