CN105895790A - 发光元件及其制作方法 - Google Patents
发光元件及其制作方法 Download PDFInfo
- Publication number
- CN105895790A CN105895790A CN201610089097.7A CN201610089097A CN105895790A CN 105895790 A CN105895790 A CN 105895790A CN 201610089097 A CN201610089097 A CN 201610089097A CN 105895790 A CN105895790 A CN 105895790A
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- China
- Prior art keywords
- light
- emitting component
- encapsulation material
- catoptric arrangement
- epitaxial layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明提供一种发光元件及其制作方法,包含一发光单元、一封装材、一透光层,及一反射结构。该发光单元具有至少一磊晶层及对应形成于该磊晶层上的二个电极,该磊晶层具有一顶面、一底面,及一连接该底面与该顶面的周面,该等电极外露于该底面。封装材形成于该磊晶层的顶面及周面。透光层配置于该封装材上,位于该磊晶层的顶面上方。反射结构围绕着该磊晶层周面设置,且形成于该封装材上。本发明还提供上述发光元件的制作方法。
Description
技术领域
本发明涉及发光元件技术,尤其涉及一种发光元件及其制作方法。
背景技术
图1为现有发光二极管的封装结构示意图,参阅图1,现有的发光二极管的封装结构1,包含一封装杯11、一发光二极管晶粒12、二导线13,及一封装胶材14。
该封装杯11具有反射特性且包括一开口朝上的封装槽110,及一具有彼此间隔且用与外界电连接的一第一接脚111与一第二接脚112的导线架113。该发光二极管晶粒12固晶于该导线架113上且位于该封装槽110内,并包括二电极123。该等导线13是由例如金或铜等导电性良好的金属所构成,且用以将该发光二极管晶粒12的两个电极123分别电连接于该第一接脚111与该第二接脚112。该封装胶材14装填于该封装槽110中,以封闭该封装槽110的开口。
现有的发光二极管的封装结构1的封装杯11具有反光特性,用以反射发光二极管晶粒12发出的光线,然而,该发光二极管晶粒12与该封装杯11的内表面具有一定的间距,导致光反射的光程增加,造成光能量于反射过程的损耗,从而降低出光效率。另外,该封装杯11的开口形状,则会扩大光线的发散角。
发明内容
因此,本发明提供一种发光元件及其制作方法,从而减低发光元件正向出光的发散角及发光均匀度。
该发光元件,包含一发光单元、一封装材、一透光层,及一反射结构。
该发光单元具有至少一可以电致发光而产生光能的磊晶层,及对应形成于该磊晶层上的二个电极,该磊晶层具有一顶面、一底面,及一连接该底面与该顶面的周面,该两个电极外露于该底面。
该封装材形成于该磊晶层的顶面及周面。
该透光层配置于该封装材上,且位于该磊晶层的顶面上方。
该反射结构围绕着该磊晶层的周面设置,且形成于该封装材上。
此外,本发明还提供一种发光元件的制作方法,包含以下步骤:
设置至少一个发光元件于一基板,其中,该发光元件具有一磊晶结构与二电极。
形成一封装材于该基板上,且包覆该磊晶结构并暴露出该二电极。
形成一透光层于该封装材上。
形成一反射结构至少于该封装材的一表面上。
本发明的有益效果在于,通过直接于该封装材上设置环绕该磊晶层的周面的反射结构,令该磊晶层发出的光可直接通过该反射结构的反射对外发出,而有效减小该发光元件的光耗损及正向出光角度。
