KR101454720B1 - 고주파 신호선로 및 전자기기 - Google Patents
고주파 신호선로 및 전자기기 Download PDFInfo
- Publication number
- KR101454720B1 KR101454720B1 KR1020137002518A KR20137002518A KR101454720B1 KR 101454720 B1 KR101454720 B1 KR 101454720B1 KR 1020137002518 A KR1020137002518 A KR 1020137002518A KR 20137002518 A KR20137002518 A KR 20137002518A KR 101454720 B1 KR101454720 B1 KR 101454720B1
- Authority
- KR
- South Korea
- Prior art keywords
- signal line
- frequency signal
- ground conductor
- axis direction
- line
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B15/00—Suppression or limitation of noise or interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/20327—Electromagnetic interstage coupling
- H01P1/20354—Non-comb or non-interdigital filters
- H01P1/20363—Linear resonators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010270123 | 2010-12-03 | ||
JPJP-P-2010-270123 | 2010-12-03 | ||
JPJP-P-2011-103644 | 2011-05-06 | ||
JP2011103644 | 2011-05-06 | ||
JP2011218074 | 2011-09-30 | ||
JPJP-P-2011-218074 | 2011-09-30 | ||
PCT/JP2011/077931 WO2012074101A1 (ja) | 2010-12-03 | 2011-12-02 | 高周波信号線路及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130054332A KR20130054332A (ko) | 2013-05-24 |
KR101454720B1 true KR101454720B1 (ko) | 2014-10-27 |
Family
ID=46172022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137002518A KR101454720B1 (ko) | 2010-12-03 | 2011-12-02 | 고주파 신호선로 및 전자기기 |
Country Status (6)
Country | Link |
---|---|
US (8) | US8624692B2 (zh) |
EP (1) | EP2590485B1 (zh) |
JP (6) | JP5310949B2 (zh) |
KR (1) | KR101454720B1 (zh) |
CN (4) | CN103906348B (zh) |
WO (2) | WO2012074100A1 (zh) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103906348B (zh) | 2010-12-03 | 2017-11-24 | 株式会社村田制作所 | 电子设备 |
JP5751343B2 (ja) * | 2011-12-02 | 2015-07-22 | 株式会社村田製作所 | 高周波信号線路の製造方法 |
CN103733741B (zh) | 2011-12-29 | 2016-03-30 | 株式会社村田制作所 | 高频信号线路及电子设备 |
JP5776849B2 (ja) * | 2012-06-28 | 2015-09-09 | 株式会社村田製作所 | 高周波伝送線路および電子機器 |
WO2014003089A1 (ja) * | 2012-06-29 | 2014-01-03 | 株式会社村田製作所 | フラットケーブルおよび電子機器 |
JP5842850B2 (ja) * | 2012-06-29 | 2016-01-13 | 株式会社村田製作所 | フラットケーブルおよび電子機器 |
JP5888274B2 (ja) * | 2012-06-29 | 2016-03-16 | 株式会社村田製作所 | 高周波線路及び電子機器 |
JP5862482B2 (ja) * | 2012-06-29 | 2016-02-16 | 株式会社村田製作所 | フラットケーブルの製造方法 |
JP5958122B2 (ja) * | 2012-06-29 | 2016-07-27 | 株式会社村田製作所 | 高周波信号線路及び信号線路付き基材層の製造方法 |
WO2014003088A1 (ja) * | 2012-06-29 | 2014-01-03 | 株式会社村田製作所 | フラットケーブル |
JP6137789B2 (ja) * | 2012-06-29 | 2017-05-31 | 株式会社村田製作所 | フラットケーブル |
JP5754554B2 (ja) * | 2012-06-29 | 2015-07-29 | 株式会社村田製作所 | 高周波信号線路の製造方法 |
