KR100300758B1 - 반도체장치와 그 제조방법 - Google Patents

반도체장치와 그 제조방법 Download PDF

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Publication number
KR100300758B1
KR100300758B1 KR1019980707001A KR19980707001A KR100300758B1 KR 100300758 B1 KR100300758 B1 KR 100300758B1 KR 1019980707001 A KR1019980707001 A KR 1019980707001A KR 19980707001 A KR19980707001 A KR 19980707001A KR 100300758 B1 KR100300758 B1 KR 100300758B1
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KR
South Korea
Prior art keywords
semiconductor device
circuit board
electrode
electrode terminal
protruding
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Expired - Lifetime
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KR1019980707001A
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Korean (ko)
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KR19990087563A (ko
Inventor
츠카사 시라이시
요시히로 벳쇼
Original Assignee
모리시타 요이찌
마쯔시다덴기산교 가부시키가이샤
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Publication of KR19990087563A publication Critical patent/KR19990087563A/ko
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    • H10W72/071—
    • H10W72/012—
    • H10W74/012—
    • H10W74/15—
    • H10W72/0711—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/227—
    • H10W72/241—
    • H10W72/251—
    • H10W72/856—
    • H10W72/923—
    • H10W72/952—

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  • Wire Bonding (AREA)
KR1019980707001A 1996-03-06 1997-03-05 반도체장치와 그 제조방법 Expired - Lifetime KR100300758B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP96-049065 1996-03-06
JP8049065A JP2951882B2 (ja) 1996-03-06 1996-03-06 半導体装置の製造方法及びこれを用いて製造した半導体装置
PCT/JP1997/000672 WO1997033313A1 (en) 1996-03-06 1997-03-05 Semiconductor device and process for producing the same

Publications (2)

Publication Number Publication Date
KR19990087563A KR19990087563A (ko) 1999-12-27
KR100300758B1 true KR100300758B1 (ko) 2001-11-02

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KR1019980707001A Expired - Lifetime KR100300758B1 (ko) 1996-03-06 1997-03-05 반도체장치와 그 제조방법

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Country Link
US (1) US6452280B1 (OSRAM)
EP (2) EP0951063B1 (OSRAM)
JP (1) JP2951882B2 (OSRAM)
KR (1) KR100300758B1 (OSRAM)
CN (1) CN1175480C (OSRAM)
DE (1) DE69722661T2 (OSRAM)
WO (1) WO1997033313A1 (OSRAM)

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US6909180B2 (en) * 2000-05-12 2005-06-21 Matsushita Electric Industrial Co., Ltd. Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same
US6940178B2 (en) * 2001-02-27 2005-09-06 Chippac, Inc. Self-coplanarity bumping shape for flip chip
TWI245395B (en) * 2001-11-20 2005-12-11 Advanced Semiconductor Eng Multi-chip module package device
CN100356559C (zh) * 2003-09-24 2007-12-19 财团法人工业技术研究院 倒装芯片封装结构及其制造方法
TWI273664B (en) * 2004-03-26 2007-02-11 Advanced Semiconductor Eng Bumping process, bump structure, packaging process and package structure
KR100696190B1 (ko) * 2004-12-14 2007-03-20 한국전자통신연구원 플립 칩 본딩방법
JP4325571B2 (ja) * 2005-02-28 2009-09-02 株式会社日立製作所 電子装置の製造方法
TWI253697B (en) * 2005-04-08 2006-04-21 Phoenix Prec Technology Corp Method for fabricating a flip chip package
JP4765804B2 (ja) * 2006-07-14 2011-09-07 株式会社デンソー 半導体装置の製造方法
JP2008135719A (ja) * 2006-10-31 2008-06-12 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器
JP2008218643A (ja) * 2007-03-02 2008-09-18 Fujitsu Ltd 半導体装置及びその製造方法
JP5028291B2 (ja) * 2008-01-31 2012-09-19 三洋電機株式会社 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法
US8309864B2 (en) * 2008-01-31 2012-11-13 Sanyo Electric Co., Ltd. Device mounting board and manufacturing method therefor, and semiconductor module
JP5385004B2 (ja) * 2009-05-22 2014-01-08 富士通テン株式会社 回路部品
JP6143104B2 (ja) * 2012-12-05 2017-06-07 株式会社村田製作所 バンプ付き電子部品及びバンプ付き電子部品の製造方法
KR102248876B1 (ko) * 2014-12-24 2021-05-07 엘지디스플레이 주식회사 표시장치 어레이 기판 및 표시장치

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JPH0831875A (ja) * 1994-07-18 1996-02-02 Sony Corp 部品実装方法
JPH0855874A (ja) * 1994-08-11 1996-02-27 Matsushita Electric Ind Co Ltd 半導体チップの接着方法

