JP2011071242A - 発光装置及び照明装置 - Google Patents
発光装置及び照明装置 Download PDFInfo
- Publication number
- JP2011071242A JP2011071242A JP2009219771A JP2009219771A JP2011071242A JP 2011071242 A JP2011071242 A JP 2011071242A JP 2009219771 A JP2009219771 A JP 2009219771A JP 2009219771 A JP2009219771 A JP 2009219771A JP 2011071242 A JP2011071242 A JP 2011071242A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- power supply
- substrate
- frame member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】本発明は、給電導体14、15を有する基板10と、この基板10に実装された複数の発光素子71と、各発光素子71の電極に接続されるとともに、各発光素子71のうち、特定の発光素子71aの電極が前記給電導体14、15に接続されるボンディングワイヤ72と、このボンディングワイヤ72の前記接続後に、前記複数の発光素子71の実装領域を囲むように基板10上に塗布された所定の初期粘度及び熱硬化性を有する樹脂製の枠部材73と、この枠部材73の内側に設けられ、前記発光素子71及びボンディングワイヤ72を含めて封止する透光性を有する封止部材74とを備える発光装置70である。
【選択図】図7
Description
照明装置には、光源や屋内又は屋外で使用される照明器具、ディスプレイ装置等が含まれる。
、この発光装置70と熱的に結合された本体20、発光素子を点灯制御する点灯回路30が配設された点灯回路基板31、この点灯回路基板31が収納されたカバー部材40、カバー部材40に取付けられた口金50及び発光装置70を覆って本体20に取付けられたグローブ60を備えて構成されている。
、各発光素子71、ボンディングワイヤ72を封止している。
その後、ボンディングワイヤ72によって隣接する発光素子71の異極の電極同士を接続する。また、個々の発光素子列において、その列の端に配置された発光素子71aの電極を正極側給電導体14又は負極側給電導体15にボンディングワイヤ72で接続する。
15・・・負極側給電導体、20・・・装置本体、70・・・発光装置、
71・・・発光素子(LEDチップ)、72・・・ボンディングワイヤ、
73・・・枠部材、74・・・封止部材、S・・・枠部材の塗布工程の始点、
E・・・枠部材の塗布工程の終点
Claims (3)
- 給電導体を有する基板と;
この基板に実装された複数の発光素子と;
各発光素子の電極に接続されるとともに、各発光素子のうち、特定の発光素子の電極が前記給電導体に接続されるボンディングワイヤと;
このボンディングワイヤの前記接続後に、前記複数の発光素子の実装領域を囲むように基板上に塗布された所定の初期粘度及び熱硬化性を有する樹脂製の枠部材と;
この枠部材の内側に設けられ、前記発光素子及びボンディングワイヤを含めて封止する透光性を有する封止部材と;
を具備することを特徴とする発光装置。 - 前記枠部材は、複数の発光素子の実装領域を囲むように多角形状に塗布され、その塗布工程における塗布の軌跡は、多角形状の角部を始点とし、当該角部を通過した角部の近傍を終点としたことを特徴とする請求項1に記載の発光装置。
- 装置本体と;
装置本体に配設された請求項1又は請求項2に記載の発光装置と;
を具備することを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009219771A JP2011071242A (ja) | 2009-09-24 | 2009-09-24 | 発光装置及び照明装置 |
US12/885,005 US8354783B2 (en) | 2009-09-24 | 2010-09-17 | Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device |
EP10177321.6A EP2302283A3 (en) | 2009-09-24 | 2010-09-17 | Light-emitting device and illumination device |
CN2010102864240A CN102034924B (zh) | 2009-09-24 | 2010-09-17 | 发光装置及照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009219771A JP2011071242A (ja) | 2009-09-24 | 2009-09-24 | 発光装置及び照明装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011071242A true JP2011071242A (ja) | 2011-04-07 |
Family
ID=43480483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009219771A Pending JP2011071242A (ja) | 2009-09-24 | 2009-09-24 | 発光装置及び照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8354783B2 (ja) |
EP (1) | EP2302283A3 (ja) |
JP (1) | JP2011071242A (ja) |
CN (1) | CN102034924B (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013021042A (ja) * | 2011-07-08 | 2013-01-31 | Citizen Electronics Co Ltd | 半導体発光装置及びその製造方法 |
JP2013026416A (ja) * | 2011-07-20 | 2013-02-04 | Toyoda Gosei Co Ltd | 素子搭載基板及びこれを備えた発光装置 |
JP2013098100A (ja) * | 2011-11-04 | 2013-05-20 | Wun Song Hu | 360度全射角の高照度ledバルブ |
JP2013232484A (ja) * | 2012-04-27 | 2013-11-14 | Nichia Chem Ind Ltd | 発光装置およびその製造方法 |
JP2014036063A (ja) * | 2012-08-07 | 2014-02-24 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2018061068A (ja) * | 2018-01-19 | 2018-04-12 | 日亜化学工業株式会社 | 発光装置 |
JP2020013949A (ja) * | 2018-07-20 | 2020-01-23 | 日亜化学工業株式会社 | 発光装置 |
JP2020150048A (ja) * | 2019-03-12 | 2020-09-17 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7758223B2 (en) | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
US8294356B2 (en) | 2008-06-27 | 2012-10-23 | Toshiba Lighting & Technology Corporation | Light-emitting element lamp and lighting equipment |
