KR20050105167A - 봉착가공용 무연 유리재와 이것을 사용한 봉착가공물 및봉착가공 방법 - Google Patents
봉착가공용 무연 유리재와 이것을 사용한 봉착가공물 및봉착가공 방법 Download PDFInfo
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Abstract
Description
Claims (15)
- B2O3 및 V2O5의 어느 한쪽 또는 양쪽으로 이루어지는 망목형성 산화물이 20∼80중량%, ZnO가 0∼60중량%, BaO가 0∼80중량%이고, 또한 ZnO와 BaO의 적어도 한쪽을 필수성분으로서 함유하는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항에 있어서, 20∼80중량%의 B2O3와, 0∼50중량%의 ZnO와, 0∼60중량%의 BaO로 이루어지는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항에 있어서, 20∼40중량%의 B2O3와, 0∼50중량%의 ZnO와, 10∼60중량%의 BaO로 이루어지는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항에 있어서, 20∼35중량%의 B2O3와, 10∼35중량%의 ZnO와, 40∼60중량%의 BaO로 이루어지는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 2 항 내지 제 4 항중 어느 한 항에 기재된 유리조성을 구성하는 산화물의 합량 100중량부에 대하여, TeO2 및 Bi2O3가 어느 한쪽의 단독 사용 또는 양쪽의 병용으로 56∼500중량부 배합되어서 이루어지는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항에 있어서, 30∼80중량%의 V2O5와, 0∼50중량%의 ZnO와, 10∼60중량%의 BaO로 이루어지는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항에 있어서, 25∼75중량%의 V2O5와, 0∼45중량%의 ZnO와, 15∼55중량%의 BaO로 이루어지는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 6 항 또는 제 7 항에 기재된 유리조성을 구성하는 산화물의 합량 100중량부에 대하여, TeO2 및 Bi2O3가 어느 한쪽의 단독 사용 또는 양쪽의 병용으로 1∼60중량부 배합되어서 이루어지는 유리조성을 갖는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항 내지 제 10 항중 어느 한 항에 기재된 유리조성을 갖는 유리 분말에 내화물 필러가 혼합되어서 이루어지는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 9 항에 있어서, 내화물 필러가 저팽창 세라믹 분말이고, 그 배합량을 유리 분말 100중량부에 대해 150중량부 이하로 하는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항 내지 제 8 항중 어느 한 항에 기재된 유리조성을 갖는 유리 분말 또는 이 유리 분말에 내화물 필러를 부가한 혼합분말의 페이스트로 이루어지는 것을 특징으로 하는 봉착가공용 무연 유리재.
- 제 1 항 내지 제 11 항중 어느 한 항에 기재된 봉착가공용 무연 유리재에 의해 개구부 또는/및 접합부가 봉착된 유리, 세라믹, 금속중 어느 하나를 주체로 하는 것을 특징으로 하는 봉착가공물.
- 제 12 항에 있어서, 내부를 고진공으로 하는 진공 패키지인 것을 특징으로 하는 봉착가공물.
- 제 11 항에 기재된 페이스트로 이루어지는 봉착가공용 무연 유리재를 봉착대상물품의 피봉착부에 도포하고, 이 물품을 상기 페이스트에 포함되는 무연 유리의 연화점 부근에서 가소성한 뒤, 당해 무연 유리의 결정화 개시온도 부근에서 본소성을 행하는 것을 특징으로 하는 봉착가공 방법.
- 제 14 항에 있어서, 가소성을 상기 연화점 -10℃부터 연화점 +40℃의 온도범위에서 행하는 동시에, 본소성을 상기 결정화 개시온도 -20℃부터 결정화 개시온도 +50℃의 온도범위에서 행하는 것을 특징으로 하는 봉착가공 방법.
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JPJP-P-2003-00041695 | 2003-02-19 | ||
JP2003041695A JP4299021B2 (ja) | 2003-02-19 | 2003-02-19 | 封着加工材及び封着加工用ペースト |
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KR1020107005939A Division KR100978359B1 (ko) | 2003-02-19 | 2003-06-27 | 봉착가공용 무연 유리재와 이것을 사용한 봉착가공물 및 봉착가공 방법 |
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KR20050105167A true KR20050105167A (ko) | 2005-11-03 |
KR100981620B1 KR100981620B1 (ko) | 2010-09-10 |
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KR1020107005939A KR100978359B1 (ko) | 2003-02-19 | 2003-06-27 | 봉착가공용 무연 유리재와 이것을 사용한 봉착가공물 및 봉착가공 방법 |
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Country | Link |
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US (3) | US7425518B2 (ko) |
EP (2) | EP3006414A1 (ko) |
JP (1) | JP4299021B2 (ko) |
KR (2) | KR100981620B1 (ko) |
CN (2) | CN101016196A (ko) |
TW (1) | TWI274746B (ko) |
WO (1) | WO2004074198A1 (ko) |
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JP4091773B2 (ja) * | 2002-02-20 | 2008-05-28 | 京セラ株式会社 | 光デバイス |
-
2003
- 2003-02-19 JP JP2003041695A patent/JP4299021B2/ja not_active Expired - Lifetime
- 2003-06-24 TW TW092117053A patent/TWI274746B/zh not_active IP Right Cessation
- 2003-06-27 EP EP15193142.5A patent/EP3006414A1/en not_active Withdrawn
- 2003-06-27 WO PCT/JP2003/008263 patent/WO2004074198A1/ja active Application Filing
- 2003-06-27 KR KR1020057012559A patent/KR100981620B1/ko active IP Right Grant
- 2003-06-27 KR KR1020107005939A patent/KR100978359B1/ko active IP Right Grant
- 2003-06-27 CN CNA2007100873258A patent/CN101016196A/zh active Pending
- 2003-06-27 EP EP03738570.5A patent/EP1595856B1/en not_active Expired - Fee Related
- 2003-06-27 CN CNA038259125A patent/CN1738776A/zh active Pending
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2005
- 2005-06-21 US US11/158,258 patent/US7425518B2/en not_active Expired - Lifetime
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2007
- 2007-04-18 US US11/736,663 patent/US20070184963A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
---|---|
EP1595856B1 (en) | 2017-01-11 |
KR20100049651A (ko) | 2010-05-12 |
EP1595856A1 (en) | 2005-11-16 |
US20070184963A1 (en) | 2007-08-09 |
US20070191203A1 (en) | 2007-08-16 |
WO2004074198A1 (ja) | 2004-09-02 |
CN101016196A (zh) | 2007-08-15 |
CN1738776A (zh) | 2006-02-22 |
US20050233885A1 (en) | 2005-10-20 |
EP3006414A1 (en) | 2016-04-13 |
TWI274746B (en) | 2007-03-01 |
EP1595856A4 (en) | 2009-09-16 |
KR100981620B1 (ko) | 2010-09-10 |
KR100978359B1 (ko) | 2010-08-27 |
JP2004250276A (ja) | 2004-09-09 |
US7425518B2 (en) | 2008-09-16 |
TW200416206A (en) | 2004-09-01 |
JP4299021B2 (ja) | 2009-07-22 |
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