WO2014021372A1 (ja) * | 2012-08-03 | 2014-02-06 | 株式会社村田製作所 | フラットケーブル |
CN104221482B (zh) * | 2012-08-09 | 2017-04-05 | 株式会社村田制作所 | 高频信号传输线路及电子设备 |
CN106169920B (zh) | 2012-08-10 | 2019-02-12 | 株式会社村田制作所 | 层叠体及通信装置 |
JP5935620B2 (ja) * | 2012-09-18 | 2016-06-15 | 株式会社村田製作所 | フラットケーブル |
JP5534120B1 (ja) * | 2012-09-28 | 2014-06-25 | 株式会社村田製作所 | 信号線路モジュールおよび通信端末装置 |
JP5704144B2 (ja) * | 2012-10-10 | 2015-04-22 | 株式会社村田製作所 | 高周波信号線路及びその製造方法 |
JP5862790B2 (ja) | 2012-10-12 | 2016-02-16 | 株式会社村田製作所 | 高周波信号線路 |
CN204361241U (zh) | 2012-10-12 | 2015-05-27 | 株式会社村田制作所 | 高频信号传输线路及电子设备 |
CN204538168U (zh) | 2012-10-12 | 2015-08-05 | 株式会社村田制作所 | 高频信号线路 |
JP5867621B2 (ja) * | 2012-10-31 | 2016-02-24 | 株式会社村田製作所 | 高周波信号線路及びその製造方法 |
WO2014069061A1 (ja) | 2012-10-31 | 2014-05-08 | 株式会社村田製作所 | 高周波信号線路及びその製造方法 |
JP5673898B2 (ja) * | 2012-11-29 | 2015-02-18 | 株式会社村田製作所 | 高周波信号線路及びこれを備えた電子機器 |
CN204809363U (zh) * | 2013-01-22 | 2015-11-25 | 株式会社村田制作所 | 高频信号传输线路及电子设备 |
CN104798248B (zh) * | 2013-01-23 | 2017-03-15 | 株式会社村田制作所 | 传输线路及电子设备 |
WO2014119410A1 (ja) * | 2013-01-29 | 2014-08-07 | 株式会社村田製作所 | 高周波信号伝送線路及び電子機器 |
WO2014119411A1 (ja) * | 2013-01-29 | 2014-08-07 | 株式会社村田製作所 | 高周波信号伝送線路及び電子機器 |
JP5800094B2 (ja) * | 2013-02-01 | 2015-10-28 | 株式会社村田製作所 | フラットケーブル型高周波フィルタ、フラットケーブル型高周波ダイプレクサ、および電子機器 |
JP5700187B2 (ja) * | 2013-02-13 | 2015-04-15 | 株式会社村田製作所 | 高周波信号伝送線路、電子機器及び高周波信号伝送線路の製造方法 |
JP5743034B2 (ja) * | 2013-02-19 | 2015-07-01 | 株式会社村田製作所 | インダクタブリッジおよび電子機器 |
CN103259070B (zh) * | 2013-04-12 | 2016-08-03 | 上海安费诺永亿通讯电子有限公司 | 一种降低损耗的传输线 |
CN103259069B (zh) * | 2013-04-12 | 2015-06-24 | 上海安费诺永亿通讯电子有限公司 | 一种改进损耗的传输线 |
CN204885387U (zh) | 2013-04-30 | 2015-12-16 | 株式会社村田制作所 | 高频传输线路 |
JP5817951B2 (ja) | 2013-05-15 | 2015-11-18 | 株式会社村田製作所 | 信号伝送ケーブル、および通信機器モジュール |
US9402303B2 (en) * | 2013-06-03 | 2016-07-26 | Apple Inc. | Flexible printed circuit cables with slits |
CN204991353U (zh) | 2013-06-14 | 2016-01-20 | 株式会社村田制作所 | 柔性电感器的安装结构及电子设备 |
KR101416159B1 (ko) * | 2013-09-06 | 2014-07-14 | 주식회사 기가레인 | 접촉 패드를 구비하는 인쇄회로기판 |
JP5811306B1 (ja) * | 2013-12-12 | 2015-11-11 | 株式会社村田製作所 | 信号伝送部品および電子機器 |
CN205646089U (zh) * | 2014-01-20 | 2016-10-12 | 株式会社村田制作所 | 信号线路 |
JP6090480B2 (ja) | 2014-02-04 | 2017-03-08 | 株式会社村田製作所 | 高周波信号伝送線路及び電子機器 |
JP6176400B2 (ja) | 2014-06-02 | 2017-08-09 | 株式会社村田製作所 | 伝送線路部材 |
WO2015186468A1 (ja) * | 2014-06-04 | 2015-12-10 | 株式会社村田製作所 | フレキシブル基板及び電子機器 |
CN110602883B (zh) * | 2014-09-26 | 2022-10-21 | 株式会社村田制作所 | 传输线路及电子设备 |
CN206640859U (zh) | 2014-09-30 | 2017-11-14 | 株式会社村田制作所 | 电子设备 |