JP5333758B2 (ja) | 2009-02-27 | 2013-11-06 | 東芝ライテック株式会社 | 照明装置および照明器具 |
JP2011049527A (ja) * | 2009-07-29 | 2011-03-10 | Toshiba Lighting & Technology Corp | Led照明装置 |
JP5601512B2 (ja) | 2009-09-14 | 2014-10-08 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP2011091033A (ja) | 2009-09-25 | 2011-05-06 | Toshiba Lighting & Technology Corp | 発光モジュール、電球形ランプおよび照明器具 |
US8678618B2 (en) | 2009-09-25 | 2014-03-25 | Toshiba Lighting & Technology Corporation | Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same |
CN102032479B (zh) | 2009-09-25 | 2014-05-07 | 东芝照明技术株式会社 | 灯泡型灯以及照明器具 |
CN102032481B (zh) | 2009-09-25 | 2014-01-08 | 东芝照明技术株式会社 | 附带灯口的照明灯及照明器具 |
JP2011204897A (ja) * | 2010-03-25 | 2011-10-13 | Toshiba Lighting & Technology Corp | 発光モジュール |
JP5612991B2 (ja) | 2010-09-30 | 2014-10-22 | シャープ株式会社 | 発光装置及びこれを備えた照明装置 |
USD707192S1 (en) | 2010-11-18 | 2014-06-17 | Cree, Inc. | Light emitting device |
USD721339S1 (en) | 2010-12-03 | 2015-01-20 | Cree, Inc. | Light emitter device |
US8564000B2 (en) | 2010-11-22 | 2013-10-22 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
USD712850S1 (en) | 2010-11-18 | 2014-09-09 | Cree, Inc. | Light emitter device |
US8624271B2 (en) | 2010-11-22 | 2014-01-07 | Cree, Inc. | Light emitting devices |
US8575639B2 (en) | 2011-02-16 | 2013-11-05 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
US9000470B2 (en) * | 2010-11-22 | 2015-04-07 | Cree, Inc. | Light emitter devices |
US9300062B2 (en) | 2010-11-22 | 2016-03-29 | Cree, Inc. | Attachment devices and methods for light emitting devices |
US9490235B2 (en) * | 2010-11-22 | 2016-11-08 | Cree, Inc. | Light emitting devices, systems, and methods |
USD706231S1 (en) | 2010-12-03 | 2014-06-03 | Cree, Inc. | Light emitting device |
USD702653S1 (en) | 2011-10-26 | 2014-04-15 | Cree, Inc. | Light emitting device component |
US8809880B2 (en) | 2011-02-16 | 2014-08-19 | Cree, Inc. | Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays |
US8455908B2 (en) | 2011-02-16 | 2013-06-04 | Cree, Inc. | Light emitting devices |
EP2704220B1 (en) * | 2011-04-26 | 2018-03-07 | Sanyu Rec Co., Ltd. | Method and apparatus for manufacturing optical device |
JP5983603B2 (ja) * | 2011-05-16 | 2016-08-31 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
USD705181S1 (en) | 2011-10-26 | 2014-05-20 | Cree, Inc. | Light emitting device component |
CN104081112B (zh) | 2011-11-07 | 2016-03-16 | 克利公司 | 高电压阵列发光二极管(led)器件、设备和方法 |
WO2013122831A1 (en) * | 2012-02-13 | 2013-08-22 | Cree, Inc. | Improved light emitting devices and methods |
JP5847619B2 (ja) * | 2012-03-14 | 2016-01-27 | シャープ株式会社 | 発光装置および照明装置 |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
DE102012106982A1 (de) * | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Leuchtmittels |
JP6024957B2 (ja) * | 2012-09-24 | 2016-11-16 | 東芝ライテック株式会社 | 発光装置および照明装置 |
US9159700B2 (en) | 2012-12-10 | 2015-10-13 | LuxVue Technology Corporation | Active matrix emissive micro LED display |
US9178123B2 (en) | 2012-12-10 | 2015-11-03 | LuxVue Technology Corporation | Light emitting device reflective bank structure |
US9029880B2 (en) * | 2012-12-10 | 2015-05-12 | LuxVue Technology Corporation | Active matrix display panel with ground tie lines |
JP2014130916A (ja) * | 2012-12-28 | 2014-07-10 | Toshiba Lighting & Technology Corp | 発光モジュール用基板及び発光モジュール用基板の製造方法 |
US9033544B2 (en) * | 2013-04-19 | 2015-05-19 | Technical Consumer Products, Inc. | Smooth LED PAR lamp |
USD739565S1 (en) | 2013-06-27 | 2015-09-22 | Cree, Inc. | Light emitter unit |
USD740453S1 (en) | 2013-06-27 | 2015-10-06 | Cree, Inc. | Light emitter unit |
