TW201703295A - 發光元件 - Google Patents

發光元件 Download PDF

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TW201703295A
TW201703295A TW105104545A TW105104545A TW201703295A TW 201703295 A TW201703295 A TW 201703295A TW 105104545 A TW105104545 A TW 105104545A TW 105104545 A TW105104545 A TW 105104545A TW 201703295 A TW201703295 A TW 201703295A
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electrode
light
unit
insulating layer
insulating
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TW105104545A
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丁紹瀅
吳協展
黃靖恩
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新世紀光電股份有限公司
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Abstract

本發明提供一種發光元件，包含一發光單元、一電極單元，及一絕緣單元。該發光單元包括一發光體與一封裝膠體，該發光體以電致發光產生光能，且該封裝膠體形成於該發光體的部分表面。該電極單元包括分別形成於該發光體未形成有該封裝膠體的表面的一第一電極與一第二電極。該絕緣單元形成於該發光單元的表面，且包括一凸出於該第一電極與該第二電極之間的第一絕緣層。本發明提供的發光元件，可於後續利用錫膏電性連接於一外部電路板時，藉由該絕緣單元的設置而有效地解決因錫膏溢流而相互接觸所造成元件短路的問題。

Description

發光元件
本發明是有關於一種發光元件，特別是指一種具有高製程良率及元件信賴性的發光元件。
發光二極體(light emitting diode，LED)由於具有體積小、亮度高、反應時間短、壽命長等優點，因此，由發光二極體進行組裝所構成的發光元件，廣泛地被應用於照明、看板，或作為顯示器之背光源等領域。
現有的發光元件製程中，主要是先將發光二極體進行封裝後，再利用表面黏著技術(surface mount technology，SMT)將發光二極體焊接於印刷電路板(printed circuit board，PCB)上，形成電性通路，而製成發光元件。
一般而言，常見的表面黏著技術係利用錫膏(solder)將發光二極體電性連接於印刷電路板上，然而，目前以此方式進行連接常見的問題為，錫膏於接合或壓合的過程中，容易產生錫膏溢流，熔融之錫膏也因為軟化流動而相互接觸造成元件短路，進而使得發光元件失效。
因此，由上述的說明可知，發展出一種能克服上述缺點之發光元件，使該發光元件能兼顧製程良率、元件信賴性，是此技術領域的相關技術人員所待突破的課題。
因此，本發明之一目的，即在提供一種發光元件。
於是，本發明發光元件，包含一發光單元、一電極單元，及一絕緣單元。
該發光單元包括一發光體與一封裝膠體，該發光體以電致發光產生光能，且該封裝膠體形成於該發光體的部分表面。
該電極單元包括一第一電極與一第二電極，該第一電極與該第二電極分別形成於該發光體未形成有該封裝膠體的的表面。
該絕緣單元形成於該發光單元的表面，且包括一凸出於該第一電極與該第二電極之間的第一絕緣層。
本發明之功效在於，在將該發光元件利用錫膏電性連接於一外部電路板時，可藉由該絕緣單元有效地分隔錫膏，以解決因錫膏溢流而造成元件短路的問題，兼具提升製程良率、元件信賴性，以及降低生產成本等優勢。
在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。有關本發明之技術內容、特點與功效，在以下的詳細說明中，將可清楚的呈現。
參閱圖1與圖2，本發明發光元件的一第一實施例包含一發光單元2、一電極單元3，及一絕緣單元4。
