KR100191975B1 - 얇은 가요성 전자 무선 주파수 태그 장치 - Google Patents

얇은 가요성 전자 무선 주파수 태그 장치 Download PDF

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KR100191975B1
KR100191975B1 KR1019950029181A KR19950029181A KR100191975B1 KR 100191975 B1 KR100191975 B1 KR 100191975B1 KR 1019950029181 A KR1019950029181 A KR 1019950029181A KR 19950029181 A KR19950029181 A KR 19950029181A KR 100191975 B1 KR100191975 B1 KR 100191975B1
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South Korea
Prior art keywords
radio frequency
chip
antenna
tag
frequency tag
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KR1019950029181A
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English (en)
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KR960012743A (ko
Inventor
앤드류 모스코위츠 폴
죤 브래디 마이클
윌리암 코터스 폴
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포만 제프리 엘
인터내셔널 비지네스 머신즈 코포레이션
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • H—ELECTRICITY
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Abstract

본 발명은 반도체 회로를 포함하는 신규하고 얇은 무선 주파수 태그에 관한 것으로, 이 반도체 회로는 로직, 메모리, 및 무선 주파수 회로를 가지며, 무선 주파수 태그는 크로스오버 없이 단일 배선 평면상에 배치된 안테나에 접속되어 있다. 팩키지의 요소(기판, 안테나, 및 적층된 커버)는 가요성이다. 팩키지의 요소는 모두 얇다. 이 태그는 얇고 가요성이어서, 신용카드, 여권, 입장권 및 우표에 무선 주파수 태그를 부착하는 것을 비롯한 독특한 범위에 이용할 수 있다.

Description

얇은 가요성 전자 무선 주파수 태그 장치
제1a도 및 제1b도는 종래기술의 두가지 전형적인 실시예의 단면도.
제2도는 본 발명의 얇은 무선 주파수 식별 태그의 하나의 바람직한 실시예의 단면을 도시하는 도면.
제3도는 기판내에 개구를 갖는 본 발명의 얇은 무선 주파수 식별 태그의 하나의 바람직한 실시예의 단면을 도시하는 도면.
제4도는 다이폴 안테나를 도시하는 얇은 태그의 평면도.
제5도는 하나 이상의 폴디드 다이폴 안테나를 갖는 얇은 태그의 평면도.
제6도는 회로내에 포함된 배터리를 갖는 얇은 태그의 평면도.
제7a도 내지 제7e도는 열압착 본딩(제7a도), 초음파 본딩(제7b도), C4 땜납 본딩(제7c도), 전도성 접착제본딩(제7d도) 및 스폿용접(제7e도)에 의하여 칩을 기판에 부착하는 종래기술의 단면을 나타낸 도면.
제8도는 우표로서 사용되는 얇은 태그를 나타낸 도면.
제9도는 공진 루프 안테나를 사용하는 것으로, 여권의 커버내에 설치된 얇은 태그를 나타낸 도면.
제10도는 입장권상에 사용되는 얇은 태그를 나타낸 도면.
제11도는 도난방지장치로서 사용되는 얇은 태그를 나타낸 도면.
제12도는 신용카드의 내측에 설치된 얇은 태그를 나타낸 도면.
제13도는 면허증의 내측에 설치된 얇은 태그를 나타낸 도면.
* 도면의 주요부분에 대한 부호의 설명
200, 300, 400, 500, 600, 810, 920, 1020, 1130, 1220, 1320 : 무선 주파수 식별 태그
210, 310, 410, 510, 610 : 칩
220, 320, 420, 520, 620 : 기판 225, 325 : 범프
222, 322, 425, 525, 625 : 접점
230, 330, 430, 530, 531, 630 : 안테나
270, 370 : 라미네이션(적층체) 340 : 밀봉재
315, 450, 550 : 윈도우 660 : 배터리
본 발명은 얇은 가요성 팩키지(a thin flexible package)내의 무선 주파수 회로 및 메모리(a radio frequency circuit and memory)에 관한 것으로, 특히 무선 주파수 태그(a radio frequency tag)로서 사용되는 얇은 가요성 무선 주파수 태그 장치에 관한 것이다.
무선 주파수 식별(Radio Frequency Identification: RFID)은 물체(objects)를 식별하기 위한 많은 식별기술(identification technologies)중의 하나이다. 무선 주파수 식별 시스템의 요부(heart)는 정보 전송 태그(an information carrying tag)에 있다. 이 태그는 베이스 스테이션(a base station)으로부터 수신된 부호화된 무선 주파수 신호(a coded RF signal)에 응답하여 작용을 한다. 전형적으로, 태그는 입사된 무선 주파수 캐리어(incident RF carrier)를 베이스 스테이션으로 다시 반사한다. 반사된 신호가 태그의 프로그램화된 정보 프로토콜(programmed informationi protocol)에 따라 태그에 의해 변조되면서 정보의 전송이 일어난다.
태그는 무선 주파수 회로(RF circuits), 로직(logic) 및 메모리(memory)를 갖는 반도체 칩(a semiconductor chip)으로 구성된다. 또한 태그는 안테나(an antenna), 종종 개별 소자의 집합체(a collection of discrete components), .캐패시터 및 다이오드, 예를 들면 능동 태그(active tags)의 경우 배터리, 소자 장착용 기판, 소자 사이의 상호접속부 및 물리적 밀폐수단을 갖는다. 태그의 일 종류인 수동 태그(passive tag)는 배터리를 갖지 않는다. 이들 수동태그는 태그를 호출하는데 사용되는 그들의 에너지를 상기 무선 주파수 신호로부터 도출한다. 일반적으로, 무선 주파수 식별 태그는 개별적인 소자를 회로 카드(a circuit card)에 장착하는 것에 의하여 제조된다. 이것은 보드(board)와 회로 소자(칩, 캐패시터, 다이오드, 안테나)의 사이에 짧은 와이어 본드 접속부(short wire bond connections)나 또는 납땜된 접속부(soldered connections)중 하나를 사용하는 것에 의하여 행해진다. 이 회로 카드는 에폭시-유리섬유 조성물(epoxy-fiberglass composition) 또는 세라믹으로 이루어질 수도 있다. 안테나는 일반적으로 회로카드에 납땜된 루프형 와이어이거나, 또는 회로 카드상에 에칭된 또는 도금된 금속으로 구성된다.
이 전체 조립체는 플라스틱 박스내에 밀폐될 수도 있고, 또는 3차원적인 플라스틱 팩키지(a three dimensional plastic package)내에 성형될 수도 있다
무선 주파수 식별기술의 응용예는 다른 식별기술, 예를 들면 바코드(bar code)만큼 널리 보급되어 있지 않지만, 이 무선 주파수 식별은 일부 분야, 그중에서도 특히 차량 식별에서 널리 보급되는 추세에 있다.
무선 주파수 식별기술의 발전은 고가의 태그, 대부분의 태그의 대형 용적(bulkiness), 및 태그의 감도와 범위의 문제에 의해서 억제되어 왔다. 전형적인 태그의 비용은 $5 내지 $10 이다.
회사들은 무선 주파수 식별기술의 적절한 용도(niche applications)에 주의를 집중하여 왔다. 어떤 종래 기술은 철도 유개화차(railway boxcars)를 식별하기 위하여 사용되고 있다 이러한 태그는 상당히 크고, 경질의 비가요성 케이싱내에 장착된 회로 기판상의 개별 소자로 제조된다 무선 주파수 태그는 요즈음에 자동식 통행료 징수 분야(automatic tol'1 industry), 예를들면 고속도로 및 교량 통행료 징수분야(thruway and bridge tolls)에 사용되고 있다. 무선 주파수 태그는 비접촉식 버스 요금 카드(contactless fare cards for buses)로서 사용하기 위하여 시험되고 있다. 직원 식별 배지(employee identification badges)와 보안 배지(security badges)가 제작되었다. 동물 식별 태그(animal identification tags)는 또한 상업적으로 구입가능하며, 마찬가지로 제조공정에서 부품을 추적하기 위한 무선 주파수 식별 시스템도 상업적으로 구입가능하다.
표준 신용 카드(a standard credit card)의 길이 및 폭을 갖는 태그가 존재한다. 그러나, 이 신용카드는1 전형적으로 그 두께가 2.5 mm 이상이고, 비가요성 케이싱(a non-flexible cabing)을 갖는다. 또한, 신용카드 크기의 길이 및 폭을 갖지만, 회로가 설치되는 돌출부(bumps)를 갖는 태그가 존재하는데, 이 돌출부는 태그의 두께를 두껍게 하여 태그가 카드. 판독기계(card reader machinery)내에 삽입될 수 없게 한다.
어떤 전자 제품 감시(e1ectronic article surveillance: EAS), 예를 들면 도난방지 장치(antitheft deifices)는 얇지만, 이 장치는 전형적으로 제한된 양(즉, 단 한 비트)의 정보를 포함한다. 이 장치중에는 한번 끄고 나면 다시 작동상태로 할 수 없는 것도 있다.
제1a도는 하나의 종래기술에 따른 무선 주파수 태그(105)의 구조체를 도시한 것이다. 이 태그(105)는 기판(115)상에 실장된 칩(110)을 갖는다. 이 칩은 와이어 본드(wire bonds)(125)를 통하여 기판(115)상의 회로(circuitry)에 접속된 접점(contacts)(120)을 갖는다. 밀봉재료(encapsulation material)(130)는 주변 보호를 위하여 칩을 덮는다. 이 태그(105)의 두께는 칩 소자들의 합산된 두께에 의하여 결정된다. 전형적으로, 이러한 태그에 있어서, 기판은 그 두께가 적어도 10mil(0.25 mm)이고, 본드의 높은 루프(high loop)(122)와 함께 칩(110)은 그 두께가 20 내지 40 mil(0.5 내지 1 mm)이며, 밀봉재료(130)는 그 두께가 약 10 mil(0.25mn)이다. 그 결과, 이러한 구조체의 태그(105)는 그 두께가 최소 40 mil(1 mm)로부터 60 mil(1, 5 mm)까지 변한다. 이러한 구조체는 많은 잠재적인 태그 용도용으로 사용하기에 너무 두껍다.
제1b도는 칩 접점(chip contacts)(120)이 전도성 접착제(conducting adhesive)(160)에 의해 회로 접점(circultry contacts)(155)에 접속되는 칩(110)을 갖는 다른 종래기술의 구조체(150)를 도시한 것이다 이 구조체(150)의 기판(165)은 전형적으로 FR4/인쇄회로 기판[두께 40 내지 60 mil(1 내지 1.5 mm)] 또는 가요성 기판[10 mil(0.25 mm)]으로서 제조된다. 칩(110)과 접착제(160)는 상기 두께를 20 내지 40 mil(0.5 내지 1 mm)만큼 증가시키며, 밀폐재료(130)는 상기 구조체(150)의 두께를 다시 10 내지 20 mil(0.25 내지 0.5 mm)만큼 증가시킨다. 따라서, 이 구조체는 두께가 80 내지 130 mil(2 내지 3.5 mm)이며, 그에 따라 제1a도의 구조체보다 더 두껍다.
또 다른 두꺼운 구조체도 당업계에 공지되어 있다. 이것들은 소자로서 쿼드 플랫 팩(quad flat pak: QFP) 및/또는 스몰 아웃라인 팩(small outline pak: SOP)을 구비한다. 이들 소자로 만든 구조체는 두께가 적어도 1 mm이며 통상은 2 내지 3 mm이다.
종래기술은 가요성 기판상에 얇은 무선 주파수 식별 태그를 제조할 필요성이 오랜동안 인식되어 왔음을 시사하고 있다. 그러나, 얇은 가요성 태그에 대한 목표가 소망되어 왔어도, 종래기술은 이 목표에 도달하지는 못했다. 하나의 종래기술의 문헌은 두께가 1.5 내지 2.0 mm인 태그를 개시하고 있다. 이 태그 두께는 이러한 태그의 적용을 제한한다. 예를 들면, 이 태그는 ISO 표준 신용카드 두께(0.76mm)보다 훨씬 더 두꺼우며, 따라서 신용카드 판독기내로 삽입되어야 할 신용카드에는 사용할 수 없다.
종래기술은 얇은 태그를 제조하는데 실패하였는 바, 그 이유는: 각 요소를 얇게 만드는데 주의를 기울이지 않았다는 점과; 요소들이 서로의 위에 적층된다는 점과, 안테나 및 접속 도선(connecting conductors)이 하나 이상의 전기 배선 평면(more than one plane of electrical wiring)을 필요로 한다는 점, 즉 설계상 상호 접속부(interconnections)를 완성하기 위하여 크로스오버(cross-overs)를 사용한다는 점 때문이다. 요소들이 적층되어 층들이 추가되기 때문에, 팩키지는 점차 더 두꺼워져서 가요성이 상실된다.
다른 종래기술의 문헌은 총 두께가 0.8 mm인 팩키지를 개시한다. 이것도 여전히 ISO 표준 신용카드 두께(0.76 mm)보다 두껍다. 더우기, 얇은 요소들이 개시되어 있지만, 전체적으로 가요성 재료를 사용하는데 주의를 기울이지 않고 있다.
소자들은 경질의 회로 카드(a hard circuit card)상에 장착되고 플라스틱으로 밀봉된다(경질이란 용어는 손으로 쉽게 찢을 수 없는 것을 말한다.) 그 결과, 강성의 팩키지(a rigid package)가 된다. 이 종래기술은 팩키지용으로 얇은 가요성 라미네이트(적층) 커버 재료(thin flexible laminate covering materials)를 사용하는 것을 개시하고 있지 않다. 그 결과, 팩키지는 두껍고 비가요성으로 된다.
본 발명의 목적은 개선된 얇은 무선 주파수 태그 장치를 제공하는데 있다.
본 발명의 목적은 얇은 가요성 보호 적층체를 갖는 가요성 무선 주파수 태그 장치를 제공하는데 있다.
본 발명의 목적은 ISO 표준 신용카드, 여권 커버, 우표, 도난방지 장치, 또는 입장권의 두께 제한내에 설치할 수도 있는 가요성 무선 주파수 태그 장치를 제공하는데 있다.
본 발명은 로직, 메모리 및 무선 주파수 회로를 갖는 반도체 회로를 포함하는 신규한 무선 주파수 태그를 제공한다. 이 반도체는 기판상에 장착되며, 또한 반도체상의 접속부(connections)에 의하여 그 반도체에 전기적으로 접속된 안테나를 통하여 무선 주파수 신호를 수신할 수 있다.
본 발명은 신규한 구조의 얇고 가요성인 무선 주파수 태그 설계를 제공한다.
이 태그는 크로스오버(교차) 없이 단일 배선 평면상에 설치된 안테나와 모든 상호 접속부를 갖는다. 팩키지의 요소는 서로 인접하게 배치된다. 즉 그들은 적층되지 않는다. 팩키지의 요소, 기판, 안테나 및 적층된 커버는 가요성이다. 이 요소들은 커버를 포함한 총 팩키지 두께가 ISO 표준 신용카드의 두께를 초과하지 않도록 모두 얇다. 그 결과, 신규한 방법으로 배열되고 접속된 얇은 가요성 소자로 이루어진 태그 팩키지도 역시 얇고 가요성을 갖는다. 따라서, 이것은 신용카드, 여권, 입장권 및 우표에 무선 주파수 식별 태그를 적용할 수 있는 새로운 범위의 응용을 가능케 한다.
제2도는 신규한 무선 주파수 식별 태그(200)의 측면도를 도시한 것이다.
칩(210)은 가요성 기판(220)위에 배치된다. 접점(222)상에 범프(접속선)(bumps)(225)를 갖는 칩(210)은 기판(220)상에 수용된 안테나(230)에 접합된다.
이 팩키지는 내측에 제공되는 EVA와 같은 열용융 접착제(a hot-melt adhesive)(250)와 외측에 제공되는 단단한 중합체성 재료(a tough polymeric material)의 외측 피막(an outer coating)(260)으로 구성된 얇은 가요성 적층체(thin flexible laminations)(270)에 의해 밀봉된다.