TWI651871B (zh) * | 2013-06-27 | 2019-02-21 | 晶元光電股份有限公司 | 發光組件及製作方法 |
WO2015050164A1 (ja) * | 2013-10-03 | 2015-04-09 | シャープ株式会社 | 発光装置用基板、発光装置、および、発光装置用基板の製造方法 |
DE102016201917A1 (de) * | 2016-02-09 | 2017-08-10 | Tridonic Jennersdorf Gmbh | LED-Lichtquelle mit höherer Schutzklasse |
USD823492S1 (en) | 2016-10-04 | 2018-07-17 | Cree, Inc. | Light emitting device |
CN206918825U (zh) * | 2017-04-25 | 2018-01-23 | 漳州立达信光电子科技有限公司 | 一种分体式筒灯 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008227412A (ja) * | 2007-03-15 | 2008-09-25 | Sharp Corp | 発光装置およびその製造方法 |
JP2009081349A (ja) * | 2007-09-27 | 2009-04-16 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2009135485A (ja) * | 2007-11-07 | 2009-06-18 | Mitsubishi Chemicals Corp | 半導体発光装置及びその製造方法 |
JP2009164157A (ja) * | 2007-12-28 | 2009-07-23 | Nichia Corp | 発光装置 |
Family Cites Families (168)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US356107A (en) * | 1887-01-18 | Ella b | ||
US534038A (en) * | 1895-02-12 | Dynamo-electric machine | ||
US534665A (en) * | 1895-02-26 | Method of casting projectiles | ||
US1972790A (en) | 1932-07-15 | 1934-09-04 | Crouse Hinds Co | Electric hand lamp |
GB1601461A (en) | 1977-05-21 | 1981-10-28 | Amp Inc | Electrical junction box |
US4503360A (en) | 1982-07-26 | 1985-03-05 | North American Philips Lighting Corporation | Compact fluorescent lamp unit having segregated air-cooling means |
JPH071374B2 (ja) | 1984-03-06 | 1995-01-11 | 株式会社ニコン | 光源装置 |
US4939420A (en) | 1987-04-06 | 1990-07-03 | Lim Kenneth S | Fluorescent reflector lamp assembly |
USD356107S (en) | 1992-05-15 | 1995-03-07 | Fujitsu Limited | Developing cartridge for copier |
JP3121916B2 (ja) | 1992-06-25 | 2001-01-09 | 矢橋工業株式会社 | 石灰焼結体の製造方法 |
DE4235289C2 (de) | 1992-10-20 | 1996-08-01 | Teves Gmbh Alfred | Signalleuchte für ein Fahrzeug |
US5323271A (en) | 1992-11-24 | 1994-06-21 | Equestrian Co., Ltd. | Water- and air-cooled reflection mirror |
JP2662488B2 (ja) | 1992-12-04 | 1997-10-15 | 株式会社小糸製作所 | 自動車用灯具における前面レンズ脚部とシール溝間のシール構造 |
US5327332A (en) | 1993-04-29 | 1994-07-05 | Hafemeister Beverly J | Decorative light socket extension |
JP2828584B2 (ja) | 1993-12-27 | 1998-11-25 | 株式会社小糸製作所 | 自動車用ヘッドランプ |
US5632551A (en) | 1994-07-18 | 1997-05-27 | Grote Industries, Inc. | LED vehicle lamp assembly |
US5537301A (en) | 1994-09-01 | 1996-07-16 | Pacific Scientific Company | Fluorescent lamp heat-dissipating apparatus |
US5585697A (en) | 1994-11-17 | 1996-12-17 | General Electric Company | PAR lamp having an integral photoelectric circuit arrangement |
US6465743B1 (en) | 1994-12-05 | 2002-10-15 | Motorola, Inc. | Multi-strand substrate for ball-grid array assemblies and method |
WO1997001728A1 (en) | 1995-06-29 | 1997-01-16 | Siemens Components, Inc. | Localized illumination using tir technology |
US6111359A (en) | 1996-05-09 | 2000-08-29 | Philips Electronics North America Corporation | Integrated HID reflector lamp with HID arc tube in a pressed glass reflector retained in a shell housing a ballast |
US6095668A (en) | 1996-06-19 | 2000-08-01 | Radiant Imaging, Inc. | Incandescent visual display system having a shaped reflector |
US5785418A (en) | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
US5857767A (en) | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
JPH1125919A (ja) | 1997-07-04 | 1999-01-29 | Moriyama Sangyo Kk | 電球装置および照明装置 |
US5947588A (en) | 1997-10-06 | 1999-09-07 | Grand General Accessories Manufacturing Inc. | Light fixture with an LED light bulb having a conventional connection post |
