KR960002624A - 건식 에칭 방법 - Google Patents
건식 에칭 방법 Download PDFInfo
- Publication number
- KR960002624A KR960002624A KR1019950014670A KR19950014670A KR960002624A KR 960002624 A KR960002624 A KR 960002624A KR 1019950014670 A KR1019950014670 A KR 1019950014670A KR 19950014670 A KR19950014670 A KR 19950014670A KR 960002624 A KR960002624 A KR 960002624A
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- low pressure
- vapor phase
- oxygen
- pressure vapor
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000001312 dry etching Methods 0.000 title claims 3
- 239000007789 gas Substances 0.000 claims abstract 26
- 239000012808 vapor phase Substances 0.000 claims abstract 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract 10
- 239000001301 oxygen Substances 0.000 claims abstract 10
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 10
- 238000005530 etching Methods 0.000 claims abstract 9
- 239000012495 reaction gas Substances 0.000 claims abstract 9
- 239000000654 additive Substances 0.000 claims abstract 7
- 230000000996 additive effect Effects 0.000 claims abstract 7
- 238000006243 chemical reaction Methods 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 150000002367 halogens Chemical class 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 2
- 229920005591 polysilicon Polymers 0.000 claims 2
- 229910001220 stainless steel Inorganic materials 0.000 claims 2
- 239000010935 stainless steel Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 238000006213 oxygenation reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/909—Controlled atmosphere
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Abstract
처리될 물체는 저압증기상 처리실내에 장입되고, 그런뒤 산소 첨가 가스 또는 적어도 산소를 함유한 첨가가스의 소량을 에칭에 사용될 반응가스에 첨가함에 의해 얻어진 에칭가스가 저압증기 처리실의 벽과 반응가스사이의 반응을 억제하기 위해 저압 증기상 처리실에 공급된다. 이 상태에서, 에칭될 물체는 에팅가스로 건식에칭된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 의한 반응성 이온 에칭 장치의 배열도이며,
제2도는 저온 정체/충전 방법의 설명도이다.
Claims (14)
- 에칭할 물체를 저압 증기상 처리실내에 장입하는 단계; 산소첨가 가스 또는 적어도 산소를 함유한 첨가 가스의 소량을 에칭에 사용되는 반응가스에 첨가함에 의해 얻은 에칭가스를 상기 저압증기상 처리실에 공급하는 단계; 및 에칭가스로 에칭할 상기 물체를 건식에칭하는 단계로 되어 있는 것을 특징으로 하는 건식 에칭방법.
- 제1항에 있어서, 첨가 가스에 함유된 산소의 유량은 반응가스의 총유량 1%이하인 것을 특징으로 하는 방법.
- 제1항에 있어서, 반응가스는 할로겐 원소를 함유하는 것을 특징으로 하는 방법.
- 제1항에 있어서, 첨가가스는, 산소와 질소의 가스혼합물, 산소와 희유가스의 가스혼합물 및 물증기를 함유한 가스혼합물로 구성된 군으로부터 선택돈 적어도 하나의 가스혼합물인 것을 특징으로 하는 방법.
- 제1항에 있어서, 에칭할 상기 물체의 표면은 폴리실리콘 또는 금속으로 형성되어 있는 것을 특징으로 하는 방법.
- 제1항에 있어서, 상기 저압 증기상 처리실은 표면이 양극처리된 알루미늄으로 형성되어 있는 것을 특징으로 하는 방법.
- 제1항에 있어서, 상기 저압 증기상 처리실은 스테인레스 스틸로 형성되어 있는 것을 특징으로 하는 방법.
- 에칭할 물체를 저압 증기상 처리실내에 장입하는 단계; 상기 저압증기상 처리실의 벽과 반응가스 사이의 반응을 억제하기 위해 산소첨가가스 또는 적어도 산소를 함유한 첨가 가스의 소량을 에칭에 사용되는 반응가스에 첨가함에 의해 얻은 에칭가스를 상기 저압증기상 처리실에 공급하는 단계; 및 에칭가스로 에칭할 상기 물체를 건식에칭하는 단계로 되어 있는 것을 특징으로 하는 방법.
- 제8항에 있어서, 첨가가스에 함유된 산소의 유량은 반응가스의 총유량의 1%이하인 것을 특징으로 하는 방법.
- 제8항에 있어서, 반응가스는 할로겐 원소를 함유하는 것을 특징으로 하는 방법.
- 제8항에 있어서, 첨가가스는, 산소와 질소의 가스혼합물, 산소와 희유가스의 가스혼합물 및 물증기를 함유한 가스혼합물로 구성된 군으로 부터 선택된 적어도 하나의 가스 혼합물인 것을 특징으로 하는 방법.
- 제8항에 있어서, 에칭할 상기 물체의 표면은 폴리실리콘 또는 금속으로 형성되어 있는 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기 저압 증기상 처리실은 표면이 양극처리된 알루미늄으로 형성되어 있는 것을 특징으로 하는 방법.
- 제8항에 있어서, 상기 저압 증기상 처리실은 스테인레스 스틸로 형성되어 있는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP94-142213 | 1994-06-02 | ||
JP6142213A JPH07331460A (ja) | 1994-06-02 | 1994-06-02 | ドライエッチング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960002624A true KR960002624A (ko) | 1996-01-26 |
KR0174777B1 KR0174777B1 (ko) | 1999-04-01 |
Family
ID=15310038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950014670A KR0174777B1 (ko) | 1994-06-02 | 1995-06-02 | 건식에칭방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5785877A (ko) |
JP (1) | JPH07331460A (ko) |
KR (1) | KR0174777B1 (ko) |
TW (1) | TWI233647B (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5908319A (en) * | 1996-04-24 | 1999-06-01 | Ulvac Technologies, Inc. | Cleaning and stripping of photoresist from surfaces of semiconductor wafers |
US6360754B2 (en) * | 1998-03-16 | 2002-03-26 | Vlsi Technology, Inc. | Method of protecting quartz hardware from etching during plasma-enhanced cleaning of a semiconductor processing chamber |
JP2002343770A (ja) * | 2001-05-16 | 2002-11-29 | Seiko Epson Corp | エッチング方法、エッチング装置及び半導体装置の製造方法 |
US6846747B2 (en) * | 2002-04-09 | 2005-01-25 | Unaxis Usa Inc. | Method for etching vias |
US20060065622A1 (en) * | 2004-09-27 | 2006-03-30 | Floyd Philip D | Method and system for xenon fluoride etching with enhanced efficiency |
US7553684B2 (en) * | 2004-09-27 | 2009-06-30 | Idc, Llc | Method of fabricating interferometric devices using lift-off processing techniques |
JP5492571B2 (ja) * | 2007-02-20 | 2014-05-14 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | Memsのエッチングを行うための機器および方法 |
US7719752B2 (en) | 2007-05-11 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same |
US7569488B2 (en) * | 2007-06-22 | 2009-08-04 | Qualcomm Mems Technologies, Inc. | Methods of making a MEMS device by monitoring a process parameter |
JP2010534865A (ja) | 2007-07-25 | 2010-11-11 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | Mems表示装置及び該mems表示装置の製造方法 |
US8023191B2 (en) * | 2008-05-07 | 2011-09-20 | Qualcomm Mems Technologies, Inc. | Printable static interferometric images |
US7719754B2 (en) * | 2008-09-30 | 2010-05-18 | Qualcomm Mems Technologies, Inc. | Multi-thickness layers for MEMS and mask-saving sequence for same |
US8659816B2 (en) | 2011-04-25 | 2014-02-25 | Qualcomm Mems Technologies, Inc. | Mechanical layer and methods of making the same |
KR20150061393A (ko) * | 2013-11-27 | 2015-06-04 | 삼성전자주식회사 | 메모리 장치로부터 읽은 데이터를 고속으로 전송하는 메모리 컨트롤러 및 그것의 데이터 전송 방법. |
JP2015211156A (ja) * | 2014-04-28 | 2015-11-24 | 東京エレクトロン株式会社 | ドライクリーニング方法及びプラズマ処理装置 |
EP3283665A4 (en) * | 2015-04-15 | 2018-12-12 | Treadstone Technologies, Inc. | Method of metallic component surface moodification for electrochemical applications |
CN112312660A (zh) * | 2019-08-01 | 2021-02-02 | 睿明科技股份有限公司 | 基板形成通孔的制作方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8004005A (nl) * | 1980-07-11 | 1982-02-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
US4505782A (en) * | 1983-03-25 | 1985-03-19 | Lfe Corporation | Plasma reactive ion etching of aluminum and aluminum alloys |
US4620208A (en) * | 1983-11-08 | 1986-10-28 | Energy Conversion Devices, Inc. | High performance, small area thin film transistor |
US4468285A (en) * | 1983-12-22 | 1984-08-28 | Advanced Micro Devices, Inc. | Plasma etch process for single-crystal silicon with improved selectivity to silicon dioxide |
US4595484A (en) * | 1985-12-02 | 1986-06-17 | International Business Machines Corporation | Reactive ion etching apparatus |
FR2616030A1 (fr) * | 1987-06-01 | 1988-12-02 | Commissariat Energie Atomique | Procede de gravure ou de depot par plasma et dispositif pour la mise en oeuvre du procede |
US5203956A (en) * | 1990-01-08 | 1993-04-20 | Lsi Logic Corporation | Method for performing in-situ etch of a CVD chamber |
US5160407A (en) * | 1991-01-02 | 1992-11-03 | Applied Materials, Inc. | Low pressure anisotropic etch process for tantalum silicide or titanium silicide layer formed over polysilicon layer deposited on silicon oxide layer on semiconductor wafer |
US5560804A (en) * | 1991-03-19 | 1996-10-01 | Tokyo Electron Limited | Etching method for silicon containing layer |
JP3088178B2 (ja) * | 1991-04-22 | 2000-09-18 | 日本電気株式会社 | ポリシリコン膜のエッチング方法 |
JP3210359B2 (ja) * | 1991-05-29 | 2001-09-17 | 株式会社東芝 | ドライエッチング方法 |
JPH0521385A (ja) * | 1991-07-10 | 1993-01-29 | Nippon Steel Corp | アルミニウム合金薄膜の製造方法 |
US5256245A (en) * | 1992-08-11 | 1993-10-26 | Micron Semiconductor, Inc. | Use of a clean up step to form more vertical profiles of polycrystalline silicon sidewalls during the manufacture of a semiconductor device |
US5354417A (en) * | 1993-10-13 | 1994-10-11 | Applied Materials, Inc. | Etching MoSi2 using SF6, HBr and O2 |
JP2639369B2 (ja) * | 1994-12-22 | 1997-08-13 | 日本電気株式会社 | 半導体装置の製造方法 |
-
1994
- 1994-06-02 JP JP6142213A patent/JPH07331460A/ja active Pending
-
1995
- 1995-06-01 TW TW084105549A patent/TWI233647B/zh not_active IP Right Cessation
- 1995-06-02 KR KR1019950014670A patent/KR0174777B1/ko not_active IP Right Cessation
-
1997
- 1997-02-11 US US08/799,083 patent/US5785877A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR0174777B1 (ko) | 1999-04-01 |
TWI233647B (en) | 2005-06-01 |
JPH07331460A (ja) | 1995-12-19 |
US5785877A (en) | 1998-07-28 |
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