안테나는 기판의 일체부(an integral part)로서 제조된다. 이 안테나는 구리/유기성 라미네이트(적층체)(a copper/organic laminate)상에서 에칭되거나 또는 유기성 표면(organic surface)상에 도금되어 있는 전형적으로는 25 내지 35 미크론 두께의 얇은 구리선(copper lines)으로 구성될 것이다. 얇은 구리는 기판의 가요성(flexibility)을 유지한다. 유기성이고 전기도금되거나 또는 압연되고 어닐링된 구리(organic and electroplated or rolled annealed copper)용으로 사용되는 전형적인 재료는 폴리에스테르 또는 폴리이미드이다. 구리는 본딩(bonding)을 촉진하기 위하여 금 또는 주석으로 도금될 수도 있다. 이 칩은 칩상의 범프를 통해서 안테나 선에 접속되며, 이러한 범프는 열압착 본딩(thermocompression bonding)용 금도금 범프 또는 땜납 본딩(solder bonding)용 C4 땜납 범프(solder bump)가 바람직하다. 이 때, 범프(225)는 접속선(connecting lines)이 된다 이들은 단지 약 25미크론이기 때문에 회로(circuit)내헤 원하지 않는 인덕턴스(unwanted inductance)를 도입함에 의하여 전기적 성능(eletrical performance)을 저하시키지 않을 것이다. 신규한 설계(novel design)는 가요성 연속 필름(flexible continuous film)내에 비아(vias)를 갖지 않는 단일 금속층(a single metal layer)을 갖는다. 단지 한 레벨의 금속만을 사용하여 안테나와 상호접속부(innerconnectlons)를 형성하기 때문에, 팩키지(package)는 얇게 유지된다. 본 발명의 다른 신규사항은 소자(components)(칩, 안페나 및 가능하면 배터리)를 서로 인접하게 배열하는 것을 포함한다. 이 것은 소자들이 밀접해 있다는 것(즉, 적층되어 있지 않다는 것)을 의미한다. 더욱 바람직한 실시예에 있어서는, 회로내에 크로스오버(교차)(crossovers)를 사용하는 일 없이 칩(210)이 안테나(230)에 직접 접합되기 때문에 밀접성(closeness)이 보장된다. 이것은 접속용으로 크로스오버를 필요로 하는 다중 루프 안테나(a multiloop antenna)를 사용하는 것이 아니라, 공진이 되는 다이폴 안테나(a dipole antenna)나 또는 폴디드 다이폴 안테나(folded dipole antenna)를 사용함으로써 달성된다. 따라서 모든 배선은 단일 평면내에 배치된다.
또한, 안테나를 칩의 근방에 유지하고 크로스오버와 적층을 피하게 되므로, 팩키지를 얇게 유지하는데에도 도움이 된다.
팩키지를 얇게 유지하기 위하여, 칩은 얇게 가공함으로써 두께가 225 내지 375 미크론이 되도록 제조된다 일반적으로, 반도체는 두꺼운 웨이퍼상에서 1 mm까지의 두께로 제조된다. 두께를 얇게 하는 가공은 제조후 웨이퍼를 연마(polishing)하거나 그 배면을 연삭(backgrinding)하는 것에 의하여 행해질 수도 있다. 모든 요소 및 본드(all elements and bonds)는 대단히 얇다. 이 요소들은: 칩(및 사용되는 경우 배터리)은 그 두께가 10 내지 12 mil(250 내지 300 미크론)이거나 또는 그보다 얇으며, 본딩 구조체(bonding structures)는 2 mil(50 ㎛) 또는 그 이하이며; 적층 재료는 각 측면이 2 내지 4 mil(50 내지 125 ㎛)로 되어; 바람직하게는 약 20 mil(500 ㎛)이며 30 mil(750 ㎛) 미만의 총 두께를 형성하는 것이 바람직하다 본딩기구(bonding mechanisms)는 와이어본딩(wirebonding)과 비슷한 기법일 것이기 때문에 태그의 두께를 증가시키지 않는다.
하나의 바람직한 실시예에서는 요구되는 것이 아니지만, 신규한 가요성 커버재료(a unique flexible covering material)(270)가 팩키지의 한 측면 또는 양 측면상에 적층될 수도 있다. 다른 바람직한 실시예에 있어서, 상기 재료는 두 층(250, 260)으로 이루어진다. 에틸-비닐-아세테이트와 같은 연성 공중합체(a soft co-polymer)는 커버의 내측(250) 표면상에 위치된다. 단단한 폴리에스테르(touch polyester)는 외측(260) 표면상에 위치된다. 이러한 조합체는 환경적 보호(environmental protection)를 제공함과 아울러 팩키지의 가요성(flexibility)을 유지한다. 커버의 전형적인 두께는 50 내지 125 미크론이다. 변형예로서, 폴리에틸렌과 같은 단층의 라미네이트가 커버용으로 사용될 수도 있다.
제3도는 신규한 무선 주파수 식별 태그의 측면도를 도시한 것이다 접점(322)과 범프(접속선)(325)를 갖는 칩(310)은 기판(320)내의 윈도우(window)(315)를 통하여 안테나(330)에 접합된다. 더욱 바람직한 실시예에 있어서, 밀봉재(encapsulant)(340)는 칩(310) 뿐만 아니라, 기판(320) 사이의 윈도우(315)내에 위치된 안테나(330)에 접속되는 접점(322)상의 범프(325)를 주변노출로부터 보호하기 위하여 사용된다. 더욱 바람직한 실시예에 있어서, 팩키지는, 내측에 있는 EVA와 같은 열 용융 접착제(hot melt adhesive)(350)와 외측에 있는 단단한 중합체성 재료(a tough polymeric material)의 외측 피막(360)으로 구성된 얇은 가요성 적층체(370)에 의해 밀봉된다. 또다른 바람직한 실시예에 있어서, 충(370)은 유기 재료의 단일 층을 포함한다.
팩키지의 두께를 더욱 감소시키기 위하여, 기판은 칩이 내부로 삽입되는 것을 허용하는 윈도우를 갖도록 제조된다. 따라서, 기판의 두께는 칩의 두께에 추가되지 않는다. 이 윈도우는 에칭(etching)이나 펀칭(punching)에 의하여 유기 재료, 폴리이미드 또는 폴리에스테르내에 제조된다. 또한, 윈도우는 칩을 밀봉 재료의 얇은 층(a thln layer of encapsulation material)으로 피복하는 것을 허용하는데 사용될 수도 있다. 하이솔 에폭시(hyson epoxy) 4510 는 하나의 그러한 재료이다. 밀봉재는 아마도 50 미크론을 추가하겠지만 전체 팩키지 두께를 크게 추가하지 않고, 칩에 대한 부가적인 환경적 보호를 제공한다. 밀봉재의 불투명한 재료(opaque materials)는 칩상의 빛에 민감한 회로(light sensitive circuits)를 보호한다. 이 실시예에 있어서, 안테나 및 칩의 중심은 동일 평면상에 있을 수 있다.
제4도는 얇은 무선 주파수 식별 태그(400)의 평면도를 도시한 것이다. 이 칩(410)은 가요성 기판(420)내에 위치된 윈도우(450)내에 설치된다. 이 칩(410)은 가요성 기판(420)상에서 접점(425)에 접합되며, 이 접점(425)은 기판상에 수용된 다이폴 안테나(430)에 접속된다.
제5도는 얇은 무선 주파수 식별 태그(500)의 평면도를 도시한 것이다. 윈도우(550)내에 설치된 칩(510)은 가요성 기판(520)상에서 접점(525)에 접합되며, 이 접점(525)은 기판상에 수용된 하나 이상의 폴디드 다이폴 안테나(530, 531)에 접속된다.
제6도는 얇은 무선 주파수 식별 태그(600)의 평면도를 도시한 것이다. 반도체 칩(610)은 접점(625)을 통해서 폴디드 다이폴 안테나(630)에 접속된다. 이 안테나는 전술한 바와 같이 기판(620)내에 수용된다. 얇은 배터리(660)는 접점(625)에 접합된 도선(leads)(661, 662)에 의해서 칩(610)에 접속된다.
상기 배터리는 칩과 배터리의 사이에 전기적 연속성(electrical continuity)을 제공하는 짧은 접속선(661, 662)을 갖는다. 배터리는 칩에 인접하게 배치되지만, 칩위에 적층되지는 않는다. 약 0.25 mm의 배터리 두께는 배터리를 가요성으로 유지한다. 안테나도 또한 배터리에 인접하도록 설계된다. 이들간에 중첩(overlap)이 존재하지 않는다. 배선이 한 평면상에 유지되며, 모든 요소(칩, 배터리, 안테나)는 동일 평면상에 있고, 적층은 없다. 그 결파, 팩키지는 얇으며 가요성이다.
배터리를 종래의 무선 주파수 태그에 부착하기 위한 본딩 방법은 후술하는 몇가지 기법, 즉 납땜(soldering), 전도성 접착제(conducting adhesive), 및 와이어 본딩(wire bending)을 포함한다. 또한, 스폿 용접(spot welding)이 사용될 수도 있다. 이 스폿 용접에 있어서, 제7E 도에 도시한 바와 같이 배터리 접속 패드는 기판상의 접점에 가압됨과 동시에, 저-전압 고-전류 펄스(a low-voltage high-current pulse)는 이 두 금속들 함께 접합한다.
하나의 바람직한 실시예에 있어서, 배터리, 칩 및 기판에서의 야금술(metallurgies)은 배터리 부착 기구가 칩 부착 방법 및 기구와 일치하도록 되어 있다. 예를 들어, 칩의 접합을 가능하게 하는 기판상의 주석 도금(tin plating)을 사용함으로써, 배터리를 부착하는 전도성 접착제의 사용을 배제할 수도 있지만, 양자의 부착을 가능하게 하는 금 도금의 사용을 허용할 수도 있다.
얇은 가요성의 단단한 팩키지를 만들기 위해 사용되는 보다 바람직한 실시예 TAB(tape automated bonding) 기술에서 사용되는 열압착 본딩[thermocompression(TC) bonding]과 같은 튼튼한 칩 부착 기법(robust chip attach techniques)을 사용한다. 칩에 열압착 본딩을 사용하고 배터리에 스폿 용접을 사용하는 것은 배터리를 가요성 기판(620)에 부착하는 것을 가능케 하는 신규한 본딩 기법의 조합(a novel combination of bonding techniques)이다. 하나의 바람직한 실시예에 있어서, 기판은 TAB 폴리이미드 또는 폴리에스테르이다.
제7a도 내지 제7b도는 무선 주파수 태그를 제조할 때 기판상의 칩을 회로에 부착하기 위해 종래기술에서 사용되고 있는 상이한 유형의 본딩법을 도시한 것이다. 이들 본딩법에는 열압착 본딩(thermocompression), 초음파 단일점 본딩(ultrasonic single point.bonding), 납땜 및 전도성 접착제가 포함된다.
제7a도에 있어서, 열압착 본딩을 사용하여 적당한 금속 표면들은 서모드(thermode)(720)에 의해 가해진 압력(750) 및 열(740)에 의해 접촉하여, 금속-대-금속 접합(a metal-to-metal bond)(760), 보통은 칩(710)상의 금 범프(730) 대 하측 서모드(780)위에 있는 기판(705)상의 금 도금 도선(706)의 접합을 형성한다.
많은 도선은 일시에 접합1집단 접합(gang bonding)]된다. 이것은 릴-대-릴 TAB(reel-to-reel TAB)용으로 광범위하게 사용된다.
제7b도는 TAB 에 대한 열압착 본딩의 변형예, 즉 초음파 단일점 본딩을 도시하는 것으로, 이 변형예에서 일부 압력은 초음파 에너지로 대체된다. 한번에 하나의 접합이 행해진다. 이러한 본딩 유형은 또한 금-대-금 야금술(gold-to-gold metallurgy)을 요구한다. 본딩 팁(bonding tip)(751)은 압력(731) 및 초음파 에너지(741)를 인가함과 동시에, 도선(721)을 하측 지지부재(705)위에 있는 칩(711)상의 범프(725)에 대해 가압한다.
제7c도는, 소형 납/주석 땜납 범프(746)가 칩(716)과 기판(736)상의 패드(pads)(726)의 사이에서 접속 매체로서 사용되는 납땜 또는 C4 점납 본딩을 도시한 것이다. 기판이 오븐(786)내의 플랫폼(platform)(756)상에 놓여 있는 동안 용융(reflow)이 실행된다. 이것은 통상적으로 상승온도에서의 땜납의 용융을 위해 땜납 플럭스(solder flux)의 사용을 요구한다.
제7d도는 전도성 접착제본딩을 도시하는 것으로, 이 실시예에서 칩(714)상의 칩 패드(740)와 기판(734)상의 기판 패드(724)의 사이에 접속 매체를 형성하기 위하여 금속으로 충전된 접착제(a metal-filled adhesive)(744)가 가해진다.
서모드(764, 754) 사이의 압축에 의하여 열(774) 및 압력(784)이 인가된다.
제7e도는 스폿 용접을 도시하는 것으로, 이 실시예에서 갭(gap)(775)에 의해 분리된 용접 팁(welding tips)(755, 765)은 절연 기판(725)상에 배치된 전도체(735)와 접촉 유지되어 있는 전도체(745)에 가압된다. 전류(785)는 용접 팁(755, 765)을 가열하여 접합을 행한다.
제8도는 안테나(815), 배터리(820), 및 봉투(envelope) 또는 팩키지(840)에 부착된 칩(830)으로 구성된 얇은 무선 주파수 태그(810)를 포함하고 있는 무선 주파수 우표(800)를 도시한 것이다. 이 태그(810)는 전술한 실시예 중 어느 것일 수 있다. 이 응용예에 있어서, 태그용 커버[대표적으로 제2도의 참조부호(270) 및 제3도의 참조부호(370)]는 우표의 종이이다. 아크릴과 같은 접착제는 얇은 종이 사이에 태그를 협지하기 위하여 사용된다. 이 접착제는 제2도의 층(250) 및 제3도의 층(350)에 대응할 것이다. [일 측면(270, 370)의] 상면은 적절한 그래픽(graphics)을 갖도록 인쇄될 수 있는 한편, [태그가 양측상에 적층된 경우의 다른 측면(270, 377)의] 하면은 우표를 패키지 또는 편지 봉투에 부착하도록 감압(減壓)성 접착제, 또한 아크릴을 구비한다. 무선 주파수 태그는 우표가 부착된 편지 또는 소포를 추적하기 위하여 사용되는 우편물(mailing)에 대한 정보를 포함할 것이다. 변형예로서, 무선 주파수 태그(850)는 소포의 막(parcel membrane)내에 또는 봉투(840)의 벽내에 수용될 수 있을 것이다. 다른 실시예에 있어서, 무선 주파수 태그는 소포 또는 봉투내에 배치될 수 있을 것이다.
제9도는 여권(930)의 커버(910)내에 매설되어 무선 주파수 여권(900)을 형성하는 얇은 무선 주파수 태그(920)를 도시한 것이다. 여기에서 태그는 여권의 종이 커버 사이에 협지된다. 이 태그는 전술한 바와 같이 주변 라미네이트(적층체)[environmental laminate(5)](270, 370)를 가질 수 있거나, 그 변형예로서 여권커버가 태그 라미네이트(270, 370)로서 사용될 수 있다. 이 태그는 그것의 메모리내에 여권 소유자의 신분증명, 비자, 입국일(dates of entry), 제한사항에 대한 정보 또는 기타 다른 소망하는 정보를 포함한다. 이 정보는 보안성을 추가하기 위하여 암호화된 형태(encrypted form)로 될 수도 있다.
암호화 열쇠(key)는 여권을 발행하는 기관(agency)에 의해 단독으로 소유되어 사용되는 소프트웨어 코드일 것이다. 암호해독의 열쇠(deencryption key)는 일반용으로 만들어져서 공중 암호해독 열쇠(a public deencryption key)를 갖고 있는 사람이라면 누구나 태그의 메모리내의 정보를 판독할 수 있으나, 암호화 열쇠를 갖는 기관만이 태그에 정보를 기록할 수 있다.
제10도는 무선 주파수 태그(1020)를 포함하는 입장권(1010)을 도시한 것이다. 이 태그는 종이 커버 또는 다른 라미네이트 사이에 밀폐된다. 이 입장권은 단순한 입장권, 또는 비행기표나 식량표(a food stamp)와 같은 권한부여증(entitlement)일 수도 있다. 그러나, 이 태그 부착 티켓은 추적장치로서의 역할을 할 수도 있다.
제11도는 박스(1120)내에 넣어진 CD(1140)를 도시하는 것으로, 이 박스(1120)는 그것에 부착된 무선 주파수 식별 도난방지 태그(1130)를 갖고 있다. 이 태그는 바코드 대체, 물품 명세서 장치(inventory device), POS 장치(point of sale device) 및 도난방지 장치로서 역할을 한다. 제품 종류(product variety), 가격, 제조일 및 판매(sale)에 대한 정보가 태그에 들어 있다. 회로의 메모리내의 추가 비트 정보는 제품이 상점으로부터 판매되는 것을 표시하도록 판매시에 변화될 수도 있다.
