TW263604B - Heat treatment apparatus - Google Patents

Heat treatment apparatus

Info

Publication number
TW263604B
TW263604B TW083110982A TW83110982A TW263604B TW 263604 B TW263604 B TW 263604B TW 083110982 A TW083110982 A TW 083110982A TW 83110982 A TW83110982 A TW 83110982A TW 263604 B TW263604 B TW 263604B
Authority
TW
Taiwan
Prior art keywords
cassette
heat treatment
turntable
group
treatment apparatus
Prior art date
Application number
TW083110982A
Other languages
Chinese (zh)
Inventor
Chiko Ishihashi
Yoshiji Fukuyama
Original Assignee
Koyo Rindobagu Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Rindobagu Kk filed Critical Koyo Rindobagu Kk
Application granted granted Critical
Publication of TW263604B publication Critical patent/TW263604B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Abstract

The present invention relates to a heat treatment apparatus comprising within the lightly closed casing 1 a cassette hand-over means 12, a cassette stocker 15 having a plurality of cassette mounting turning tables 16A, 16B disposed on the same vertical direction, cassette transfer means 33, a heat treatment means formed from vertical heat treatment oven 41 and a boat lifting and lowering without interference, and a wafer transfer means 46. All the turntables 16A, 16B of the cassette stacker 15 are divided into upper and lower groups. There are more than two turntalbes in the upper group, and there is one turntable 16B in the lower group. The two groups of turntable 16A, 16B are driven to rotate respectively. The turntable 16A of the upper group and the turntable 16B of lower group are driven to rotate individually.
TW083110982A 1994-11-24 1994-11-25 Heat treatment apparatus TW263604B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6289537A JP2952748B2 (en) 1994-11-24 1994-11-24 Heat treatment equipment

Publications (1)

Publication Number Publication Date
TW263604B true TW263604B (en) 1995-11-21

Family

ID=17744531

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110982A TW263604B (en) 1994-11-24 1994-11-25 Heat treatment apparatus

Country Status (3)

Country Link
JP (1) JP2952748B2 (en)
KR (1) KR100204942B1 (en)
TW (1) TW263604B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6481956B1 (en) * 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
US5908281A (en) * 1996-09-20 1999-06-01 Brooks Automation Inc. Coaxial drive loader arm
KR100325123B1 (en) * 1998-12-29 2002-07-03 신현준 Charge plate of coil using furnace
JP2987148B1 (en) 1999-01-26 1999-12-06 国際電気株式会社 Substrate processing equipment
KR100558570B1 (en) * 2000-04-03 2006-03-13 삼성전자주식회사 Method for increasing wafer batch capacity within boat in semiconductor fabrication equipment
JP3999723B2 (en) 2003-10-08 2007-10-31 川崎重工業株式会社 Substrate holding device
JP4266197B2 (en) 2004-10-19 2009-05-20 東京エレクトロン株式会社 Vertical heat treatment equipment
JP4816545B2 (en) * 2007-03-30 2011-11-16 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and storage medium
JP2007227972A (en) * 2007-05-28 2007-09-06 Dainippon Screen Mfg Co Ltd Carrier stocker
KR101415265B1 (en) * 2012-06-04 2014-07-07 국제엘렉트릭코리아 주식회사 Cassette stocker and substrate processing apparatus
US11201073B2 (en) 2013-08-26 2021-12-14 Brooks Automation, Inc Substrate transport apparatus

Also Published As

Publication number Publication date
KR960019593A (en) 1996-06-17
JP2952748B2 (en) 1999-09-27
JPH08148503A (en) 1996-06-07
KR100204942B1 (en) 1999-06-15

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