TWI534240B - 壓敏性黏著劑組成物，壓敏性黏著膜及使用彼製造有機電子裝置之方法 - Google Patents
壓敏性黏著劑組成物，壓敏性黏著膜及使用彼製造有機電子裝置之方法 Download PDFInfo
- Publication number
- TWI534240B TWI534240B TW103126848A TW103126848A TWI534240B TW I534240 B TWI534240 B TW I534240B TW 103126848 A TW103126848 A TW 103126848A TW 103126848 A TW103126848 A TW 103126848A TW I534240 B TWI534240 B TW I534240B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensitive adhesive
- pressure
- film
- composition
- resin
- Prior art date
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims description 203
- 239000000203 mixture Substances 0.000 title claims description 117
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000010410 layer Substances 0.000 claims description 89
- 229920005989 resin Polymers 0.000 claims description 74
- 239000011347 resin Substances 0.000 claims description 74
- 150000001875 compounds Chemical class 0.000 claims description 37
- -1 olefin compound Chemical class 0.000 claims description 35
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 29
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 17
- 238000002834 transmittance Methods 0.000 claims description 16
- 229920006223 adhesive resin Polymers 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000011148 porous material Substances 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 8
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 6
- 150000003254 radicals Chemical class 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 150000001993 dienes Chemical class 0.000 claims description 5
- 239000004840 adhesive resin Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 description 47
- 239000000806 elastomer Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 21
- 230000002745 absorbent Effects 0.000 description 20
- 239000002250 absorbent Substances 0.000 description 20
- 230000004888 barrier function Effects 0.000 description 16
- 238000000576 coating method Methods 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 15
- 229920000647 polyepoxide Polymers 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 12
- 238000001723 curing Methods 0.000 description 11
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 11
- 239000002904 solvent Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 125000003545 alkoxy group Chemical group 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 229920002367 Polyisobutene Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229920005549 butyl rubber Polymers 0.000 description 5
- 125000004122 cyclic group Chemical group 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000003760 tallow Substances 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000002981 blocking agent Substances 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052747 lanthanoid Inorganic materials 0.000 description 3
- 150000002602 lanthanoids Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229920002877 acrylic styrene acrylonitrile Polymers 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- POJWUDADGALRAB-UHFFFAOYSA-N allantoin Chemical compound NC(=O)NC1NC(=O)NC1=O POJWUDADGALRAB-UHFFFAOYSA-N 0.000 description 2
- LBDSXVIYZYSRII-IGMARMGPSA-N alpha-particle Chemical compound [4He+2] LBDSXVIYZYSRII-IGMARMGPSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 230000000877 morphologic effect Effects 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920006124 polyolefin elastomer Polymers 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 229920005673 polypropylene based resin Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 239000010455 vermiculite Substances 0.000 description 2
- 229910052902 vermiculite Inorganic materials 0.000 description 2
- 235000019354 vermiculite Nutrition 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical group NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 1
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LARNQUAWIRVQPK-UHFFFAOYSA-N 2-methyloxiran-2-amine Chemical compound NC1(CO1)C LARNQUAWIRVQPK-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- CXMYWOCYTPKBPP-UHFFFAOYSA-N 3-(3-hydroxypropylamino)propan-1-ol Chemical compound OCCCNCCCO CXMYWOCYTPKBPP-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- POJWUDADGALRAB-PVQJCKRUSA-N Allantoin Natural products NC(=O)N[C@@H]1NC(=O)NC1=O POJWUDADGALRAB-PVQJCKRUSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- NMVKAIUSNRENEG-UHFFFAOYSA-N C(=CC)OCCCC(C(OC)(OC)C)CCCCCCCC Chemical compound C(=CC)OCCCC(C(OC)(OC)C)CCCCCCCC NMVKAIUSNRENEG-UHFFFAOYSA-N 0.000 description 1
- QBSZKOXEASPZRG-UHFFFAOYSA-N C(=CC)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=CC)OCCCC(C(OC)(OC)OC)CCCCCCCC QBSZKOXEASPZRG-UHFFFAOYSA-N 0.000 description 1
- HNXKXJJTCQVBNX-UHFFFAOYSA-N C(=CC)OCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical compound C(=CC)OCCCC(C(OCC)(OCC)OCC)CCCCCCCC HNXKXJJTCQVBNX-UHFFFAOYSA-N 0.000 description 1
- IEHMVWCATUJFRF-UHFFFAOYSA-N C(C(=C)C)(=O)OCC(C(OCC)(OCC)C)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCC(C(OCC)(OCC)C)CCCCCCCC IEHMVWCATUJFRF-UHFFFAOYSA-N 0.000 description 1
- OZIIZTNJFUIYMJ-UHFFFAOYSA-N C(C(=C)C)(=O)OCC(CC(OC)(OC)OC)CCCCCCC Chemical compound C(C(=C)C)(=O)OCC(CC(OC)(OC)OC)CCCCCCC OZIIZTNJFUIYMJ-UHFFFAOYSA-N 0.000 description 1
- OYHHNGMTUXGMES-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(C)(C)OC)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(C)(C)OC)CCCCCCCC OYHHNGMTUXGMES-UHFFFAOYSA-N 0.000 description 1
- DDXSGRJLQHWXNI-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(C)(C)OCC)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(C)(C)OCC)CCCCCCCC DDXSGRJLQHWXNI-UHFFFAOYSA-N 0.000 description 1
- JSAYWGHZJQCMEQ-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(OC)(OC)C)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(OC)(OC)C)CCCCCCCC JSAYWGHZJQCMEQ-UHFFFAOYSA-N 0.000 description 1