제12도는 무선 주파수 태그(1220)를 포함하는 ISO 표준 신용카드(1210)를 도시한 것이다. 이 신용카드는 AT? 카드, 상객 항공권 카드(frequent flyer card), 도서관 카드(library card), 전화카드(phone card), 직원 식별 카드(employee ID), 가솔린 신용 카드(gasoline credit card) 또는 기타 신용 또는 캐시 카드(any credit or deait card)로서 역할을 할 수도 있다. 태그의 커버[라미네이트(270, 370)]는 신용카드의 커버, 바람직하게는 PVC 적층체일 수 있다. 두께가 0.5 mm인 신용카드의 코어(core)는 제조시 그 내에 배치된 윈도우를 갖는다.
이 0.5 mm 두께의 태그 팩키지는 윈도우내에 배치된 다음, 카드내에 밀봉된다. 그 결과로 형성된 태그를 포함하는 신용카드는 ISO 표준을 충족시키는 길이 및 폭을 가질 뿐만 아니라 두께도 가질 것이다.
제13 도에 도시한 본 발명의 다른 실시예에 있어서, 무선 주파수 태그(1320)는 전술한 것과 동일한 방식으로 자동차 운전면허증(a vehicular drivers licence)(1310)내에 배치된다. 이것은 무선 주파수 태그의 정보가 신분증명, 운전 기록, 장기 기증 정보(organ donor information), 제한 사항(restrictions), 신원 증명(proof of identity) 및 나이 등의 용으로 사용될 수 있게 한다. 이 정보는 보안 목적으로 암호화될 수 있다.

Claims (29)

  1. 얇은 가요성 전자 무선 주파수 태그 장치(a thin flexible electronic radio frequency tag apparatus)에 있어서, a. 절연 가요성 기판(an insulating, flexible substrate)과; b. 상기 기판의 일체부이고 단자(terminals)를 갖는 안테나와; c. 변조 회로(modulator circuit), 로직 회로, 메모리 회로 및 칩 접속기(chip connectors)를 가지며, 상기 안테나에 근접하게 상기 기판상에 있는 회로 칩과, d. 상기 안테나 단자와 상기 칩 접속기의 사이에 놓여 있고, 상기 안테나 단자와 상기 칩 접속기 사이에 높이가 높은 루프(high loop) 없이 실질적인 직접 경로를 제공하는 하나 또는 그 이상의 접속선을 포함하며, e. 상기 기판, 상기 안테나 및 상기 회로 칩은, 안테나 커플링에 의해 통신하는 얇은 가요성 전자 무선 주파수 태그를 구성하는 팩키지의 일부를 이루는 얇은 가요성 전자 무선 주파수 태그 장치.
  2. 제1항에 있어서, 상기 기판은 상기 칩이 배치되는 개구(an aperture)를 갖는 얇은 가요성 전자 무선 주파수 태그 장치.
  3. 제1항에 있어서, 상기 칩은 밀봉재(an encapsulant)에 의해 덮히는 얇은 가요성 전자 무선 주파수 태그 장치.
  4. 제3항에 있어서, 상기 밀봉재는 불투명한 얇은 가요성 전자 무선 주파수 태그 장치.
  5. 제3항에 있어서, 유기성 커버(an organic cover)가 상기 칩, 상기 밀봉재, 상기 기판 및 상기 안테나를 둘러싸는 얇은 가요성 전자 무선 주파수 태그 장치.
  6. 제1항에 있어서, 상기 태그 장치는 하나 또는 그 이상의 층에 의해 적층된 얇은 가요성 전자 무선 주파수 태그 장치.
  7. 제6항에 있어서, 상기 태그 장치는 경질의 외층(a hard outer layer)과 접착제내층(an adhesive Inner layer)을 포함하는 두층의 라미네이트(a two layer laminate)에 의 해 적층된 얇은 가요성 전자 무선 주파수 태그 장치.
  8. 제6항에 있어서, 상기 태그 장치는 일 측면이 적층되어 있는 얇은 가요성 전자 무선 주파수 태그 장치.
  9. 제6항에 있어서, 상기 태그 장치는 양 측면이 적층되어 있는 쟈은 가요성 전자 무선 주파수 태그 장치.
  10. 제9항에 있어서, 상기 외층은 폴리에스테르, 마일라, 폴리이미드 및 폴리에틸렌을 포함하는 재료중 하나인 얇은 가요성 전자 무선 주파수 태그 장치.
  11. 제7항에 있어서, 상기 접착제는 에틸 비닐 아세테이트(ethyl vinyl acetate : EVA), 페놀 부티랄(phenolic butyral), 실리콘 접착제(silicone adhesive) 등을 포함하는 재료중 하나인 얇은 가요성 전자 무선 주파수 태그 장치.
  12. 제1항에 있어서, 상기 안테나는 공진 안테나(a resonant antenna)이고, 폴디드 다이폴(folded dipole), 반파장 다이폴(half-wave dipole) 및 루프(loop)를 포함하는 구조체중 어느 하나인 얇은 가요성 전자 무선 주파수 태그 장치.
  13. 제1항에 있어서, 배터리가 상기 안테나 및 칩에 근접하게 상기 기판에 부착되고 또한 하나 또는 그 이상의 배터리 접속선에 의해 두개 또는 그 이상의 칩 배터리 접점(two or more chip battery contacts)에 접속되며, 상기 배터리 접속선과 상기 배터리 접점은 상기 안테나 및 접속선과 동일 평면에 있는 얇은 가요성 전자 무선 주파수 태그 장치.
  14. 제13항에 있어서, 상기 배터리 접점은 스폿 용접(spot welding), 납땜(soldering), 열압착 본딩(thermocompression bonding) 및 전도성 접착제(conducting adhesive)를 포함하는 본딩 유형중 어느 하나에 의해 상기 배터리 접속선에 접속되는 얇은 가요성 전자 무선 주파수 태그 장치.
  15. 제13항에 있어서, 상기 배터리 접점은 스폿 용접에 의해 접속되고, 상기 침 접점은 열압착 본딩에 의해 상기 안테나에 접속되는 얇은 가요성 전자 주파수 태그 장치.
  16. 제1항에 있어서, 상기 칩은 300 미크론(12 mil) 미만의 적어도 하나의 칩 치수를 가지며, 상기 안테나는 35 미크론(1.4 mil) 미만의 적어도 하나의 안테나 치수를 가지며, 상기 기판은 125 미크론(5 mil) 미만의 적어도 하나의 기판 치수를 구비하여, 상기 태그 장치는 508 미트론(20 mil) 미만의 적어도 하나의 치수를 갖게 되는 얇은 가요성 전자 무선 주파수 태그 장치.
  17. 제16항에 있어서, 상기 칩 메모리는 우편물(mailing)에 대한 정보를 가지며, 상기 태그는 우송되는 편지 또는 소포(a mailed letter or parcel)에 부착되는 얇은 가요성 전자 무선 주파수 태그 장치.
  18. 제17항에 있어서, 상기 무선 주파수 태그(RF tag)는 우표(a stamp)내에 수용되는 얇은 가요성 전자 무선 주파수 태그 장치.
  19. 제17항에 있어서, 상기 무선 주파수 태그는 상기 소포 또는 봉투의 막(membrane)내에 수용되는 얇은 가요성 전자 무선 주파수 태그 장치.
  20. 제16항에 있어서, 상기 무선 주파수 태그는 여권(a passport)내에 수용되는 얇은 가요성 전자 무선 주파수 태그 장치.
  21. 제16항에 있어서, 상기 무선 주파수 태그는 입장권(an admission ticket)내에 수용되는 얇은 가요성 전자 무선 주파수 태그 장치.
  22. 제16항에 있어서, 상기 태그는 제품(an article)내에 수용되고, 상기 무선 주파수 태그는 도난을 방지하기 위한 정보를 한는 얇은 가요성 전자 무선 주파수 태그 장치.
  23. 제6항에 있어서, 상기 태그는 760 미크론(30 mil) 미만의 적어도 하나의 태그 치수를 갖는 얇은 가요성 전자 무선 주파수 태그 장치.
  24. 제23항에 있어서, 상기 태그는 ISO 표준 신용카드 크기의 팩키지(an ISO standard credit card size package)로서 밀봉되는 얇은 가요성 전자 무선 주파수 태그 장치.
  25. 제16항에 있어서, 상기 무선 주파수 태그는 운전 면허증(a drivers license)내에 수용되는 얇은 가요성 전자 무선 주파수 태그 장치.
  26. 제1항에 있어서, 상기 안테나 단자는 크로스오버(crossovers) 없이 상기 칩 접속기에 접속되는 얇은 가요성 전자 무선 주파수 태그 장치.
  27. 제1항 또는 제26항에 있어서, 상기 접속선은 상기 안테나 단자와 상기 칩 접속기 사이에 고체 금속 경로를 제공하는 얇은 가요성 전자 무선 주파수 태그 장치.
  28. 제1항 또는 제26항에 있어서, 상기 안테나 단자와 상기 칩 접속기 사이의 경로는 원하지 않는 인덕턴스의 도입을 방지하도록 비교적 짧은 길이를 갖는 얇은 가요성 전자 무선 주파수 태그 장치.
  29. 제1항 또는 제26항에 있어서, 상기 기판의 한 표면만이 배선을 갖는 얇은 가요성 전자 무선 주파수 태그 장치.
KR1019950029181A 1994-09-09 1995-09-06 얇은 가요성 전자 무선 주파수 태그 장치 KR100191975B1 (ko)

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US08/303,977 1994-09-09
US8/303,977 1994-09-09
US08/303,977 US5528222A (en) 1994-09-09 1994-09-09 Radio frequency circuit and memory in thin flexible package

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KR100191975B1 true KR100191975B1 (ko) 1999-06-15

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100437007B1 (ko) * 1998-09-11 2004-06-23 모토로라 인코포레이티드 무선 주파수 식별 태그 장치 및 관련 방법
KR101038493B1 (ko) * 2004-11-12 2011-06-01 삼성테크윈 주식회사 극초단파용 라디오 주파수 인식태그 제조방법
US8223531B2 (en) 2004-10-18 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of the same
KR101328152B1 (ko) 2004-07-14 2013-11-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 무선 프로세서, 무선 메모리, 정보 처리 시스템, 및반도체장치

Families Citing this family (699)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2125786C (fr) * 1991-12-19 2007-07-31 Ake Gustafson Dispositif de scellement de securite
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US6422476B1 (en) 1993-11-05 2002-07-23 Intermec Ip Corp. Method, apparatus and character set for encoding and decoding data characters in data carriers, such as RFID tags
US6321986B1 (en) 1993-11-05 2001-11-27 Intermec Ip Corporation Robust machine-readable symbology and method and apparatus for printing and reading same
US5841978A (en) 1993-11-18 1998-11-24 Digimarc Corporation Network linking method using steganographically embedded data objects
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
US6771981B1 (en) 2000-08-02 2004-08-03 Nokia Mobile Phones Ltd. Electronic device cover with embedded radio frequency (RF) transponder and methods of using same
FI99071C (fi) * 1995-02-15 1997-09-25 Nokia Mobile Phones Ltd Menetelmä sovellusten käyttämiseksi matkaviestimessä ja matkaviestin
US6329139B1 (en) 1995-04-25 2001-12-11 Discovery Partners International Automated sorting system for matrices with memory
US7805500B2 (en) * 1995-05-08 2010-09-28 Digimarc Corporation Network linking methods and apparatus
CA2176625C (en) * 1995-05-19 2008-07-15 Donald Harold Fergusen Radio frequency identification tag
US6496382B1 (en) 1995-05-19 2002-12-17 Kasten Chase Applied Research Limited Radio frequency identification tag
US7002475B2 (en) * 1997-12-31 2006-02-21 Intermec Ip Corp. Combination radio frequency identification transponder (RFID tag) and magnetic electronic article surveillance (EAS) tag
US5939984A (en) * 1997-12-31 1999-08-17 Intermec Ip Corp. Combination radio frequency transponder (RF Tag) and magnetic electronic article surveillance (EAS) material
US5640002A (en) * 1995-08-15 1997-06-17 Ruppert; Jonathan Paul Portable RF ID tag and barcode reader
GB2305075A (en) * 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
US6075441A (en) 1996-09-05 2000-06-13 Key-Trak, Inc. Inventoriable-object control and tracking system
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
US6371375B1 (en) 1995-09-25 2002-04-16 Intermec Ip Corp. Method and apparatus for associating data with a wireless memory device
US6411213B1 (en) 1995-10-11 2002-06-25 Motorola, Inc. Radio frequency identification tag system using tags arranged for coupling to ground
US6040773A (en) * 1995-10-11 2000-03-21 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6496112B1 (en) 1998-02-27 2002-12-17 Motorola, Inc. Radio frequency identification tag with a programmable circuit state
US6611199B1 (en) 1995-10-11 2003-08-26 Motorola, Inc. Capacitively powered portable communication device and associated exciter/reader and related method
US6404339B1 (en) 1995-10-11 2002-06-11 Motorola, Inc. Radio frequency identification tag arranged with a printable display
US6252508B1 (en) 1995-10-11 2001-06-26 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6580369B1 (en) 1995-10-11 2003-06-17 Motorola, Inc. Electronic tag assembly and method therefor
AU2155697A (en) * 1996-03-14 1997-10-01 Pav Card Gmbh Smart card, connection arrangement and method of producing smart card
US5786626A (en) * 1996-03-25 1998-07-28 Ibm Corporation Thin radio frequency transponder with leadframe antenna structure
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
US5654693A (en) * 1996-04-10 1997-08-05 X-Cyte, Inc. Layered structure for a transponder tag
US6130602A (en) * 1996-05-13 2000-10-10 Micron Technology, Inc. Radio frequency data communications device
US5821859A (en) * 1996-06-07 1998-10-13 Ibm Corporation Concealed magnetic ID code and antitheft tag
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
NL1003802C1 (nl) * 1996-07-24 1998-01-28 Chiptec International Ltd Identiteitsbewijs en identificatiesysteem bestemd voor toepassing daarmee.