JP2000083343A (ja) | 1998-09-03 | 2000-03-21 | Mitsubishi Electric Corp | モーターフレーム及びモーターフレームの製造方法 |
ES2289822T3 (es) | 1998-09-17 | 2008-02-01 | Koninklijke Philips Electronics N.V. | Lampara de led. |
JP3753291B2 (ja) | 1998-09-30 | 2006-03-08 | 東芝ライテック株式会社 | 電球形蛍光ランプ |
US6502968B1 (en) | 1998-12-22 | 2003-01-07 | Mannesmann Vdo Ag | Printed circuit board having a light source |
US6186646B1 (en) | 1999-03-24 | 2001-02-13 | Hinkley Lighting Incorporated | Lighting fixture having three sockets electrically connected and mounted to bowl and cover plate |
JP2000294434A (ja) | 1999-04-02 | 2000-10-20 | Hanshin Electric Co Ltd | 内燃機関用点火コイル |
US6227679B1 (en) | 1999-09-16 | 2001-05-08 | Mule Lighting Inc | Led light bulb |
US6525455B1 (en) | 1999-09-22 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd. | Bulb-form lamp and its manufacturing method |
US6161910A (en) | 1999-12-14 | 2000-12-19 | Aerospace Lighting Corporation | LED reading light |
JP2001243809A (ja) | 2000-02-28 | 2001-09-07 | Mitsubishi Electric Lighting Corp | Led電球 |
US6814470B2 (en) | 2000-05-08 | 2004-11-09 | Farlight Llc | Highly efficient LED lamp |
US6626554B2 (en) | 2000-05-18 | 2003-09-30 | Aaron Nathan Rincover | Light apparatus |
WO2002001627A1 (fr) | 2000-06-26 | 2002-01-03 | Hitachi, Ltd. | Dispositif a semi-conducteur et procede de fabrication associe |
JP2002075011A (ja) | 2000-08-30 | 2002-03-15 | Matsushita Electric Ind Co Ltd | 管 球 |
US6517217B1 (en) | 2000-09-18 | 2003-02-11 | Hwa Hsia Glass Co., Ltd. | Ornamental solar lamp assembly |
US6357902B1 (en) | 2000-09-25 | 2002-03-19 | Brian Horowitz | After market LED taillight bulb |
EP1360877A1 (en) | 2001-02-02 | 2003-11-12 | Koninklijke Philips Electronics N.V. | Integrated light source |
JP2002280617A (ja) | 2001-03-19 | 2002-09-27 | Matsushita Electric Ind Co Ltd | 照明装置 |
US6598996B1 (en) | 2001-04-27 | 2003-07-29 | Pervaiz Lodhie | LED light bulb |
CN2489462Y (zh) | 2001-06-17 | 2002-05-01 | 广东伟雄集团有限公司 | 带镶嵌条的节能灯 |
JP4674418B2 (ja) | 2001-06-29 | 2011-04-20 | パナソニック株式会社 | 照明装置 |
JP4076329B2 (ja) | 2001-08-13 | 2008-04-16 | エイテックス株式会社 | Led電球 |
JP4193446B2 (ja) * | 2001-08-22 | 2008-12-10 | 日亜化学工業株式会社 | 発光装置 |
US6866401B2 (en) | 2001-12-21 | 2005-03-15 | General Electric Company | Zoomable spot module |
US6682211B2 (en) | 2001-09-28 | 2004-01-27 | Osram Sylvania Inc. | Replaceable LED lamp capsule |
JP2003115203A (ja) | 2001-10-03 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 低圧水銀蒸気放電ランプ及びその製造方法 |
US6525668B1 (en) | 2001-10-10 | 2003-02-25 | Twr Lighting, Inc. | LED array warning light system |
US6942365B2 (en) | 2002-12-10 | 2005-09-13 | Robert Galli | LED lighting assembly |
KR20090115810A (ko) | 2001-12-29 | 2009-11-06 | 항조우 후양 신잉 띠앤즈 리미티드 | Led 및 led램프 |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
US6685339B2 (en) | 2002-02-14 | 2004-02-03 | Polaris Pool Systems, Inc. | Sparkle light bulb with controllable memory function |
US6641283B1 (en) | 2002-04-12 | 2003-11-04 | Gelcore, Llc | LED puck light with detachable base |
CN1264152C (zh) | 2002-05-08 | 2006-07-12 | 国硕科技工业股份有限公司 | 高密度可录式光记录介质 |
US6824296B2 (en) | 2002-07-02 | 2004-11-30 | Leviton Manufacturing Co., Inc. | Night light assembly |
US20040012955A1 (en) | 2002-07-17 | 2004-01-22 | Wen-Chang Hsieh | Flashlight |
JP4123886B2 (ja) | 2002-09-24 | 2008-07-23 | 東芝ライテック株式会社 | Led点灯装置 |
US6787999B2 (en) | 2002-10-03 | 2004-09-07 | Gelcore, Llc | LED-based modular lamp |
JP2004140185A (ja) * | 2002-10-17 | 2004-05-13 | Matsushita Electric Ind Co Ltd | 発光装置 |
