KR101655897B1 - 마이크로전자 조립체 및 적층형 마이크로전자 조립체의 제조 방법 - Google Patents
마이크로전자 조립체 및 적층형 마이크로전자 조립체의 제조 방법 Download PDFInfo
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- KR101655897B1 KR101655897B1 KR1020107028161A KR20107028161A KR101655897B1 KR 101655897 B1 KR101655897 B1 KR 101655897B1 KR 1020107028161 A KR1020107028161 A KR 1020107028161A KR 20107028161 A KR20107028161 A KR 20107028161A KR 101655897 B1 KR101655897 B1 KR 101655897B1
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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| US6195308P | 2008-06-16 | 2008-06-16 | |
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- 2009-06-15 EP EP09767074.9A patent/EP2308087B1/en not_active Not-in-force
- 2009-06-15 US US12/456,349 patent/US8680662B2/en active Active
- 2009-06-15 WO PCT/US2009/003643 patent/WO2009154761A1/en not_active Ceased
- 2009-06-15 KR KR1020107028161A patent/KR101655897B1/ko not_active Expired - Fee Related
- 2009-06-16 TW TW098120145A patent/TWI425611B/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2308087B1 (en) | 2020-08-12 |
| EP2308087A1 (en) | 2011-04-13 |
| WO2009154761A9 (en) | 2010-03-11 |
| US8680662B2 (en) | 2014-03-25 |
| WO2009154761A1 (en) | 2009-12-23 |
| US20090316378A1 (en) | 2009-12-24 |
| JP2011524647A (ja) | 2011-09-01 |
| TW201005918A (en) | 2010-02-01 |
| CN102067310B (zh) | 2013-08-21 |
| KR20110027690A (ko) | 2011-03-16 |
| JP5639052B2 (ja) | 2014-12-10 |
| CN102067310A (zh) | 2011-05-18 |
| TWI425611B (zh) | 2014-02-01 |
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