KR960704348A - 유체내에서 반도체 웨이퍼를 처리하기 위한 공정 및 장치(process and apparatus for the treatment of semiconductor wafers in a fluid) - Google Patents

유체내에서 반도체 웨이퍼를 처리하기 위한 공정 및 장치(process and apparatus for the treatment of semiconductor wafers in a fluid) Download PDF

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KR960704348A
KR960704348A KR1019960700195A KR19960700195A KR960704348A KR 960704348 A KR960704348 A KR 960704348A KR 1019960700195 A KR1019960700195 A KR 1019960700195A KR 19960700195 A KR19960700195 A KR 19960700195A KR 960704348 A KR960704348 A KR 960704348A
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tank
permeable member
gas
deionized water
wafer
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로저 매튜즈 로버트
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로저 매튜즈 로버트
레가시 시스템즈, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)

Abstract

반도체 웨이퍼로부터 유기물질을 제거하기 위한 공정이 제공된다. 상기 공정은 물에 흡수된 오존을 가진 이온제거된 물을 사용하는 것이 필요하다. 상기한 오존화된 물은 웨이퍼 위를 유동하며 또한 상기 오존은 웨이퍼로부터의 유기물질을 불용성 가스로 산화시킨다. 상기 오존화된 물은 오존을 웨이퍼와 이온화된 물이 담겨있는 탱크에 확산시킴으로써 준비된다. 또한, 유체로 반도체 웨이퍼(14)를 처리하기 위한 탱크와 웨이퍼 처리탱크(1)에 있는 유체로 직접 가스를 확산시키기 위한 가스 디퓨져(4)로 구성된 장치가 제공된다.

Description

유체내에서 반도체 웨이퍼를 처리하기 위한 공정 및 장치(PROCESS AND APPARATUS FOR THE TREATMENT OF SEMICONDUCTOR WAFERS IN A FLUID)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 유체를 사용하여 반도체 웨이퍼를 처리하기 위한 장치의 측단면에 대한 개략도이다.

Claims (24)

  1. 웨이퍼를 약 10℃~15℃의 온도에 있는 오존 및 물과 접촉시키는 단계를 포함하는 것을 특징으로 하는 반도체 웨이퍼로부터 유기물질을 제거하는 공정.
  2. 제1항에 있어서, 상기 유기물질이 모포레지스트인 것을 특징으로 하는 반도체 웨이퍼로부터 유기물질을 제거하는 공정.
  3. 제1항에 있어서, 상기 온도가 5℃~9℃인 것을 특징으로 하는 반도체 웨이퍼로부터 유기물질을 제거하는 공정
  4. 반도체 웨이퍼를 이온제거된 물을 담은 탱크에 위치시키는 단계; 웨이퍼에서부터의 유기물질을 불용성 가스로 산화시키기에 충분한 시간동안 오존을 이온제거된 물로 확산시키는 단계; 이온제거된 물을 약 10℃~15℃의 온도로 유지시키는 단계; 및 이온제거된 물로 웨이퍼를 세정하는 단계로 구성되는 것을 특징으로 하는 반도체 웨이퍼로부터 유기물질을 제거하는 공정.
  5. 제4항에 있어서, 탱크로부터 불용성 가스를 배기시키는 단계를 포함하는 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정
  6. 제4항에 있어서, 상기 오존이 탱크내에 있는 각 웨이퍼의 면을 가로질러 균일하게 확산되는 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  7. 제4항에 있어서, 이온제거된 물로 세정한 후에 약65℃~85℃ 사이의 온도로 가열된 이온제거된 물을 사용하여 웨이퍼를 세정하는 단계를 포함하는 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  8. 제4항에 있어서, 오존이 약 1~15분 동안에 이온제거된 물로 확산되는 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  9. 제8항에 있어서, 상기 웨이퍼들이 약 1~5분 동안에 린스되는 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  10. 제4항에 있어서, 상기 유기물질이 포토레지스트인 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  11. 제14항에 있어서, 상기 이온제거된 물이 약 5℃~9℃의 온도인을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  12. 웨이퍼를 이온제거된 물이 담겨진 탱크에 놓는 단계; 오존을 이온제거된 물로 확산시키는 단계; 오존이 유기물질을 불용성 가스로 산화시키는 산소없는 기 및 산소분자를 형성하도록 이온제거될 물을 통과하여 흡수됨과 아울러 거품이 형성됨에 따라 오존을 확산시킴과 동시에 오존을 자외선에 노출시키는 단계; 약 10℃~15℃의 온도에서 이온제거된 물을 유지하는 단계; 및 이온제거된 물로 웨이퍼를 세정하는 단계로 구성되는 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  13. 제12항에 있어서, 상기 유기물질이 포토레지스트인 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  14. 제12항에 있어서, 상기 불용성 가스가 탱크로부터 배기되는 것을 특징으로 하는 반도체 웨이퍼로 부터 유기물질을 제거하는 공정.
  15. 유체를 탱크에 공급하기 위해서 탱크에 연결된 수단; 가스를 탱크로 주입하기 위해서 탱크에 연결된 수단; 및 가스가 유체에 흡수되어 탱크내에 있는 각 웨이퍼의 면들과 접촉하도록 탱크로 가스를 확산시키는 수단으로 구성되며, 또한 상기 확산 수단을 침투성 부재의 비침투성 부재를 구비하고 있고, 상기 침투성 부재는 상부와 하부, 침투성 부재의 중심부에 개방공간을 형성하는 수단, 상기 침투성 부재의 외부 경계와 개방공간을 형성하는 수단 사이에서 상기 침투성 부재위에 위치되는 트렌치를 형성하는 수단을 포함하고, 상기 불침투성 부재는 상기 침투성 부재의 중심부에 있는 개방 공간을 형성하는 수단에 대응하는 불침투성 부재의 중심부에 개방공간을 형성하는 수단을 구비하고 있고, 상기 트렌치가 침투성 부재의 상부에서 개방되어 불침투성 부재에 의해 덮혀지며, 또한 상기 복합요소가 상개 탱크의 바닥과 연결된 침투성 부재의 바닥부에 위치되는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  16. 제15항에 있어서, 침투성 부재와 불침투성 부재가 폴리테트라 플루오로에틸렌과 퍼플루오로알콕실비닐 에테르로 구성되는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  17. 제15항에 있어서, 상기 탱크는 첫번째 측부와 두번째 측부를 가지고 있고, 상기 탱크의 첫번째 측부는 탱크의 상부에 있는 수직부와 탱크의 하부에 있는 내측으로 테이퍼진 부분을 구비한 한편 상기 테이퍼진 부분은 수직부보다 길며, 또한 상기 탱크의 두번째 측부는 상기 탱크의 상부에 있는 수직부와 상기 탱크에 있는 테이퍼진 부분을 구비한 한편 상기 테이퍼진 부분이 상기 수직부보다 짧은 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  18. 제17항에 있어서, 탱크의 첫번째 측부의 안쪽으로 테이퍼진 부분에 위치한 초대음속 변환기를 포함하고 있는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  19. 제18항에 있어서, 가스확산수단위에 있는 탱크의 내측에 위치한 자외광원을 포함하고 있는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  20. 제19항에 있어서, 가스가 확산수단으로 상향 주입되도록 가스확산수단의 하측에 가스주입수단이 배치되는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  21. 제20항에 있어서, 탱크로의 유체공급수단이 첫번째 방향으로의 유체유동을 제공하며, 아울러 탱크로의 가스주입수단이 상기 유체유동과 반대인 두번째 방향으로 가스를 제공하는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  22. 제15항에 있어서, 탱크로의 가스주입수단이 가스를 개별적이거나 하나 또는 그 이상의 다른 가스와 함께 공급하는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  23. 침투성 부재와 불침투성 부재를 구비한 복합요소를 포함하고, 상기 침투성 부재는 상부와 바닥부, 침투성 부재의 중심부에 개방공간을 형성하는 수단, 및 침투성 부재의 외부 경계와 개방공간을 형성하는 수단 사이에 있는 침투성 부재의 상부위에 위치된 트렌치를 형성하는 수단을 구비하고, 상기 불침투성 부재의 중심부에 개방공간을 형성하는 수단에 대응하는 불침투성 부재의 중심부에 개방공간을 형성하는 수단을 구비하고, 상기 트렌치가 상기 침투성 부재의 상부에서 개방되는 한편 불침투성 부재에 의해 덮히도록 상기 침투성 부재와 불침투성 부재가 결합되며, 또한 상기 복합요소가 상기 탱크의 바닥부에 연결된 침투성 부재의 바닥부에 위치되는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
  24. 제23항에 있어서, 상기 침투성 부재와 불침투성 부재가 폴리테트라 플루오로에틸렌과 퍼플루오로 알콕 실비닐에테르의 혼합물로 구성되는 것을 특징으로 하는 다수의 측부와 바닥을 구비하여 유체로 반도체 웨이퍼를 처리하는 탱크.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960700195A 1993-07-16 1994-07-15 유체로반도체웨이퍼를처리하기위한장치및그장치에사용되는가스확산기 KR100365529B1 (ko)

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DE69434583T2 (de) 2006-07-20
JP4054374B2 (ja) 2008-02-27
US5727578A (en) 1998-03-17
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DE69434583D1 (de) 2006-01-26
KR100365529B1 (ko) 2003-03-06
AU7887598A (en) 1998-10-01
CA2167283A1 (en) 1995-01-26
EP0708981B1 (en) 2005-12-21
TW301465U (en) 1997-03-21
EP0708981A4 (en) 1997-03-12
AU699567B2 (en) 1998-12-10
AU7332994A (en) 1995-02-13
AU707359B2 (en) 1999-07-08
ATE313855T1 (de) 2006-01-15
JPH09501017A (ja) 1997-01-28
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CN1127569A (zh) 1996-07-24
US5464480A (en) 1995-11-07
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US5776296A (en) 1998-07-07
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