該發光單元2包括一發光體21、一封裝膠體22，及一透光基板23。該發光體21以電致發光產生光能且具有一第一面211、一反向於該第一面211的第二面212，及一連接該第一面211與第二面212的周面213。該封裝膠體22形成於該周面213及第一面211，且具有彼此反向的一第三面221及一第四面222，該發光體21是自該第四面222朝向該第三面221設置而被該封裝膠體22包覆。該透光基板23對應形成於該第一面211的上方，並與該封裝膠體22的第三面221連接。
該電極單元3包括一第一電極31，及一第二電極32，該第一電極31與該第二電極32分別形成於該發光體21的第二面212。
此處要說明的是，該發光單元2具有一出光面24，及一反向於該出光面24的底面25，其中，該發光體21的第二面212與該封裝膠體22的第四面222即為該底面25。該發光體21具有一N型半導體(圖未示)與一P型半導體(圖未示)，且該第一電極31與該第二電極32分別電性連接該N型半導體與該P型半導體。詳細地說，該發光體21具有一N型半導體層、一形成於該N型半導體層上的發光層，及一形成於該發光層上的P型半導體層，其中，該第一電極31與該第二電極32則分別形成於該N型半導體層與該P型半導體層的表面。
該第一實施例中，由於該發光單元2與該電極單元3的細部結構及材料選用係為本技術領域者所周知，且非為本發明之主要技術特徵，因此不再多加贅述。
該絕緣單元4形成於該底面25，且包括一凸出該第一電極31與該第二電極32之間的第一絕緣層41。其中，該第一絕緣層41的材料選自絕緣材料，且可利用網印、UV固化、曝光顯影製程，或3D列印等方式形成於該第一電極31與該第二電極32之間。本發明該第一實施例設置該絕緣單元4的目的是於焊接的過程中，用以隔絕該第一電極31與該第二電極32上的錫膏，亦即該絕緣單元4所選用的絕緣材料是可耐製程高溫的材料。因此，該第一絕緣層41的材料包括但不限於環氧樹脂(epoxy resin)、光阻(photoresist)、塑膠、二氧化矽(silicon dioxide，SiO2 )、矽樹脂(silicone)，或前述其中之一組合。該些材料皆具有優良的抗化性、耐熱性與機械性質。
於此還要說明的是，該第一絕緣層41於製作時，可如圖1所示，凸出於該第一電極31與該第二電極32之間，由於該第一絕緣層41所選用之材料本身即有防沾錫的功效，因此，該第一絕緣層41也可如圖3所示，與該第一電極31及第二電極32齊平，亦可達到相同的功效且具有節省成本的優點。
此外，還要說明的是，該第一絕緣層41除了可如圖1與圖2所示，形成於該第一電極31與該第二電極32之間且不與該第一電極31及第二電極32接觸，亦可如圖4與圖5所示，該第一絕緣層41可與該第一電極31及第二電極32接觸；亦或如圖6所示，該第一絕緣層41覆蓋部分的該第一電極31及第二電極32，其可依製程條件或成本考量等情況適時地進行調整，於此並無限制。
參閱圖7至圖9，本發明發光元件的一第二實施例與該第一實施例大致相同，其不同之處在於，該第二實施例不包含該透光基板23，進而可達到薄型化的設計趨勢，亦更加符合市場的需求。
參閱圖10，本發明發光元件的一第三實施例與該第一實施例大致相同，其不同之處在於，該絕緣單元4還包括至少一第二絕緣層42，該第二絕緣層42形成於該第一電極31與第二電極32的表面，並將該第一電極31與第二電極32分別區隔成至少二個第一電極區311與至少二個第二電極區321。圖10是以該絕緣單元4還包括一第二絕緣層42為例來做說明，但不限於此。此外，由於該第二絕緣層42的材料選擇及形成方式與該第一絕緣層41相同，於此不再多加說明。
此處要說明的是，該第一絕緣層41與第二絕緣層42的邊緣可與該發光體21的邊緣切齊(如圖2所示)，亦或可延伸至該封裝膠體22的周緣，其可依製程條件或成本考量等情況適時的進行調整，於此並無限制。圖10是以該第一絕緣層41與第二絕緣層42分別延伸至該封裝膠體22的周緣為例來做說明，但不限於此。
此外，還要說明的是，本發明該第三實施例藉由該第二絕緣層42進一步將被該第一絕緣層41隔離的該第一電極31與第二電極32分別區隔成二個第一電極區311與二個第二電極區321，因此，可於後續電性連接於一外部電路板時，利用該等第一電極區311與第二電極區321達到對位的功能，進而使該發光元件可更精準的連接於該外部電路板上。
參閱圖11，本發明發光元件的一第四實施例與該第一實施例大致相同，其不同之處在於，該絕緣單元4還包括一第三絕緣層43，該第三絕緣層43形成於該封裝膠體22的第四面222，且與該第一絕緣層41相連接。具體地說，該第一絕緣層41與第三絕緣層43會凸出於該發光單元2與該電極單元3，並與該發光單元2和該電極單元3共同界定出二個凹槽44。
本發明該第四實施例則藉由該等凹槽44，於後續利用錫膏電性連接於一外部電路板時，除了可提供對位的功能外，還能將錫膏限制於該等凹槽44中，以防止錫膏溢流，亦可避免元件產生短路或漏電的情況。
於此要說明的是，該第一絕緣層41與第三絕緣層43除了可凸出於該發光單元2與該電極單元3，同樣地，如圖12所示，也可如前述該第一實施例所述，與該電極單元3齊平。
參閱圖13，本發明發光元件的一第五實施例與該第四實施例大致相同，其不同之處在於，該絕緣單元4還包括該第二絕緣層42，也就是說，該第三絕緣層43會與該第一絕緣層41與該第二絕緣層42相連接，且同該第四實施例所述，該第一絕緣層41、第二絕緣層42與第三絕緣層43會與該發光單元2和該電極單元3共同界定出四個凹槽44。
此外，還需說明的是，配合參閱圖14與圖15，本發明該第四實施例及第五實施例與該第二實施例相同也可不包含該透光基板23，以達到薄型化的設計趨勢。
參閱圖16與圖17，圖16與圖17是說明分別以本發明該第一實施例與第二實施例為例，將其電性連接於一外部電路板5上。於是，在將本發明該第一實施例與第二實施例接合於一外部電路板5的過程中，需先在該外部電路板5上配置複數個墊片51，再於該等墊片51上印刷錫膏52，再將本發明該第一實施例與第二實施例之發光元件電性連接於該外部電路板5上。
本發明該第一實施例至第五實施例所呈現不同態樣的發光元件，主要都是藉由該絕緣單元4而將該第一電極31與第二電極32隔離，以防止焊錫時錫膏溢流所造成元件短路的問題。因此，可有效地提升製程良率與元件信賴性，進而可因產品良率的提升而達到降低生產成本的優點。另一方面，本發明該發光元件還能藉由該第一絕緣層41與第二絕緣層42的設置，彈性地調整該第一電極區311與第二電極區321的數量，以配合產品的種類或後續對位組裝製程的需求。
綜上所述，本發明發光元件藉由該絕緣單元4的設置，可於後續電性連接於該外部電路板5時，防止因錫膏52溢流而相互接觸所造成元件短路的問題，兼顧高製程良率、元件信賴性，以及低成本等優勢。因此，確實能達到本發明之目的。
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。
2‧‧‧發光單元
21‧‧‧發光體
211‧‧‧第一面
212‧‧‧第二面
213‧‧‧周面
22‧‧‧封裝膠體
221‧‧‧第三面
222‧‧‧第四面
23‧‧‧透光基板
24‧‧‧出光面
25‧‧‧底面
3‧‧‧電極單元
31‧‧‧第一電極
311‧‧‧第一電極區
32‧‧‧第二電極
321‧‧‧第二電極區
4‧‧‧絕緣單元
41‧‧‧第一絕緣層
42‧‧‧第二絕緣層
43‧‧‧第三絕緣層
44‧‧‧凹槽
5‧‧‧外部電路板
51‧‧‧墊片
52‧‧‧錫膏
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中： 圖1是一剖視圖，說明本發明發光元件的一第一實施例； 圖2是一以圖1為例的俯視圖，說明本發明該第一實施例； 圖3是一剖視圖，說明本發明該第一實施例的其中一態樣； 圖4是一剖視圖，說明本發明該第一實施例的另一態樣； 圖5是一以圖4為例的俯視圖，說明本發明該第一實施例的另一態樣； 圖6是一剖視圖，說明本發明該第一實施例的又一態樣； 圖7是一剖視圖，說明本發明發光元件的一第二實施例； 圖8是一剖視圖，說明本發明該第二實施例的另一態樣； 圖9是一剖視圖，說明本發明該第二實施例的又一態樣； 圖10是一俯視圖，說明本發明發光元件的一第三實施例； 圖11是一立體圖，說明本發明發光元件的一第四實施例； 圖12是一立體圖，說明本發明該第四實施例的另一態樣； 圖13是一立體圖，說明本發明發光元件的一第五實施例； 圖14是一類似於圖11的立體圖，說明本發明該第四實施例不包含該透光基板的結構態樣； 圖15是一類似於圖13的立體圖，說明本發明該第五實施例不包含該透光基板的結構態樣； 圖16是一剖視圖，說明以本發明該第一實施例電性連接於一外部電路板的實施態樣； 圖17是一剖視圖，說明以本發明該第二實施例電性連接於該外部電路板的實施態樣。
2‧‧‧發光單元
21‧‧‧發光體
211‧‧‧第一面
212‧‧‧第二面
23‧‧‧透光基板
24‧‧‧出光面
25‧‧‧底面
3‧‧‧電極單元
213‧‧‧周面
22‧‧‧封裝膠體
221‧‧‧第三面
222‧‧‧第四面
31‧‧‧第一電極
32‧‧‧第二電極
4‧‧‧絕緣單元
41‧‧‧第一絕緣層