EP0920676B1 (de) * 1996-08-22 2001-11-21 PAV Card GmbH Verfahren zur herstellung einer elektrischen und mechanischen verbindung eines moduls in einer ausnehmung eines kartenkörpers
US6111506A (en) * 1996-10-15 2000-08-29 Iris Corporation Berhad Method of making an improved security identification document including contactless communication insert unit
DE19753619A1 (de) * 1997-10-29 1999-05-06 Meto International Gmbh Identifizierungselement und Verfahren zu seiner Herstellung
US7751596B2 (en) 1996-11-12 2010-07-06 Digimarc Corporation Methods and arrangements employing digital content items
NO965015D0 (no) * 1996-11-25 1996-11-25 Security Signs & Service As Sikkerhets- og varslingsanordning for nökler/nökkelkort
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
DE19701167A1 (de) * 1997-01-15 1998-07-23 Siemens Ag Chipkarte
US6028564A (en) * 1997-01-29 2000-02-22 Intermec Ip Corp. Wire antenna with optimized impedance for connecting to a circuit
US6097347A (en) * 1997-01-29 2000-08-01 Intermec Ip Corp. Wire antenna with stubs to optimize impedance for connecting to a circuit
FR2761527B1 (fr) * 1997-03-25 1999-06-04 Gemplus Card Int Procede de fabrication de carte sans contact avec connexion d'antenne par fils soudes
DE19716342C2 (de) * 1997-04-18 1999-02-25 Pav Card Gmbh Verfahren zur Herstellung einer Chipkarte
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
DE19861367B4 (de) * 1997-05-01 2009-11-05 Micron Technology Inc. Hochfrequenz-Identifikationsvorrichtung und Verfahren zu ihrer Herstellung
US6057779A (en) 1997-08-14 2000-05-02 Micron Technology, Inc. Method of controlling access to a movable container and to a compartment of a vehicle, and a secure cargo transportation system
US5955949A (en) * 1997-08-18 1999-09-21 X-Cyte, Inc. Layered structure for a transponder tag
US6980085B1 (en) * 1997-08-18 2005-12-27 Micron Technology, Inc. Wireless communication devices and methods of forming and operating the same
WO1999008596A1 (en) * 1997-08-19 1999-02-25 Philipp Lang Measurement of capillary related interstitial fluid using ultrasound methods and devices
US6339385B1 (en) * 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
WO1999013444A1 (en) * 1997-09-11 1999-03-18 Precision Dynamics Corporation Laminated radio frequency identification device
US5982284A (en) * 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
FR2769109B1 (fr) * 1997-09-26 1999-11-19 Gemplus Sca Dispositif electronique a puce jetable et procede de fabrication
FR2769440B1 (fr) * 1997-10-03 1999-12-03 Gemplus Card Int Procede pour la fabrication d'un dispositif electronique a puce et/ou a antenne et dispositif obtenu par le procede
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US5973599A (en) * 1997-10-15 1999-10-26 Escort Memory Systems High temperature RFID tag
US6177859B1 (en) 1997-10-21 2001-01-23 Micron Technology, Inc. Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus
US6164551A (en) * 1997-10-29 2000-12-26 Meto International Gmbh Radio frequency identification transponder having non-encapsulated IC chip
US20020180605A1 (en) * 1997-11-11 2002-12-05 Ozguz Volkan H. Wearable biomonitor with flexible thinned integrated circuit
US7786562B2 (en) * 1997-11-11 2010-08-31 Volkan Ozguz Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
US6043745A (en) * 1997-11-13 2000-03-28 Micron Technology, Inc. Electronic devices and methods of forming electronic devices
US7844505B1 (en) 1997-11-21 2010-11-30 Symbol Technologies, Inc. Automated real-time distributed tag reader network
US7035818B1 (en) * 1997-11-21 2006-04-25 Symbol Technologies, Inc. System and method for electronic inventory
US6002344A (en) * 1997-11-21 1999-12-14 Bandy; William R. System and method for electronic inventory
US6268796B1 (en) * 1997-12-12 2001-07-31 Alfred Gnadinger Radio frequency identification transponder having integrated antenna
US5898370A (en) * 1997-12-16 1999-04-27 At&T Corp Security monitoring system and method
FR2772529B1 (fr) * 1997-12-17 2000-02-04 Smurfit Worldwide Research Eur Subsrat muni d'un dispositif electronique
US6343019B1 (en) 1997-12-22 2002-01-29 Micron Technology, Inc. Apparatus and method of stacking die on a substrate
US6329915B1 (en) * 1997-12-31 2001-12-11 Intermec Ip Corp RF Tag having high dielectric constant material
US6177872B1 (en) 1998-03-13 2001-01-23 Intermec Ip Corp. Distributed impedance matching circuit for high reflection coefficient load
US6281794B1 (en) 1998-01-02 2001-08-28 Intermec Ip Corp. Radio frequency transponder with improved read distance
US6249227B1 (en) 1998-01-05 2001-06-19 Intermec Ip Corp. RFID integrated in electronic assets
US6104291A (en) * 1998-01-09 2000-08-15 Intermec Ip Corp. Method and apparatus for testing RFID tags
US6593845B1 (en) 1998-01-09 2003-07-15 Intermac Ip Corp. Active RF tag with wake-up circuit to prolong battery life
GB2333207B (en) * 1998-01-09 2003-06-11 Peter George Milton Monitoring reels of paper for use on printing presses
US6019865A (en) * 1998-01-21 2000-02-01 Moore U.S.A. Inc. Method of forming labels containing transponders
IL123028A (en) * 1998-01-22 2007-09-20 Nds Ltd Protection of data on media recording disks
US6061036A (en) * 1998-02-03 2000-05-09 Ericsson, Inc. Rigid and flexible antenna
US6356535B1 (en) * 1998-02-04 2002-03-12 Micron Technology, Inc. Communication systems and methods of communicating
US6441740B1 (en) 1998-02-27 2002-08-27 Intermec Ip Corp. Radio frequency identification transponder having a reflector
US6094138A (en) * 1998-02-27 2000-07-25 Motorola, Inc. Integrated circuit assembly and method of assembly
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
US6639509B1 (en) 1998-03-16 2003-10-28 Intermec Ip Corp. System and method for communicating with an RFID transponder with reduced noise and interference
US6320509B1 (en) 1998-03-16 2001-11-20 Intermec Ip Corp. Radio frequency identification transponder having a high gain antenna configuration
US6362738B1 (en) 1998-04-16 2002-03-26 Motorola, Inc. Reader for use in a radio frequency identification system and method thereof
US6282407B1 (en) 1998-04-16 2001-08-28 Motorola, Inc. Active electrostatic transceiver and communicating system
US6107921A (en) 1998-04-16 2000-08-22 Motorola, Inc. Conveyor bed with openings for capacitive coupled readers
US6275681B1 (en) 1998-04-16 2001-08-14 Motorola, Inc. Wireless electrostatic charging and communicating system
NL1008929C2 (nl) * 1998-04-20 1999-10-21 Vhp Ugchelen Bv Uit papier vervaardigd substraat voorzien van een geïntegreerde schakeling.
US6459726B1 (en) * 1998-04-24 2002-10-01 Micron Technology, Inc. Backscatter interrogators, communication systems and backscatter communication methods
US6121878A (en) * 1998-05-01 2000-09-19 Intermec Ip Corp. System for controlling assets
US6154137A (en) * 1998-06-08 2000-11-28 3M Innovative Properties Company Identification tag with enhanced security
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6130613A (en) * 1998-06-09 2000-10-10 Motorola, Inc. Radio frequency indentification stamp and radio frequency indentification mailing label
US6246327B1 (en) 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
US6091332A (en) * 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
US6724895B1 (en) 1998-06-18 2004-04-20 Supersensor (Proprietary) Limited Electronic identification system and method with source authenticity verification
US6161761A (en) * 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
US6031459A (en) * 1998-07-22 2000-02-29 Micron Technology, Inc. Wireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devices
US6251211B1 (en) 1998-07-22 2001-06-26 Micron Technology, Inc. Circuitry interconnection method
AU758692B2 (en) † 1998-07-27 2003-03-27 Joergen Brosow Security paper, method and device for checking the authenticity of documents recorded thereon
DE19834515C1 (de) * 1998-07-31 2000-03-16 Deutsche Telekom Ag Elektronische Erkennungsmarke
EP1145189B1 (en) 1998-08-14 2008-05-07 3M Innovative Properties Company Radio frequency identification systems applications
EP1862982B1 (en) 1998-08-14 2014-11-19 3M Innovative Properties Company Method of interrogating a package bearing an RFID tag
US6424262B2 (en) 1998-08-14 2002-07-23 3M Innovative Properties Company Applications for radio frequency identification systems
CN1312928A (zh) 1998-08-14 2001-09-12 3M创新有限公司 射频识别系统的应用
US6494562B1 (en) * 1998-09-03 2002-12-17 Hewlett-Packard Company Method and apparatus for identifying a sales channel
DE19840226B4 (de) * 1998-09-03 2006-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen eines Schaltungschips auf einen Träger
US6195005B1 (en) 1998-09-11 2001-02-27 Key-Trak, Inc. Object carriers for an object control and tracking system
AU5704499A (en) * 1998-09-11 2000-04-03 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
US5986562A (en) * 1998-09-11 1999-11-16 Brady Worldwide, Inc. RFID tag holder for non-RFID tag
US6427913B1 (en) 1998-09-11 2002-08-06 Key-Trak, Inc. Object control and tracking system with zonal transition detection
US6147605A (en) * 1998-09-11 2000-11-14 Motorola, Inc. Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
US6204764B1 (en) 1998-09-11 2001-03-20 Key-Trak, Inc. Object tracking system with non-contact object detection and identification
US6891473B2 (en) * 1998-09-11 2005-05-10 Key-Trak, Inc. Object carriers and lighted tags for an object control and tracking system
US6232876B1 (en) * 1998-09-11 2001-05-15 Key-Trak, Inc. Mobile object tracking system
US6262664B1 (en) 1998-09-11 2001-07-17 Key-Trak, Inc. Tamper detection prevention for an object control and tracking system
US8228193B1 (en) * 1998-09-14 2012-07-24 Tuemer Tuemay O Tag having a semiconductor chip and method of attachment to article
WO2000021031A1 (en) * 1998-10-06 2000-04-13 Intermec Ip Corp. Rfid tag having dipole over ground plane antenna
DE19847088A1 (de) * 1998-10-13 2000-05-18 Ksw Microtec Ges Fuer Angewand Flächig ausgebildeter Träger für Halbleiter-Chips und Verfahren zu seiner Herstellung
US6114962A (en) * 1998-10-15 2000-09-05 Intermec Ip Corp. RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto
US6147604A (en) * 1998-10-15 2000-11-14 Intermec Ip Corporation Wireless memory device
US6201474B1 (en) * 1998-10-21 2001-03-13 Intermec Ip Corp. Magnetic tape storage media having RFID transponders
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6285342B1 (en) 1998-10-30 2001-09-04 Intermec Ip Corp. Radio frequency tag with miniaturized resonant antenna
DE19850353C1 (de) * 1998-11-02 2000-03-16 David Finn Identifikationslabel sowie Verfahren zur Herstellung eines Indentifikationslabels
US6236223B1 (en) 1998-11-09 2001-05-22 Intermec Ip Corp. Method and apparatus for wireless radio frequency testing of RFID integrated circuits
JP3864701B2 (ja) * 1998-11-30 2007-01-10 株式会社日立製作所 電子回路チップの装着方法
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6531964B1 (en) 1999-02-25 2003-03-11 Motorola, Inc. Passive remote control system
US7749089B1 (en) 1999-02-26 2010-07-06 Creative Kingdoms, Llc Multi-media interactive play system
US10973397B2 (en) 1999-03-01 2021-04-13 West View Research, Llc Computerized information collection and processing apparatus
US8636648B2 (en) 1999-03-01 2014-01-28 West View Research, Llc Endoscopic smart probe
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
EP1039543B1 (en) * 1999-03-24 2014-02-26 Motorola Solutions, Inc. Circuit chip connector and method of connecting a circuit chip
CA2366540A1 (en) * 1999-04-14 2000-10-19 Baruch Levanon Functionally improved battery and method of making same
US6302527B1 (en) 1999-04-20 2001-10-16 Hewlett-Packard Company Method and apparatus for transferring information between a printer portion and a replaceable printing component
DE19920593B4 (de) 1999-05-05 2006-07-13 Assa Abloy Identification Technology Group Ab Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls
JP3517374B2 (ja) * 1999-05-21 2004-04-12 新光電気工業株式会社 非接触型ｉｃカードの製造方法
US8065155B1 (en) 1999-06-10 2011-11-22 Gazdzinski Robert F Adaptive advertising apparatus and methods
US8585852B2 (en) * 1999-06-16 2013-11-19 Vanguard Identification Systems, Inc. Methods of making printed planar radio frequency identification elements
US8654018B2 (en) * 2005-04-06 2014-02-18 Vanguard Identificaiton Systems, Inc. Printed planar RFID element wristbands and like personal identification devices
US8636220B2 (en) * 2006-12-29 2014-01-28 Vanguard Identification Systems, Inc. Printed planar RFID element wristbands and like personal identification devices
WO2001003188A1 (en) * 1999-07-01 2001-01-11 Intermec Ip Corp. Integrated circuit attachment process and apparatus
US7212112B2 (en) * 1999-07-21 2007-05-01 Dow Agrosciences Llc Detection and control of pests
WO2001006851A1 (en) * 1999-07-21 2001-02-01 Dow Agrosciences Llc Pest control techniques
US6914529B2 (en) * 1999-07-21 2005-07-05 Dow Agrosciences Llc Sensing devices, systems, and methods particularly for pest control
US7262702B2 (en) 1999-07-21 2007-08-28 Dow Agrosciences Llc Pest control devices, systems, and methods
US7348890B2 (en) * 1999-07-21 2008-03-25 Dow Agrosciences Llc Pest control techniques
US7212129B2 (en) * 1999-07-21 2007-05-01 Dow Agrosciences Llc Devices, systems, and method to control pests
US6260029B1 (en) * 1999-08-11 2001-07-10 Pitney Bowes Inc. Postage meter that provides on a mailpiece evidence of postage paid together with cryptographically secured, third party certified, non-shipping information about the sender of the mailpiece
US6381418B1 (en) * 1999-08-11 2002-04-30 Eastman Kodak Company Print having information associated with the print stored in a memory coupled to the print
US6363239B1 (en) 1999-08-11 2002-03-26 Eastman Kodak Company Print having attached audio data storage and method of providing same
US6294839B1 (en) 1999-08-30 2001-09-25 Micron Technology, Inc. Apparatus and methods of packaging and testing die
US7710273B2 (en) * 1999-09-02 2010-05-04 Round Rock Research, Llc Remote communication devices, radio frequency identification devices, wireless communication systems, wireless communication methods, radio frequency identification device communication methods, and methods of forming a remote communication device
US7889052B2 (en) 2001-07-10 2011-02-15 Xatra Fund Mx, Llc Authorizing payment subsequent to RF transactions
US7239226B2 (en) 2001-07-10 2007-07-03 American Express Travel Related Services Company, Inc. System and method for payment using radio frequency identification in contact and contactless transactions
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6557758B1 (en) 1999-10-01 2003-05-06 Moore North America, Inc. Direct to package printing system with RFID write/read capability
US6509217B1 (en) 1999-10-22 2003-01-21 Damoder Reddy Inexpensive, reliable, planar RFID tag structure and method for making same
US6271793B1 (en) * 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
