USD410438S - Heat retaining tube for use in a semiconductor wafer heat processing apparatus - Google Patents

Heat retaining tube for use in a semiconductor wafer heat processing apparatus Download PDF

Info

Publication number
USD410438S
USD410438S US29/074,298 US7429897F USD410438S US D410438 S USD410438 S US D410438S US 7429897 F US7429897 F US 7429897F US D410438 S USD410438 S US D410438S
Authority
US
United States
Prior art keywords
processing apparatus
semiconductor wafer
retaining tube
heat
heat processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/074,298
Inventor
Katsutoshi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISHII, KATSUTOSHI
Application granted granted Critical
Publication of USD410438S publication Critical patent/USD410438S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus.
FIG. 2 a front elevational view thereof, the rear elevational view being a mirror image of the front view.
FIG. 3 a top plan view thereof.
FIG. 4 a bottom plan view thereof.
FIG. 5 a right side view thereof.
FIG. 6 a left side view thereof.
FIG. 7 a cross sectional view thereof taken along lineVII--VIl in FIG. 3; and,
FIG. 8 a cross sectional view thereof taken along line VIII--VIII in FIG. 2.

Claims (1)

  1. I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/074,298 1997-01-31 1997-07-24 Heat retaining tube for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD410438S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9-2651 1997-01-31
JP265197 1997-01-31

Publications (1)

Publication Number Publication Date
USD410438S true USD410438S (en) 1999-06-01

Family

ID=71617873

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/074,298 Expired - Lifetime USD410438S (en) 1997-01-31 1997-07-24 Heat retaining tube for use in a semiconductor wafer heat processing apparatus

Country Status (1)

Country Link
US (1) USD410438S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD786201S1 (en) * 2015-10-19 2017-05-09 Tymphany Hk Limited Heat sink for woofer
USD793974S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD793975S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD795209S1 (en) * 2015-09-29 2017-08-22 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD913229S1 (en) * 2019-04-24 2021-03-16 Tokyo Electron Limited Heater for heating semiconductor wafer
USD913230S1 (en) * 2019-04-24 2021-03-16 Tokyo Electron Limited Heater for heating semiconductor wafer

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857689A (en) * 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
US5314574A (en) * 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5407449A (en) * 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857689A (en) * 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5407449A (en) * 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
US5314574A (en) * 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD793974S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD793975S1 (en) * 2015-09-29 2017-08-08 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD795209S1 (en) * 2015-09-29 2017-08-22 Hitachi Kokusai Electric Inc. Heater for semiconductor thermal process
USD786201S1 (en) * 2015-10-19 2017-05-09 Tymphany Hk Limited Heat sink for woofer
USD913229S1 (en) * 2019-04-24 2021-03-16 Tokyo Electron Limited Heater for heating semiconductor wafer
USD913230S1 (en) * 2019-04-24 2021-03-16 Tokyo Electron Limited Heater for heating semiconductor wafer

Similar Documents

Publication Publication Date Title
USD404372S (en) Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) Cap for use in a semiconductor wafer heat processing apparatus
USD411176S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD405431S (en) Tube for use in a semiconductor wafer heat processing apparatus
USD409158S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD431470S (en) Plastic bottle
USD405429S (en) Processing tube for use in a semiconductor wafer heat processing apparatus
USD394244S (en) Semiconductor device
USD401912S (en) Semiconductor device
USD404015S (en) Wafer boat for use in a semiconductor wafer heat processing apparatus
USD440458S1 (en) Single cool/hot water dispenser
USD407696S (en) Inner tube for use in a semiconductor wafer heat processing apparatus
USD405430S (en) Inner tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) Processing tube for use in a semiconductor wafer heat processing apparatus
USD404369S (en) Manifold cover for use in a semiconductor wafer heat processing apparatus
USD406113S (en) Processing tube for use in a semiconductor wafer heat processing apparatus
USD418485S (en) Semiconductor device
USD430532S (en) Bicycle support rack
USD420812S (en) Canopied seating support structure
USD404368S (en) Outer tube for use in a semiconductor wafer heat processing apparatus
USD410438S (en) Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD357926S (en) Wafer for the welding and/or cutting of plastic tubes
USD400106S (en) Bottle
USD387670S (en) Bottle