US7111961B2 (en) | 2002-11-19 | 2006-09-26 | Automatic Power, Inc. | High flux LED lighting device |
US7188980B2 (en) | 2002-12-02 | 2007-03-13 | Honda Motor Co., Ltd. | Head light system |
US7153004B2 (en) | 2002-12-10 | 2006-12-26 | Galli Robert D | Flashlight housing |
JP2004193053A (ja) | 2002-12-13 | 2004-07-08 | Toshiba Lighting & Technology Corp | 電球形蛍光ランプおよび照明器具 |
US6964501B2 (en) | 2002-12-24 | 2005-11-15 | Altman Stage Lighting Co., Ltd. | Peltier-cooled LED lighting assembly |
JP4038136B2 (ja) | 2003-01-13 | 2008-01-23 | シーシーエス株式会社 | パワーledを利用したスポット照明装置 |
EP1447619A1 (fr) | 2003-02-12 | 2004-08-18 | Exterieur Vert S.A. | Dispositif d'éclairage, notamment projecteur tel que luminaire étanche encastré dans le sol, à refroidissement par ventilation d'air |
CN2637885Y (zh) | 2003-02-20 | 2004-09-01 | 高勇 | 发光面为曲面的led灯泡 |
JP3885032B2 (ja) | 2003-02-28 | 2007-02-21 | 松下電器産業株式会社 | 蛍光ランプ |
AU2003902031A0 (en) | 2003-04-29 | 2003-05-15 | Eveready Battery Company, Inc | Lighting device |
US6921181B2 (en) | 2003-07-07 | 2005-07-26 | Mei-Feng Yen | Flashlight with heat-dissipation device |
US7679096B1 (en) | 2003-08-21 | 2010-03-16 | Opto Technology, Inc. | Integrated LED heat sink |
US7300173B2 (en) | 2004-04-08 | 2007-11-27 | Technology Assessment Group, Inc. | Replacement illumination device for a miniature flashlight bulb |
US7329024B2 (en) | 2003-09-22 | 2008-02-12 | Permlight Products, Inc. | Lighting apparatus |
US6982518B2 (en) | 2003-10-01 | 2006-01-03 | Enertron, Inc. | Methods and apparatus for an LED light |
US6942360B2 (en) | 2003-10-01 | 2005-09-13 | Enertron, Inc. | Methods and apparatus for an LED light engine |
US7144135B2 (en) | 2003-11-26 | 2006-12-05 | Philips Lumileds Lighting Company, Llc | LED lamp heat sink |
JP2005166578A (ja) | 2003-12-05 | 2005-06-23 | Hamai Denkyu Kogyo Kk | 電球形ledランプ |
US7281818B2 (en) | 2003-12-11 | 2007-10-16 | Dialight Corporation | Light reflector device for light emitting diode (LED) array |
US7198387B1 (en) | 2003-12-18 | 2007-04-03 | B/E Aerospace, Inc. | Light fixture for an LED-based aircraft lighting system |
USD497439S1 (en) | 2003-12-24 | 2004-10-19 | Elumina Technolgy Incorporation | Lamp with high power LED |
JP4343720B2 (ja) | 2004-01-23 | 2009-10-14 | 株式会社小糸製作所 | 灯具 |
US6948829B2 (en) | 2004-01-28 | 2005-09-27 | Dialight Corporation | Light emitting diode (LED) light bulbs |
JP2005217354A (ja) | 2004-02-02 | 2005-08-11 | Sumitomo Wiring Syst Ltd | 発光素子ユニット |
JP2005286267A (ja) | 2004-03-31 | 2005-10-13 | Hitachi Lighting Ltd | 発光ダイオードランプ |
US7059748B2 (en) | 2004-05-03 | 2006-06-13 | Osram Sylvania Inc. | LED bulb |
US7367692B2 (en) | 2004-04-30 | 2008-05-06 | Lighting Science Group Corporation | Light bulb having surfaces for reflecting light produced by electronic light generating sources |
TWI257991B (en) | 2004-05-12 | 2006-07-11 | Kun-Lieh Huang | Lighting device with auxiliary heat dissipation functions |
US7125146B2 (en) | 2004-06-30 | 2006-10-24 | H-Tech, Inc. | Underwater LED light |
EP1774570A2 (en) | 2004-07-27 | 2007-04-18 | Koninklijke Philips Electronics N.V. | Integrated reflector lamp |
JP2006040727A (ja) | 2004-07-27 | 2006-02-09 | Matsushita Electric Works Ltd | 発光ダイオード点灯装置及び照明器具 |
US20060034077A1 (en) | 2004-08-10 | 2006-02-16 | Tsu-Kang Chang | White light bulb assembly using LED as a light source |
DE102004042186B4 (de) | 2004-08-31 | 2010-07-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US7165866B2 (en) | 2004-11-01 | 2007-01-23 | Chia Mao Li | Light enhanced and heat dissipating bulb |
JP2005123200A (ja) | 2004-11-04 | 2005-05-12 | Toshiba Lighting & Technology Corp | 電球形蛍光ランプ |
JP3787148B1 (ja) | 2005-09-06 | 2006-06-21 | 株式会社未来 | 照明ユニット及び照明装置 |
JP2006156187A (ja) | 2004-11-30 | 2006-06-15 | Mitsubishi Electric Corp | Led光源装置及びled電球 |
US7144140B2 (en) | 2005-02-25 | 2006-12-05 | Tsung-Ting Sun | Heat dissipating apparatus for lighting utility |
JP2006244725A (ja) | 2005-02-28 | 2006-09-14 | Atex Co Ltd | Led照明装置 |
US7255460B2 (en) | 2005-03-23 | 2007-08-14 | Nuriplan Co., Ltd. | LED illumination lamp |
JP2006278774A (ja) | 2005-03-29 | 2006-10-12 | Hitachi Cable Ltd | 両面配線基板の製造方法、両面配線基板、およびそのベース基板 |
NL1028678C2 (nl) | 2005-04-01 | 2006-10-03 | Lemnis Lighting Ip Gmbh | Koellichaam, lamp en werkwijze voor het vervaardigen van een koellichaam. |
US7758223B2 (en) | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
JP4725231B2 (ja) | 2005-04-08 | 2011-07-13 | 東芝ライテック株式会社 | 電球型ランプ |
CN101660741B (zh) | 2005-04-08 | 2013-11-06 | 东芝照明技术株式会社 | 灯 |
JP4482706B2 (ja) | 2005-04-08 | 2010-06-16 | 東芝ライテック株式会社 | 電球型ランプ |
USD535038S1 (en) | 2005-04-15 | 2007-01-09 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US7226189B2 (en) | 2005-04-15 | 2007-06-05 | Taiwan Oasis Technology Co., Ltd. | Light emitting diode illumination apparatus |
USD534665S1 (en) | 2005-04-15 | 2007-01-02 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
JP2006310057A (ja) | 2005-04-27 | 2006-11-09 | Arumo Technos Kk | Led照明灯及びled点灯制御回路 |
US7744256B2 (en) | 2006-05-22 | 2010-06-29 | Edison Price Lighting, Inc. | LED array wafer lighting fixture |
US7862201B2 (en) | 2005-07-20 | 2011-01-04 | Tbt Asset Management International Limited | Fluorescent lamp for lighting applications |
CA2621160A1 (en) | 2005-09-06 | 2007-03-15 | Lsi Industries, Inc. | Linear lighting system |
JP4715422B2 (ja) * | 2005-09-27 | 2011-07-06 | 日亜化学工業株式会社 | 発光装置 |
US20070103904A1 (en) | 2005-11-09 | 2007-05-10 | Ching-Chao Chen | Light emitting diode lamp |
JP2007188832A (ja) | 2006-01-16 | 2007-07-26 | Toshiba Lighting & Technology Corp | ランプ |
JP2007207576A (ja) | 2006-02-01 | 2007-08-16 | Jefcom Kk | Ledランプ |
KR20090019871A (ko) | 2006-05-31 | 2009-02-25 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 및 조명 방법 |
US7824075B2 (en) | 2006-06-08 | 2010-11-02 | Lighting Science Group Corporation | Method and apparatus for cooling a lightbulb |
TWM309051U (en) | 2006-06-12 | 2007-04-01 | Grand Halo Technology Co Ltd | Light-emitting device |
JP4300223B2 (ja) | 2006-06-30 | 2009-07-22 | 株式会社 日立ディスプレイズ | 照明装置および照明装置を用いた表示装置 |
JP4367457B2 (ja) | 2006-07-06 | 2009-11-18 | パナソニック電工株式会社 | 銀膜、銀膜の製造方法、led実装用基板、及びled実装用基板の製造方法 |
US7922359B2 (en) | 2006-07-17 | 2011-04-12 | Liquidleds Lighting Corp. | Liquid-filled LED lamp with heat dissipation means |
US7396146B2 (en) | 2006-08-09 | 2008-07-08 | Augux Co., Ltd. | Heat dissipating LED signal lamp source structure |
CN101128041B (zh) | 2006-08-15 | 2010-05-12 | 华为技术有限公司 | 接入网和核心网间下行数据隧道失效后的处理方法和系统 |
TW200837308A (en) | 2006-09-21 | 2008-09-16 | Led Lighting Fixtures Inc | Lighting assemblies, methods of installing same, and methods of replacing lights |
US20080080187A1 (en) | 2006-09-28 | 2008-04-03 | Purinton Richard S | Sealed LED light bulb |
WO2008061084A1 (en) | 2006-11-14 | 2008-05-22 | Cree Led Lighting Solutions, Inc. | Lighting assemblies and components for lighting assemblies |
JP5785361B2 (ja) | 2006-11-30 | 2015-09-30 | クリー インコーポレイテッドCree Inc. | 安定器内蔵型固体照明装置 |
US20110128742A9 (en) | 2007-01-07 | 2011-06-02 | Pui Hang Yuen | High efficiency low cost safety light emitting diode illumination device |
US7968900B2 (en) | 2007-01-19 | 2011-06-28 | Cree, Inc. | High performance LED package |
JP2008277561A (ja) | 2007-04-27 | 2008-11-13 | Toshiba Lighting & Technology Corp | 照明装置 |
CN101307887A (zh) | 2007-05-14 | 2008-11-19 | 穆学利 | 一种led照明灯泡 |
WO2008146694A1 (ja) | 2007-05-23 | 2008-12-04 | Sharp Kabushiki Kaisha | 照明装置 |
US8403531B2 (en) * | 2007-05-30 | 2013-03-26 | Cree, Inc. | Lighting device and method of lighting |
JP5029893B2 (ja) | 2007-07-06 | 2012-09-19 | 東芝ライテック株式会社 | 電球形ledランプおよび照明装置 |
MX2010002082A (es) | 2007-08-22 | 2010-04-30 | Quantum Leap Res Inc | Conjunto para iluminacion con una pluralidad de fuentes de luz con un mecanismo de control para su ajuste lateral y elevacion de las mismas. |
US8390207B2 (en) | 2007-10-09 | 2013-03-05 | Koninklijke Philipe Electronics N.V. | Integrated LED-based luminare for general lighting |
TWI481068B (zh) | 2007-10-10 | 2015-04-11 | 克里公司 | 照明裝置及其製造方法 |
JP4569683B2 (ja) | 2007-10-16 | 2010-10-27 | 東芝ライテック株式会社 | 発光素子ランプ及び照明器具 |
DE102007055133A1 (de) | 2007-11-19 | 2009-05-20 | Osram Gesellschaft mit beschränkter Haftung | Beleuchtungsvorrichtung mit einem Kühlkörper |
JP2009135026A (ja) | 2007-11-30 | 2009-06-18 | Toshiba Lighting & Technology Corp | Led照明器具 |
US7625104B2 (en) | 2007-12-13 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Light emitting diode for mounting to a heat sink |
US20090184646A1 (en) | 2007-12-21 | 2009-07-23 | John Devaney | Light emitting diode cap lamp |
US8049237B2 (en) * | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
JP5353216B2 (ja) | 2008-01-07 | 2013-11-27 | 東芝ライテック株式会社 | Led電球及び照明器具 |
TWM336390U (en) | 2008-01-28 | 2008-07-11 | Neng Tyi Prec Ind Co Ltd | LED lamp |
US8461613B2 (en) | 2008-05-27 | 2013-06-11 | Interlight Optotech Corporation | Light emitting device |
JP5345363B2 (ja) * | 2008-06-24 | 2013-11-20 | シャープ株式会社 | 発光装置 |
CN102175000B (zh) | 2008-07-30 | 2013-11-06 | 东芝照明技术株式会社 | 灯装置及照明器具 |
US7919339B2 (en) * | 2008-09-08 | 2011-04-05 | Iledm Photoelectronics, Inc. | Packaging method for light emitting diode module that includes fabricating frame around substrate |
US8143769B2 (en) | 2008-09-08 | 2012-03-27 | Intematix Corporation | Light emitting diode (LED) lighting device |
US8188486B2 (en) | 2008-09-16 | 2012-05-29 | Osram Sylvania Inc. | Optical disk for lighting module |
US7918587B2 (en) | 2008-11-05 | 2011-04-05 | Chaun-Choung Technology Corp. | LED fixture and mask structure thereof |
DE202008016231U1 (de) | 2008-12-08 | 2009-03-05 | Huang, Tsung-Hsien, Yuan Shan | Wärmeableiter-Modul |
WO2010127138A2 (en) | 2009-05-01 | 2010-11-04 | Express Imaging Systems, Llc | Gas-discharge lamp replacement with passive cooling |
US7963686B2 (en) | 2009-07-15 | 2011-06-21 | Wen-Sung Hu | Thermal dispersing structure for LED or SMD LED lights |
TWI354365B (en) * | 2009-08-26 | 2011-12-11 | Quasioptical led package structure for increasing | |
US8066417B2 (en) | 2009-08-28 | 2011-11-29 | General Electric Company | Light emitting diode-light guide coupling apparatus |
US20110079814A1 (en) | 2009-10-01 | 2011-04-07 | Yi-Chang Chen | Light emitted diode substrate and method for producing the same |
US8602593B2 (en) | 2009-10-15 | 2013-12-10 | Cree, Inc. | Lamp assemblies and methods of making the same |
TWI396844B (zh) | 2009-12-15 | 2013-05-21 | Biosensors Electrode Technology Co Ltd | 用於生物檢測試片之電極、其製造方法及其生物檢測試片 |
CN102102816A (zh) | 2009-12-22 | 2011-06-22 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US8058782B2 (en) | 2010-03-10 | 2011-11-15 | Chicony Power Technology Co., Ltd. | Bulb-type LED lamp |