US6634560B1 (en) * 1999-12-14 2003-10-21 Moore North America, Inc. Radio frequency identification tagging, encoding/reading through a digitizer tablet
FR2803413A1 (fr) * 1999-12-30 2001-07-06 Schlumberger Systems & Service Element de carte a circuit integre monte en flip-chip
US6313745B1 (en) 2000-01-06 2001-11-06 Fujitsu Limited System and method for fitting room merchandise item recognition using wireless tag
FI112288B (fi) * 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
US6320556B1 (en) 2000-01-19 2001-11-20 Moore North America, Inc. RFID foil or film antennas
EP1126522A1 (en) * 2000-02-18 2001-08-22 Alcatel Packaged integrated circuit with radio frequency antenna
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
US7878905B2 (en) 2000-02-22 2011-02-01 Creative Kingdoms, Llc Multi-layered interactive play experience
US6761637B2 (en) 2000-02-22 2004-07-13 Creative Kingdoms, Llc Method of game play using RFID tracking device
US7445550B2 (en) 2000-02-22 2008-11-04 Creative Kingdoms, Llc Magical wand and interactive play experience
US6785739B1 (en) 2000-02-23 2004-08-31 Eastman Kodak Company Data storage and retrieval playback apparatus for a still image receiver
US6262662B1 (en) * 2000-02-25 2001-07-17 Xerox Corporation Systems and methods that detect proximity information using electric field sensing devices and a page identification using embedded identification tags
US7627531B2 (en) 2000-03-07 2009-12-01 American Express Travel Related Services Company, Inc. System for facilitating a transaction
US6229442B1 (en) 2000-03-14 2001-05-08 Motorola, Inc, Radio frequency identification device having displacement current control and method thereof
CA2402683A1 (en) * 2000-03-15 2001-09-20 International Paper Package identification system
EP1134694A1 (de) * 2000-03-16 2001-09-19 Infineon Technologies AG Dokument mit integrierter elektronischer Schaltung
US7194801B2 (en) 2000-03-24 2007-03-27 Cymbet Corporation Thin-film battery having ultra-thin electrolyte and associated method
FI112287B (fi) * 2000-03-31 2003-11-14 Rafsec Oy Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
AU2000234571A1 (en) * 2000-03-31 2001-10-15 Hitachi Capital Corporation Gift certificate distribution managing method and gift certificate
US7191156B1 (en) 2000-05-01 2007-03-13 Digimarc Corporation Digital watermarking systems
WO2001090849A2 (en) * 2000-05-22 2001-11-29 Avery Dennison Corporation Trackable files and systems for using the same
FI111881B (fi) * 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
US6457337B1 (en) 2000-06-14 2002-10-01 Motorola, Inc. Key, lock, and key and lock system
US6483473B1 (en) * 2000-07-18 2002-11-19 Marconi Communications Inc. Wireless communication device and method
US6806842B2 (en) * 2000-07-18 2004-10-19 Marconi Intellectual Property (Us) Inc. Wireless communication device and method for discs
US7098850B2 (en) * 2000-07-18 2006-08-29 King Patrick F Grounded antenna for a wireless communication device and method
AU2001282935A1 (en) 2000-08-01 2002-02-13 First Usa Bank, N.A. System and method for transponder-enabled account transactions
US6384727B1 (en) 2000-08-02 2002-05-07 Motorola, Inc. Capacitively powered radio frequency identification device
FR2812740B1 (fr) * 2000-08-02 2005-09-02 Arjo Wiggins Sa Dispositif de controle d'un document d'identite ou analogue
JP2004515839A (ja) 2000-08-02 2004-05-27 ノキア コーポレイション 高周波（ｒｆ）トランスポンダを組み込んだ電子デバイスカバー及びその使用方法
US20020020479A1 (en) * 2000-08-16 2002-02-21 Shaffer Charles A. Tires filled with flatproofing material
US6918979B2 (en) * 2000-08-16 2005-07-19 Pc Industries Method for making tires filled with flatproofing material
US6988524B2 (en) * 2000-08-16 2006-01-24 Pc Industries Apparatus for making tires filled with flatproofing material
US7584033B2 (en) 2000-08-31 2009-09-01 Strategic Design Federation W. Inc. Automobile monitoring for operation analysis
JP2002174879A (ja) * 2000-09-18 2002-06-21 Eastman Kodak Co 無線周波数識別トランスポンダを有するシート媒体パッケージ
US6392544B1 (en) 2000-09-25 2002-05-21 Motorola, Inc. Method and apparatus for selectively activating radio frequency identification tags that are in close proximity
US6975834B1 (en) * 2000-10-03 2005-12-13 Mineral Lassen Llc Multi-band wireless communication device and method
USRE47599E1 (en) 2000-10-20 2019-09-10 Promega Corporation RF point of sale and delivery method and system using communication with remote computer and having features to read a large number of RF tags
US20020183882A1 (en) * 2000-10-20 2002-12-05 Michael Dearing RF point of sale and delivery method and system using communication with remote computer and having features to read a large number of RF tags
ATE504903T1 (de) 2000-10-20 2011-04-15 Promega Corp Hochfrequenzidenfikationsverfahren und system zum verteilen von produkten
US7066781B2 (en) 2000-10-20 2006-06-27 Denise Chapman Weston Children's toy with wireless tag/transponder
FI112121B (fi) * 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
EP2287777A1 (en) * 2001-02-12 2011-02-23 Symbol Technologies, Inc. Radio frequency identification architecture
US20040069851A1 (en) * 2001-03-13 2004-04-15 Grunes Mitchell B. Radio frequency identification reader with removable media
US7349873B2 (en) 2001-04-26 2008-03-25 Cfph, Llc Methods and systems for accessing financial prospectus data
FR2824018B1 (fr) * 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US8543823B2 (en) 2001-04-30 2013-09-24 Digimarc Corporation Digital watermarking for identification documents
US7463154B2 (en) * 2001-04-30 2008-12-09 Neology, Inc. Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
DE10121126A1 (de) * 2001-04-30 2002-11-07 Intec Holding Gmbh Identifikationsträger und Verfahren zu dessen Herstellung
US7369090B1 (en) * 2001-05-17 2008-05-06 Cypress Semiconductor Corp. Ball Grid Array package having integrated antenna pad
US7650314B1 (en) 2001-05-25 2010-01-19 American Express Travel Related Services Company, Inc. System and method for securing a recurrent billing transaction
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
FI112550B (fi) * 2001-05-31 2003-12-15 Rafsec Oy Älytarra ja älytarraraina
US20050032151A1 (en) * 2001-06-05 2005-02-10 Eisenberg Peter M. Methods of managing the transfer and use of data
WO2002099743A1 (en) * 2001-06-07 2002-12-12 Sokymat S.A. Ic connected to a winded isolated wire coil by flip-chip technology
US6501382B1 (en) * 2001-06-11 2002-12-31 Timken Company Bearing with data storage device
US6707381B1 (en) * 2001-06-26 2004-03-16 Key-Trak, Inc. Object tracking method and system with object identification and verification
FI117331B (fi) * 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
US7303120B2 (en) 2001-07-10 2007-12-04 American Express Travel Related Services Company, Inc. System for biometric security using a FOB
US20040236699A1 (en) 2001-07-10 2004-11-25 American Express Travel Related Services Company, Inc. Method and system for hand geometry recognition biometrics on a fob
US9031880B2 (en) 2001-07-10 2015-05-12 Iii Holdings 1, Llc Systems and methods for non-traditional payment using biometric data
US7429927B2 (en) * 2001-07-10 2008-09-30 American Express Travel Related Services Company, Inc. System and method for providing and RFID transaction device
US7249112B2 (en) 2002-07-09 2007-07-24 American Express Travel Related Services Company, Inc. System and method for assigning a funding source for a radio frequency identification device
US7746215B1 (en) 2001-07-10 2010-06-29 Fred Bishop RF transactions using a wireless reader grid
US7735725B1 (en) 2001-07-10 2010-06-15 Fred Bishop Processing an RF transaction using a routing number
US8294552B2 (en) 2001-07-10 2012-10-23 Xatra Fund Mx, Llc Facial scan biometrics on a payment device
US9454752B2 (en) 2001-07-10 2016-09-27 Chartoleaux Kg Limited Liability Company Reload protocol at a transaction processing entity
US8001054B1 (en) 2001-07-10 2011-08-16 American Express Travel Related Services Company, Inc. System and method for generating an unpredictable number using a seeded algorithm
US8284025B2 (en) 2001-07-10 2012-10-09 Xatra Fund Mx, Llc Method and system for auditory recognition biometrics on a FOB
US7360689B2 (en) 2001-07-10 2008-04-22 American Express Travel Related Services Company, Inc. Method and system for proffering multiple biometrics for use with a FOB
US9024719B1 (en) 2001-07-10 2015-05-05 Xatra Fund Mx, Llc RF transaction system and method for storing user personal data
US8548927B2 (en) 2001-07-10 2013-10-01 Xatra Fund Mx, Llc Biometric registration for facilitating an RF transaction
US7668750B2 (en) 2001-07-10 2010-02-23 David S Bonalle Securing RF transactions using a transactions counter
US8452242B2 (en) 2002-06-29 2013-05-28 Cell Lotto, Inc. Functional identifiers on wireless devices for gaming/wagering/lottery applications and methods of using same
US6693541B2 (en) 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
FR2827986B1 (fr) * 2001-07-30 2004-04-02 Arjo Wiggins Sa Procede de fabrication d'un article comportant une couche fibreuse et au moins une puce electronique, et article ainsi obtenu
US7218527B1 (en) * 2001-08-17 2007-05-15 Alien Technology Corporation Apparatuses and methods for forming smart labels
US7137000B2 (en) * 2001-08-24 2006-11-14 Zih Corp. Method and apparatus for article authentication
PT1456810E (pt) 2001-12-18 2011-07-25 L 1 Secure Credentialing Inc Características de segurança com imagens múltiplas para documentos de identificação e processo para as efectuar
FI119401B (fi) * 2001-12-21 2008-10-31 Upm Raflatac Oy Älytarraraina ja menetelmä sen valmistamiseksi
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
US7214569B2 (en) * 2002-01-23 2007-05-08 Alien Technology Corporation Apparatus incorporating small-feature-size and large-feature-size components and method for making same
US6816083B2 (en) 2002-02-04 2004-11-09 Nokia Corporation Electronic device with cover including a radio frequency indentification module
US20030151028A1 (en) * 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
US7638042B2 (en) * 2002-02-15 2009-12-29 3M Innovative Properties Company System for monitoring the performance of fluid treatment cartridges
US20030168389A1 (en) * 2002-02-15 2003-09-11 Astle Robert E. System for monitoring the performance of fluid treatment cartridges
GB2388744A (en) * 2002-03-01 2003-11-19 Btg Int Ltd An RFID tag
US7009496B2 (en) * 2002-04-01 2006-03-07 Symbol Technologies, Inc. Method and system for optimizing an interrogation of a tag population
US6967566B2 (en) 2002-04-05 2005-11-22 Creative Kingdoms, Llc Live-action interactive adventure game
US20070066396A1 (en) 2002-04-05 2007-03-22 Denise Chapman Weston Retail methods for providing an interactive product to a consumer
US7191507B2 (en) 2002-04-24 2007-03-20 Mineral Lassen Llc Method of producing a wireless communication device
US6825767B2 (en) 2002-05-08 2004-11-30 Charles Humbard Subscription system for monitoring user well being
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
EP1363233A1 (de) * 2002-05-13 2003-11-19 Orell Füssli Sicherheitsdruck AG Sicherheitsdokument mit Schwingkreis
JP4342771B2 (ja) * 2002-05-15 2009-10-14 リンテック株式会社 Ｉｃタグ
DE10229168A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht
US20040008123A1 (en) * 2002-07-15 2004-01-15 Battelle Memorial Institute System and method for tracking medical devices
US7002474B2 (en) * 2002-07-17 2006-02-21 Ncr Corporation Radio frequency identification (RFID) tag and a method of operating an RFID tag
US7792759B2 (en) * 2002-07-29 2010-09-07 Emv Co. Llc Methods for performing transactions in a wireless environment
US6848162B2 (en) * 2002-08-02 2005-02-01 Matrics, Inc. System and method of transferring dies using an adhesive surface
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
KR20040016075A (ko) * 2002-08-14 2004-02-21 (주) 세이프텔 우편집중국 물류자동화 시스템
KR20040016077A (ko) * 2002-08-14 2004-02-21 (주) 세이프텔 전자우표를 이용한 우편물관리방법
JP2004094839A (ja) * 2002-09-04 2004-03-25 Hitachi Ltd Ｒｆｉｄタグ
US20040049733A1 (en) * 2002-09-09 2004-03-11 Eastman Kodak Company Virtual annotation of a recording on an archival media
US20040049471A1 (en) * 2002-09-10 2004-03-11 Pitney Bowes Incorporated Method for processing and delivering registered mail
US6805287B2 (en) 2002-09-12 2004-10-19 American Express Travel Related Services Company, Inc. System and method for converting a stored value card to a credit card
US20040052203A1 (en) * 2002-09-13 2004-03-18 Brollier Brian W. Light enabled RFID in information disks
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
US6849936B1 (en) 2002-09-25 2005-02-01 Lsi Logic Corporation System and method for using film deposition techniques to provide an antenna within an integrated circuit package
US6667092B1 (en) 2002-09-26 2003-12-23 International Paper Company RFID enabled corrugated structures
US7233498B2 (en) 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US20040229560A1 (en) * 2002-10-10 2004-11-18 Maloney William C. Methods of tracking and verifying human assets
US20040070504A1 (en) * 2002-10-14 2004-04-15 Brollier Brian W. Semi-covert RFID enabled containers
US6947777B2 (en) * 2002-10-16 2005-09-20 Ward-Kraft, Inc. Compact electronic communication device with self-mounting feature and method of removably coupling such a device to a surface
AU2003286702A1 (en) * 2002-10-25 2004-05-13 Symbol Technologies, Inc. Optimization of a binary tree traversal with secure communications
KR20040038134A (ko) * 2002-10-31 2004-05-08 주식회사 쓰리비 시스템 안정된 비접촉 통신수단을 제공하는 콤비형 스마트 카드
US6702185B1 (en) 2002-11-13 2004-03-09 Identicard Systems, Incorporated Identification device having an integrated circuit
US7135979B2 (en) * 2002-11-14 2006-11-14 Brady Worldwide, Inc. In-mold radio frequency identification device label
AU2003288687A1 (en) * 2002-11-22 2004-06-18 Bnc Ip Switzerland Gmbh Radio frequency identification device formed in a non-metallized region with an antenna connected to an outside metallized region, and method of manufacturing
US7221258B2 (en) 2002-11-23 2007-05-22 Kathleen Lane Hierarchical electronic watermarks and method of use
US7333001B2 (en) * 2002-11-23 2008-02-19 Kathleen Lane Secure personal RFID documents and method of use
US7170391B2 (en) * 2002-11-23 2007-01-30 Kathleen Lane Birth and other legal documents having an RFID device and method of use for certification and authentication
EP1570421A4 (en) * 2002-12-06 2009-05-27 Jt Corp METHOD FOR PRODUCING AN IC CARD BY LAMINATING A MULTIPLE OF FOILS
US7102522B2 (en) * 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US6906436B2 (en) * 2003-01-02 2005-06-14 Cymbet Corporation Solid state activity-activated battery device and method
US7603144B2 (en) * 2003-01-02 2009-10-13 Cymbet Corporation Active wireless tagging system on peel and stick substrate
US7294209B2 (en) * 2003-01-02 2007-11-13 Cymbet Corporation Apparatus and method for depositing material onto a substrate using a roll-to-roll mask