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JPS63152135A (ja) 1986-12-17 1988-06-24 Hitachi Ltd 半導体装置の製造方法
JPS63289824A (ja) 1987-05-21 1988-11-28 Fuji Electric Co Ltd 集積回路装置の実装方法
JPS647542A (en) 1987-06-30 1989-01-11 Toshiba Corp Formation of bump
JPH0793306B2 (ja) 1987-08-05 1995-10-09 日本電装株式会社 半導体集積回路装置
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JPH02177546A (ja) * 1988-12-28 1990-07-10 Fujitsu Ltd 半導体集積回路の製造方法
JPH03209831A (ja) * 1990-01-12 1991-09-12 Matsushita Electric Ind Co Ltd 半導体装置
JP2764632B2 (ja) 1990-04-09 1998-06-11 イビデン株式会社 電子回路基板とその製造方法
JPH046841A (ja) * 1990-04-24 1992-01-10 Matsushita Electric Works Ltd 半導体装置の実装構造
JPH0433348A (ja) * 1990-05-29 1992-02-04 Sharp Corp 半導体装置
JPH04137541A (ja) 1990-09-27 1992-05-12 Sharp Corp 突起電極の形成方法
JPH04137630A (ja) 1990-09-28 1992-05-12 Seiko Epson Corp 半導体装置
JPH04144145A (ja) 1990-10-04 1992-05-18 Matsushita Electric Ind Co Ltd 半導体装置の実装方法
JPH05283414A (ja) * 1991-04-16 1993-10-29 Nippon Steel Corp 半導体装置用金属配線のバンプ高さ制御装置
JPH05144821A (ja) 1991-04-30 1993-06-11 Toshiba Corp 半導体装置
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JPH05144888A (ja) * 1991-11-19 1993-06-11 Fujitsu Ltd 半導体チツプの実装方法
JPH05166879A (ja) 1991-12-12 1993-07-02 Matsushita Electric Ind Co Ltd Ｉｃ実装方法
US5436503A (en) 1992-11-18 1995-07-25 Matsushita Electronics Corporation Semiconductor device and method of manufacturing the same
JP3259393B2 (ja) * 1993-01-08 2002-02-25 ソニー株式会社 半導体チップの実装方法
JPH06302649A (ja) 1993-04-13 1994-10-28 Citizen Watch Co Ltd 半導体装置の接続方法
JP3209831B2 (ja) 1993-06-07 2001-09-17 大和製罐株式会社 金属薄板の溶接不良検出方法および装置
KR0171438B1 (ko) * 1993-09-29 1999-10-15 모리시따 요오이찌 반도체 장치를 회로 기판상에 장착하는 방법 및 반도체 장치가 장착된 회로 기판
US5640051A (en) * 1993-12-13 1997-06-17 Matsushita Electric Industrial Co., Ltd. Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex
JP2793766B2 (ja) * 1993-12-27 1998-09-03 株式会社ピーエフユー 導電ペースト転写方法
JP3255796B2 (ja) 1994-05-26 2002-02-12 松下電器産業株式会社 半導体装置の実装方法
US5907187A (en) * 1994-07-18 1999-05-25 Kabushiki Kaisha Toshiba Electronic component and electronic component connecting structure
US5686353A (en) 1994-12-26 1997-11-11 Matsushita Electric Industrial Co., Ltd. Semiconductor device and manufacturing method thereof
JP3291950B2 (ja) 1994-12-28 2002-06-17 日産自動車株式会社 設計支援装置
EP0732107A3 (en) * 1995-03-16 1997-05-07 Toshiba Kk Shielding device for a circuit substrate
US5801446A (en) * 1995-03-28 1998-09-01 Tessera, Inc. Microelectronic connections with solid core joining units
US5796591A (en) 1995-06-07 1998-08-18 International Business Machines Corporation Direct chip attach circuit card
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JPH0982760A (ja) * 1995-07-07 1997-03-28 Toshiba Corp 半導体装置、半導体素子およびその半田接続部検査方法
US5874780A (en) * 1995-07-27 1999-02-23 Nec Corporation Method of mounting a semiconductor device to a substrate and a mounted structure
JPH09134934A (ja) * 1995-11-07 1997-05-20 Sumitomo Metal Ind Ltd 半導体パッケージ及び半導体装置
US6010769A (en) * 1995-11-17 2000-01-04 Kabushiki Kaisha Toshiba Multilayer wiring board and method for forming the same
US5611884A (en) 1995-12-11 1997-03-18 Dow Corning Corporation Flip chip silicone pressure sensitive conductive adhesive
KR100438256B1 (ko) * 1995-12-18 2004-08-25 마츠시타 덴끼 산교 가부시키가이샤 반도체장치 및 그 제조방법
JP3409957B2 (ja) 1996-03-06 2003-05-26 松下電器産業株式会社 半導体ユニット及びその形成方法
JP2891184B2 (ja) * 1996-06-13 1999-05-17 日本電気株式会社 半導体装置及びその製造方法
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Publication number Priority date Publication date Assignee Title
JPH0499040A (ja) * 1990-08-06 1992-03-31 Matsushita Electric Ind Co Ltd 半導体素子の実装方法および実装基板
JPH0831875A (ja) * 1994-07-18 1996-02-02 Sony Corp 部品実装方法
JPH0855874A (ja) * 1994-08-11 1996-02-27 Matsushita Electric Ind Co Ltd 半導体チップの接着方法

Also Published As

Publication number Publication date
KR19990087563A (ko) 1999-12-27
EP0951063A4 (OSRAM) 1999-10-20
EP1191578A3 (en) 2002-05-08
DE69722661D1 (de) 2003-07-10
WO1997033313A1 (en) 1997-09-12
US6452280B1 (en) 2002-09-17
EP0951063A1 (en) 1999-10-20
EP1191578A2 (en) 2002-03-27
CN1212786A (zh) 1999-03-31
JP2951882B2 (ja) 1999-09-20
CN1175480C (zh) 2004-11-10
EP0951063B1 (en) 2003-06-04
JPH09246320A (ja) 1997-09-19
DE69722661T2 (de) 2004-05-13

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