- YAAQEISEHDUIFO-UHFFFAOYSA-N C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 Chemical compound C=CC#N.OC(=O)C=CC=CC1=CC=CC=C1 YAAQEISEHDUIFO-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical class C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 1
- 229910019800 NbF 5 Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910004529 TaF 5 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 125000004036 acetal group Chemical group 0.000 description 1
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229960000458 allantoin Drugs 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- SGUXGJPBTNFBAD-UHFFFAOYSA-L barium iodide Chemical compound [I-].[I-].[Ba+2] SGUXGJPBTNFBAD-UHFFFAOYSA-L 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Inorganic materials [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 1
- WGEFECGEFUFIQW-UHFFFAOYSA-L calcium dibromide Chemical compound [Ca+2].[Br-].[Br-] WGEFECGEFUFIQW-UHFFFAOYSA-L 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 125000002837 carbocyclic group Chemical group 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- VEVZSMAEJFVWIL-UHFFFAOYSA-O cyanidin Natural products [O+]=1C2=CC(O)=CC(O)=C2C=C(O)C=1C1=CC=C(O)C(O)=C1 VEVZSMAEJFVWIL-UHFFFAOYSA-O 0.000 description 1
- 235000007336 cyanidin Nutrition 0.000 description 1
- 150000004292 cyclic ethers Chemical group 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 125000006182 dimethyl benzyl group Chemical group 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- QWWKGFGQXXNWHX-UHFFFAOYSA-N hexa-1,3-diene styrene Chemical compound CCC=CC=C.C=Cc1ccccc1 QWWKGFGQXXNWHX-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000026045 iodination Effects 0.000 description 1
- 238000006192 iodination reaction Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- DLMVDBDHOIWEJZ-UHFFFAOYSA-N isocyanatooxyimino(oxo)methane Chemical compound O=C=NON=C=O DLMVDBDHOIWEJZ-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000000686 lactone group Chemical group 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- OTRIMLCPYJAPPD-UHFFFAOYSA-N methanol prop-2-enoic acid Chemical compound OC.OC.OC(=O)C=C.OC(=O)C=C OTRIMLCPYJAPPD-UHFFFAOYSA-N 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- HDZGCSFEDULWCS-UHFFFAOYSA-N monomethylhydrazine Chemical compound CNN HDZGCSFEDULWCS-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 125000004043 oxo group Chemical group O=* 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- HDUMBHAAKGUHAR-UHFFFAOYSA-J titanium(4+);disulfate Chemical compound [Ti+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HDUMBHAAKGUHAR-UHFFFAOYSA-J 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- PYHOFAHZHOBVGV-UHFFFAOYSA-N triazane Chemical compound NNN PYHOFAHZHOBVGV-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
- C08F255/10—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms on to butene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/04—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2415/00—Presence of rubber derivatives
- C09J2415/003—Presence of rubber derivatives in the primer coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/003—Presence of polyolefin in the primer coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/003—Presence of (meth)acrylic polymer in the primer coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electroluminescent Light Sources (AREA)
- Adhesive Tapes (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Sealing Material Composition (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
本發明係關於壓敏性黏著劑組成物、壓敏性黏著膜以及使用彼製造有機電子裝置之方法。
有機電子裝置(OED)係指包括使用電洞及電子產生電荷交替之有機材料層的裝置，且可包括例如光伏打裝置、整流器、傳送器(transmitter)以及有機發光二極體(OLED)。
代表性的OED，為OLED，其相較於習知光源係具有較低耗電及較高反應速度，並形成較薄的顯示裝置或光源。此外，OLED具有極佳的空間利用度，且有望於包括所有種類之可攜式裝置、螢幕、筆記型電腦及TV的各種領域中應用。
擴展OLED之商業化與用途的主要問題為耐久性。OLED所含之有機材料和金屬電極極易因外在因素
如水而氧化。因此，包括有OLED之產品對環境因素非常敏感。因此，對於有機電子裝置如OLED已提出各種用以避免氧氣或水從外在環境透入的方法。
韓國未審查專利申請公開案第2008-0088606號係提出黏著劑包封組成物及有機電致發光裝置，其因以聚異丁烯(PIB)為基礎的壓敏性黏著劑而加工性差且於高溫及高濕度之可靠性低。
因此，於有機電子裝置，需要開發能確保所需壽命、極佳地避免濕氣透入、在高溫及高濕度下維持可靠性、且具有極佳光學特性之封裝劑。
本發明係關於提供一種壓敏性黏著劑組成物，其可形成有效避免濕氣或氧氣從外在環境透入有機電子裝置之結構，且具有優異機械特性(諸如操作性(handleability)與加工性)和優異透光性(transparency)；一種壓敏性黏著膜；以及一種使用彼製造有機電子裝置之方法。
於一態樣中，本發明係提供壓敏性黏著劑組成物。該壓敏性黏著劑組成物可應用於，例如，有機電子裝置如OLED之封裝(encapsulation)或包封(capsulation)。
在本文中使用之術語“有機電子裝置”係指具有包含於彼此面對之電極對間之使用電洞及電子產生電荷交替的有機材料層之結構的產品或裝置，且可包含，但不
限於，例如，光伏打裝置、整流器、傳送器(transmitter)以及有機發光二極體(OLED)。於一實例中，有機電子裝置可為OLED。
本發明之壓敏性黏著劑組成物可具有方程式1所示之凝膠含量(gel content)為50%或更高，及方程式2所示之微凝膠含量(micro gel content)為3%或更低。
[方程式1]凝膠含量(wt%)=B/A×100
[方程式2]微凝膠含量(wt%)=C/A×100
在方程式1中，A係壓敏性黏著劑組成物的質量，而B係該壓敏性黏著劑組成物於浸入甲苯中在60℃歷時24小時並以200-篩目篩(孔徑：74μm)過濾後剩餘的不可溶含量之乾質量(dry mass)。
又，在方程式2中，A係壓敏性黏著劑組成物的質量，而C係該壓敏性黏著劑組成物於浸入甲苯中在60℃歷時24小時並初步以200-篩目篩(孔徑：74μm)過濾並次之以1000-篩目篩(孔徑：5μm)過濾後剩餘的不可溶含量之乾質量。
方程式1所示之凝膠含量可為50至99%、50至90%、50至80%、或50至70%。此外，方程式2所示之微凝膠含量可為3%、2%、1%、0.8%、或0.5%或更低。在此，該下限未特別受限且可為0%。當該微凝膠含量為0%時，該壓敏性黏著劑組成物可次之以1000-篩目篩
(孔徑：5μm)過濾，且過濾後剩餘的壓敏性黏著劑組成物之乾質量可為0。此外，微凝膠可使用尺寸5μm之注射器鑑定。舉例而言，當該壓敏性黏著劑組成物初步以200-篩目篩(孔徑：74μm)過濾且該濾出溶液通過使用之具有5μm之注射器，於組成物中存在具有方程式2所示之微凝膠(尺寸約100nm至20μm)超過3%，該注射器會堵塞，且因此該組成物無法通過。另一方面，當幾乎無微凝膠或未有微凝膠存在於該交聯結構中時，該組成物會通過注射器，且方程式2所示之微凝膠含量為3%內(事實上，幾乎接近0%)。此外，透過形態分析，可實際確認微凝膠的存在。透過形態分析所觀察之微凝膠可具有約100nm至20μm之尺寸。該注射器可為任何具有5μm之尺寸而無特定限制，且因此可通常為本技術領域中所使用之微濾器(micro filter)。
即，由方程式2所示之微凝膠含量係相對於無法穿過或在該壓敏性黏著劑組成物浸入甲苯於60℃歷時24小時並以1000篩目篩(孔徑：5μm)過濾後剩餘之溶膠組分之值，其可測定該壓敏性黏著劑組成物中的微凝膠的存在，且因此成為可實現所欲之可靠性及光學特性之指標。即，僅以習用的凝膠含量來確定交聯結構及交聯程度是不夠的，且因此壓敏性黏著劑組成物之交聯結構及交聯程度的範圍係使用微凝膠含量來確定，而藉此實現具有優異濕度阻隔能力、可靠性、及光學特性之壓敏性黏著劑組成物。
該壓敏性黏著劑組成物於膜之厚度方向量測的水蒸氣穿透率(WVTR)(製成膜厚度為100μm)可為50、40、30、20或10g/m2．day或更低(於100℉以及100%相對濕度)。藉由控制壓敏性黏著劑組成物的組成及交聯狀態以具有此WVTR，可實現當用於電子裝置的封裝或包封結構時能藉由有效阻斷濕氣或氧氣自外在環境透入而安定地保護元件之封裝或包封結構。WVTR越低，濕氣阻隔能力越佳，因此，WVTR的下限可為、但未特別受限於0g/m2．day。
此外，該壓敏性黏著劑組成物可對可見光區具有優異的透光度。於一實例中，本發明之壓敏性黏著劑組成物形成為膜且可具有85%或更高之透光度(對可見光區)。例如，該壓敏性黏著劑組成物形成為膜且可具有85%、87%、或90%或更高之透光度(對可見光區)。此外，本發明之壓敏性黏著劑組成物可具有低霧度(haze)與優異透光度。於一實例中，該壓敏性黏著劑組成物可形成為膜且具有3%、2%、1%、0.8%、0.5%、或0.3%或更低之霧度。即，根據本發明之壓敏性黏著劑組成物可藉由符合如上述之根據方程式1及2的凝膠含量及微凝膠含量而實現優異的光學特性以及於在高溫與高濕度下之可靠性。
本發明之壓敏性黏著劑組成物可使用各種材料形成，只要符合該物理性質即可。
舉例來說，該壓敏性黏著劑組成物可包括封裝樹脂及多官能性活性能量射線可聚合之化合物(可藉由
照射活性能量射線而聚合)。
於本發明之例示性實施態樣中，該封裝樹脂之玻璃轉化溫度可為低於0、-10、-30、-50或-60℃。此處，玻璃轉化溫度可指以約1J/cm2或更高之劑量照射UV射線後之玻璃轉化溫度，或者於UV照射後另進行熱固化之後的玻璃轉化溫度。
在一實例中，該封裝樹脂可包括苯乙烯系樹脂或彈性物、聚烯烴系樹脂或彈性物、其他彈性物、聚氧伸烷基系樹脂或彈性物、聚酯系樹脂或彈性物、聚氯乙烯系樹脂或彈性物、聚碳酸酯系樹脂或彈性物、聚伸苯硫醚系樹脂(polyphenylenesulfide-based resin)或彈性物、聚醯胺系樹脂或彈性物、丙烯酸酯系樹脂或彈性物、環氧系樹脂、矽系(silicon-based)樹脂或彈性物、氟系樹脂或彈性物、或彼等之混合物。
在此，該苯乙烯系樹脂或彈性物可例如為苯乙烯-伸乙基-丁二烯-苯乙烯(SEBS)嵌段共聚物、苯乙烯-異戊二烯-苯乙烯(SIS)嵌段共聚物、丙烯腈-丁二烯-苯乙烯(ABS)嵌段共聚物、丙烯腈-苯乙烯-丙烯酸酯(ASA)嵌段共聚物、苯乙烯-丁二烯-苯乙烯(SBS)嵌段共聚物、苯乙烯系均聚物、或其混合物。該烯烴系樹脂或彈性物可例如為高密度聚乙烯系樹脂或彈性物、低密度聚乙烯系樹脂或彈性物、聚丙烯系樹脂或彈性物、或其混合物。該彈性物可例如為酯系熱塑性彈性物、烯烴系彈性物、矽系彈性物、丙烯酸系彈性物、或其混合物。在這些之中，該烯烴
系熱塑性彈性物可為聚丁二烯樹脂或彈性物或聚異丁烯樹脂或彈性物。該聚氧伸烷基系樹脂或彈性物可例如為聚氧亞甲基系樹脂或彈性物、聚氧乙烯系(polyoxyethylene-based)樹脂或彈性物、聚丙烯系樹脂或彈性物、或其混合物。該聚酯系樹脂或彈性物可例如為聚對酞酸乙二酯系樹脂或彈性物、聚對酞酸丁二酯系樹脂或彈性物、或其混合物。該聚氯乙烯系樹脂或彈性物可例如為聚二氯亞乙烯。該烴類之混合物可例如為三十六烷或石蠟。該聚醯胺系樹脂或彈性物可例如為耐綸。該丙烯酸酯系樹脂或彈性物可例如為聚(甲基)丙烯酸丁酯。該環氧系樹脂或彈性物可例如為雙酚型，諸如雙酚A型、雙酚F型、雙酚S型、及其氫化產物；酚醛型，諸如酚系酚醛(phenolnovolac)型或甲酚系酚醛(cresolnovolac)型；含氮環型，諸如三環氧丙基異三聚氰酸酯(triglycidylisocyanurate)型或尿囊素型；脂環型；脂族型；芳族型，諸如萘型或聯苯型；環氧丙基型，諸如環氧丙基醚型、環氧丙基胺型、或環氧丙基酯型；二環型，諸如雙環戊二烯型；酯型；醚型；或其混合物。該矽系樹脂或彈性物可例如為聚二甲基矽氧烷。此外，該氟系樹脂或彈性物可為聚三氟乙烯樹脂或彈性物、聚四氟乙烯樹脂或彈性物、聚三氟氯乙烯(polychlorotrifluoroethylene)樹脂或彈性物、聚六氟丙烯樹脂或彈性物、聚二氟亞乙烯、聚氟乙烯、聚氟化乙烯丙烯(polyethylenepropylene fluoride)、或其混合物。
上列樹脂或彈性物可接枝至例如順丁烯二酸
酐、與上列樹脂或彈性物中之另一者或用於製備該樹脂或彈性物之單體共聚合、或者以非上述樹脂或彈性物之化合物改質。該化合物可為羧基封端的丁二烯-丙烯腈共聚物。
於一實例中，該壓敏性黏著劑組成物係封裝樹脂，其可包括烯烴系彈性物、矽系彈性物、或前述類型之丙烯酸系彈性物，但本發明不限於此。
特定言之，該封裝樹脂可為二烯和具有一個碳-碳雙鍵之烯烴系化合物之共聚物。在此，該烯烴系化合物可包括異丁烯、丙烯、或乙烯，且二烯可為能夠與烯烴系化合物聚合之單體，例如，1-丁烯、2-丁烯、異戊二烯、或丁二烯。即，本發明之封裝樹脂可例如為異丁烯單體之均聚物；藉由使異丁烯單體與能與其聚合之單體共聚合而製備之共聚物；或其混合物。於一實例中，二烯與具有一個碳-碳雙鍵之烯烴系化合物之共聚物可為丁基橡膠。當如上所述使用特定樹脂時，本發明所獲致之濕氣阻隔能力令人滿意。此外，本發明可藉由引入各種交聯結構及實施特定凝膠含量及微凝膠含量而改善耐濕氣性和耐熱性，而常用之異丁烯聚合物雖透濕性(moisture permeability)低但耐熱性低。
於壓敏性黏著劑組成物中，該樹脂或彈性物組份之重量平均分子量(Mw)可為使該壓敏性黏著劑組成物可被塑化成膜類型之程度。舉例而言，該樹脂或彈性物之重量平均分子量(Mw)可為約100,000至2,000,000、
100,000至1,500,000、或100,000至1,000,000。本文中所使用之術語"重量平均分子量"係指以凝膠穿透層析法(GPC)測得之相對於聚苯乙烯標準品的轉換值。然而，該樹脂或彈性物組分不一定具有該上述重量平均分子量。舉例而言，當樹脂或彈性物組份的分子量不足以形成膜時，另外的黏合劑樹脂可摻入壓敏性黏著劑組成物中。
如上所述，本發明之壓敏性黏著劑組成物可包括與封裝樹脂之相容性高且能夠與封裝樹脂形成特定交聯結構的活性能量射線可聚合之化合物。於一例示性實施態樣中，該交聯結構可為藉由施加熱而形成的交聯結構、藉由照射活性能量射線而形成的交聯結構、或藉由於室溫下老化而形成的交聯結構。此處，在"活性能量射線"類別中，可包括微波、紅外(IR)射線、紫外(UV)射線、X射線、與γ射線，以及粒子束如α-粒子束、質子束、中子束、或電子束，且慣常為UV射線或電子束。
舉例來說，本發明之壓敏性黏著劑組成物可包括可藉由照射活性能量射線而與封裝樹脂聚合的多官能性活性能量射線可聚合之化合物。活性能量射線可聚合之化合物可指，例如，包括至少二個由照射活性能量射線而參與聚合反應之官能基(例如，含有乙烯系不飽和雙鍵(如丙烯醯基或甲基丙烯醯基)之官能基、及如環氧基或氧呾基之官能基)的化合物。
作為多官能性活性能量射線可聚合之化合物可使用多官能性丙烯酸酯(MFA)。
此外，可藉由照射活性能量射線而聚合之多官能性活性能量射線可聚合之化合物係可符合式1。此外，該活性能量射線可聚合之化合物之含量，相對於100重量份之封裝樹脂，可為5至30、5至25、8至20、10至18、或12至18重量份。
在式1中，R1係氫或具有1至4個碳原子之烷基，n係2或更大之整數，以及，X為自具有3至30個碳原子之直鏈、支鏈或環狀烷基衍生之基團(residue)。此處，當X為由環狀烷基衍生之基團時，X可例如為由具有3至30、6至28、8至22、或12至20個碳原子之環狀烷基衍生之基團。此外，當X為由直鏈烷基衍生之基團時，X可為由具有3至30、6至25、或8至20個碳原子之直鏈烷基衍生之基團。此外，當X為由支鏈烷基衍生之基團時，X可為由具有3至30、5至25、或6至20個碳原子之支鏈烷基衍生之基團。
本文中所使用之術語"由烷基衍生之基團"可指由烷基構成之特定化合物的基團。於一實例中，式1中，當n為2時，X可為伸烷基。此外，當n為3或更大時，烷基的至少二個氫可從X釋出，且接著鍵結至式1之
(甲基)丙烯醯基。
本文中所使用之術語"烷基"，若未另有特別定義，係可指具有1至30、1至25、1至20、1至16、1至12、1至8、或1至4個碳原子之烷基。烷基可為直鏈、支鏈、或環狀結構，且可任意地經至少一取代基取代。
本文中所使用之術語"伸烷基"，若未另有特別定義，係可為具有2至30、2至25、2至20、2至16、2至12、2至10、或2至8個碳原子之伸烷基。伸烷基可為直鏈、支鏈、或環狀結構，且可任意地經至少一取代基取代。
可藉由照射活性能量射線而聚合之多官能性活性能量射線可聚合之化合物係可為任何符合式1者而無限制。舉例而言，該化合物可為1,4-丁二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯(1,3-butylene glycol di(meth)acrylate)、1,6-己二醇二(甲基)丙烯酸酯、1,8-辛二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、二(甲基)丙烯酸二環戊酯、環己烷-1,4-二甲醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、二羥甲基二環戊烷二(甲基)丙烯酸酯、經新戊二醇改質之三甲基丙烷二(甲基)丙烯酸酯、金剛烷二(甲基)丙烯酸酯(adamantane di(meth)acrylate)、三羥甲基丙烷三(甲基)丙烯酸酯、或其混合物。
作為多官能性活性能量射線可聚合之化合物
可使用，例如，具有低於1,000之分子量且包括至少二個官能基的化合物。於此例中，分子量是指重量平均分子量或習知分子量。多官能性活性能量射線可聚合之化合物中所含之環狀結構可為碳環結構、雜環結構、單環結構及多環結構中之任一者。
於本發明之一例示性實施態樣中，該壓敏性黏著劑組成物可包含符合式2之矽烷化合物：
在式2中，R1為氫或烷基。R1可例如為具有1至4或1至2個碳原子之烷基。此外，式2中，R2及R3係各自獨立地為氫或直鏈、支鏈或環狀烷基，或者R2係與R3連結而藉此形成環狀烷基。舉例而言，R2及R3可各自獨立地為氫或直鏈、支鏈或環狀烷基。此處，直鏈烷基可具有1至10、1至6、或1至4個碳原子，支鏈烷基可具有3至10、3至6、或3至4個碳原子，且環狀烷基可具有3至10、3至8、3至6、或3至4個碳原子。此外，R2可與R3連結而藉此形成具有2至10、3至10、4至9、或4至8個碳原子之環狀烷基。此外，式2中，R4、R5及R6係各獨立地為氫、烷基或烷氧基，R4、R5及R6中之至少一者為烷氧基，以及，n係1或更大之整數。
具言之，R4、R5及R6係各獨立地為具有1至10、1至6、1至4、或1至2個碳原子之烷基；或具有1至10、1至8、1至4或1至2個碳原子之烷氧基。此處，R4、R5及R6中之至少一者可為烷氧基，且R4、R5及R6可均為烷氧基，但本發明不限於此。
本文中所使用之術語"烷氧基"，除非另有特別定義，係可為具有1至20、1至16、1至12、1至8、或1至4個碳原子之烷氧基。該烷氧基可為直鏈、支鏈、或環型。此外，該烷氧基可任意地經至少一取代基取代。
於一實例中，矽烷化合物並無特別限制，只要其符合式2，且其可例如為3-甲基丙烯醯氧基丙基三甲氧基矽烷(3-methacryloxypropyl trimethoxysilane)、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、3-丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基甲基三乙氧基矽烷、3-甲基丙烯醯氧基甲基三甲氧基矽烷、3-丙烯醯氧基丙基甲基二甲氧基矽烷、甲基丙烯醯氧基甲基甲基二甲氧基矽烷(methacryloxy methyl methyldimethoxysilane)、甲基丙烯醯氧基甲基甲基二乙氧基矽烷、甲基丙烯醯氧基丙基甲基二甲氧基矽烷、甲基丙烯醯氧基丙基甲基二乙氧基矽烷、甲基丙烯醯氧基丙基二甲基甲氧基矽烷或甲基丙烯醯氧基丙基二甲基乙氧基矽烷。該矽烷化合物的丙烯醯基可藉由與壓敏性黏著劑組成物之封裝樹脂或活性能量射線可聚合之化合物交聯而用以增加界面壓敏性黏著劑強度。該矽烷化合物之含量，相對
於100重量份之封裝樹脂，可包括例如0.1至10、0.5至8、0.8至5、1至5、1至4.5、或1至4重量份。
於一實例中，該活性能量射線可聚合之化合物可與符合式2之矽烷化合物形成交聯結構，且該交聯結構可與封裝樹脂形成半互穿聚合物網路(semi-interpenetrating polymer network)(半-IPN)。即，該壓敏性黏著劑組成物可包含半-IPN。術語"半-IPN"包括至少一聚合物交聯結構(聚合物網路)及至少一直鏈或分枝聚合物，且至少一部分該直鏈或分枝聚合物具有穿入該聚合物交聯結構之結構。半-IPN係與IPN結構不同，其在於該直鏈或支鏈聚合物理論上可無損化學鍵而與聚合物交聯結構分離。
於一例示性實施態樣中，該交聯結構可為藉由施加熱而形成的交聯結構、藉由照射活性能量射線而形成的交聯結構、或藉由於室溫下老化而形成的交聯結構。此處，在"活性能量射線"類別中，可包括微波、紅外(IR)射線、紫外(UV)射線、X射線、與γ射線，以及粒子束如α-粒子束、質子束、中子束、或電子束，且慣常為UV射線及電子束。由於引入此半-IPN結構，因而可增加壓敏性黏著劑組成物之機械性質如加工性、改善耐濕氣黏著效能、實現透光性，以及實現目前無法達到的高濕氣阻隔效能、和優異的面板壽命。
於一實例中，該活性能量射線可聚合之化合物可與符合式2之矽烷化合物形成交聯結構，且封裝樹脂
可與活性能量射線可聚合之化合物或符合式2之矽烷化合物形成交聯結構，而藉此形成互穿聚合物網路(IPN)結構。此外，術語"IPN結構"係指其中壓敏性黏著劑中存在至少二個交聯結構之狀態。於一實例中，該IPN結構可指包括至少二個為交結(intertwining)、糾結(entanglement)或穿入(penetrating)狀態的交聯結構之結構。舉例而言，本發明之組成物可包括由封裝樹脂形成之交聯結構(下文中稱為“第一交聯結構”)以及由活性能量射線可聚合之化合物與符合式2之矽烷化合物之反應形成之交聯結構(下文中稱為“第二交聯結構”)，且第一和第二交聯結構可為穿入狀態或糾結狀態。即，因壓敏性黏著劑組成物包含為交聯狀態之半-IPN或IPN結構，因而可藉由增加壓敏性黏著劑之高溫及高濕度下的壓敏性黏著強度及避免因濕氣透入而降低之界面壓敏性黏著強度以能於嚴苛條件如高溫及高濕度下實現壓敏性黏著劑之優異耐久性及可靠性。
於本發明之例示性實施態樣中，該壓敏性黏著劑組成物可進一步包括自由基引發劑，其可引發上述活性能量射線可聚合之化合物的聚合反應。該自由基引發劑可為光引發劑或熱引發劑。可考量固化速率和黃化可能性而適當選擇特定種類的光引發劑。舉例而言，作為光引發劑，可使用苯偶姻系、羥基酮系、胺基酮系、或膦氧化物系光引發劑，且特定言之，為苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻異丙基醚、苯偶姻正丁基醚、苯偶姻異丁基醚、苯乙酮、二甲胺基苯乙酮、2,2-二甲氧基-2-苯
基苯乙酮、2,2-二乙氧基-2-苯基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-羥基環己基苯基酮、2-甲基-1-[4-(甲硫基)苯基]-2-啉基-丙烷-1-酮、4-(2-羥基乙氧基)苯基-2-(羥基-2-丙基)酮、二苯酮、對苯基二苯酮(p-phenylbenzophenone)、4,4’-二乙胺基二苯酮、二氯二苯酮、2-甲基蒽醌、2-乙基蒽醌、2-三級丁基蒽醌、2-胺基蒽醌、2-甲基硫代酮(2-methylthioxanthone)、2-乙基硫代酮、2-氯硫代酮、2,4-二甲基硫代酮、2,4-二乙基硫代酮、苄基二甲基縮酮、苯乙酮二甲基縮酮、對二甲胺苄酸酯(p-dimethylamino benzoic acid ester)、寡[2-羥基-2-甲基-1-[4-(1-甲基乙烯基)苯基]丙酮]、或氧化2,4,6-三甲苯甲醯基二苯基膦(2,4,6-trimethylbenzoyl-diphenyl-phosphineoxide)。
該自由基引發劑之含量，相對於100重量份之活性能量射線可聚合之化合物，可為0.2至20重量份。因此，有效地引發活性能量射線可聚合之化合物之反應，且可避免由於固化後殘留的組份以致於壓敏性黏著劑組成物之物理性質劣化。
於一實例中，該壓敏性黏著劑組成物可進一步包括賦黏劑。該賦黏劑可為氫化環烯烴系聚合物。作為該賦黏劑，舉例而言，可使用藉由氫化石油樹脂所獲得之氫化石油樹脂。該氫化石油樹脂可為部分或或完全氫化，且可為此等樹脂之混合。此賦黏劑可具有與壓敏性黏著劑組成物之高相容性、優異的濕氣阻隔能力以及小含量之有
機揮發性組份。該氫化石油樹脂之特定實例可為氫化萜烯系樹脂、氫化酯系樹脂、或氫化雙環戊二烯系樹脂。該賦黏劑可具有約200至5,000之重量平均分子量。該賦黏劑之含量必要時可經適當控制。舉例而言，可考量上述之凝膠含量及微凝膠含量而選擇賦黏劑之含量。根據一實例，該賦黏劑之含量，相對於100重量份之壓敏性黏著劑組成物的固體含量，可為5至100重量份。
需要時，壓敏性黏著劑組成物可進一步包括濕氣吸收劑。術語"濕氣吸收劑"可指能藉由化學反應移除透入下文所述之壓敏性黏著膜之濕氣或蒸氣的材料。當本發明之壓敏性黏著劑組成物包括濕氣吸收劑時，於形成膜時可能未符合下文所述之透光度，但卻能實現極佳的濕氣阻隔能力。特定言之，該壓敏性黏著劑組成物可形成欲用於封裝有機電子裝置之膜。在此情況中，當該壓敏性黏著劑組成物不包括濕氣吸收劑且展現極佳的透光性時，其可用於封裝頂射型(top-emissive)有機電子裝置，或當該壓敏性黏著劑組成物包括濕氣吸收劑且展現優異的濕氣阻隔能力時，其可用於封裝底射型(bottom-emissive)有機電子裝置。然而，本發明不限於此。即，當該壓敏性黏著劑組成物不包括濕氣吸收劑且展現優異的透光性時，其可用於封裝底射型(bottom-emissive)有機電子裝置。
舉例來說，該濕氣吸收劑可存在為均勻地分散於壓敏性黏著劑組成物或下文所述之壓敏性黏著層中。在此，均勻分散狀態可意指濕氣吸收劑以相同或實質相同
之密度均勻存在於壓敏性黏著劑組成物或壓敏性黏著層之任何部分的狀態。作為本文中所使用之濕氣吸收劑，可使用例如金屬氧化物、硫酸鹽或有機金屬氧化物。特定言之，該硫酸鹽可為硫酸鎂、硫酸鈉或硫酸鎳，且有機金屬氧化物可為氧化鋁辛酸鹽(aluminum oxide octylate)。在此，金屬氧化物可為五氧化磷(P2O5)、氧化鋰(Li2O)、氧化鈉(Na2O)、氧化鋇(BaO)、氧化鈣(CaO)或氧化鎂(MgO)，且金屬鹽可為硫酸鹽如硫酸鋰(Li2SO4)、硫酸鈉(Na2SO4)、硫酸鈣(CaSO4)、硫酸鎂(MgSO4)、硫酸鈷(CoSO4)、硫酸鎵(Ga2(SO4)3)、硫酸鈦(Ti(SO4)2)或硫酸鎳(NiSO4)；金屬鹵化物，如氯化鈣(CaCl2)、氯化鎂(MgCl2)、氯化鍶(SrCl2)、氯化釔(YCl3)、氯化銅(CuCl2)、氟化銫(CsF)、氟化鉭(TaF5)、氟化鈮(NbF5)、溴化鋰(LiBr)、溴化鈣(CaBr2)、溴化銫(CeBr3)、溴化硒(SeBr4)、溴化釩(VBr3)、溴化鎂(MgBr2)、碘化鋇(BaI2)或碘化鎂(MgI2)；或金屬氯酸鹽，如過氯酸鋇(Ba(ClO4)2)或過氯酸鎂(Mg(ClO4)2)，但本發明不限於此。作為可含於壓敏性黏著劑組成物中之濕氣吸收劑，可使用上述材料中之一或至少二者。於一實例中，當使用上述材料之至少二者時，濕氣吸收劑可為經煅燒的白雲石。
此濕氣吸收劑可根據其用途而控制於適當尺寸。於一實例中，濕氣吸收劑的平均直徑可控制於約10至15000nm。具有上述平均直徑範圍之濕氣吸收劑因為與濕氣的反應速率不會過高而易於儲存，且可有效地移除
濕氣且不會損及欲封裝之元件。
可考量所欲的阻隔特性以適當選擇濕氣吸收劑之含量而無特別限制。
需要時，該壓敏性黏著劑組成物可進一步包括濕氣阻斷劑(moisture blocker)。本文中所使用之術語"濕氣阻斷劑"可指能阻斷或避免濕氣或蒸氣於膜中移動並與濕氣不具反應性或反應性低的材料。作為濕氣阻斷劑，可使用黏土、滑石、針型矽石(pin-type silica)、平面矽石(planar silica)、多孔矽石、沸石、氧化鈦及氧化鋯中之一或至少二者。此外，水阻斷劑之表面可經有機改質劑處理以促進有機材料透入。作為此有機改質劑，舉例而言，可使用二甲基苄基氫化之牛脂四級銨(dimethyl benzyl hydrogenated tallow quaternary ammonium)、二甲基氫化之牛脂四級銨、甲基牛脂雙-2-羥基乙基四級銨、二甲基氫化之牛脂2-乙基己基四級銨、二甲基去氫化之牛脂四級銨、或其混合物。
可考量所欲阻斷特性以適當選擇濕氣阻斷劑之含量而無特別限制。
除了上述組份以外，壓敏性黏著劑組成物可根據其用途及下文所述之壓敏性黏著膜之製法而含有各種添加劑。舉例來說，該壓敏性黏著劑組成物可根據所欲物理性質而包括適當含量範圍之可固化材料、交聯劑或填料。
於另一態樣中，本發明提供一種壓敏性黏著
膜。此外，該壓敏性黏著膜可包括上述之壓敏性黏著劑組成物或其交聯產物所形成的壓敏性黏著層。該壓敏性黏著層亦可形成為膜或片狀。此壓敏性黏著層可用於封裝有機電子元件。
於本發明之例示性實施態樣中，該壓敏性黏著層形成為如上述之單層結構，或者可由下文所述之至少二層所形成。舉例而言，該壓敏性黏著層可包括含有上述之壓敏性黏著劑組成物或其交聯產物的第一層以及包括壓敏性黏著樹脂或黏著樹脂的第二層。第二層所包括之壓敏性黏著樹脂或黏著樹脂可與上述封裝樹脂相同或不同，且可根據目的由嫻於此技術之人士適當地選擇。此外，第一和第二層可包括或不包括濕氣吸收劑。
於一實例中，第二層所包括之壓敏性黏著樹脂可包括含有至少一熱可固化官能基(如環氧丙基、異氰酸基(isocyanate group)、羥基、羧基、或醯胺基)、或至少一電磁波可固化官能基(如環氧基、環狀醚基、硫醚基(sulfide group)、縮醛基或內酯基)的可固化樹脂，其可經固化而展現黏著特性。此外，此樹脂之特定種類可為但不限於丙烯酸樹脂、聚酯樹脂、異氰酸樹脂或環氧樹脂。
在本發明中，作為可固化樹脂，可使用芳族或脂族、或直鏈或支鏈環氧樹脂。於本發明之一例示性實施態樣中，可使用含有至少二個官能基並具有180至1,000g/eq之環氧化物當量(epoxy equivalent)的環氧樹脂。當使用具有上述範圍之環氧化物當量的環氧樹脂時，
可有效維持固化產物之特性如黏著效能和玻璃轉化溫度。此環氧樹脂可為下列者中之一者或至少二者之混合物：甲酚酚醛環氧樹脂(cresol novolac epoxy resin)、雙酚A型環氧樹脂、雙酚A型酚醛環氧樹脂、酚系酚醛環氧樹脂、四官能性環氧樹脂、聯苯型環氧樹脂、三酚甲烷(triphenol methane)型環氧樹脂、經烷基改質之三酚甲烷環氧樹脂、萘型環氧樹脂、雙環戊二烯型環氧樹脂、以及經雙環戊二烯改質之酚型環氧樹脂。
於本發明之例示性實施態樣中，除了上述樹脂外，第二層可包括另外的組份如上述活性能量射線可聚合之化合物、自由基引發劑、賦黏劑、濕氣吸收劑、濕氣阻斷劑、分散劑、或矽烷化合物，其可與第一層中者相同或不同。此外，第二層可根據所欲物理性質而包括適當含量範圍之可固化材料、固化劑或填料。
第一及第二層之層疊順序並無特別限制，因此第二層可形成於第一層上，或者第一層可形成於第二層上。
於一實例中，該壓敏性黏著膜可包括於該壓敏性黏著層之一表面上的阻隔膜。該阻隔膜可由本技術領域中常用的任何材料所形成而無限制。舉例而言，在此，該阻隔膜可包括基底層、有機底塗層、無機沈積層、和有機頂塗層，且該有機頂塗層可以與該壓敏性黏著層接觸。
該壓敏性黏著膜的於膜之厚度方向量測的水蒸氣穿透率(WVTR)(形成膜厚度為10μm)可為50、40、
30、20或10g/m2．day或更低(於100℃以及100%相對濕度)。藉由控制包括壓敏性黏著劑組成物之壓敏性黏著層的組成及交聯狀態以具有此WVTR，可實現當用於電子裝置的封裝或包封結構時能藉由有效阻斷濕氣或氧氣自外在環境透入而安定地保護元件之封裝或包封結構。WVTR越低，濕氣阻隔能力越佳，因此，WVTR的下限可為、但未特別受限於0g/m2．day。
此外，該壓敏性黏著膜可對可見光區具有優異的透光度。於一實例中，本發明之壓敏性黏著膜之透光度(對可見光區)可為85%或更高。例如，壓敏性黏著膜之透光度(對可見光區)可為85%、87%、或90%或更高。此外，本發明之壓敏性黏著膜可具有低霧度(haze)與優異透光度。於一實例中，該壓敏性黏著膜之霧度可為3%、2%、1%、0.8%、0.5%、或0.3%或更低。即，根據本發明之壓敏性黏著膜可藉由符合如上述之根據方程式1及2的凝膠含量及微凝膠含量而實現優異的光學特性以及於在高溫與高濕度下之可靠性。
該壓敏性黏著膜可進一步包括基底膜或釋離膜(release film)(下文中可稱為"第一膜")，且該壓敏性黏著層可形成於該基底膜或釋離膜上。該結構可進一步包括形成於該壓敏性黏著層上之基底膜或釋離膜(下文中可稱為"第二膜")。
圖1及2為例示性壓敏性黏著膜之橫截面圖。
如圖1所示，壓敏性黏著膜1可包括形成於基底膜或釋離膜12上之壓敏性黏著層11。如圖2所示，另一例示性壓敏性黏著膜2可進一步包括形成於壓敏性黏著層11上之基底膜或釋離膜21。雖未示於圖1及2，但該壓敏性黏著膜亦可具有壓敏性黏著劑組成物而無承載基底如基底膜或釋離膜，並因而具有僅含形成為於室溫維持固相或半固相之膜或片之壓敏性黏著層的結構，或者壓敏性黏著層係形成於一基底膜或釋離膜之二表面上的結構。
未特別限制第一膜之特定類型。作為第一膜可使用例如塑料膜。第一膜可為聚對酞酸乙二酯膜、聚四氟乙烯膜、聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、氯乙烯共聚物膜、聚胺甲酸酯(polyurethane)膜、乙烯-乙酸乙烯酯膜、乙烯-丙烯共聚物膜、乙烯-丙烯酸乙酯共聚物膜、乙烯-丙烯酸甲酯共聚物膜、或聚醯亞胺膜。
當第一膜為釋離膜時，可於此塑料膜之一或二面上進行適當的離型處理(release treatment)。作為離型處理使用之離型劑，可使用醇酸(alkyd)系離型劑、矽系離型劑、氟系離型劑、不飽和酯系離型劑、聚烯烴系離型劑、或蠟系離型劑。考量耐熱性，於上述實例中慣常使用醇酸(alkyd)系離型劑、矽系離型劑或氟系離型劑，但本發明不限於此。
作為第一膜可使用例如於基底之頂面或側面上形成氣體阻隔層之塑料膜。此膜可直接構成例如用於實現可撓性元件之有機電子裝置的基材。
亦未特別限制第二膜之類型。舉例而言，作為第二膜，可使用於上列之第一膜的類別中之一者，其可與第一膜相同或不同。
第一膜或第二膜之厚度並無特別限制。於一實例中，第一膜之厚度可為約50至500或100至200μm。於此範圍，製備或製造壓敏性黏著劑或有機電子裝置之方法可有效地自動化，且可獲致經濟可行性上之有利效果。
第二膜之厚度亦無特別限制。舉例而言，第二膜之厚度可為與第一膜者相同、或較小或較大。
該壓敏性黏著膜之壓敏性黏著層包括該壓敏性黏著劑組成物，且形成為膜或片。於該壓敏性黏著層中，該壓敏性黏著劑組成物可為交聯或未交聯狀態。該壓敏性黏著層可於室溫為固相或半固相。呈固化或半固化相之包括於該壓敏性黏著層中之可固化壓敏性黏著樹脂可為未交聯狀態。此壓敏性黏著樹脂可於有機電子元件之封裝結構中形成交聯結構，此將於下文描述。
壓敏性黏著層之厚度並無特別限制，且可考量其用途而適當選擇。舉例而言，該壓敏性黏著層之厚度可為約5至200μm。可考量，例如，埋置性(embeddability)(當作為有機電子元件的封裝劑時)、加工性或經濟可行性而控制壓敏性黏著層之厚度。
於另一態樣中，本發明提供製造壓敏性黏著膜之方法。可藉由將壓敏性黏著劑組成物塑化成膜或片而
製造例示性壓敏性黏著膜。
於一實例中，該方法可包括將含有壓敏性黏著劑組成物之塗覆溶液施加於為片或膜之基底膜或釋離膜，並乾燥該所施加之塗覆溶液。該方法可進一步包括將另外的基底膜或釋離膜黏附至乾燥的塗覆溶液。
含有壓敏性黏著劑組成物之塗覆溶液可藉由例如將上述各壓敏性黏著劑組成物之組份溶於或分散於適合溶劑而製備。於一實例中，該壓敏性黏著劑組成物可藉由將濕氣吸收劑、阻斷劑或填料(需要時)溶於或分散於溶劑中、磨碎所得產物、並使經磨碎濕氣吸收劑、阻斷劑或填料與封裝樹脂混合而製備。
用於製備塗覆溶液之溶劑的種類並無特別限制。然而，當溶劑的乾燥時間過長或需於高溫乾燥溶劑，在壓敏性黏著膜之可加工性或耐久性上會有些許問題。因此，可使用揮發溫度為150℃或更低之溶劑。考量到膜之模製性(moldability)，可將少量具上述範圍之揮發溫度的溶劑混合以使用。溶劑可為但不限於下列者中之一或至少二者：甲基乙基酮(MEK)、丙酮、甲苯、二甲基甲醯胺(DMF)、甲基賽璐蘇(MCS)、四氫呋喃(THF)、二甲苯、及N-甲基吡咯啶酮(NMP)。
將塗覆溶液施於基底膜或釋離膜之方法可為但未特別受限於已知的塗覆法，諸如刮刀塗覆(knife coating)、輥塗(roll coating)、噴塗(spray coating)、凹版式塗覆(gravure coating)、簾塗(curtain coating)、逗號刮
刀塗覆(comma coating)或唇模塗覆(lip coating)。
可乾燥所施加之塗覆液以揮發溶劑，藉此形成壓敏性黏著層。乾燥可於例如70至150℃進行1至10分鐘。可考量所使用之溶劑種類而改變乾燥條件。
乾燥後，可於該壓敏性黏著層上形成另外的基底膜或釋離膜。
於又另一態樣中，本發明提供用於封裝有機電子裝置之產品。用於封裝有機電子裝置之產品可包括基材；形成於該基材上之有機電子元件；以及封裝有機電子元件之整個表面例如頂面和側面的壓敏性黏著膜。該壓敏性黏著膜可包括含有交聯狀態之壓敏性黏著劑組成物的壓敏性黏著層。用於封裝有機電子裝置之產品可進一步包括形成於壓敏性黏著層之頂面的覆蓋基材。
在此，該有機電子元件可例如為有機發光元件，且於一實例中，可為頂射型有機發光元件。
於又另一態樣中，本發明提供製造有機電子裝置之方法。用於封裝有機電子裝置之產品可使用例如壓敏性黏著膜而製造。
該壓敏性黏著層可形成作為封裝層，以供有效地固定及承載基材與覆蓋基材，同時展現優異的濕氣阻隔性質及光學性質。
此外，無論有機電子裝置之類型為何(例如，頂射型(top-emissive)或底射型(bottom-emissive)有機電子裝置)，壓敏性黏著層可展現優異的透光性且可為安定
的。
本文中所使用之術語"封裝層"可指覆蓋有機電子元件之頂面與側面兩者之壓敏性黏著層。
圖3為其中有機電子元件係有機發光元件之例示性有機電子裝置之示意圖。
舉例而言，製造有機電子裝置係可包括，將上述之壓敏性黏著膜施加於其上形成有機電子元件之基材以覆蓋該有機電子元件；以及固化該壓敏性黏著膜。
本文中所使用之術語"固化"可指藉由形成本發明之壓敏性黏著劑組成物使透過加熱或UV照射而具有交聯結構以製備壓敏性黏著劑。
特定言之，有機電子元件32係可藉由以如真空沈積或濺鍍之方法於作為基材之玻璃或聚合物膜31上形成透明電極、於該透明電極上形成由例如電洞傳輸層、發光層和電子傳輸層構成之發光有機材料層、以及於其上進一步形成電極層而形成。接著，係設置壓敏性黏著膜之壓敏性黏著層以覆蓋歷經上述程序的基材31之有機電子元件32的整個表面。
接著，可藉由使用層壓機(laminator)(並加熱以提供流動性)以將壓敏性黏著壓至該有機電子元件、以及交聯壓敏性黏著層中之樹脂，以形成封裝層。
於一實例中，設置以覆蓋有機電子元件32整個表面之該壓敏性黏著層33可事先轉移至覆蓋基材34(如玻璃或聚合物膜)。將壓敏性黏著層轉移至覆蓋基材34，
係可在從該壓敏性黏著膜剝離第一或第二膜後使用真空壓製機或真空層壓機並加熱而進行，且壓敏性黏著層接觸該覆蓋基材34。當壓敏性黏著劑包括熱可固化壓敏性黏著樹脂且在此製程期間過度進行固化反應時，封裝層之黏結強度(cohesive strength)或壓敏性黏著強度可能會降低。因此，製程溫度可控制為約100℃或更低，且製程時間可控制為於5分鐘內。
可藉由將已轉移有壓敏性黏著層之覆蓋基材34設置於有機電子元件32上、並進行熱壓程序，以形成封裝層。
封裝層可藉由固化該壓敏性黏著層33而形成。舉例而言，可根據可固化壓敏性黏著樹脂之固化方法，於適當加熱室或UV室中進行固化程序。可考量有機電子元件的安定性和壓敏性黏著樹脂的固化性而適當選擇加熱條件或活性能量射線照射條件，且為了增加壓製效率，可採取同時施加熱與壓力之熱壓(autoclaving)。
在此，係描述製造有機電子裝置之方法的一實例，但該有機電子裝置可藉不同的方法製造。舉例而言，可藉上述方法製造該裝置，但可改變程序之順序或條件。舉例來說，可藉由先將壓敏性黏著層轉移至基材31上之有機電子元件上，而非轉移至覆蓋基材34上，並且在層疊覆蓋基材34時實施固化程序，以形成封裝層。
本發明可提供可有效阻斷從外在環境透入有機電子裝置之濕氣或氧氣、並展現於諸如高溫及高濕度之嚴苛條件下之可靠性與優異光學特性的壓敏性黏著劑組成物，以及包括彼之壓敏性黏著膜。
1,2‧‧‧壓敏性黏著膜
11‧‧‧壓敏性黏著層
12‧‧‧第一膜
21‧‧‧第二膜
3‧‧‧有機電子裝置
31‧‧‧基材
32‧‧‧有機電子元件
33‧‧‧壓敏性黏著層或封裝層
34‧‧‧覆蓋基材
圖1及2為根據本發明之例示性實施態樣之壓敏性黏著膜的橫截面圖；圖3為根據本發明之一例示性實施態樣之用於封裝有機電子裝置之產品的橫截面圖；圖4為顯示根據本發明之實施例1之壓敏性黏著膜的可靠性測試結果的圖解；以及圖5顯示根據本發明之比較例1之壓敏性黏著膜的可靠性測試結果的圖解。
以下參照實施例及比較例詳述本發明，但本發明之範疇並不為以下實施例所限制。
塗覆溶液係藉由添加90g的丁基橡膠(LANXESS,BUTYL 301)作為封裝樹脂、10g的氫化之DCPD系賦黏劑樹脂(SU-90,Kolon)作為賦黏劑、15g的三環癸烷二甲醇二丙烯酸酯(M262，Miwon)作為活性能量射線可聚合之化合物、以及1g的2,2-二甲氧基-1,2-二苯
基乙烷-1-酮(Irgacure651,Ciba)作為自由基引發劑、並於甲苯將混合物稀釋成固體含量(solid content)為約15wt%而製備。
將製得的溶液塗覆在離型(release)PET之離型表面(released surface)，在烘箱中於100℃乾燥15分鐘，以製造包括厚度為20μm之壓敏性黏著層的壓敏性黏著膜。所製的膜以2J/cm2照射UV射線後量測樣品之物理性質。
以如實施例1所述之相同方法製備壓敏性黏著膜，但使用60g的丁基橡膠(LANXESS,BUTYL 301)及30克的聚異丁烯(包括25g的BASF,B80及5g的B15)作為封裝樹脂。
以如實施例1所述之相同方法製備壓敏性黏著膜，但加入相對於100重量份之丁基橡膠及賦黏劑樹脂為20重量份的CaO(Aldrich)作為濕氣吸收劑。
以如實施例1所述之相同方法製備壓敏性黏著膜，但加入80克的聚異丁烯(BASF,B80)作為封裝樹脂、加入丙烯酸2-羥乙酯(HEA,Aldrich)、以及加入異佛酮二異氰酸酯(IPDI,Aldrich)。
以如實施例1所述之相同方法製備壓敏性黏
著膜，但使用聚丁二烯二甲基丙烯酸酯(CN301,Sartomer)作為活性能量射線可聚合之化合物。
比較例3
以如實施例1所述之相同方法製備壓敏性黏著膜，但活性能量射線可聚合之化合物的含量改為3g。
比較例4
以如實施例1所述之相同方法製備壓敏性黏著膜，但活性能量射線可聚合之化合物的含量改為0g。
比較例5
塗覆溶液(壓敏性黏著組成物)係藉由添加99重量份之丙烯酸正丁酯及1重量份之甲基丙烯酸2-羥乙酯、並摻合多官能性環氧化合物(三羥甲基丙烷三環氧丙醚)、陽離子光引發劑(六氟銻酸三芳基鋶)、及γ-環氧丙基氧基丙基三甲氧基矽烷於具有約1,800,000之分子量(Mw)的丙烯酸系壓敏性黏著劑中、以及稀釋該混合物於適當濃度而製備。藉由塗覆及乾燥已製備之塗覆溶液於其上進行釋離處理的聚對酞酸乙二酯(PET)膜之經釋離處理表面上、並藉由照射UV射線形成交聯結構，形成厚度約50μm的壓敏性黏著層。
比較例6
以如實施例1所述之相同方法製備壓敏性黏著膜，但使用80g的聚異丁烯(BASF,B80)作為封裝樹脂代替丁基橡膠，以及加入15g的發煙矽石(R812,Evonik)。
下文中，藉下列方法評估實施例和比較例之物理性質。
1.凝膠含量
凝膠含量(wt%)=B/A×100
在此，A係壓敏性黏著劑組成物的重量，而B係該壓敏性黏著劑組成物於浸入甲苯中在60℃歷時24小時並以200-篩目篩(孔徑：74μm)過濾後剩餘的不可溶含量之乾重。在比較例5中，使用乙酸乙酯以代替甲苯。
2.微凝膠含量
微凝膠含量(wt%)=C/A×100
在此，A係壓敏性黏著劑組成物的重量，而C係該壓敏性黏著劑組成物於浸入甲苯中在60℃歷時24小時並初步以200-篩目篩(孔徑：74μm)過濾並次之以1000-篩目篩(孔徑：5μm)過濾後剩餘的不可溶含量之乾重。在比較例5中，使用乙酸乙酯以代替甲苯。
此外，微凝膠可使用5μm注射器偵測。舉例而言，當該壓敏性黏著劑組成物初步以200-篩目篩(孔徑：74μm)過濾並通過5μm注射器，具有方程式2所示之微凝膠含量超過3%的壓敏性黏著劑組成物，由於注射器因微凝膠(具有約100nm至20μm之尺寸)存在於該組成物中而堵塞所以無法通過。當該組成物無法濾過時，在表1中以X示之。另一方面，當幾乎未有微凝膠時，該組成物即通過注射器(在表1中以O示之)，且方程式2所示之微凝膠含量為偵測為3%或更低。此外，透過形態分
析，可實際確認微凝膠的存在。
3.水蒸氣穿透率(WVTR)
藉由將用於實施例或比較例中的樹脂溶於溶劑中而製備樹脂組成物。將該樹脂組成物施加至具有38μm之厚度的基底膜(釋離聚酯膜，RS-21G,SKC)。接著，該組成物於110℃乾燥10分鐘，藉此形成具有100μm之厚度的膜型層。之後，將該基底膜剝離，且接著沿厚度方向測量該膜型層的WVTR，而該層維持在100℉及100%的相對濕度。根據ASTM F1249的規範標準測量WVTR。
4.評估可靠性
(1)藉由將實施例或比較例中所製造的膜層疊於阻隔膜(作為覆蓋基材)上、將所得之產物層疊於玻璃基材之間、以及使用高壓釜於50℃及5atm將所得之產物壓力及熱加壓而製備樣品。之後，樣品於85℃及85%相對濕度的恆定溫度及恆定濕度室中維持約500小時，並觀察是否介於玻璃基材及壓敏性黏著層之間的界面產生浮起、氣泡、或霧化。當以肉眼觀看時，在介於玻璃基材及壓敏性黏著層之間的界面，若產生至少一浮起、氣泡、或霧化，則以X表示，且若無浮起、氣泡、或霧化產生，則以O表示。
(2)藉由相同方法製造樣品，但在85℃及85%相對濕度評估可靠性的方法中，進一步將偏光板層疊於阻隔膜上，且在80℃室中維持約500小時，觀察以檢查是否介於玻璃基材及壓敏性黏著層之間的界面產生浮起
或氣泡。當以肉眼觀看時，若在介於玻璃基材及壓敏性黏著層之間的界面有至少一浮起或氣泡，則以X表示，且若無浮起或氣泡，則以O表示。
5.測量透光度及霧度
如上述所製之壓敏性黏著膜之透光度係使用UV-Vis光譜儀以550nm測量，且該壓敏性黏著膜之霧度係根據JIS K7105的標準測試方法使用霧度計測量。
1‧‧‧壓敏性黏著膜
11‧‧‧壓敏性黏著層
12‧‧‧第一膜
Claims (17)
- 一種壓敏性黏著劑組成物，其具有方程式1所示之凝膠含量(gel content)為50%或更高、方程式2所示之微凝膠含量(micro gel content)為3%或更低、以及形成厚度為100μm之膜時沿厚度方向具有50g/m2．day或更低之水蒸氣穿透率(water vapor transmission rate)：[方程式1]凝膠含量(wt%)=B/A×100 [方程式2]微凝膠含量(wt%)=C/A×100其中在方程式1及2中，A係該壓敏性黏著劑組成物的質量，在方程式1中，B係該壓敏性黏著劑組成物於浸入甲苯中在60℃歷時24小時並以200-篩目篩(孔徑：74μm)過濾後剩餘的不可溶含量之乾質量(dry mass)，且在方程式2中，C係該壓敏性黏著劑組成物於浸入甲苯中在60℃歷時24小時並初步以200-篩目篩(孔徑：74μm)過濾並次之以1000-篩目篩(孔徑：5μm)過濾後剩餘的不可溶含量之乾質量。
- 如請求項1之組成物，其具有方程式1所示之凝膠含量為50至99%。
- 如請求項1之膜，其於形成膜時，具有對可見光區 之透光度為85%或更高。
- 如請求項1之膜，其於形成膜時，具有霧度為3%或更低。
- 如請求項1之組成物，其包含：封裝樹脂及多官能性活性能量射線可聚合之化合物。
- 如請求項5之組成物，其中，該封裝樹脂係二烯和具有一個碳-碳雙鍵之烯烴系化合物的共聚物。
- 如請求項5之組成物，其中，該活性能量射線可聚合之化合物係多官能性丙烯酸酯。
- 如請求項5之組成物，其中，該活性能量射線可聚合之化合物符合式1：
- 如請求項5之組成物，其進一步包含：賦黏劑。
- 如請求項5之組成物，其進一步包含：自由基引發劑。
- 如請求項1之組成物，其進一步包含： 濕氣吸收劑。
- 一種壓敏性黏著膜，其包含：壓敏性黏著層，其包含如請求項1之壓敏性黏著劑組成物或其交聯產物。
- 如請求項12之膜，其中，該壓敏性黏著層包含具有如請求項1之壓敏性黏著劑組成物或其交聯產物的第一層以及具有壓敏性黏著樹脂或黏著樹脂的第二層。
- 如請求項12之膜，其對可見光區之透光率為85%或更高。
- 如請求項12之膜，其霧度為3%或更低。
- 一種用於封裝有機電子裝置之產品，其包含：基材；有機電子元件，其形成於該基材上；以及如請求項12項之壓敏性黏著膜，以封裝該有機電子元件。
- 一種製造有機電子裝置之方法，其包含：將如請求項12之壓敏性黏著膜施加於其上形成有機電子元件之基材以覆蓋該有機電子元件；以及固化該壓敏性黏著膜。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130092782 | 2013-08-05 | ||
| KR1020140040827A KR20150016880A (ko) | 2013-08-05 | 2014-04-04 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201522566A TW201522566A (zh) | 2015-06-16 |
| TWI534240B true TWI534240B (zh) | 2016-05-21 |
Family
ID=52573472
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103126852A TWI586774B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著組成物、壓敏性黏著膜、及使用彼製造有機電子裝置之方法 |
| TW103126848A TWI534240B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著劑組成物，壓敏性黏著膜及使用彼製造有機電子裝置之方法 |
| TW103126849A TWI548713B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著劑組成物、壓敏性黏著膜及使用彼製造有機電子裝置之方法 |
| TW103126851A TWI589667B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著膜及使用彼製造有機電子裝置之方法 |
| TW103126850A TWI563058B (en) | 2013-08-05 | 2014-08-05 | Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same |
| TW103126847A TWI557964B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著膜及使用彼製造有機電子裝置之方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103126852A TWI586774B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著組成物、壓敏性黏著膜、及使用彼製造有機電子裝置之方法 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103126849A TWI548713B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著劑組成物、壓敏性黏著膜及使用彼製造有機電子裝置之方法 |
| TW103126851A TWI589667B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著膜及使用彼製造有機電子裝置之方法 |
| TW103126850A TWI563058B (en) | 2013-08-05 | 2014-08-05 | Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same |
| TW103126847A TWI557964B (zh) | 2013-08-05 | 2014-08-05 | 壓敏性黏著膜及使用彼製造有機電子裝置之方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (9) | US9803112B2 (zh) |
| EP (6) | EP2963095B1 (zh) |
| JP (6) | JP6223570B2 (zh) |
| KR (12) | KR20150016880A (zh) |
| CN (6) | CN105143377B (zh) |
| TW (6) | TWI586774B (zh) |
| WO (6) | WO2015020408A1 (zh) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2803711B1 (en) * | 2013-05-17 | 2018-06-27 | 3M Innovative Properties Company | Pressure sensitive adhesive assembly comprising filler material |
| KR20150016880A (ko) * | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
| JP6152319B2 (ja) * | 2013-08-09 | 2017-06-21 | 日東電工株式会社 | 粘着剤組成物、粘着テープ又はシート |
| JP6586107B2 (ja) * | 2015-02-04 | 2019-10-02 | エルジー・ケム・リミテッド | 封止フィルム |
| CN107636104B (zh) * | 2015-03-24 | 2020-09-15 | 株式会社Lg化学 | 粘合剂组合物 |
| KR102034441B1 (ko) * | 2015-09-25 | 2019-10-21 | 주식회사 엘지화학 | 점착제 조성물 |
| KR102056598B1 (ko) * | 2015-09-25 | 2019-12-17 | 주식회사 엘지화학 | 점착제 조성물 |
| JP6867126B2 (ja) * | 2015-11-04 | 2021-04-28 | 日東電工株式会社 | 粘着剤層付き偏光板、画像表示装置、偏光板の貼り合わせ方法、および粘着剤層付き偏光板の製造方法 |
| KR20170061227A (ko) | 2015-11-25 | 2017-06-05 | 삼성디스플레이 주식회사 | 유기막 형성용 조성물 및 이의 경화물을 포함한 전자 장치 |
| KR101693797B1 (ko) * | 2015-12-29 | 2017-01-09 | 주식회사 이녹스 | 유기전자장치 봉지재용 점착필름 및 이를 포함하는 봉지재 |
| KR102494986B1 (ko) | 2016-01-11 | 2023-02-03 | 삼성디스플레이 주식회사 | 폴더블 표시장치 |
| KR102069936B1 (ko) * | 2016-04-29 | 2020-01-23 | 주식회사 엘지화학 | 발열체 |
| KR101720932B1 (ko) | 2016-05-04 | 2017-03-29 | (주)리버앤씨 | 데이터 로거를 구비하는 해저계류장치 |
| KR101887993B1 (ko) * | 2016-07-27 | 2018-08-13 | 주식회사 엘지화학 | 광경화 수지 조성물 및 이의 용도 |
| JP7146282B2 (ja) * | 2016-12-09 | 2022-10-04 | エルジー・ケム・リミテッド | 密封材組成物 |
| JP6625079B2 (ja) * | 2017-02-14 | 2019-12-25 | アイカ工業株式会社 | 封止樹脂組成物 |
| KR20190124318A (ko) | 2017-03-22 | 2019-11-04 | 미쯔비시 케미컬 주식회사 | 경화성 조성물, 시트, 그것을 이용한 적층체, 화상 표시 장치 |
| JP7010597B2 (ja) * | 2017-03-30 | 2022-01-26 | リンテック株式会社 | 粘着剤組成物、封止シート、及び封止体 |
| US9960389B1 (en) | 2017-05-05 | 2018-05-01 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
| KR101936600B1 (ko) * | 2017-07-06 | 2019-01-09 | (주)이녹스첨단소재 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| KR101961699B1 (ko) * | 2017-08-08 | 2019-03-25 | (주)이녹스첨단소재 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| KR101961700B1 (ko) * | 2017-08-08 | 2019-03-25 | (주)이녹스첨단소재 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| JP7170387B2 (ja) * | 2017-08-21 | 2022-11-14 | リンテック株式会社 | 粘着シートおよび表示体 |
| KR101962193B1 (ko) * | 2017-08-22 | 2019-03-26 | (주)이녹스첨단소재 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| EP3683264A4 (en) | 2017-09-12 | 2020-07-29 | LG Chem, Ltd. | ENCLOSURE COMPOSITION |
| KR102283118B1 (ko) * | 2017-11-01 | 2021-07-28 | 주식회사 엘지화학 | 유-무기 복합 태양전지 및 유-무기 복합 태양전지 제조방법 |
| KR102190867B1 (ko) | 2017-11-17 | 2020-12-14 | 주식회사 엘지화학 | 폼 조성물 및 이의 경화물을 포함하는 폼층을 포함하는 폼 테이프 |
| KR20190065662A (ko) * | 2017-12-04 | 2019-06-12 | 주식회사 케이씨씨 | 접착제 키트, 이를 포함하는 접착필름 및 봉지재, 및 유기전자장치의 봉지방법 |
| KR102316235B1 (ko) * | 2017-12-18 | 2021-10-25 | 주식회사 엘지화학 | 봉지용 조성물 |
| KR102212139B1 (ko) * | 2018-01-11 | 2021-02-03 | 주식회사 엘지화학 | 온도가변형 점착 시트 및 이를 이용한 온도가변형 점착 시트 제조방법 |
| TWI708819B (zh) * | 2018-06-14 | 2020-11-01 | 香港商創王(香港)股份有限公司 | 顯示裝置及其製造方法 |
| US11643494B2 (en) | 2018-07-12 | 2023-05-09 | 3M Innovative Properties Company | Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer |
| CN109439262B (zh) * | 2018-10-29 | 2021-04-23 | 常州浩阳水性新材料有限公司 | 一种pvc带胶膜用胶水及其制备方法 |
| CN113316624A (zh) * | 2018-11-20 | 2021-08-27 | 俄勒冈州立大学 | 来自植物油或动物脂的紫外线辐射固化的压敏粘合剂 |
| JP7354251B2 (ja) * | 2018-12-07 | 2023-10-02 | エルジー・ケム・リミテッド | 封止組成物 |
| KR102208996B1 (ko) * | 2019-02-13 | 2021-01-28 | 서울대학교산학협력단 | 내열성이 향상된 유사-상호침투 중합체 네트워크 구조의 고무 점착 필름, 이의 제조방법 및 이를 포함하는 점착 필름 |
| JP7317133B2 (ja) * | 2019-02-28 | 2023-07-28 | エルジー・ケム・リミテッド | 封止フィルム |
| KR102059172B1 (ko) * | 2019-07-04 | 2019-12-24 | (주)이녹스첨단소재 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| CN110752312A (zh) * | 2019-10-30 | 2020-02-04 | 京东方科技集团股份有限公司 | 一种显示面板、其制作方法及显示装置 |
| CN110776832A (zh) * | 2019-11-07 | 2020-02-11 | 广州市永隆新材料研究院有限公司 | 一种遮盖压敏胶及其制备方法与应用 |
| CN110828707A (zh) * | 2019-11-19 | 2020-02-21 | 京东方科技集团股份有限公司 | 显示基板的制备方法和离型层材料 |
| KR102349088B1 (ko) * | 2020-01-29 | 2022-01-12 | 주식회사 오플렉스 | 백플레이트 필름 및 이를 이용한 플렉서블 표시장치 |
| KR102240907B1 (ko) * | 2020-02-28 | 2021-04-15 | (주)이녹스첨단소재 | 디스플레이용 점착 시트 |
| TWI774184B (zh) | 2020-03-18 | 2022-08-11 | 日商日本航空電子工業股份有限公司 | 可薄型化半導體裝置及其製造方法 |
| KR20220008987A (ko) * | 2020-07-14 | 2022-01-24 | 삼성전자주식회사 | 가공 테이프 및 이를 사용한 반도체 장치 제조 방법 |
| JP2022028180A (ja) | 2020-08-03 | 2022-02-16 | 日本航空電子工業株式会社 | デバイス及びデバイスの製造方法 |
| KR20230082595A (ko) * | 2021-12-01 | 2023-06-08 | 주식회사 엘지화학 | 봉지 필름 |
Family Cites Families (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4133731A (en) * | 1978-03-03 | 1979-01-09 | Shell Oil Company | Radiation cured, high temperature adhesive composition |
| JPS6092343A (ja) * | 1983-10-27 | 1985-05-23 | Sumitomo Chem Co Ltd | 低温加硫方法 |
| JPS60104142A (ja) | 1983-11-10 | 1985-06-08 | Nippon Zeon Co Ltd | 粘着剤組成物 |
| KR910004643B1 (ko) * | 1987-10-31 | 1991-07-09 | 고려화학 주식회사 | 고분자 수지재의 반도체봉지용 충격완화제 제조방법 |
| JP2706285B2 (ja) | 1988-12-23 | 1998-01-28 | 関西ペイント株式会社 | 活性エネルギー線硬化型組成物 |
| US5393841A (en) * | 1993-11-09 | 1995-02-28 | Shell Oil Company | Dissimilar arm asymmetric radial or star block copolymers for adhesives and sealants |
| US6093757A (en) * | 1995-12-19 | 2000-07-25 | Midwest Research Institute | Composition and method for encapsulating photovoltaic devices |
| JPH1046125A (ja) | 1996-08-01 | 1998-02-17 | Nippon Synthetic Chem Ind Co Ltd:The | 粘着剤組成物 |
| JP3918887B2 (ja) | 1997-07-07 | 2007-05-23 | 株式会社ブリヂストン | 電子デバイス用封止フィルム |
| JPH11199837A (ja) | 1998-01-06 | 1999-07-27 | Sekisui Chem Co Ltd | 粘着テープおよびそれを用いた壁施工方法 |
| JP3260349B2 (ja) * | 2000-06-05 | 2002-02-25 | 松下電器産業株式会社 | 電気化学素子用封止剤およびそれを用いた電気化学素子 |
| ES2587187T3 (es) * | 2001-05-01 | 2016-10-21 | A. V. Topchiev Institute Of Petrochemical Synthesis | Composición bioadhesiva absorbente de agua bifásica |
| US20060100299A1 (en) * | 2002-07-24 | 2006-05-11 | Ranjit Malik | Transformable pressure sensitive adhesive tape and use thereof in display screens |
| JP4243939B2 (ja) | 2002-09-17 | 2009-03-25 | 日東ライフテック株式会社 | カイロ用粘着部材およびそれを用いたカイロ |
| JP2004307579A (ja) | 2003-04-03 | 2004-11-04 | Mitsubishi Chemicals Corp | 活性エネルギー線硬化性コーティング剤組成物及び該組成物から得られる硬化皮膜を有する成形品 |
| US7479653B2 (en) * | 2003-12-04 | 2009-01-20 | Henkel Ag & Co Kgaa | UV curable protective encapsulant |
| JP2005261453A (ja) | 2004-03-16 | 2005-09-29 | Nitto Lifetech Kk | 紙おむつ内面用粘着シートおよび紙おむつ |
| JP4459138B2 (ja) | 2004-09-13 | 2010-04-28 | 富士フイルム株式会社 | 熱現像感光材料を用いた画像形成方法 |
| JP3916638B2 (ja) * | 2004-12-02 | 2007-05-16 | 日東電工株式会社 | 粘着型光学フィルムおよび画像表示装置 |
| DE102004058282A1 (de) * | 2004-12-02 | 2006-06-08 | Tesa Ag | Doppelseitige Haftklebebänder zur Herstellung von LC-Displays mit lichtreflektierenden und absorbierenden Eigenschaften |
| JP2006309114A (ja) | 2005-03-30 | 2006-11-09 | Lintec Corp | 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法 |
| CN1872933A (zh) | 2005-03-30 | 2006-12-06 | 琳得科株式会社 | 起偏振片用压敏粘合剂和起偏振片及起偏振片的制备方法 |
| JP2006276671A (ja) | 2005-03-30 | 2006-10-12 | Canon Inc | 光学機器 |
| US7462651B2 (en) * | 2005-04-04 | 2008-12-09 | National Starch And Chemical Investment Holding Corporation | Radiation-curable desiccant-filled adhesive/sealant |
| US7687119B2 (en) | 2005-04-04 | 2010-03-30 | Henkel Ag & Co. Kgaa | Radiation-curable desiccant-filled adhesive/sealant |
| KR101263393B1 (ko) * | 2005-07-15 | 2013-05-21 | 삼성전자주식회사 | 유피앤피 에이브이 스트림 전송 방법 및 장치 |
| JP4122033B2 (ja) * | 2005-10-21 | 2008-07-23 | 横浜ゴム株式会社 | 変性ブチルゴム組成物 |
| JP2007197517A (ja) * | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機ｅｌ素子 |
| KR100813217B1 (ko) * | 2006-03-16 | 2008-03-13 | 재단법인서울대학교산학협력재단 | Ｓｅｍｉ-ＩＰＮ 구조 형성에 의한 ＵＶ 경화형 아크릴점착제 점착물성 개선방법 |
| EP2004746B1 (en) | 2006-03-29 | 2018-08-01 | Henkel AG & Co. KGaA | Radiation-curable rubber adhesive/sealant |
| JP2007262309A (ja) | 2006-03-29 | 2007-10-11 | Sekisui Plastics Co Ltd | 高分子ゲル、該ゲル製造用組成物及び粘着テープ |
| CN101516617B (zh) | 2006-09-26 | 2012-08-29 | 琳得科株式会社 | 剥离片以及粘合体 |
| KR101000565B1 (ko) * | 2007-02-02 | 2010-12-14 | 주식회사 엘지화학 | 점착제 조성물, 이를 이용한 광학 필터 및 플라즈마디스플레이 패널 표시 장치 |
| WO2008144080A1 (en) | 2007-05-18 | 2008-11-27 | Henkel Ag & Co. Kgaa | Organic electronic devices protected by elastomeric laminating adhesive |
| JP2009096856A (ja) | 2007-10-16 | 2009-05-07 | Bridgestone Corp | ゴム組成物及びそれを用いた重荷重用空気入りラジアルタイヤ |
| KR101023842B1 (ko) * | 2008-01-11 | 2011-03-22 | 주식회사 엘지화학 | 점착제 조성물, 상기를 포함하는 편광판 및 액정표시장치 |
| US9487680B2 (en) | 2008-04-21 | 2016-11-08 | Lg Chem, Ltd. | Pressure sensitive adhesive compositions, polarizers and liquid crystal displays comprising the same |
| JP2009267020A (ja) * | 2008-04-24 | 2009-11-12 | Nitto Denko Corp | 太陽電池パネル用粘着シート、該粘着シートを用いてなる太陽電池パネルおよび該粘着シートを用いた太陽電池パネルの製造方法 |
| US20110073901A1 (en) | 2008-06-02 | 2011-03-31 | Jun Fujita | Adhesive encapsulating composition and electronic devices made therewith |
| US8232350B2 (en) * | 2008-06-02 | 2012-07-31 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| JP2010132761A (ja) | 2008-12-04 | 2010-06-17 | Tosoh Corp | 粘着剤組成物 |
| JP5455362B2 (ja) * | 2008-12-25 | 2014-03-26 | チェイル インダストリーズ インコーポレイテッド | 粘着剤組成物およびこれを用いた光学部材 |
| US8368218B2 (en) | 2009-01-14 | 2013-02-05 | Dow Corning Corporation | Adhesive flexible barrier film, method of forming same, and organic electronic device including same |
| KR101075192B1 (ko) | 2009-03-03 | 2011-10-21 | 도레이첨단소재 주식회사 | 전자부품 제조용 점착테이프 |
| JP2010209168A (ja) | 2009-03-09 | 2010-09-24 | Lintec Corp | 粘着シート |
| DE102009012272B4 (de) * | 2009-03-11 | 2011-06-09 | Wellmann, Stefanie, Dr. | Dual härtende UV-Klebstoffe und deren Verwendungen |
| CN102725141B (zh) * | 2010-01-21 | 2015-09-30 | 日东电工株式会社 | 透明膜及其利用 |
| JP5495906B2 (ja) | 2010-04-06 | 2014-05-21 | 東亞合成株式会社 | 光硬化性接着剤組成物、偏光板とその製造法、光学部材及び液晶表示装置 |
| KR101297003B1 (ko) * | 2010-04-20 | 2013-08-14 | 닛토덴코 가부시키가이샤 | 수분산형 아크릴계 점착제 조성물 및 점착 시트 |
| JP2011236298A (ja) | 2010-05-07 | 2011-11-24 | Bridgestone Corp | 接着性組成物、フレキシブル情報表示パネル及びフレキシブル情報表示パネルの製造方法 |
| WO2012026118A1 (ja) * | 2010-08-27 | 2012-03-01 | 日東電工株式会社 | アクリル系粘着剤組成物、アクリル系粘着剤層およびアクリル系粘着テープ |
| JP5593175B2 (ja) * | 2010-09-09 | 2014-09-17 | リンテック株式会社 | 封止用粘着シート、電子デバイス、及び有機デバイス |
| TWI522438B (zh) | 2010-11-02 | 2016-02-21 | Ｌｇ化學股份有限公司 | 黏著層及利用其封裝有機電子裝置之方法 |
| KR101576689B1 (ko) * | 2010-11-24 | 2015-12-10 | (주)엘지하우시스 | 터치패널용 점착제 조성물, 점착필름 및 터치패널 |
| JP6097474B2 (ja) | 2010-12-13 | 2017-03-15 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルム、および画像表示装置 |
| JP6097473B2 (ja) | 2010-12-13 | 2017-03-15 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルム、および画像表示装置 |