US20040131760A1 (en) * 2003-01-02 2004-07-08 Stuart Shakespeare Apparatus and method for depositing material onto multiple independently moving substrates in a chamber
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
RU2340942C2 (ru) * 2003-03-12 2008-12-10 Бундесдрукерай Гмбх Способ изготовления вставки для книжного переплета и документа в виде книжки, а также вставка для переплета и документ в виде книжки
DE10311185A1 (de) * 2003-03-12 2004-09-30 Siemens Ag Funkabfragbares Etikett, Herstellungsverfahren sowie Verwendung eines derartigen funkabfragbaren Etiketts zur Identifizierung von Textilien und/oder in Wäschereinigungsbetrieben
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US9446319B2 (en) 2003-03-25 2016-09-20 Mq Gaming, Llc Interactive gaming toy
DE10316771A1 (de) * 2003-04-10 2004-10-28 Giesecke & Devrient Gmbh Sicherheitslabel und Herstellungsverfahren für dasselbe
US7051429B2 (en) * 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities
CA2522551C (en) 2003-04-16 2009-12-22 Digimarc Corporation Three dimensional data storage
US7209039B2 (en) * 2003-05-08 2007-04-24 Illinois Tool Works Inc. Decorative surface covering with embedded RF antenna and RF shield and method for making the same
US20040238623A1 (en) * 2003-05-09 2004-12-02 Wayne Asp Component handling device having a film insert molded RFID tag
US7336243B2 (en) * 2003-05-29 2008-02-26 Sky Cross, Inc. Radio frequency identification tag
US20050005434A1 (en) * 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for high volume transfer of dies
GB2402920A (en) * 2003-06-21 2004-12-22 Arjo Med Aktiebolag Ltd Sling attachment device
DE10333704B4 (de) 2003-07-23 2009-12-17 Ovd Kinegram Ag Sicherheitselement zur RF-Identifikation
US7120987B2 (en) * 2003-08-05 2006-10-17 Avery Dennison Corporation Method of making RFID device
US7349627B2 (en) * 2003-09-12 2008-03-25 Eastman Kodak Company Tracking an image-recording medium using a watermark and associated memory
EP1521208A1 (en) * 2003-10-01 2005-04-06 Axalto S.A. Electronic identification document
WO2005034031A1 (en) * 2003-10-01 2005-04-14 Axalto Sa Identification document
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
US20050137904A1 (en) * 2003-10-14 2005-06-23 Kathleen Lane System and method for monitoring secured liens
US7211351B2 (en) 2003-10-16 2007-05-01 Cymbet Corporation Lithium/air batteries with LiPON as separator and protective barrier and method
US7403708B2 (en) * 2003-11-04 2008-07-22 Eastman Kodak Company Tracking an image-recording medium using an identifying mark and film encodement
JP2007510983A (ja) 2003-11-06 2007-04-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ データキャリア又は文書キャリア
US20050108076A1 (en) * 2003-11-13 2005-05-19 Battelle Memorial Institute System for routing and tracking deliverables
US7109986B2 (en) * 2003-11-19 2006-09-19 Eastman Kodak Company Illumination apparatus
US7145464B2 (en) * 2003-11-19 2006-12-05 Eastman Kodak Company Data collection device
US7039440B2 (en) 2003-11-20 2006-05-02 International Business Machines Corporation Wireless rechargeable money card
US7009494B2 (en) * 2003-11-21 2006-03-07 Eastman Kodak Company Media holder having communication capabilities
FR2863083B1 (fr) * 2003-12-02 2006-03-03 A S K Livret d'identite a dispositif d'indentification radiofrequence
US7427024B1 (en) 2003-12-17 2008-09-23 Gazdzinski Mark J Chattel management apparatus and methods
WO2005062246A1 (en) * 2003-12-19 2005-07-07 Axalto Sa Identification document
US20050137989A1 (en) * 2003-12-19 2005-06-23 Brookner George M. Detecting copied value-added indicia
EP1714333A2 (en) * 2004-01-06 2006-10-25 Cymbet Corporation Layered barrier structure having one or more definable layers and method
EP1733337A4 (en) * 2004-01-12 2008-06-25 Symbol Technologies Inc INLAY SORTING AND MODULE OF A HIGH FREQUENCY IDENTIFICATION LABEL
US7370808B2 (en) * 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
JP4386038B2 (ja) * 2004-01-15 2009-12-16 日立化成工業株式会社 電子装置の製造方法
US7405656B2 (en) * 2004-01-30 2008-07-29 United Parcel Service Of America, Inc. Device and method for encapsulation and mounting of RFID devices
TWI373925B (en) * 2004-02-10 2012-10-01 Tridev Res L L C Tunable resonant circuit, tunable voltage controlled oscillator circuit, tunable low noise amplifier circuit and method of tuning a resonant circuit
US7508898B2 (en) 2004-02-10 2009-03-24 Bitwave Semiconductor, Inc. Programmable radio transceiver
DE102004008840A1 (de) * 2004-02-20 2005-09-01 Bundesdruckerei Gmbh Verfahren zur Herstellung eines buchartigen Wertdokuments sowie ein buchartiges Wertdokument
US20050197062A1 (en) * 2004-03-02 2005-09-08 Peter Sprogis Method and apparatus for transponder initiated messaging
US8440139B2 (en) * 2004-03-04 2013-05-14 Ethican, Inc. Method of delivering liquid sterilant to a sterilizer
US7309014B2 (en) * 2004-03-04 2007-12-18 Ethicon, Inc. Sterilizer cassette handling system with dual visual code reading
US7602284B2 (en) * 2004-03-04 2009-10-13 Ethicon, Inc. Sterilizer cassette handling system with data link
US7481917B2 (en) * 2004-03-05 2009-01-27 Hydranautics Filtration devices with embedded radio frequency identification (RFID) tags
US7057562B2 (en) * 2004-03-11 2006-06-06 Avery Dennison Corporation RFID device with patterned antenna, and method of making
US7250868B2 (en) * 2004-03-12 2007-07-31 A K Stamping Co. Inc. Manufacture of RFID tags and intermediate products therefor
DE102004014214B3 (de) * 2004-03-23 2005-09-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Verbinden eines Chips und eines Substrats
US7528728B2 (en) * 2004-03-29 2009-05-05 Impinj Inc. Circuits for RFID tags with multiple non-independently driven RF ports
US7667589B2 (en) * 2004-03-29 2010-02-23 Impinj, Inc. RFID tag uncoupling one of its antenna ports and methods
US7423539B2 (en) 2004-03-31 2008-09-09 Impinj, Inc. RFID tags combining signals received from multiple RF ports
DE102004017840A1 (de) * 2004-04-13 2005-11-03 Deutsche Telekom Ag Anordnung zum Schutz von Daten
US20050224590A1 (en) * 2004-04-13 2005-10-13 John Melngailis Method and system for fabricating integrated circuit chips with unique identification numbers
FR2868987B1 (fr) * 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
US7764183B2 (en) * 2005-04-22 2010-07-27 Infratab, Inc. Apparatus and method for monitoring and communicating data associated with a product
US7495558B2 (en) 2004-04-27 2009-02-24 Infratab, Inc. Shelf-life monitoring sensor-transponder system
US20050242962A1 (en) * 2004-04-29 2005-11-03 Lind Michael A Tag device, luggage tag, and method of manufacturing a tag device
US7336183B2 (en) * 2004-04-30 2008-02-26 Kimberly-Clark Worldwide, Inc. Decommissioning an electronic data tag
US7098794B2 (en) * 2004-04-30 2006-08-29 Kimberly-Clark Worldwide, Inc. Deactivating a data tag for user privacy or tamper-evident packaging
US7948381B2 (en) 2004-04-30 2011-05-24 Binforma Group Limited Liability Company Reversibly deactivating a radio frequency identification data tag
US7151455B2 (en) * 2004-04-30 2006-12-19 Kimberly-Clark Worldwide, Inc. Activating a data tag by load or orientation or user control
US7196627B2 (en) * 2004-05-20 2007-03-27 Xerox Corporation Control of packaged modules
US20050258228A1 (en) * 2004-05-20 2005-11-24 Xerox Corporation Control of programmable modules
US20050263422A1 (en) * 2004-05-28 2005-12-01 Kohler James P Cassette assembly
US7452504B2 (en) 2004-05-28 2008-11-18 Ethicon, Inc. Sterilization/disinfection cycle control
US20050263421A1 (en) * 2004-05-28 2005-12-01 Kohler James P Cassette with encoded lumen claim
US7510117B2 (en) * 2004-06-04 2009-03-31 Impinj Inc Decoding with memory in RFID system
EP1756755B1 (en) * 2004-06-16 2011-07-20 Gemalto SA Shielded contactless electronic document
WO2006012358A2 (en) * 2004-06-29 2006-02-02 Symbol Technologies, Inc. Systems and methods for testing radio frequency identification tags
DE102004031879B4 (de) * 2004-06-30 2017-11-02 Ovd Kinegram Ag Sicherheitsdokument zur RF-Identifikation
US7318550B2 (en) 2004-07-01 2008-01-15 American Express Travel Related Services Company, Inc. Biometric safeguard method for use with a smartcard
US20060002690A1 (en) * 2004-07-01 2006-01-05 Eastman Kodak Company Intelligent media splice
US7548153B2 (en) 2004-07-09 2009-06-16 Tc License Ltd. Multi-protocol or multi-command RFID system
JP4328682B2 (ja) * 2004-07-13 2009-09-09 富士通株式会社 光記録媒体用の無線タグアンテナ構造および無線タグアンテナ付き光記録媒体の収納ケース
US7772063B2 (en) * 2004-08-11 2010-08-10 Identifi Technologies, Inc. Reduced-step CMOS processes for low-cost radio frequency identification devices
DE102004039567A1 (de) 2004-08-13 2006-02-23 Ovd Kinegram Ag Individualisiertes Sicherheitsdokument
GB2417117A (en) * 2004-08-13 2006-02-15 Hewlett Packard Development Co Index print with associated memory tags for storing image data
WO2006023620A2 (en) 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation of radio frequency identification (rfid) tags for testing and/or programming
DE102004040831A1 (de) * 2004-08-23 2006-03-09 Polyic Gmbh & Co. Kg Funketikettfähige Umverpackung
US7760141B2 (en) * 2004-09-02 2010-07-20 E.I. Du Pont De Nemours And Company Method for coupling a radio frequency electronic device to a passive element
WO2006047006A2 (en) * 2004-09-02 2006-05-04 E.I. Dupont De Nemours And Company Method for making a radio frequency coupling structure
WO2006047007A2 (en) * 2004-09-02 2006-05-04 E.I. Dupont De Nemours And Company Radio frequency coupling structure for coupling to an electronic device
US9152902B2 (en) * 2004-09-02 2015-10-06 Nxp, B.V. Identification document with a contactless RFID chip
TWM264528U (en) * 2004-09-03 2005-05-11 Ind Tech Res Inst Ultra-thin and soft electronic device
US8035482B2 (en) * 2004-09-07 2011-10-11 Eastman Kodak Company System for updating a content bearing medium
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7362212B2 (en) * 2004-09-24 2008-04-22 Battelle Memorial Institute Communication methods, systems, apparatus, and devices involving RF tag registration
EP1797543B1 (en) 2004-10-04 2010-12-15 Emerson & Cuming Microwave Products Improved rfid tags
KR100933278B1 (ko) * 2004-10-04 2009-12-22 에머슨 앤드 커밍 마이크로웨어 프로덕츠, 인코포레이티드 개선된 알에프아이디 태그
US9953259B2 (en) 2004-10-08 2018-04-24 Thin Film Electronics, Asa RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same
US7635086B2 (en) * 2004-10-22 2009-12-22 II Carroll Alexis Spencer Covers having RFID functionality for portable electronic devices
US9519898B2 (en) 2004-10-22 2016-12-13 Smart Cellco, Inc. Wearable electronic devices and mobile transactions and/or actions
US9153088B2 (en) 2004-10-22 2015-10-06 Smart Cellco, Inc. RFID functionality for portable electronic devices
JP4333555B2 (ja) 2004-10-27 2009-09-16 富士通株式会社 Ｒｆｉｄタグ
US7811530B2 (en) * 2004-10-29 2010-10-12 Ethicon, Inc. Sterilization cassette and packaging
FR2877462B1 (fr) * 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
US7551141B1 (en) 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US7452748B1 (en) 2004-11-08 2008-11-18 Alien Technology Corporation Strap assembly comprising functional block deposited therein and method of making same
US7385284B2 (en) * 2004-11-22 2008-06-10 Alien Technology Corporation Transponder incorporated into an electronic device
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
DE102004059464A1 (de) * 2004-12-10 2006-06-29 Polyic Gmbh & Co. Kg Elektronikbauteil mit Modulator
DE102004059467A1 (de) * 2004-12-10 2006-07-20 Polyic Gmbh & Co. Kg Gatter aus organischen Feldeffekttransistoren
DE102004059465A1 (de) * 2004-12-10 2006-06-14 Polyic Gmbh & Co. Kg Erkennungssystem
DE102004063435A1 (de) 2004-12-23 2006-07-27 Polyic Gmbh & Co. Kg Organischer Gleichrichter
JP4717830B2 (ja) 2005-01-07 2011-07-06 富士通株式会社 タグ装置
FR2881252A1 (fr) * 2005-01-24 2006-07-28 Ask Sa Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication
FR2881251B1 (fr) * 2005-01-24 2007-04-13 Ask Sa Livret d'identite a dispositif d'identification radiofrequence resistant aux milieux humides
US20070034694A1 (en) * 2005-01-26 2007-02-15 Dublin Management Associates Of New Jersey, Inc. Interactive display system with indicia reader
US7196626B2 (en) * 2005-01-28 2007-03-27 Wha Yu Industrial Co., Ltd. Radio frequency identification RFID tag
US10417463B2 (en) 2005-02-07 2019-09-17 Steven Michael Colby Passport RFID readability
US10417462B2 (en) 2005-02-07 2019-09-17 Steven Michael Colby Passport including readability states
US9569777B2 (en) 2005-02-07 2017-02-14 Mynette Technologies, Inc. EPassport including shielding method
US10956689B2 (en) 2005-02-07 2021-03-23 Mynette Technologies, Inc. Passport including RFID shielding
US11295095B2 (en) 2005-02-07 2022-04-05 Mynette Technologies, Inc. Secure reading of passport RFID tags
US11170185B2 (en) 2005-02-07 2021-11-09 Steven Michael Colby State dependent passport reading
US11270182B2 (en) 2005-02-07 2022-03-08 Mynette Technologies, Inc. RFID financial device including mechanical switch
US10650199B2 (en) 2005-02-07 2020-05-12 Steven Michael Colby Passport including metallic fibers
US10592709B2 (en) 2005-02-07 2020-03-17 Steven Michael Colby Passport shield
FR2882174B1 (fr) * 2005-02-11 2007-09-07 Smart Packaging Solutions Sps Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
DE102005009819A1 (de) 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe
DE102005009820A1 (de) * 2005-03-01 2006-09-07 Polyic Gmbh & Co. Kg Elektronikbaugruppe mit organischen Logik-Schaltelementen
US7392953B2 (en) * 2005-03-10 2008-07-01 Mil. Digital Labeling, Inc. Programmable digital labels
JP2006264728A (ja) * 2005-03-24 2006-10-05 Fuji Photo Film Co Ltd 記録媒体収納ケース用インデックスカードおよび記録媒体収納ケース
US7607586B2 (en) * 2005-03-28 2009-10-27 R828 Llc Semiconductor structure with RF element
US20060223225A1 (en) * 2005-03-29 2006-10-05 Symbol Technologies, Inc. Method, system, and apparatus for transfer of integrated circuit dies using an attractive force
EP1864266A2 (en) * 2005-03-29 2007-12-12 Symbol Technologies, Inc. Smart radio frequency identification (rfid) items
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US8203449B2 (en) * 2005-03-30 2012-06-19 Samsung Electronics Co., Ltd. RF-ID tag reading system for using password and method thereof
US7760104B2 (en) * 2005-04-08 2010-07-20 Entegris, Inc. Identification tag for fluid containment drum
DE102005017655B4 (de) * 2005-04-15 2008-12-11 Polyic Gmbh & Co. Kg Mehrschichtiger Verbundkörper mit elektronischer Funktion
WO2006112458A1 (ja) * 2005-04-18 2006-10-26 Hitachi Chemical Co., Ltd. 電子装置の製造方法
DE602006004494D1 (de) 2005-04-20 2009-02-12 Ibm System und Verfahren zur Manipulationsdetektion
US7623034B2 (en) * 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
JP5049959B2 (ja) * 2005-04-27 2012-10-17 プリバシーズ，インコーポレイテッド 電子カード、その製造方法、スマートカード、セキュアトランザクションカード、スワイプエミュレーティングブロードキャスタおよび薄い輪郭を描くアプリケーションについての低ループ接着を造り出す方法