CN110212276B (zh) * | 2014-12-01 | 2022-05-10 | 株式会社村田制作所 | 电子设备及电气元件 |
JP6187776B2 (ja) * | 2014-12-12 | 2017-08-30 | カシオ計算機株式会社 | 電子機器 |
US10051746B2 (en) * | 2014-12-16 | 2018-08-14 | Amphenol Corporation | High-speed interconnects for printed circuit boards |
CN104733823A (zh) * | 2015-04-14 | 2015-06-24 | 上海安费诺永亿通讯电子有限公司 | 一种可弯折的扁平传输线 |
JP6168258B1 (ja) * | 2015-09-25 | 2017-07-26 | 株式会社村田製作所 | アンテナモジュールおよび電子機器 |
CN210130017U (zh) | 2016-01-20 | 2020-03-06 | 株式会社村田制作所 | 树脂多层基板与电路基板的接合构造 |
KR102552614B1 (ko) * | 2016-02-26 | 2023-07-06 | 주식회사 기가레인 | 연성회로기판 |
WO2017170074A1 (ja) * | 2016-04-01 | 2017-10-05 | 株式会社村田製作所 | 電子機器 |
WO2018003383A1 (ja) * | 2016-06-30 | 2018-01-04 | 株式会社村田製作所 | 多層基板 |
WO2018037871A1 (ja) | 2016-08-26 | 2018-03-01 | 株式会社村田製作所 | 樹脂多層基板、伝送線路、モジュールおよびモジュールの製造方法 |
CN210157483U (zh) | 2016-10-27 | 2020-03-17 | 株式会社村田制作所 | 多层基板 |
JP6665081B2 (ja) * | 2016-12-26 | 2020-03-13 | 京セラ株式会社 | 電子機器 |
JP6683264B2 (ja) * | 2017-01-05 | 2020-04-15 | 株式会社村田製作所 | 電子機器 |
US9900999B1 (en) * | 2017-02-03 | 2018-02-20 | Google Inc. | Circuit board architecture for an electronic device |
CN210405777U (zh) * | 2017-02-20 | 2020-04-24 | 株式会社村田制作所 | 电子设备 |
US20180288889A1 (en) * | 2017-03-30 | 2018-10-04 | Google Inc. | Circuit board and battery architecture of an electronic device |
JP6776280B2 (ja) * | 2018-01-10 | 2020-10-28 | 株式会社東芝 | 無線通信モジュール、プリント基板、および製造方法 |
CN108366486B (zh) * | 2018-01-26 | 2020-08-25 | 苏州浪潮智能科技有限公司 | 一种减小clk高速信号串扰的布局和布线方法 |
JP7100487B2 (ja) * | 2018-04-27 | 2022-07-13 | 京セラ株式会社 | 印刷配線板 |
KR20200025543A (ko) * | 2018-08-30 | 2020-03-10 | 삼성전자주식회사 | 패키지 볼을 갖는 반도체 패키지를 포함하는 전자 소자 |
CN110876226A (zh) * | 2018-08-31 | 2020-03-10 | 鹏鼎控股(深圳)股份有限公司 | 软硬结合电路板及其制作方法 |
KR102578352B1 (ko) * | 2018-11-22 | 2023-09-13 | 미쓰비시덴키 가부시키가이샤 | 플렉시블 기판 |
WO2020196681A1 (ja) * | 2019-03-28 | 2020-10-01 | 株式会社村田製作所 | 多極コネクタセット |
KR102639871B1 (ko) * | 2019-05-21 | 2024-02-23 | 삼성전자 주식회사 | 전기적 연결 장치 및 그것을 포함하는 전자 장치 |
WO2020262372A1 (ja) | 2019-06-27 | 2020-12-30 | 株式会社村田製作所 | 樹脂多層基板およびその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007123740A (ja) * | 2005-10-31 | 2007-05-17 | Sony Corp | フレキシブル基板、光送受信モジュール及び光送受信装置 |
KR20080021884A (ko) * | 2006-09-05 | 2008-03-10 | 삼성전기주식회사 | 전자파 차폐 및 전하방전 방지형 인쇄회로 기판장치 |
JP2008147461A (ja) * | 2006-12-11 | 2008-06-26 | Shin Etsu Handotai Co Ltd | 半導体基板の評価方法および半導体基板評価用素子 |
JP2008187670A (ja) * | 2007-01-31 | 2008-08-14 | Fujitsu Ltd | 中継基板および光通信モジュール |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8828281D0 (en) * | 1988-12-03 | 1989-01-05 | Quantel Ltd | Strip lines |