| KR101362879B1 (ko) | 2010-12-31 | 2014-02-14 | 제일모직주식회사 | 편광판용 점착제 조성물 |
| KR101545379B1 (ko) | 2011-08-25 | 2015-08-20 | 주식회사 엘지화학 | 점착제 |
| TWI437343B (zh) * | 2011-09-14 | 2014-05-11 | Hon Hai Prec Ind Co Ltd | 取像鏡頭遮光罩結構 |
| JP5945393B2 (ja) * | 2011-09-30 | 2016-07-05 | 日東電工株式会社 | 粘着シート |
| DE102011085034A1 (de) * | 2011-10-21 | 2013-04-25 | Tesa Se | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
| US20140262002A1 (en) * | 2011-10-24 | 2014-09-18 | 3M Innovative Properties Company | Micro-structured optically clear adhesives |
| KR101459125B1 (ko) | 2011-12-07 | 2014-11-07 | 제일모직주식회사 | 광경화형 점착제 조성물 및 이를 포함하는 디스플레이 장치 |
| CN103930502B (zh) | 2011-11-14 | 2016-04-27 | Lg化学株式会社 | 粘合膜和使用该粘合膜封装有机电子器件的方法 |
| WO2013073902A1 (ko) | 2011-11-18 | 2013-05-23 | 주식회사 엘지화학 | 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법 |
| CN103959501B (zh) * | 2011-11-18 | 2017-06-20 | Lg化学株式会社 | 用于包封有机电子装置的光可固化压敏粘合膜、有机电子装置以及包封该装置的方法 |
| JP2013120804A (ja) * | 2011-12-06 | 2013-06-17 | Daicel Corp | シート状カバリング剤、カバリング方法又は電子デバイスの製造方法 |
| TWI521030B (zh) * | 2011-12-21 | 2016-02-11 | Ｌｇ化學股份有限公司 | 壓感性黏著劑組成物 |
| WO2013103281A1 (ko) | 2012-01-06 | 2013-07-11 | 주식회사 엘지화학 | 봉지용 필름 |
| JP2015529344A (ja) | 2012-08-27 | 2015-10-05 | エルジー・ケム・リミテッド | 偏光板 |
| JP6374793B2 (ja) * | 2012-10-29 | 2018-08-15 | リンテック株式会社 | 粘着剤組成物及び粘着シート |
| KR20150016880A (ko) * | 2013-08-05 | 2015-02-13 | 주식회사 엘지화학 | 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법 |
| KR101758418B1 (ko) * | 2013-08-27 | 2017-07-14 | 주식회사 엘지화학 | 내구성이 우수한 고무계 점착제 조성물 |
| KR101574024B1 (ko) * | 2013-09-24 | 2015-12-02 | 주식회사 엘지화학 | 점착성 조성물 |
| JP6461910B2 (ja) * | 2014-02-25 | 2019-01-30 | リンテック株式会社 | 接着剤組成物、接着シート及び電子デバイス |
| TWI602863B (zh) * | 2014-03-27 | 2017-10-21 | Ｌｇ化學股份有限公司 | 封裝膜及含彼之有機電子裝置 |
| US20160098728A1 (en) * | 2014-10-04 | 2016-04-07 | Piotr Nawrocki | Communication Method And System With DTA Register Architecture |
| KR101807920B1 (ko) * | 2014-11-12 | 2017-12-12 | 주식회사 엘지화학 | 점착 필름 |
| JP6586107B2 (ja) * | 2015-02-04 | 2019-10-02 | エルジー・ケム・リミテッド | 封止フィルム |
| CN107580619A (zh) * | 2015-03-24 | 2018-01-12 | 株式会社Lg化学 | 粘合剂组合物 |
| TWI603318B (zh) * | 2016-02-01 | 2017-10-21 | 于詠為 | Piano |
-
2014
- 2014-04-04 KR KR1020140040827A patent/KR20150016880A/ko unknown
- 2014-04-04 KR KR1020140040825A patent/KR20150016878A/ko unknown
- 2014-04-04 KR KR1020140040826A patent/KR20150016879A/ko unknown
- 2014-04-04 KR KR1020140040817A patent/KR20150016877A/ko unknown
- 2014-04-04 KR KR1020140040828A patent/KR20150016881A/ko unknown
- 2014-04-04 KR KR1020140040816A patent/KR20150016876A/ko unknown
- 2014-08-05 KR KR1020140100681A patent/KR101778835B1/ko active IP Right Grant
- 2014-08-05 EP EP14835409.5A patent/EP2963095B1/en active Active
- 2014-08-05 JP JP2016531542A patent/JP6223570B2/ja active Active
- 2014-08-05 WO PCT/KR2014/007236 patent/WO2015020408A1/ko active Application Filing
- 2014-08-05 EP EP14833722.3A patent/EP2966138B1/en active Active
- 2014-08-05 KR KR1020140100642A patent/KR101645092B1/ko active IP Right Review Request
- 2014-08-05 TW TW103126852A patent/TWI586774B/zh active
- 2014-08-05 US US14/763,410 patent/US9803112B2/en active Active
- 2014-08-05 US US14/762,389 patent/US10351738B2/en active Active
- 2014-08-05 CN CN201480014535.2A patent/CN105143377B/zh active Active
- 2014-08-05 TW TW103126848A patent/TWI534240B/zh active
- 2014-08-05 TW TW103126849A patent/TWI548713B/zh active
- 2014-08-05 EP EP14835324.6A patent/EP2966137B1/en active Active
- 2014-08-05 CN CN201480005577.XA patent/CN105051139B/zh active Active
- 2014-08-05 WO PCT/KR2014/007244 patent/WO2015020413A1/ko active Application Filing
- 2014-08-05 WO PCT/KR2014/007243 patent/WO2015020412A1/ko active Application Filing
- 2014-08-05 CN CN201480018982.5A patent/CN105121575B/zh active Active
- 2014-08-05 WO PCT/KR2014/007235 patent/WO2015020407A1/ko active Application Filing
- 2014-08-05 US US14/647,365 patent/US10202525B2/en active Active
- 2014-08-05 KR KR1020140100644A patent/KR101815342B1/ko active IP Right Review Request
- 2014-08-05 JP JP2016533239A patent/JP6277275B2/ja active Active
- 2014-08-05 CN CN201480030234.9A patent/CN105246999B/zh active Active
- 2014-08-05 US US14/765,494 patent/US10392536B2/en active Active
- 2014-08-05 JP JP2016531543A patent/JP6261738B2/ja active Active
- 2014-08-05 KR KR1020140100664A patent/KR101817387B1/ko active IP Right Grant
- 2014-08-05 KR KR1020140100665A patent/KR101790395B1/ko active IP Right Grant
- 2014-08-05 EP EP14833859.3A patent/EP2966136B1/en active Active
- 2014-08-05 US US14/764,119 patent/US10336917B2/en active Active
- 2014-08-05 TW TW103126851A patent/TWI589667B/zh active
- 2014-08-05 CN CN201480020732.5A patent/CN105121581B/zh active Active
- 2014-08-05 JP JP2016533240A patent/JP6223572B2/ja active Active
- 2014-08-05 EP EP14834795.8A patent/EP2949717B1/en active Active
- 2014-08-05 WO PCT/KR2014/007239 patent/WO2015020411A1/ko active Application Filing
- 2014-08-05 KR KR1020140100676A patent/KR101815343B1/ko active IP Right Grant
- 2014-08-05 EP EP14835356.8A patent/EP2966139B1/en active Active
- 2014-08-05 WO PCT/KR2014/007238 patent/WO2015020410A1/ko active Application Filing
- 2014-08-05 TW TW103126850A patent/TWI563058B/zh active
- 2014-08-05 US US14/765,482 patent/US10308842B2/en active Active
- 2014-08-05 CN CN201480011630.7A patent/CN105008476B/zh active Active
- 2014-08-05 JP JP2015557959A patent/JP6177936B2/ja active Active
- 2014-08-05 TW TW103126847A patent/TWI557964B/zh active
- 2014-08-05 JP JP2016531541A patent/JP6261737B2/ja active Active
-
2018
- 2018-12-18 US US16/224,040 patent/US10752814B2/en active Active
-
2019
- 2019-04-17 US US16/386,925 patent/US10683440B2/en active Active
- 2019-05-16 US US16/414,163 patent/US10570321B2/en active Active
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI534240B (zh) | 壓敏性黏著劑組成物，壓敏性黏著膜及使用彼製造有機電子裝置之方法 | |
| JP6304606B2 (ja) | 粘着フィルム |