EP1908043B1 (en) * 2005-04-28 2015-03-25 ZIH Corporation Antimicrobial coating for identification devices
US7501947B2 (en) * 2005-05-04 2009-03-10 Tc License, Ltd. RFID tag with small aperture antenna
US11347949B2 (en) 2005-05-06 2022-05-31 Mynette Technologies, Inc. Cellular device including inductive antenna
US20060276157A1 (en) * 2005-06-03 2006-12-07 Chen Zhi N Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
US7542301B1 (en) 2005-06-22 2009-06-02 Alien Technology Corporation Creating recessed regions in a substrate and assemblies having such recessed regions
US20060290498A1 (en) * 2005-06-23 2006-12-28 Ncr Corporation Incorporation of RFID devices into labels
DE102005031448A1 (de) 2005-07-04 2007-01-11 Polyic Gmbh & Co. Kg Aktivierbare optische Schicht
US20070012244A1 (en) * 2005-07-15 2007-01-18 Cymbet Corporation Apparatus and method for making thin-film batteries with soft and hard electrolyte layers
WO2007011899A2 (en) 2005-07-15 2007-01-25 Cymbet Corporation Thin-film batteries with polymer and lipon electrolyte layers and method
US7776478B2 (en) * 2005-07-15 2010-08-17 Cymbet Corporation Thin-film batteries with polymer and LiPON electrolyte layers and method
US7436305B2 (en) * 2005-07-19 2008-10-14 Checkpoint Systems, Inc. RFID tags for pallets and cartons and system for attaching same
DE102005035589A1 (de) 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines elektronischen Bauelements
DE102005035590A1 (de) * 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Elektronisches Bauelement
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
DE102005042166A1 (de) * 2005-09-06 2007-03-15 Polyic Gmbh & Co.Kg Organisches Bauelement und ein solches umfassende elektrische Schaltung
CN101389389B (zh) * 2005-09-07 2012-10-24 美国海德能公司 具有rfid标签供电的流量计和电导率计的逆渗透过滤设备
DE102005044306A1 (de) * 2005-09-16 2007-03-22 Polyic Gmbh & Co. Kg Elektronische Schaltung und Verfahren zur Herstellung einer solchen
US7298271B2 (en) * 2005-09-19 2007-11-20 Peter Sprogis Method and apparatus for providing awards using transponders
US8199689B2 (en) 2005-09-21 2012-06-12 Intermec Ip Corp. Stochastic communication protocol method and system for radio frequency identification (RFID) tags based on coalition formation, such as for tag-to-tag communication
JP4768379B2 (ja) * 2005-09-28 2011-09-07 富士通株式会社 Ｒｆｉｄタグ
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
US7646305B2 (en) * 2005-10-25 2010-01-12 Checkpoint Systems, Inc. Capacitor strap
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
DE502005004748D1 (de) * 2005-11-11 2008-08-28 Siemens Ag Speicherprogrammierbare Steuerung mit einer RFID
US20100019482A1 (en) * 2005-11-17 2010-01-28 Kumagai Monto H Method to personalize real estate brochures, postcards, books, and photo documents using radio frequency identification tags
US7955681B2 (en) * 2005-11-21 2011-06-07 Nbcuniversal Media, Llc Optical article having a material capable of undergoing a morphological transformation as an anti-theft feature and a system and method for inhibiting theft of same
US8753097B2 (en) 2005-11-21 2014-06-17 Entegris, Inc. Method and system for high viscosity pump
US7684781B2 (en) * 2005-11-25 2010-03-23 Semiconductor Energy Laboratory Co., Ltd Semiconductor device
US20070122735A1 (en) * 2005-11-30 2007-05-31 Wisnudel Marc B Optical storage device having limited-use content and method for making same
US20070126556A1 (en) * 2005-12-07 2007-06-07 Kovio, Inc. Printed radio frequency identification (RFID) tag using tags-talk-first (TTF) protocol
US20070131016A1 (en) * 2005-12-13 2007-06-14 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070139057A1 (en) * 2005-12-15 2007-06-21 Symbol Technologies, Inc. System and method for radio frequency identification tag direct connection test
US20070139202A1 (en) * 2005-12-21 2007-06-21 Symbol Technologies, Inc. Radio frequency identification (RFID) solution to lost time spent on instrument inventory
US8067253B2 (en) * 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
US7555826B2 (en) * 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
KR100783107B1 (ko) 2005-12-26 2007-12-07 한국조폐공사 전자여권의 전자 데이터 보호장치
US7504952B2 (en) * 2005-12-28 2009-03-17 Sandlinks Ltd. Wide band RFID system with tag on flexible label
US20070159341A1 (en) * 2006-01-09 2007-07-12 Yuen Foong Yu Paper Mfg. Co., Ltd. Packaging structure for radio frequency identification devices
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP4437475B2 (ja) * 2006-01-31 2010-03-24 富士通株式会社 折り返しダイポールアンテナ及びこれを使用したタグ
US7557715B1 (en) 2006-02-08 2009-07-07 Tc License Ltd. Destructible RFID transponder
WO2007102360A1 (ja) * 2006-03-06 2007-09-13 Mitsubishi Electric Corporation Ｒｆｉｄタグ、ｒｆｉｄタグの製造方法及びｒｆｉｄタグの設置方法
WO2007106747A2 (en) * 2006-03-10 2007-09-20 Littelfuse, Inc. Suppressing electrostatic discharge associated with radio frequency identification tags
AU2007227628A1 (en) * 2006-03-13 2007-09-27 Hydranautics Device for measuring permeate flow and permeate conductivity of individual reverse osmosis membrane elements
US20070218258A1 (en) * 2006-03-20 2007-09-20 3M Innovative Properties Company Articles and methods including patterned substrates formed from densified, adhered metal powders
US8120461B2 (en) * 2006-04-03 2012-02-21 Intermec Ip Corp. Automatic data collection device, method and article
US7646304B2 (en) 2006-04-10 2010-01-12 Checkpoint Systems, Inc. Transfer tape strap process
US20070244657A1 (en) * 2006-04-11 2007-10-18 Drago Randall A Methods and systems for testing radio frequency identification (RFID) tags having multiple antennas
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US7538730B2 (en) * 2006-04-26 2009-05-26 Nokia Corporation Antenna
CA2653409A1 (fr) * 2006-04-28 2007-11-08 Ask S.A. Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900484B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900485B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
US7564359B2 (en) * 2006-05-03 2009-07-21 Kingston Technology Corporation Memory module and card with integrated RFID tag
US20070285239A1 (en) * 2006-06-12 2007-12-13 Easton Martyn N Centralized optical-fiber-based RFID systems and methods
US7672645B2 (en) * 2006-06-15 2010-03-02 Bitwave Semiconductor, Inc. Programmable transmitter architecture for non-constant and constant envelope modulation
US20080007365A1 (en) * 2006-06-15 2008-01-10 Jeff Venuti Continuous gain compensation and fast band selection in a multi-standard, multi-frequency synthesizer
CN101467209B (zh) 2006-06-30 2012-03-21 株式会社村田制作所 光盘
US7901533B2 (en) * 2006-06-30 2011-03-08 Tamarack Products, Inc. Method of making an RFID article
CN101410693B (zh) 2006-06-30 2012-01-25 国际商业机器公司 用于使用射频识别标签保护土地测量员的标志的装置
US8002173B2 (en) * 2006-07-11 2011-08-23 Intermec Ip Corp. Automatic data collection device, method and article
US8521303B2 (en) * 2006-07-17 2013-08-27 University Of Utah Reasearch Foundation In vivo implantable coil assembly
WO2008027719A1 (en) * 2006-08-31 2008-03-06 3M Innovative Properties Company Rfid tag including a three-dimensional antenna
US7855647B2 (en) * 2006-08-31 2010-12-21 3M Innovative Properties Company Flame resistant RFID tag and method of making the same
CN101140633B (zh) * 2006-09-05 2010-09-01 黄胜昌 无线射频辨识模内成型标签
WO2008050535A1 (fr) 2006-09-26 2008-05-02 Murata Manufacturing Co., Ltd. Module couplé électromagnétiquement et article muni de celui-ci
US7564356B1 (en) 2006-10-06 2009-07-21 Tc License, Ltd. Interdigit AC coupling for RFID tags
CA2672915A1 (en) * 2006-10-11 2008-04-17 Kovio, Inc. Multi-mode tags and methods of making and using the same
US20080103944A1 (en) * 2006-10-30 2008-05-01 Mobile Logistics Management L.L.C. Intelligent Pallet
US8421626B2 (en) * 2006-10-31 2013-04-16 Corning Cable Systems, Llc Radio frequency identification transponder for communicating condition of a component
US10032102B2 (en) 2006-10-31 2018-07-24 Fiber Mountain, Inc. Excess radio-frequency (RF) power storage in RF identification (RFID) tags, and related systems and methods
US9652708B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Protocol for communications between a radio frequency identification (RFID) tag and a connected device, and related systems and methods
US9652707B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Radio frequency identification (RFID) connected tag communications protocol and related systems and methods
US9652709B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Communications between multiple radio frequency identification (RFID) connected tags and one or more devices, and related systems and methods
US8264366B2 (en) * 2009-03-31 2012-09-11 Corning Incorporated Components, systems, and methods for associating sensor data with component location
US7772975B2 (en) 2006-10-31 2010-08-10 Corning Cable Systems, Llc System for mapping connections using RFID function
US7782202B2 (en) 2006-10-31 2010-08-24 Corning Cable Systems, Llc Radio frequency identification of component connections
US20080106379A1 (en) * 2006-11-03 2008-05-08 Lasercard Corporation Antenna using optical recording media
US8820639B2 (en) * 2006-11-03 2014-09-02 Assa Abloy Ab Security feature RFID card
US8093101B2 (en) * 2006-11-14 2012-01-10 Taiyo Yuden Co., Ltd. Electronic device and method of fabricating the same
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US8264355B2 (en) * 2006-12-14 2012-09-11 Corning Cable Systems Llc RFID systems and methods for optical fiber network deployment and maintenance
US7667574B2 (en) * 2006-12-14 2010-02-23 Corning Cable Systems, Llc Signal-processing systems and methods for RFID-tag signals
US7760094B1 (en) 2006-12-14 2010-07-20 Corning Cable Systems Llc RFID systems and methods for optical fiber network deployment and maintenance
JP4975825B2 (ja) 2006-12-19 2012-07-11 ダウ アグロサイエンシィズ エルエルシー 信頼性の高い有害生物検出
US20080143519A1 (en) * 2006-12-19 2008-06-19 3M Innovative Properties Company Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag
JP5289324B2 (ja) 2006-12-21 2013-09-11 ダウ アグロサイエンシィズ エルエルシー 熱可塑性ポリマー、有害生物食用材料、および殺有害生物剤を含む複合材料
US7791481B2 (en) * 2007-01-22 2010-09-07 Tc License Ltd. Light activated RFID tag
US7547150B2 (en) * 2007-03-09 2009-06-16 Corning Cable Systems, Llc Optically addressed RFID elements
US7965186B2 (en) 2007-03-09 2011-06-21 Corning Cable Systems, Llc Passive RFID elements having visual indicators
US7710275B2 (en) 2007-03-16 2010-05-04 Promega Corporation RFID reader enclosure and man-o-war RFID reader system
US7546955B2 (en) * 2007-03-16 2009-06-16 Intermec Ip Corp. Systems, devices, and methods for reading machine-readable characters and human-readable characters
WO2008126649A1 (ja) * 2007-04-09 2008-10-23 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
WO2008136226A1 (ja) * 2007-04-26 2008-11-13 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
JP4666102B2 (ja) * 2007-05-11 2011-04-06 株式会社村田製作所 無線ｉｃデバイス
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
US7696885B2 (en) * 2007-06-21 2010-04-13 Round Rock Research, Llc Methods and systems of attaching a radio transceiver to an antenna
KR101047266B1 (ko) * 2007-07-04 2011-07-06 가부시키가이샤 무라타 세이사쿠쇼 무선 ｉｃ 디바이스 및 무선 ｉｃ 디바이스용 부품
EP2166617B1 (en) 2007-07-09 2015-09-30 Murata Manufacturing Co. Ltd. Wireless ic device
US20090015407A1 (en) * 2007-07-13 2009-01-15 Micron Technology, Inc. Rifid tags and methods of designing rfid tags
KR101037035B1 (ko) 2007-07-17 2011-05-25 가부시키가이샤 무라타 세이사쿠쇼 무선 ｉｃ 디바이스 및 전자기기
EP2568419B1 (en) * 2007-07-18 2015-02-25 Murata Manufacturing Co., Ltd. Apparatus comprising an RFID device
US20090021352A1 (en) * 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Radio frequency ic device and electronic apparatus
WO2009011376A1 (ja) * 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
JP4434311B2 (ja) 2007-07-18 2010-03-17 株式会社村田製作所 無線ｉｃデバイスおよびその製造方法
US7777630B2 (en) * 2007-07-26 2010-08-17 Round Rock Research, Llc Methods and systems of RFID tags using RFID circuits and antennas having unmatched frequency ranges
US7855697B2 (en) * 2007-08-13 2010-12-21 Corning Cable Systems, Llc Antenna systems for passive RFID tags
US7855648B2 (en) * 2007-08-14 2010-12-21 Avery Dennison Corporation RFID tag
US8400269B2 (en) * 2007-08-30 2013-03-19 Round Rock Research, Llc Methods and systems using polarization modulated electromagnetic waves
DE102007041751B4 (de) * 2007-09-04 2018-04-19 Bielomatik Leuze Gmbh + Co. Kg Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts
US20090058609A1 (en) * 2007-09-05 2009-03-05 Clayman Henry M Coupon provided with rfid tag and method of using the same
US9304555B2 (en) 2007-09-12 2016-04-05 Devicefidelity, Inc. Magnetically coupling radio frequency antennas
US9311766B2 (en) 2007-09-12 2016-04-12 Devicefidelity, Inc. Wireless communicating radio frequency signals
US20090069049A1 (en) 2007-09-12 2009-03-12 Devicefidelity, Inc. Interfacing transaction cards with host devices
US8070057B2 (en) 2007-09-12 2011-12-06 Devicefidelity, Inc. Switching between internal and external antennas
US8915447B2 (en) 2007-09-12 2014-12-23 Devicefidelity, Inc. Amplifying radio frequency signals
JP2009075687A (ja) * 2007-09-19 2009-04-09 Hitachi Ltd Ｒｆｉｄタグ
US8289163B2 (en) * 2007-09-27 2012-10-16 3M Innovative Properties Company Signal line structure for a radio-frequency identification system
US20090085750A1 (en) * 2007-09-27 2009-04-02 3M Innovative Properties Company Extended RFID tag
CA2702399C (en) * 2007-10-10 2019-01-08 Kovio, Inc. Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
US8717244B2 (en) * 2007-10-11 2014-05-06 3M Innovative Properties Company RFID tag with a modified dipole antenna
CN101430772B (zh) * 2007-11-06 2011-06-29 台湾积层工业股份有限公司 设有射频识别卷标的包装材料及其制作方法
JP4462388B2 (ja) 2007-12-20 2010-05-12 株式会社村田製作所 無線ｉｃデバイス
WO2009080420A1 (en) * 2007-12-20 2009-07-02 International Business Machines Corporation System and method to locate rfid devices
EP2235669A1 (en) 2007-12-20 2010-10-06 International Business Machines Corporation System and method for determining rfid tagged items encompassed in a given area
CN103401063B (zh) * 2007-12-26 2018-03-02 株式会社村田制作所 天线装置及无线ic器件
US7847697B2 (en) * 2008-02-14 2010-12-07 3M Innovative Properties Company Radio frequency identification (RFID) tag including a three-dimensional loop antenna
WO2009108736A1 (en) * 2008-02-26 2009-09-03 Avery Dennison Corporation Rfid tag for direct and indirect food contact
EP2251933A4 (en) * 2008-03-03 2012-09-12 Murata Manufacturing Co COMPOSITE ANTENNA
EP2251934B1 (en) * 2008-03-03 2018-05-02 Murata Manufacturing Co. Ltd. Wireless ic device and wireless communication system
US8079132B2 (en) * 2008-03-11 2011-12-20 Henry Clayman Method for shielding RFID tagged discarded items in retail, manufacturing and wholesale industries
WO2009119548A1 (ja) * 2008-03-26 2009-10-01 株式会社村田製作所 無線ｉｃデバイス
GB0805596D0 (en) * 2008-03-27 2008-04-30 British Telecomm Tagged cable