-
2009
- 2009-09-24 JP JP2009219771A patent/JP2011071242A/ja active Pending
-
2010
- 2010-09-17 EP EP10177321.6A patent/EP2302283A3/en not_active Withdrawn
- 2010-09-17 US US12/885,005 patent/US8354783B2/en not_active Expired - Fee Related
- 2010-09-17 CN CN2010102864240A patent/CN102034924B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008227412A (ja) * | 2007-03-15 | 2008-09-25 | Sharp Corp | 発光装置およびその製造方法 |
JP2009081349A (ja) * | 2007-09-27 | 2009-04-16 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2009135485A (ja) * | 2007-11-07 | 2009-06-18 | Mitsubishi Chemicals Corp | 半導体発光装置及びその製造方法 |
JP2009164157A (ja) * | 2007-12-28 | 2009-07-23 | Nichia Corp | 発光装置 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013021042A (ja) * | 2011-07-08 | 2013-01-31 | Citizen Electronics Co Ltd | 半導体発光装置及びその製造方法 |
JP2013026416A (ja) * | 2011-07-20 | 2013-02-04 | Toyoda Gosei Co Ltd | 素子搭載基板及びこれを備えた発光装置 |
JP2013098100A (ja) * | 2011-11-04 | 2013-05-20 | Wun Song Hu | 360度全射角の高照度ledバルブ |
JP2013232484A (ja) * | 2012-04-27 | 2013-11-14 | Nichia Chem Ind Ltd | 発光装置およびその製造方法 |
JP2014036063A (ja) * | 2012-08-07 | 2014-02-24 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2018061068A (ja) * | 2018-01-19 | 2018-04-12 | 日亜化学工業株式会社 | 発光装置 |
JP2020013949A (ja) * | 2018-07-20 | 2020-01-23 | 日亜化学工業株式会社 | 発光装置 |
JP2021121019A (ja) * | 2018-07-20 | 2021-08-19 | 日亜化学工業株式会社 | 発光装置 |
JP7058388B2 (ja) | 2018-07-20 | 2022-04-22 | 日亜化学工業株式会社 | 発光装置 |
JP2020150048A (ja) * | 2019-03-12 | 2020-09-17 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
JP7240907B2 (ja) | 2019-03-12 | 2023-03-16 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2302283A3 (en) | 2013-04-24 |
US8354783B2 (en) | 2013-01-15 |
EP2302283A2 (en) | 2011-03-30 |
US20110068674A1 (en) | 2011-03-24 |
CN102034924B (zh) | 2013-05-22 |
CN102034924A (zh) | 2011-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011071242A (ja) | 発光装置及び照明装置 | |
JP6209874B2 (ja) | 発光装置及びその製造方法 | |
JP5768435B2 (ja) | 発光装置 | |
JP2008270733A (ja) | 高熱伝導効率ledのパッケージング方法とその構造 | |
WO2011129203A1 (ja) | 発光装置 | |
TW201501364A (zh) | 發光組件及製作方法 | |
JP2005223216A (ja) | 発光光源、照明装置及び表示装置 | |
JP2011192703A (ja) | 発光装置及び照明装置 | |
JP2012505543A (ja) | マルチチップledパッケージ | |
JP2010278246A (ja) | 発光モジュール及びその製造方法 | |
JP5376404B2 (ja) | 発光装置 | |
JP2014082481A (ja) | 発光装置 | |
JP5447686B2 (ja) | 発光モジュール、および照明器具 | |
JP6206266B2 (ja) | 車両用発光モジュール、車両用照明装置、および車両用灯具 | |
KR20140004351A (ko) | 발광 다이오드 패키지 | |
JP5946311B2 (ja) | Ledモジュール | |
JP2010080796A (ja) | 照明装置 | |
JP6459949B2 (ja) | 発光装置 | |
KR100954858B1 (ko) | 고휘도 엘이디 패키지 및 그 제조 방법 | |
JP2009076516A (ja) | 照明装置 | |
JP5420124B1 (ja) | 電球形ランプ、照明装置及び電球形ランプの製造方法 | |
JP2006049715A (ja) | 発光光源、照明装置及び表示装置 | |
JP6711381B2 (ja) | 発光装置及びその製造方法 | |
JP2011096876A (ja) | 発光装置及び照明装置 | |
JP2009076803A (ja) | 発光モジュール及び発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120307 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120809 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20120814 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121009 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130708 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20130809 |
|
RD07 | Notification of extinguishment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7427 Effective date: 20140205 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140318 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140617 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20140624 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20140822 |