Claims (10)

  1. 一種發光元件，包含： 一發光單元，包括一發光體與一封裝膠體，該發光體以電致發光產生光能，且該封裝膠體形成於該發光體的部分表面； 一電極單元，包括一第一電極與一第二電極，該第一、二電極分別形成於該發光體未形成有該封裝膠體的的表面；及 一絕緣單元，形成於該發光單元的表面，且包括一凸出於該第一電極與該第二電極之間的第一絕緣層。
  2. 如請求項第1項所述的發光元件，其中，該發光體具有一第一面、一反向於該第一面的第二面，及一連接該第一面與第二面的周面，該封裝膠體形成於該發光體的周面及第一面，且該電極單元形成於該第二面。
  3. 如請求項第2項所述的發光元件，其中，該封裝膠體具有彼此反向的一第三面及一第四面，該發光體是自該第四面朝向該第三面設置而被該封裝膠體包覆。
  4. 如請求項第3項所述的發光元件，其中，該絕緣單元還包括至少一第二絕緣層，且該至少一第二絕緣層將該第一電極與第二電極分別區隔成至少二個第一電極區與至少二個第二電極區。
  5. 如請求項第3項所述的發光元件，其中，該絕緣單元還包括一第二絕緣層，且該第二絕緣層將該第一電極與第二電極分別區隔成二個第一電極區與二個第二電極區。
  6. 如請求項第5項所述的發光元件，其中，該絕緣單元還包括一第三絕緣層，該第三絕緣層形成於該封裝膠體的第四面，且與該第一、二絕緣層相連接。
  7. 如請求項第3項所述的發光元件，其中，該絕緣單元還包括一第三絕緣層，該第三絕緣層形成於該封裝膠體的第四面，且與該第一絕緣層相連接。
  8. 如請求項第3項所述的發光元件，其中，該發光單元還包括一透光基板，該透光基板對應形成於該發光體之第一面的上方，並與該封裝膠體的第三面連接。
  9. 如請求項第3項所述的發光元件，其中，該發光體具有一N型半導體及一P型半導體，該第一電極與該第二電極分別電性連接於該N型半導體及該P型半導體。
  10. 如請求項第1項所述的發光元件，其中，該絕緣單元的材料包括環氧樹脂、光阻、塑膠、二氧化矽、矽樹脂，或前述其中之一組合。
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