EP2264831B1 (en) * 2008-04-14 2020-05-27 Murata Manufacturing Co. Ltd. Radio ic device, electronic device, and method for adjusting resonance frequency of radio ic device
KR100944306B1 (ko) * 2008-04-18 2010-02-24 엘에스엠트론 주식회사 Ｒｆｉｄ 태그의 제조방법
US8179232B2 (en) * 2008-05-05 2012-05-15 Round Rock Research, Llc RFID interrogator with adjustable signal characteristics
US7852221B2 (en) * 2008-05-08 2010-12-14 Round Rock Research, Llc RFID devices using RFID circuits and antennas having unmatched frequency ranges
US8488428B2 (en) * 2008-05-14 2013-07-16 Nbcuniversal Media, Llc Enhanced security of optical article
US8712334B2 (en) 2008-05-20 2014-04-29 Micron Technology, Inc. RFID device using single antenna for multiple resonant frequency ranges
CN102037605B (zh) 2008-05-21 2014-01-22 株式会社村田制作所 无线ic器件
WO2009142068A1 (ja) * 2008-05-22 2009-11-26 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
US8154456B2 (en) * 2008-05-22 2012-04-10 Philtech Inc. RF powder-containing base
US8188924B2 (en) * 2008-05-22 2012-05-29 Philtech Inc. RF powder and method for manufacturing the same
CN102047271B (zh) * 2008-05-26 2014-12-17 株式会社村田制作所 无线ic器件系统及无线ic器件的真伪判定方法
JP4535210B2 (ja) * 2008-05-28 2010-09-01 株式会社村田製作所 無線ｉｃデバイス用部品および無線ｉｃデバイス
US8228171B2 (en) * 2008-06-20 2012-07-24 International Business Machines Corporation Methods and systems for RFID tag geographical location using beacon tags and listening tags
US8207820B2 (en) * 2008-06-24 2012-06-26 International Business Machines Corporation Location localization method and system
JP4557186B2 (ja) * 2008-06-25 2010-10-06 株式会社村田製作所 無線ｉｃデバイスとその製造方法
EP2306586B1 (en) * 2008-07-04 2014-04-02 Murata Manufacturing Co. Ltd. Wireless ic device
CN101625729B (zh) * 2008-07-11 2011-09-07 中国钢铁股份有限公司 贴附于金属上的立体式无线识别标签
US8248208B2 (en) 2008-07-15 2012-08-21 Corning Cable Systems, Llc. RFID-based active labeling system for telecommunication systems
EP2320519B1 (en) * 2008-08-19 2017-04-12 Murata Manufacturing Co., Ltd. Wireless ic device and method for manufacturing same
TWI478665B (zh) 2008-08-19 2015-04-01 Dow Agrosciences Llc 含有聚胺甲酸酯發泡體之誘餌材料、害蟲監控裝置及其他的害蟲管控裝置
US8731405B2 (en) * 2008-08-28 2014-05-20 Corning Cable Systems Llc RFID-based systems and methods for collecting telecommunications network information
WO2010047214A1 (ja) * 2008-10-24 2010-04-29 株式会社村田製作所 無線ｉｃデバイス
WO2010050361A1 (ja) * 2008-10-29 2010-05-06 株式会社村田製作所 無線ｉｃデバイス
CN102187518B (zh) 2008-11-17 2014-12-10 株式会社村田制作所 天线及无线ic器件
US9016585B2 (en) 2008-11-25 2015-04-28 Thin Film Electronics Asa Printed antennas, methods of printing an antenna, and devices including the printed antenna
US8269609B2 (en) * 2008-12-11 2012-09-18 At&T Intellectual Property I, Lp Devices, systems and methods for portable device location
JP5041075B2 (ja) 2009-01-09 2012-10-03 株式会社村田製作所 無線ｉｃデバイスおよび無線ｉｃモジュール
TW201026573A (en) * 2009-01-13 2010-07-16 Taiwan Lamination Ind Inc Packaging material having radio frequency identification capability and its bag body structure thereof
WO2010082413A1 (ja) * 2009-01-16 2010-07-22 株式会社村田製作所 高周波デバイス及び無線ｉｃデバイス
CN102301528B (zh) 2009-01-30 2015-01-28 株式会社村田制作所 天线及无线ic器件
US8116897B2 (en) * 2009-02-20 2012-02-14 Henry Clayman Method for manufacturing multi-piece article using RFID tags
FR2944124B1 (fr) 2009-04-03 2012-05-11 Paragon Identification Etiquette d'identification de radio frequence(rfid) et procede de fabrication de l'etiquette
WO2010119854A1 (ja) 2009-04-14 2010-10-21 株式会社村田製作所 無線ｉｃデバイス用部品及び無線ｉｃデバイス
JP4687832B2 (ja) 2009-04-21 2011-05-25 株式会社村田製作所 アンテナ装置
US8743661B2 (en) * 2009-05-29 2014-06-03 Chronotrack Systems, Corp. Timing tag
JP5447515B2 (ja) 2009-06-03 2014-03-19 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
WO2010146944A1 (ja) 2009-06-19 2010-12-23 株式会社村田製作所 無線ｉｃデバイス及び給電回路と放射板との結合方法
FR2947392B1 (fr) * 2009-06-29 2019-05-10 Idemia France Procede de raccordement electrique de deux organes entre eux
JP4788850B2 (ja) 2009-07-03 2011-10-05 株式会社村田製作所 アンテナモジュール
US20110022524A1 (en) * 2009-07-21 2011-01-27 Monahan Brian H Printed circuit board with passive rfid transponder
DE102009040537B4 (de) 2009-09-08 2013-12-24 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiges Folienelement sowie Verfahren zur Bereitstellung eines Schwingkreises
JP5182431B2 (ja) 2009-09-28 2013-04-17 株式会社村田製作所 無線ｉｃデバイスおよびそれを用いた環境状態検出方法
JP5201270B2 (ja) 2009-09-30 2013-06-05 株式会社村田製作所 回路基板及びその製造方法
JP5304580B2 (ja) * 2009-10-02 2013-10-02 株式会社村田製作所 無線ｉｃデバイス
JP5522177B2 (ja) 2009-10-16 2014-06-18 株式会社村田製作所 アンテナ及び無線ｉｃデバイス
JP5418600B2 (ja) 2009-10-27 2014-02-19 株式会社村田製作所 送受信装置及び無線タグ読み取り装置
CN102473244B (zh) 2009-11-04 2014-10-08 株式会社村田制作所 无线ic标签、读写器及信息处理系统
CN102549838B (zh) 2009-11-04 2015-02-04 株式会社村田制作所 通信终端及信息处理系统
CN108063314A (zh) 2009-11-04 2018-05-22 株式会社村田制作所 通信终端及信息处理系统
US8502735B1 (en) 2009-11-18 2013-08-06 Ball Aerospace & Technologies Corp. Antenna system with integrated circuit package integrated radiators
CN104617374B (zh) 2009-11-20 2018-04-06 株式会社村田制作所 移动通信终端
US8421604B2 (en) * 2009-11-30 2013-04-16 Symbol Technologies, Inc. Method and apparatus for identifying read zone of RFID reader
US8416062B2 (en) * 2009-11-30 2013-04-09 Symbol Technologies, Inc. Method and apparatus for improving RFID tag reading
EP2507746B1 (en) * 2009-11-30 2015-10-14 Corning Incorporated Rfid condition latching
CN102687338B (zh) 2009-12-24 2015-05-27 株式会社村田制作所 天线及便携终端
US8684705B2 (en) 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
US8727744B2 (en) * 2010-02-26 2014-05-20 Entegris, Inc. Method and system for optimizing operation of a pump
WO2011108341A1 (ja) 2010-03-03 2011-09-09 株式会社村田製作所 無線通信デバイス及び無線通信端末
JP5652470B2 (ja) 2010-03-03 2015-01-14 株式会社村田製作所 無線通信モジュール及び無線通信デバイス
JP5477459B2 (ja) 2010-03-12 2014-04-23 株式会社村田製作所 無線通信デバイス及び金属製物品
CN102668241B (zh) 2010-03-24 2015-01-28 株式会社村田制作所 Rfid系统
JP5630499B2 (ja) 2010-03-31 2014-11-26 株式会社村田製作所 アンテナ装置及び無線通信デバイス
US8172468B2 (en) 2010-05-06 2012-05-08 Corning Incorporated Radio frequency identification (RFID) in communication connections, including fiber optic components
JP5170156B2 (ja) 2010-05-14 2013-03-27 株式会社村田製作所 無線ｉｃデバイス
JP5299351B2 (ja) 2010-05-14 2013-09-25 株式会社村田製作所 無線ｉｃデバイス
US9189904B1 (en) 2013-08-21 2015-11-17 Impinj, Inc. Exit-code-based RFID loss-prevention system
WO2012005278A1 (ja) 2010-07-08 2012-01-12 株式会社村田製作所 アンテナ及びｒｆｉｄデバイス
WO2012014939A1 (ja) 2010-07-28 2012-02-02 株式会社村田製作所 アンテナ装置および通信端末機器
JP5423897B2 (ja) 2010-08-10 2014-02-19 株式会社村田製作所 プリント配線板及び無線通信システム
JP5234071B2 (ja) 2010-09-03 2013-07-10 株式会社村田製作所 Ｒｆｉｃモジュール
DE102010044598B3 (de) 2010-09-07 2012-01-19 Leonhard Kurz Stiftung & Co. Kg Antennen-Bauelement sowie Verfahren zur Herstellung eines Antennen-Bauelements
US8584955B2 (en) 2010-09-17 2013-11-19 Apple Inc. Systems and methods for integrating radio-frequency identification circuitry into flexible circuits
US8866595B1 (en) * 2010-09-25 2014-10-21 Impinj, Inc. Ticket-based RFID loss-prevention system
JP5630506B2 (ja) 2010-09-30 2014-11-26 株式会社村田製作所 無線ｉｃデバイス
CN105226382B (zh) 2010-10-12 2019-06-11 株式会社村田制作所 天线装置及终端装置
TWI563351B (en) 2010-10-20 2016-12-21 Entegris Inc Method and system for pump priming
WO2012053412A1 (ja) 2010-10-21 2012-04-26 株式会社村田製作所 通信端末装置
CN105048058B (zh) 2011-01-05 2017-10-27 株式会社村田制作所 无线通信器件
CN103299325B (zh) 2011-01-14 2016-03-02 株式会社村田制作所 Rfid芯片封装以及rfid标签
DE102011011051B3 (de) * 2011-02-11 2012-03-01 Ovd Kinegram Ag Verfahren zur Herstellung eines Laminats sowie Kartenkörper aus diesem
CN103119786B (zh) 2011-02-28 2015-07-22 株式会社村田制作所 无线通信器件
WO2012121185A1 (ja) 2011-03-08 2012-09-13 株式会社村田製作所 アンテナ装置及び通信端末機器
DE102011014902B3 (de) * 2011-03-23 2012-02-02 Leonhard Kurz Stiftung & Co. Kg Verfahren zur Herstellung eines Antennen-Bauelements
JP5708137B2 (ja) * 2011-03-30 2015-04-30 凸版印刷株式会社 非接触型情報媒体および非接触型情報媒体付属冊子
CN103081221B (zh) 2011-04-05 2016-06-08 株式会社村田制作所 无线通信器件
WO2012141070A1 (ja) 2011-04-13 2012-10-18 株式会社村田製作所 無線ｉｃデバイス及び無線通信端末
JP5569648B2 (ja) 2011-05-16 2014-08-13 株式会社村田製作所 無線ｉｃデバイス
US10601074B2 (en) 2011-06-29 2020-03-24 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US11996517B2 (en) 2011-06-29 2024-05-28 Space Charge, LLC Electrochemical energy storage devices
US11527774B2 (en) 2011-06-29 2022-12-13 Space Charge, LLC Electrochemical energy storage devices
US9853325B2 (en) 2011-06-29 2017-12-26 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
WO2013008874A1 (ja) 2011-07-14 2013-01-17 株式会社村田製作所 無線通信デバイス
JP5333707B2 (ja) 2011-07-15 2013-11-06 株式会社村田製作所 無線通信デバイス
CN203850432U (zh) 2011-07-19 2014-09-24 株式会社村田制作所 天线装置以及通信终端装置
WO2013035821A1 (ja) 2011-09-09 2013-03-14 株式会社村田製作所 アンテナ装置および無線デバイス
DE102011117985B8 (de) * 2011-11-09 2016-12-01 Leonhard Kurz Stiftung & Co. Kg Kunststoffteil sowie Verfahren zur Herstellung eines Kunststoffteils
JP5344108B1 (ja) 2011-12-01 2013-11-20 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
CN102610534A (zh) * 2012-01-13 2012-07-25 华中科技大学 一种可伸缩rfid电子标签及其制造方法
JP5354137B1 (ja) 2012-01-30 2013-11-27 株式会社村田製作所 無線ｉｃデバイス
JP5464307B2 (ja) 2012-02-24 2014-04-09 株式会社村田製作所 アンテナ装置および無線通信装置
JP5304975B1 (ja) 2012-04-13 2013-10-02 株式会社村田製作所 Ｒｆｉｄタグの検査方法及び検査装置
US9165232B2 (en) 2012-05-14 2015-10-20 Corning Incorporated Radio-frequency identification (RFID) tag-to-tag autoconnect discovery, and related methods, circuits, and systems
US20130342423A1 (en) * 2012-06-22 2013-12-26 Etansi Inc. Electronic device, decorated article, decoration film, manufacturing method for decorated article and manufacturing method for decoration film
US9563832B2 (en) 2012-10-08 2017-02-07 Corning Incorporated Excess radio-frequency (RF) power storage and power sharing RF identification (RFID) tags, and related connection systems and methods
EP2901431A4 (en) 2012-10-09 2016-03-09 Infratab Inc ELECTRONIC DATAGE SYSTEM BY INFERENCE OF A CONSERVATION TIME DESIGNED FOR PERISHABLE FOODSTUFFS
WO2014121300A2 (en) * 2013-02-04 2014-08-07 American Semiconductor, Inc. Photonic data transfer assembly
US9396367B2 (en) 2013-02-05 2016-07-19 Amtech Systems, LLC System and method for synchronizing RFID readers utilizing RF or modulation signals
US20140224882A1 (en) * 2013-02-14 2014-08-14 Douglas R. Hackler, Sr. Flexible Smart Card Transponder
US9524033B2 (en) 2013-03-08 2016-12-20 International Business Machines Corporation Wireless keyboard
CN103646269A (zh) * 2013-11-25 2014-03-19 浙江钧普科技股份有限公司 Rfid柔性标签和rfid柔性标签的封装方法
US10121289B1 (en) 2014-04-11 2018-11-06 Amtech Systems, LLC Vehicle-based electronic toll system with interface to vehicle display
US9687181B2 (en) 2014-09-17 2017-06-27 International Business Machines Corporation Semiconductor device to be embedded within a contact lens
US9878825B1 (en) 2015-06-02 2018-01-30 Ecoenvelopes, Llc Reusable top flap envelope with dual opposing seal flaps
WO2017048876A1 (en) 2015-09-14 2017-03-23 Neology, Inc. Embedded on-board diagnostic (obd) device for a vehicle
ES2598806B1 (es) * 2016-02-06 2017-08-02 David MOLLEJA RIVAGORDA Sistema y método para relacionar fichas ilustradas en soporte físico con contenidos multimedia
CN106203585A (zh) * 2016-06-28 2016-12-07 湖北华威科智能技术有限公司 一种带温湿度传感器的rfid电子标签
WO2018035297A1 (en) 2016-08-17 2018-02-22 Fowling Enterprises, Llc Automated game scoring and pin tracking system
US10671969B2 (en) 2017-05-03 2020-06-02 Summate Technologies, Inc. Operating room situated, parts-inventory control system and supervisory arrangement for accurately tracking the use of and accounting for the ultimate disposition of an individual component part of a complete implant which is then being surgically engrafted in-vivo upon or into the body of a living subject
US10496916B1 (en) 2017-12-22 2019-12-03 Randy G. Cowan Screen protector article with identification functionality
CN112020405A (zh) * 2018-02-26 2020-12-01 艾利丹尼森零售信息服务公司 将rfid芯片直接附接到金属结构作为织物标签的一部分
WO2019173626A1 (en) 2018-03-07 2019-09-12 Space Charge, LLC Thin-film solid-state energy-storage devices
US10470809B1 (en) 2018-06-19 2019-11-12 Summate Technologies, Inc. Automated screw identification system and method
US10628723B2 (en) 2018-07-10 2020-04-21 Datamax-O'neil Corporation Methods, systems, and apparatuses for encoding a radio frequency identification (RFID) inlay
DE102018117364A1 (de) * 2018-07-18 2020-01-23 Infineon Technologies Ag Verfahren und Vorrichtung zum Trimmen einer auf einem Träger aufgebrachten Antenne, Verfahren zum Herstellen einer Trägerstruktur, Trägerstruktur und Chipkarte
US10938173B2 (en) 2018-09-25 2021-03-02 Caliente LLC Resistance welding copper terminals through mylar
US10909343B1 (en) 2019-07-12 2021-02-02 Summate Technologies, Inc. Automated screw identification system and method with labeled pegs
CN110516778B (zh) * 2019-08-19 2023-05-19 神思电子技术股份有限公司 一种应用于rfid餐盘的电子标签封装方法
US20230136355A1 (en) * 2020-03-04 2023-05-04 Linxens Holding A pre-package for a smartcard, a smartcard and a method of forming the same
CN112232471A (zh) * 2020-10-22 2021-01-15 浙江清华柔性电子技术研究院 柔性防盗标签及控制方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1060113A (en) * 1974-05-13 1979-08-07 Howard S. White Monitoring system for vehicles
US3934122A (en) * 1974-08-15 1976-01-20 Riccitelli James A Electronic security card and system for authenticating card ownership
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
JPS6337279A (ja) * 1986-08-01 1988-02-17 Wako Sangyo:Kk 物品の移動検知システム
JP2661115B2 (ja) * 1988-03-14 1997-10-08 日本電気株式会社 Ｉｃカード
AU4292689A (en) * 1988-10-14 1990-04-26 Total Alert Corportation Personal locator transmitter
JPH02173888A (ja) * 1988-12-26 1990-07-05 Sony Corp 情報カード
US5204663A (en) * 1990-05-21 1993-04-20 Applied Systems Institute, Inc. Smart card access control system
JPH04152191A (ja) * 1990-10-17 1992-05-26 Mitsubishi Electric Corp Ｔａｂ基板及びそれを用いた非接触ｉｃカード
WO1993009551A1 (de) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder sowie verfahren und vorrichtung zur herstellung
US5257011A (en) * 1991-12-03 1993-10-26 Avid Corporation Data altering means for multi-memory electronic identification tag
JPH05266268A (ja) * 1992-03-23 1993-10-15 Fujitsu Ltd Ｉｃカードの実装構造
DE4345610B4 (de) * 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)
GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag
FI94562C (fi) * 1992-11-09 1995-09-25 Tapio Robertsson Rullan tunnistuslaite ja menetelmä sen valmistamiseksi
US5396218A (en) * 1993-07-23 1995-03-07 Olah; George Portable security system using communicating cards

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100437007B1 (ko) * 1998-09-11 2004-06-23 모토로라 인코포레이티드 무선 주파수 식별 태그 장치 및 관련 방법
KR101328152B1 (ko) 2004-07-14 2013-11-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 무선 프로세서, 무선 메모리, 정보 처리 시스템, 및반도체장치
US8716814B2 (en) 2004-07-14 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Wireless processor, wireless memory, information system, and semiconductor device
US9087280B2 (en) 2004-07-14 2015-07-21 Semiconductor Energy Laboratory Co., Ltd. Wireless processor, wireless memory, information system, and semiconductor device
US9425215B2 (en) 2004-07-14 2016-08-23 Semiconductor Energy Laboratory Co., Ltd. