DE69722661D1 - Verfahren zur herstellung einer halbleitervorrichtung - Google Patents
Verfahren zur herstellung einer halbleitervorrichtungInfo
- Publication number
- DE69722661D1 DE69722661D1 DE69722661T DE69722661T DE69722661D1 DE 69722661 D1 DE69722661 D1 DE 69722661D1 DE 69722661 T DE69722661 T DE 69722661T DE 69722661 T DE69722661 T DE 69722661T DE 69722661 D1 DE69722661 D1 DE 69722661D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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- H01L2224/05644—Gold [Au] as principal constituent
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/05663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/05671—Chromium [Cr] as principal constituent
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1401—Structure
- H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2924/01079—Gold [Au]
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8049065A JP2951882B2 (ja) | 1996-03-06 | 1996-03-06 | 半導体装置の製造方法及びこれを用いて製造した半導体装置 |
JP4906596 | 1996-03-06 | ||
PCT/JP1997/000672 WO1997033313A1 (fr) | 1996-03-06 | 1997-03-05 | Dispositif a semi-conducteur et son procede de production |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69722661D1 true DE69722661D1 (de) | 2003-07-10 |
DE69722661T2 DE69722661T2 (de) | 2004-05-13 |
Family
ID=12820690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69722661T Expired - Fee Related DE69722661T2 (de) | 1996-03-06 | 1997-03-05 | Verfahren zur herstellung einer halbleitervorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6452280B1 (de) |
EP (2) | EP0951063B1 (de) |
JP (1) | JP2951882B2 (de) |
KR (1) | KR100300758B1 (de) |
CN (1) | CN1175480C (de) |
DE (1) | DE69722661T2 (de) |
WO (1) | WO1997033313A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001086716A1 (en) * | 2000-05-12 | 2001-11-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
US6940178B2 (en) * | 2001-02-27 | 2005-09-06 | Chippac, Inc. | Self-coplanarity bumping shape for flip chip |
TWI245395B (en) * | 2001-11-20 | 2005-12-11 | Advanced Semiconductor Eng | Multi-chip module package device |
CN100356559C (zh) * | 2003-09-24 | 2007-12-19 | 财团法人工业技术研究院 | 倒装芯片封装结构及其制造方法 |
TWI273664B (en) * | 2004-03-26 | 2007-02-11 | Advanced Semiconductor Eng | Bumping process, bump structure, packaging process and package structure |
KR100696190B1 (ko) * | 2004-12-14 | 2007-03-20 | 한국전자통신연구원 | 플립 칩 본딩방법 |
JP4325571B2 (ja) * | 2005-02-28 | 2009-09-02 | 株式会社日立製作所 | 電子装置の製造方法 |
TWI253697B (en) * | 2005-04-08 | 2006-04-21 | Phoenix Prec Technology Corp | Method for fabricating a flip chip package |
JP4765804B2 (ja) * | 2006-07-14 | 2011-09-07 | 株式会社デンソー | 半導体装置の製造方法 |
JP2008135719A (ja) * | 2006-10-31 | 2008-06-12 | Sanyo Electric Co Ltd | 半導体モジュール、半導体モジュールの製造方法および携帯機器 |
JP2008218643A (ja) * | 2007-03-02 | 2008-09-18 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US8309864B2 (en) * | 2008-01-31 | 2012-11-13 | Sanyo Electric Co., Ltd. | Device mounting board and manufacturing method therefor, and semiconductor module |
JP5028291B2 (ja) * | 2008-01-31 | 2012-09-19 | 三洋電機株式会社 | 素子搭載用基板、素子搭載用基板の製造方法、半導体モジュールおよび半導体モジュールの製造方法 |
JP5385004B2 (ja) * | 2009-05-22 | 2014-01-08 | 富士通テン株式会社 | 回路部品 |
JP6143104B2 (ja) * | 2012-12-05 | 2017-06-07 | 株式会社村田製作所 | バンプ付き電子部品及びバンプ付き電子部品の製造方法 |
KR102248876B1 (ko) * | 2014-12-24 | 2021-05-07 | 엘지디스플레이 주식회사 | 표시장치 어레이 기판 및 표시장치 |
Family Cites Families (50)
Publication number | Priority date | Publication date | Assignee | Title |
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DE296385C (de) | ||||
US4661192A (en) * | 1985-08-22 | 1987-04-28 | Motorola, Inc. | Low cost integrated circuit bonding process |
US4740657A (en) | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JPS6360540A (ja) | 1986-09-01 | 1988-03-16 | Seiko Epson Corp | 接続端子の製造方法 |
JPS63152135A (ja) | 1986-12-17 | 1988-06-24 | Hitachi Ltd | 半導体装置の製造方法 |
JPS63289824A (ja) * | 1987-05-21 | 1988-11-28 | Fuji Electric Co Ltd | 集積回路装置の実装方法 |
JPS647542A (en) | 1987-06-30 | 1989-01-11 | Toshiba Corp | Formation of bump |
JPH0793306B2 (ja) | 1987-08-05 | 1995-10-09 | 日本電装株式会社 | 半導体集積回路装置 |
US5014111A (en) * | 1987-12-08 | 1991-05-07 | Matsushita Electric Industrial Co., Ltd. | Electrical contact bump and a package provided with the same |
JP2541284B2 (ja) * | 1988-06-09 | 1996-10-09 | 富士通株式会社 | 半導体チップの実装方法 |
US5001542A (en) | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JPH02177546A (ja) * | 1988-12-28 | 1990-07-10 | Fujitsu Ltd | 半導体集積回路の製造方法 |
JPH03209831A (ja) * | 1990-01-12 | 1991-09-12 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP2764632B2 (ja) | 1990-04-09 | 1998-06-11 | イビデン株式会社 | 電子回路基板とその製造方法 |
JPH046841A (ja) * | 1990-04-24 | 1992-01-10 | Matsushita Electric Works Ltd | 半導体装置の実装構造 |
JPH0433348A (ja) * | 1990-05-29 | 1992-02-04 | Sharp Corp | 半導体装置 |
JP2881999B2 (ja) * | 1990-08-06 | 1999-04-12 | 松下電器産業株式会社 | 半導体素子の実装方法および実装基板 |
JPH04137541A (ja) | 1990-09-27 | 1992-05-12 | Sharp Corp | 突起電極の形成方法 |
JPH04137630A (ja) | 1990-09-28 | 1992-05-12 | Seiko Epson Corp | 半導体装置 |
JPH04144145A (ja) | 1990-10-04 | 1992-05-18 | Matsushita Electric Ind Co Ltd | 半導体装置の実装方法 |
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-
1996
- 1996-03-06 JP JP8049065A patent/JP2951882B2/ja not_active Expired - Fee Related
-
1997
- 1997-03-05 KR KR1019980707001A patent/KR100300758B1/ko not_active IP Right Cessation
- 1997-03-05 WO PCT/JP1997/000672 patent/WO1997033313A1/ja active IP Right Grant
- 1997-03-05 US US09/117,695 patent/US6452280B1/en not_active Expired - Lifetime
- 1997-03-05 EP EP97905446A patent/EP0951063B1/de not_active Expired - Lifetime
- 1997-03-05 DE DE69722661T patent/DE69722661T2/de not_active Expired - Fee Related
- 1997-03-05 EP EP01129307A patent/EP1191578A3/de not_active Ceased
- 1997-03-05 CN CNB971927987A patent/CN1175480C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR19990087563A (ko) | 1999-12-27 |
CN1175480C (zh) | 2004-11-10 |
JP2951882B2 (ja) | 1999-09-20 |
EP0951063A4 (de) | 1999-10-20 |
EP0951063B1 (de) | 2003-06-04 |
WO1997033313A1 (fr) | 1997-09-12 |
EP1191578A3 (de) | 2002-05-08 |
EP1191578A2 (de) | 2002-03-27 |
EP0951063A1 (de) | 1999-10-20 |
KR100300758B1 (ko) | 2001-11-02 |
CN1212786A (zh) | 1999-03-31 |
JPH09246320A (ja) | 1997-09-19 |
DE69722661T2 (de) | 2004-05-13 |
US6452280B1 (en) | 2002-09-17 |
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