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图做详细说明如下。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是现有发光二极管的封装结构示意图;
图2是本发明发光元件的第一实施例示意图;
图3A是本发明发光元件的第二实施例示意图;
图3B是本发明发光二极管的第三实施例示意图;
图4是本发明发光元件的第四实施例示意图;
图5是本发明发光元件的第五实施例示意图。
附图标记:
2:发光元件;
21:发光单元;
212:磊晶层;
213:电极;
214:顶面;
215:底面;
216:周面;
22:封装材;
23:透光层;
30:反射结构。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明被详细描述之前,应当注意在以下的说明内容中,类似的元件是以相同的编号来表示。
图2为本发明发光元件的第一实施例示意图,参阅图2,本发明发光元件的第一较佳实施例包含一发光单元21、一封装材22、一透光层23,及一反射结构30。
该发光单元21设置于一基板(图未示)的其中一表面,包括一可以电致发光而产生光能的磊晶层212及二个电极213,该磊晶层212具有一与该透光层23连接的顶面214、一相反的底面215,及一连接该底面215与该顶面214的周面216,该二个电极213设置于该底面215。
具体地说,该磊晶层212可视所需的发光波长而选用不同材料,于本实施例中,该磊晶层212为具有一n型半导体层、一形成于该n型半导体层部份表面的主发光层,及一形成于该主发光层表面的p型半导体层,其中,该p型半导体层及该n型半导体层于同向裸露的表面即为该底面215,该两个电极213为分别形成于该n型半导体层及p型半导体层裸露的表面。由于该磊晶层212结构与材料的选择为本技术领域所周知,且非本发明的重点,于此不多加赘述。
该封装材22形成于该磊晶层212的顶面214及周面216。
具体的说,该封装材22选自可透光的有机的高分子封装材料,如环氧树脂、聚硅烷氧或硅树脂,或是可透光的无机材料,例如是玻璃,可隔绝该磊晶层212与外界环境接触,以避免如湿气渗透或其他外在因素而影响该发光单元21的寿命。
该透光层23配置于该封装材22的一顶面上,且位于该发光单元21的磊晶层212的顶面214上方。选自可透光且不影响光学性质的材料所构成,例如玻璃、聚碳酸酯、亚克力、陶瓷、塑胶等。
该反射结构30对应围绕该磊晶层212的周面216,直接形成于该封装材22表面,并延伸至该透光层23的周缘,使该反射结构30与该磊晶层212周面216间具有该封装材22,用以反射自该发光单元21发出的光线。通过该反射结构30将自该磊晶层212周面216发出的光直接反射,因此,可让该磊晶层212产生的光仅可自该顶面214发出,而有效减低该发光单元21的光发散角。较佳地,该反射结构30的反射率不小于25%。
具体地说,该反射结构30的目的是用于反射该发光单元21自该周面216发出的光,因此,只要能反射该发光单元21发出的光即可,其构成材料并不须特别加以限制。但以制程及成本考量,较佳地,在让该反射结构30的反射率不小于25%的同时,该反射结构30可以是由包含粘结剂及多数分散于该粘结剂中的反射粒子所共同构成,通过该等反射粒子,使该发光单元21发出的光在碰到该反射结构30时,提高整体反射效果;或是选自具有良好反射的银、铝、铂,及金等金属或合金金属所构成。其中,该粘结剂选自高分子树脂、亚克力树脂、硅胶,或是由一般光硬化或热硬化组成材料硬化后而得,该反射粒子选自二氧化钛、二氧化锆、硫酸钡,及五氧化二钽等金属氧化物;抑或是由不同反射率膜层相互堆叠而成的布拉格反射镜。于本实施例中该反射结构30延伸至该透光层23的周缘,而能进一步的改善该透光层23侧边漏光的情况,当然,该反射结构30也可视实际需求,仅对应形成于该磊晶层212的周面216,而不延伸至该透光层23的周缘。
值得一提的是,该封装材22还可进一步包含荧光粉,是通过将荧光粉添加在前述的有机材料中或是让荧光粉与玻璃粉一同烧结成玻璃荧光体而形成封装材22,可让该发光单元21所发出的光再激发荧光粉而发出其它预定波长的光,以供后续不同的运用。由于本发明该封装材22是全面盖覆于该磊晶层212的顶面214及周面216,因此,当该封装材22还包含荧光粉时,该发光单元21无论是自该周面216还是顶面214所发出的光,均能通过该封装材22的荧光粉改变光色,且通过该反射结构30对光的多次反射,还可更进一步提升对该荧光粉的激发效率,因此能使该发光单元21对外发出的光形更为集中,且光色更为均匀。
图3A是本发明发光元件的第二实施例示意图,参阅图3A,本发明发光元件的第二实施例与该第一实施例的结构大致相同,其不同之处在于,该反射结构30还进一步形成于该封装材22的一底面上。也就是说,该反射结构30是往下延伸地包覆整个封装材22,以使该发光单元21的磊晶层212朝向该封装材22的底面发出的光也能通过该反射结构30的反射,而朝向该透光层23对外出光。
图3B是本发明发光二极管的第三实施例示意图,参阅图3B,本发明发光元件的第三实施例与该第一实施例的结构大致相同,其不同之处在于,该封装材22是形成于该磊晶层212的顶面,该反射结构30是直接紧贴该磊晶层212及该封装材22的侧面,使该磊晶层212发出的光减少行进于该封装材22中,可直接通过该反射结构30反射,而朝向该透光层23对外出光。
图4是本发明发光元件的第四实施例示意图,图5是本发明发光元件的第五实施例示意图,参阅图4与图5,图4与图5分别显示本发明发光元件的第四实施例与第五实施例,其结构分别与该第一实施例及该第二实施例大致相同,不同之处仅在于该发光单元21具有多个间隔设置的磊晶层212,图4与图5是以该发光单元21具有三个间隔设置的磊晶层212为例。当该发光单元21具有多个间隔设置的磊晶层212时,该反射结构30则是围绕该等磊晶层212形成于该封装材22表面,并延伸至该透光层23周缘,或再进一步延伸至该封装材22的底部,而形成于发光元件整体的最外围。
具体地说,前述该等实施例所述的发光元件是由下列步骤制备而得。
首先进行一准备步骤,准备一基板(图未示),将多个发光元件2成一间隙间隔设置于该基板上。其中,该每一个发光元件2即是由该发光单元21、该封装材22,及该透光层23所构成。
详细地说,前述该每一个发光元件2的发光单元21可以是仅具有一个磊晶层212(如图2、图3A、图3B),或是可以由多个磊晶层212成一组共同构成,图4与图5是以该发光单元21为由三个磊晶层212成一组为例做说明。如图4、5所示,当该发光单元21由三个磊晶层212成一组构成时,该等磊晶层212会彼此间隔设置,该封装材22是填置于该等磊晶层212的顶面214与周面216,该透光层23则为与该封装材22连接并位于该等磊晶层212的顶面214上方。
而于设置前述该等发光元件2时,则以该等电极213朝向该基板与该基板连接。由于设置该等发光元件2于该基板上的技术为本领域所周知,于此不多加赘述。
接着,进行一反射结构形成步骤,于对应该发光元件2的周面216的封装材22上直接形成该反射结构30,使该反射结构30与该发光元件2的磊晶层212的周面216间具有该封装材22。
具体地说,该反射结构形成步骤可利用于该等发光元件2的间隙填置一具有反射性的胶状树脂组成,之后将该胶状树脂组成固化,而得到该反射结构30;也可以通过物理气相沉积的蒸镀或溅镀等方式直接于该间隙间沉积金属或合金金属而构成该反射结构30。其中,该胶状树脂组成即是由粘结剂及多数分散于该粘结剂中的反射粒子所共同构成,其中,该粘结剂为光可硬化或热可硬化的材料或是室温下为固体的高分子树脂或硅胶,该反射粒子选自二氧化钛、二氧化锆、硫酸钡及五氧化二钽等金属氧化物,且该反射结构30的形成态样可视需求仅形成如图4所示,形成于该封装材22的侧面而露出该封装材22的底面215,或如图5所示,包覆整个封装材22。
最后,进行一切割步骤,利用激光切割、刀轮、钻石刀、钨钢刀、陶瓷刀、橡胶刀,或树脂刀等方式沿该间隙进行切割,即可得到如图2~图5所示,具有该反射结构30的发光元件。
综上所述,本发明发光元件及其制作方法,主要是通过将该透光层23设置于该磊晶层212的顶面214上方,并搭配围绕该磊晶层212的周面216而直接设置于该封装材22上的反射结构30,因此,可有效缩小发光单元21对外出光的发散角并增加出光的光均匀性,此外,因为该反射结构30为直接设置于该封装材22上,因此,可有效减少反射光的光程,降低光于反射过程的耗损,以增加出光效率,故确实能达成本发明的目的。
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人离本发明各实施例技术方案的范围。
Claims (15)
1.一种发光元件,其特征在于,包括:
一发光单元,具有至少一磊晶层及对应形成于所述磊晶层上的两个电极,所述磊晶层具有一顶面、一底面,及一连接所述底面与所述顶面的周面,所述两个电极外露于所述底面;
一封装材,至少形成于所述磊晶层的顶面;
一透光层,配置于所述封装材上,且位于所述磊晶层的顶面上方;及
一反射结构,围绕着所述磊晶层的周面设置,且形成于所述封装材上。
2.根据权利要求1所述的发光元件,其特征在于,所述封装材还形成于所述磊晶层的周面及,所述反射结构形成于所述封装材的表面,圈围所述磊晶层并延伸至所述透光层的周缘。
3.根据权利要求2所述的发光元件,其特征在于,所述封装材具有一顶面与一底面,所述透光层形成于所述封装材的顶面上,所述反射结构还进一步形成于所述封装材的底面上。
4.根据权利要求1所述的发光元件,其特征在于,所述反射结构的构成材料包括粘结剂及分散于所述粘结剂中的反射粒子。
5.根据权利要求4所述的发光元件,其特征在于,所述反射粒子选自下列群组其中任一:二氧化钛、二氧化锆、硫酸钡,及五氧化二钽。
6.根据权利要求4所述的发光元件,其特征在于,所述粘结剂选自高分子树脂、亚克力树脂或硅胶。
7.根据权利要求1所述的发光元件,其特征在于,所述反射结构的构成材料选自下列群组其中任一:银、铝、铂、金或其合金金属。
8.根据权利要求1所述的发光元件,其特征在于,所述反射结构为布拉格反射镜。
9.根据权利要求1所述的发光元件,其特征在于,所述封装材含有荧光粉。
10.一种发光元件的制作方法,其特征在于,包括:
设置至少一个发光元件于一基板,其中,所述发光元件具有一磊晶结构与二电极;
形成一封装材于所述基板上,且包覆所述磊晶结构并暴露出所述二电极;
形成一透光层于所述封装材上;及
形成一反射结构至少于所述封装材的一表面上。
11.根据权利要求10所述的发光元件的制作方法,其特征在于,所述封装材含有荧光粉。
12.根据权利要求10所述的发光元件的制作方法,其特征在于,所述设置至少一个发光元件于该基板的步骤是于所述基板上设置多个呈一间隙分布发光元件,形成所述反射结构的步骤是于所述间隙中填置一具有反射性的流体树脂组成,并将所述流体树脂组成固化,而得到所述反射结构。
13.根据权利要求12所述的发光元件的制作方法,其特征在于,所述胶状树脂组成包括粘结剂及多数分散于该粘结剂中的反射粒子。
14.根据权利要求10所述的发光元件的制作方法,其特征在于,形成所述反射结构的步骤是以蒸镀或溅镀方式形成所述反射结构。
15.根据权利要求12所述的发光元件的制作方法,其特征在于,还包含一沿该间隙切割,得到具有该反射结构的发光元件的步骤。
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