USD410438S - Heat retaining tube for use in a semiconductor wafer heat processing apparatus - Google Patents
Heat retaining tube for use in a semiconductor wafer heat processing apparatus Download PDFInfo
- Publication number
- USD410438S USD410438S US29/074,298 US7429897F USD410438S US D410438 S USD410438 S US D410438S US 7429897 F US7429897 F US 7429897F US D410438 S USD410438 S US D410438S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- semiconductor wafer
- retaining tube
- heat
- heat processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus.
FIG. 2 a front elevational view thereof, the rear elevational view being a mirror image of the front view.
FIG. 3 a top plan view thereof.
FIG. 4 a bottom plan view thereof.
FIG. 5 a right side view thereof.
FIG. 6 a left side view thereof.
FIG. 7 a cross sectional view thereof taken along lineVII--VIl in FIG. 3; and,
FIG. 8 a cross sectional view thereof taken along line VIII--VIII in FIG. 2.
Claims (1)
- I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9-2651 | 1997-01-31 | ||
JP265197 | 1997-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD410438S true USD410438S (en) | 1999-06-01 |
Family
ID=71617873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/074,298 Expired - Lifetime USD410438S (en) | 1997-01-31 | 1997-07-24 | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
Country Status (1)
Country | Link |
---|---|
US (1) | USD410438S (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
USD793974S1 (en) * | 2015-09-29 | 2017-08-08 | Hitachi Kokusai Electric Inc. | Heater for semiconductor thermal process |
USD793975S1 (en) * | 2015-09-29 | 2017-08-08 | Hitachi Kokusai Electric Inc. | Heater for semiconductor thermal process |
USD795209S1 (en) * | 2015-09-29 | 2017-08-22 | Hitachi Kokusai Electric Inc. | Heater for semiconductor thermal process |
USD913229S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
USD913230S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4857689A (en) * | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
US5174045A (en) * | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
US5314574A (en) * | 1992-06-26 | 1994-05-24 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
US5407449A (en) * | 1992-03-10 | 1995-04-18 | Asm International N.V. | Device for treating micro-circuit wafers |
USD361752S (en) * | 1993-09-17 | 1995-08-29 | Tokyo Electron Kasbushiki Kaisha | Wafer boat or rack for holding semiconductor wafers |
US5516732A (en) * | 1992-12-04 | 1996-05-14 | Sony Corporation | Wafer processing machine vacuum front end method and apparatus |
US5658115A (en) * | 1991-09-05 | 1997-08-19 | Hitachi, Ltd. | Transfer apparatus |
US5752796A (en) * | 1996-01-24 | 1998-05-19 | Muka; Richard S. | Vacuum integrated SMIF system |
-
1997
- 1997-07-24 US US29/074,298 patent/USD410438S/en not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4857689A (en) * | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
US5174045A (en) * | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
US5658115A (en) * | 1991-09-05 | 1997-08-19 | Hitachi, Ltd. | Transfer apparatus |
US5407449A (en) * | 1992-03-10 | 1995-04-18 | Asm International N.V. | Device for treating micro-circuit wafers |
US5314574A (en) * | 1992-06-26 | 1994-05-24 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
US5516732A (en) * | 1992-12-04 | 1996-05-14 | Sony Corporation | Wafer processing machine vacuum front end method and apparatus |
USD361752S (en) * | 1993-09-17 | 1995-08-29 | Tokyo Electron Kasbushiki Kaisha | Wafer boat or rack for holding semiconductor wafers |
US5752796A (en) * | 1996-01-24 | 1998-05-19 | Muka; Richard S. | Vacuum integrated SMIF system |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD793974S1 (en) * | 2015-09-29 | 2017-08-08 | Hitachi Kokusai Electric Inc. | Heater for semiconductor thermal process |
USD793975S1 (en) * | 2015-09-29 | 2017-08-08 | Hitachi Kokusai Electric Inc. | Heater for semiconductor thermal process |
USD795209S1 (en) * | 2015-09-29 | 2017-08-22 | Hitachi Kokusai Electric Inc. | Heater for semiconductor thermal process |
USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
USD913229S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
USD913230S1 (en) * | 2019-04-24 | 2021-03-16 | Tokyo Electron Limited | Heater for heating semiconductor wafer |
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