KR970072163A - 반도체 질화막 에칭장치 - Google Patents
반도체 질화막 에칭장치 Download PDFInfo
- Publication number
- KR970072163A KR970072163A KR1019960061033A KR19960061033A KR970072163A KR 970072163 A KR970072163 A KR 970072163A KR 1019960061033 A KR1019960061033 A KR 1019960061033A KR 19960061033 A KR19960061033 A KR 19960061033A KR 970072163 A KR970072163 A KR 970072163A
- Authority
- KR
- South Korea
- Prior art keywords
- phosphoric acid
- semiconductor nitride
- nitride film
- chemical
- acid solution
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims abstract description 9
- 150000004767 nitrides Chemical class 0.000 title claims description 6
- 239000004065 semiconductor Substances 0.000 title claims 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract 12
- 239000000126 substance Substances 0.000 claims abstract 11
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract 6
- 239000007788 liquid Substances 0.000 claims abstract 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract 4
- 239000010703 silicon Substances 0.000 claims abstract 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 230000005484 gravity Effects 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Weting (AREA)
Abstract
실리콘 질소화막의 에칭레이트의 안정화 및 에칭선택비의 안정적제어를 얻는다.
열인산계의 약액에 있어서, 인산농도, 실리콘농도, 불소농도, 비중등을 측정하는 수단을 설치하여, 약액첨가물의 제어, 약액의 교환등에 의해, 약액의 성분 및 농도, 특히 실리콘 농도의 조정을 하도록 하여, 에칭레이트를 제어하도록 하였다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예1에 의한 질화막 에칭장치(웨트처리장치)의 전체의 구성을 도시한 도면.
Claims (4)
- 가열한 인산용액을 주제로 하는 약액에 불화암모늄 또는 버퍼드플루오르화수소산을 첨가하는 수단을 구비한 것을 특징으로 하는 반도체 질화막에칭장치.
- 인산용액을 주제로 하는 약액에 실리콘 또는 실리콘 화합물을 첨가하는 수단을 구비한 것을 특징으로 하는 반도체 질화막 에칭장치.
- 인산용액을 주제로 하는 처리조내의 약액을 냉각하여 배출하는 수단과, 새로이 인산용액을 주입하는 수단을 구비하여, 처리조내의 약액의 성분의 조정을 하도록 한 것을 특징으로 하는 반도체 질화막 에칭장치.
- 인산용액을 주제로 하고 실리콘을 포함하는 약액을 수용한 복수의 처리조를 구비하여, 이들의 처리조의 사이에서 약액을 이송하는 것에 의해 상기 처리조에 수용된 약액의 실리콘농도의 조정을 하도록 한 것을 특징으로 하는 반도체 질화막 에칭장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8081176A JPH09275091A (ja) | 1996-04-03 | 1996-04-03 | 半導体窒化膜エッチング装置 |
JP96-081176 | 1996-04-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970072163A true KR970072163A (ko) | 1997-11-07 |
KR100249143B1 KR100249143B1 (ko) | 2000-03-15 |
Family
ID=13739164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960061033A KR100249143B1 (ko) | 1996-04-03 | 1996-12-02 | 반도체 질화막 에칭장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6001215A (ko) |
JP (1) | JPH09275091A (ko) |
KR (1) | KR100249143B1 (ko) |
DE (1) | DE19648471A1 (ko) |
TW (1) | TW458376U (ko) |
Families Citing this family (85)
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JP7158249B2 (ja) * | 2018-11-09 | 2022-10-21 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置および記憶媒体 |
KR102084044B1 (ko) * | 2018-12-24 | 2020-03-03 | 주식회사 세미부스터 | 인산용액 중의 실리콘 농도 분석방법 |
JP2020150126A (ja) * | 2019-03-13 | 2020-09-17 | 東京エレクトロン株式会社 | 混合装置、混合方法および基板処理システム |
US11075218B2 (en) * | 2019-05-22 | 2021-07-27 | Sandisk Technologies Llc | Method of making a three-dimensional memory device using silicon nitride etching end point detection |
CN112908845B (zh) * | 2021-02-24 | 2023-10-10 | 上海华虹宏力半导体制造有限公司 | 氧化物薄膜初始蚀刻率的优化控制方法及系统 |
KR20240065582A (ko) * | 2022-11-03 | 2024-05-14 | 주식회사 제우스 | 기판 식각 방법 및 기판 식각 장치 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US3772105A (en) * | 1970-07-24 | 1973-11-13 | Shipley Co | Continuous etching process |
DE2321013A1 (de) * | 1973-04-26 | 1974-11-14 | Philips Nv | Verfahren zum aetzen eines musters in einer siliciumnitridschicht und halbleiteranordnung, die durch dieses verfahren hergestellt ist |
US4092211A (en) * | 1976-11-18 | 1978-05-30 | Northern Telecom Limited | Control of etch rate of silicon dioxide in boiling phosphoric acid |
JPS5368070A (en) * | 1976-11-29 | 1978-06-17 | Fujitsu Ltd | Etching method |
JPS5794574A (en) * | 1980-12-02 | 1982-06-12 | Seiko Epson Corp | Etching vessel |
JPS60137024A (ja) * | 1983-12-26 | 1985-07-20 | Matsushita Electronics Corp | 窒化珪素膜のエツチング方法 |
US4540465A (en) * | 1984-06-11 | 1985-09-10 | Mcdonnell Douglas Corporation | Process for continuous recovery of nitric acid/hydrofluoric acid titanium etchant |
JPH0653253B2 (ja) * | 1986-11-08 | 1994-07-20 | 松下電工株式会社 | セラミツク基板の粗化法 |
JPH02137228A (ja) * | 1988-11-17 | 1990-05-25 | Nec Yamagata Ltd | 半導体装置の製造方法 |
JP2725875B2 (ja) * | 1990-04-25 | 1998-03-11 | セントラル硝子株式会社 | エッチング剤 |
US5227010A (en) * | 1991-04-03 | 1993-07-13 | International Business Machines Corporation | Regeneration of ferric chloride etchants |
US5310457A (en) * | 1992-09-30 | 1994-05-10 | At&T Bell Laboratories | Method of integrated circuit fabrication including selective etching of silicon and silicon compounds |
JPH06349808A (ja) * | 1993-06-14 | 1994-12-22 | Hitachi Ltd | 窒化シリコン膜除去液およびそれを用いた半導体製造装置 |
JP3072876B2 (ja) * | 1993-09-17 | 2000-08-07 | 日曹エンジニアリング株式会社 | エッチング液の精製方法 |
US5472562A (en) * | 1994-08-05 | 1995-12-05 | At&T Corp. | Method of etching silicon nitride |
JPH0883792A (ja) * | 1994-09-09 | 1996-03-26 | Nippon Motorola Ltd | エッチング剤及びエッチング方法 |
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1996
- 1996-04-03 JP JP8081176A patent/JPH09275091A/ja active Pending
- 1996-09-25 US US08/719,372 patent/US6001215A/en not_active Expired - Fee Related
- 1996-10-15 TW TW089215329U patent/TW458376U/zh not_active IP Right Cessation
- 1996-11-22 DE DE19648471A patent/DE19648471A1/de not_active Withdrawn
- 1996-12-02 KR KR1019960061033A patent/KR100249143B1/ko not_active IP Right Cessation
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US6001215A (en) | 1999-12-14 |
JPH09275091A (ja) | 1997-10-21 |
TW458376U (en) | 2001-10-01 |
DE19648471A1 (de) | 1997-10-09 |
KR100249143B1 (ko) | 2000-03-15 |
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