JPH05343820A (ja) | 1992-06-04 | 1993-12-24 | Toshiba Corp | マルチチップモジュール用回路基板 |
JP3815528B2 (ja) * | 1998-05-01 | 2006-08-30 | 富士ゼロックス株式会社 | 電子機器 |
JP2001085805A (ja) * | 1999-09-17 | 2001-03-30 | Kyoden:Kk | プリント基板 |
JP2001313444A (ja) * | 2000-03-22 | 2001-11-09 | Hewlett Packard Co <Hp> | フレキシブルプリント回路基板およびそのシールド方法 |
JP3976473B2 (ja) * | 2000-05-09 | 2007-09-19 | 日本電気株式会社 | 高周波回路及びそれを用いたモジュール、通信機 |
JP2002111324A (ja) * | 2000-09-28 | 2002-04-12 | Toshiba Corp | 信号伝送用回路基板、その製造方法及びそれを用いた電子機器 |
US6624729B2 (en) * | 2000-12-29 | 2003-09-23 | Hewlett-Packard Development Company, L.P. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
JP2003218480A (ja) * | 2002-01-25 | 2003-07-31 | Mitsubishi Electric Corp | プリント配線板及びその製造方法 |
JP2004088020A (ja) | 2002-08-29 | 2004-03-18 | Toshiba Corp | フレキシブルプリント基板及び該基板を備えた電子機器 |
JP2004152963A (ja) * | 2002-10-30 | 2004-05-27 | Denso Corp | 電子回路と外部部品との接続方法 |
US20050083147A1 (en) * | 2003-10-20 | 2005-04-21 | Barr Andrew H. | Circuit board and method in which the impedance of a transmission-path is selected by varying at least one opening in a proximate conductive plane |
US7405698B2 (en) * | 2004-10-01 | 2008-07-29 | De Rochemont L Pierre | Ceramic antenna module and methods of manufacture thereof |
JP2006157646A (ja) * | 2004-11-30 | 2006-06-15 | Sony Corp | 配線基板 |
JP4798483B2 (ja) * | 2005-10-24 | 2011-10-19 | 住友ベークライト株式会社 | 回路基板 |
JP2007234500A (ja) * | 2006-03-03 | 2007-09-13 | Jst Mfg Co Ltd | 高速伝送用fpc及びこのfpcに接続されるプリント基板 |
JP2007242963A (ja) * | 2006-03-09 | 2007-09-20 | Toshiba Corp | 基板構造 |
JP2008147462A (ja) * | 2006-12-11 | 2008-06-26 | Nidec Sankyo Corp | 回路基板 |
KR20080073480A (ko) * | 2007-02-06 | 2008-08-11 | 삼성전자주식회사 | 플랫케이블 및 이를 갖는 전자장치 |
JP4981618B2 (ja) * | 2007-10-23 | 2012-07-25 | 日東電工株式会社 | 配線回路基板 |
JP2009212329A (ja) * | 2008-03-05 | 2009-09-17 | Epson Imaging Devices Corp | 回路基板、電気光学装置及び電子機器 |
JP4894865B2 (ja) * | 2009-02-12 | 2012-03-14 | 富士電機株式会社 | 双方向スイッチの電流検出回路 |
US20100225425A1 (en) * | 2009-03-09 | 2010-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | High performance coupled coplanar waveguides with slow-wave features |
WO2010103722A1 (ja) * | 2009-03-10 | 2010-09-16 | 住友ベークライト株式会社 | 回路基板 |
JP2010212438A (ja) * | 2009-03-10 | 2010-09-24 | Sumitomo Bakelite Co Ltd | 回路基板 |
JP5375319B2 (ja) * | 2009-05-08 | 2013-12-25 | 株式会社村田製作所 | 信号線路及びその製造方法 |
US8350638B2 (en) * | 2009-11-20 | 2013-01-08 | General Motors Llc | Connector assembly for providing capacitive coupling between a body and a coplanar waveguide and method of assembling |
CN103906348B (zh) * | 2010-12-03 | 2017-11-24 | 株式会社村田制作所 | 电子设备 |
-
2011
- 2011-12-02 CN CN201410121164.XA patent/CN103906348B/zh active Active
- 2011-12-02 WO PCT/JP2011/077930 patent/WO2012074100A1/ja active Application Filing
- 2011-12-02 WO PCT/JP2011/077931 patent/WO2012074101A1/ja active Application Filing
- 2011-12-02 KR KR1020137002518A patent/KR101454720B1/ko active IP Right Grant
- 2011-12-02 CN CN201510812491.4A patent/CN105472867B/zh active Active
- 2011-12-02 JP JP2012524420A patent/JP5310949B2/ja active Active
- 2011-12-02 JP JP2012513788A patent/JP5136723B2/ja active Active
- 2011-12-02 CN CN201180038249.6A patent/CN103053225B/zh active Active
- 2011-12-02 CN CN2011800342253A patent/CN102986308A/zh active Pending
- 2011-12-02 EP EP11845031.1A patent/EP2590485B1/en active Active
-
2012
- 2012-09-18 JP JP2012204126A patent/JP5282840B2/ja active Active
-
2013
- 2013-01-11 US US13/739,076 patent/US8624692B2/en active Active
- 2013-02-01 US US13/756,867 patent/US8525613B2/en active Active
- 2013-05-20 JP JP2013106192A patent/JP5737328B2/ja active Active
- 2013-07-03 JP JP2013139452A patent/JP2013191894A/ja active Pending
- 2013-07-19 US US13/945,947 patent/US8659370B2/en active Active
- 2013-07-19 US US13/945,950 patent/US8653910B2/en active Active
- 2013-12-12 US US14/103,914 patent/US9185795B2/en active Active
-
2014
- 2014-01-10 US US14/151,871 patent/US9007151B2/en active Active
- 2014-01-10 US US14/151,867 patent/US9414482B2/en active Active
-
2015
- 2015-04-16 JP JP2015083922A patent/JP5907297B2/ja active Active
-
2016
- 2016-05-17 US US15/156,395 patent/US9882256B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007123740A (ja) * | 2005-10-31 | 2007-05-17 | Sony Corp | フレキシブル基板、光送受信モジュール及び光送受信装置 |
KR20080021884A (ko) * | 2006-09-05 | 2008-03-10 | 삼성전기주식회사 | 전자파 차폐 및 전하방전 방지형 인쇄회로 기판장치 |
JP2008147461A (ja) * | 2006-12-11 | 2008-06-26 | Shin Etsu Handotai Co Ltd | 半導体基板の評価方法および半導体基板評価用素子 |
JP2008187670A (ja) * | 2007-01-31 | 2008-08-14 | Fujitsu Ltd | 中継基板および光通信モジュール |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101454720B1 (ko) | 고주파 신호선로 및 전자기기 | |
JP5754562B1 (ja) | 高周波信号線路及び電子機器 | |
JP5751343B2 (ja) | 高周波信号線路の製造方法 | |
US20140176254A1 (en) | High-frequency signal transmission line and electronic device | |
US20140176265A1 (en) | High-frequency signal transmission line and electronic device | |
JP5472551B2 (ja) | 高周波信号線路及び電子機器 | |
JP5472552B2 (ja) | 高周波信号線路及び電子機器 | |
JP2013135173A (ja) | 高周波信号線路 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |