KR930020627A - 마이크로회로 웨이퍼들을 처리하기 위한 장치 - Google Patents

마이크로회로 웨이퍼들을 처리하기 위한 장치 Download PDF

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KR930020627A
KR930020627A KR1019930003544A KR930003544A KR930020627A KR 930020627 A KR930020627 A KR 930020627A KR 1019930003544 A KR1019930003544 A KR 1019930003544A KR 930003544 A KR930003544 A KR 930003544A KR 930020627 A KR930020627 A KR 930020627A
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wafer
processing
gas
units
wafers
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KR1019930003544A
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KR100278154B1 (ko
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잔 진저
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존 엘. 베노이스트
탬프래스 비이.브이.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Manipulator (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

본 발명은 마이크로회로웨이퍼들을 처리하기 위한 장치에 관한 것으로, 웨이퍼들을 갖춘 카셋트를 위한 공급부와, 웨이퍼캐리어들과 처리수단들이 함께 배치되어진 최소1개이상의 처리부 및, 카셋트로부터 웨이퍼들을 인출하여 웨이퍼캐리어에 놓으며 처리후에는 다시 웨이퍼들을 웨이퍼캐리어로 부터 인출하여 카셋트에 놓기 위한 전달수단들을 제공하는 하나이상의 전달부로 이루어지되, 단면형상이 부분적으로 최소한 1개이상의 정다각형의 변을 가지면서 독자연결이 가능한 공급부와 처리부가 유닛트들로서 반드시 인용되고, 이들 유닛트들은 정다각형상 둘레부의 변들위치에서 다른 유닛트들과 연결되어지도록 구성된 마이크로회로 웨이퍼를 처리하기위한 장치이다.

Description

마이크로회로 웨이퍼들을 처리하기 위한 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 장치의 수평단면도.
제2도는 본 발명의 제2실시예에 따른 장치의 부분절개투시도.
제3도는 본 발명에 따른 공급부의 부분절개투시도.
제4도는 본 발명에 따른 처리부의 부분절개투시도.

Claims (10)

  1. 웨이퍼들은 갖춘 카세트를 위한 공급부와, 웨이퍼캐리어들과 처리수단들이 함께 배치되어진 최소 1개이상의 처리부 및, 카셋트로부터 웨이퍼들을 인출하여 웨이퍼캐리어에 놓으며 처리후에는 다시 웨이퍼들은 웨이퍼캐리어로부터 인출하여 카셋트에 놓기 위한 전달수단들을 제공하는 하나이상의 전달부로 이루어지되, 단면형상이 부분적으로 최소한 1개 이상의 정다각형의 변을 가지면서 독자연결이 가능한 공급부와 처리부가 연결유니트들로서 반드시 인용되고, 이들 유니트들은 정다각형상 둘레부의 변들위치에서 다른 유니트들과 연결되도록 구성되어진 마이크로회로 웨이퍼를 처리하기 위한 장치.
  2. 제1항에 있어서, 상기 연결가능한 유닛트들은 각기 수평단면에 있어서 최소한 정다각형상 둘레의 변들중 1변에 폐쇄가능한 개방통로를 갖추면서 부분적으로 최소 1개 이상의 정다각형상의 둘레부를 갖는 밀폐된 케이싱이 구비되어진 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
  3. 제1항 또는 제2항에 있어서, 상기 전달부는 4각둘레부를 갖추고 상기 공급부와 처리부는 부분적으로 각기 135°의 각도를 갖는 정8각형상 둘레부를 갖추면서 전달부의 변길이와 동일한 길이를 갖는 변에 전달부가 연결된 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
  4. 상기 제1항 내지 제3항에 있어서, 상기 유닛트들은 각기 자체가스순환장치를 제공받는 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치
  5. 제4항에 있어서, 상기 가스순환장치는 중앙가스확산수단들과 둘레부에 밀착한 가스분출수단들로 구성되어져 웨이퍼들을 따라 가스분사수단으로 부터 가스분출수단까지 가스를 층류유동으로 안내할 수 있는 가스안내수단을 제공받는 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
  6. 제5항에 있어서, 상기 공급부는 다수의 웨이퍼카세트들을 지지하기 위한 회전테이블로 구성되고, 가스안내수단들은 회전테이블의 회전축에 집중적으로 배치된 관모양의 필터로 구성되며, 가스분산수단은 관모양 필터요소의 내부와 연결되는 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
  7. 제5항에 있어서, 상기 처리부들은 최소한 1개이상이 열처리부이고 웨이퍼캐리어들은 회전테이블위에 배치되며, 가스안내수단들은 웨이퍼캐리어 각각과 평행되게 배치된 필터요소들과, 중앙분산수단들에서 웨이퍼캐리어로부터 멀리 떨어진 필터 요소의 측면까지 가스를 안내하기 위한 안내벽들로 구성된 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
  8. 제7항에 있어서, 상기 웨이퍼캐리어 각각은 회전테이블의 격리된 칸막이내에 배치되는 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
  9. 제7항 또는 제8항에 있어서, 상기 회전테이블은 3개의 웨이퍼캐리어들과, 3개의 회전위치상에서 회전테이블의 정지와 구동을 이루는 구동 및 정지수단들로 구성되고, 회전위치상 웨이퍼캐리어들중 하나의 위치와 일치되는 위치상에 관모양의 오븐이 배치되며, 인양수단들이 웨이퍼캐리어를 회전테이블과 연관되는 오븐내로 인양하도록 된 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
  10. 제1항 내지 제9항에 있어서, 상기 전달부가 인양장치위에 장착된 주지의 로보트유닛트로 구성되어진 것을 특징으로 하는 마이크로회로 웨이퍼를 처리하기 위한 장치.
    ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019930003544A 1992-03-10 1993-03-10 마이크로회로 웨이퍼들을 처리하기 위한 장치 KR100278154B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9200446A NL9200446A (nl) 1992-03-10 1992-03-10 Inrichting voor het behandelen van microschakeling-schijven (wafers).
NL9200446 1992-03-10

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KR930020627A true KR930020627A (ko) 1993-10-20
KR100278154B1 KR100278154B1 (ko) 2001-02-01

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US (1) US5407449A (ko)
EP (1) EP0560439B1 (ko)
JP (1) JP3408278B2 (ko)
KR (1) KR100278154B1 (ko)
AT (1) ATE175052T1 (ko)
DE (1) DE69322671T2 (ko)
NL (1) NL9200446A (ko)
SG (1) SG49224A1 (ko)
TW (1) TW228601B (ko)

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KR100648238B1 (ko) * 2000-09-27 2006-11-24 에이에스엠 인터내셔널 엔.브이. 웨이퍼 핸들링 시스템
KR100972255B1 (ko) * 2005-08-05 2010-07-23 어드밴스드 마이크로 패브리케이션 이큅먼트 인코퍼레이티드 아시아 반도체 공작물 처리 시스템 및 처리 방법
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DE69322671T2 (de) 1999-06-17
US5407449A (en) 1995-04-18
EP0560439A1 (en) 1993-09-15
DE69322671D1 (de) 1999-02-04
TW228601B (ko) 1994-08-21
JPH0621197A (ja) 1994-01-28
JP3408278B2 (ja) 2003-05-19

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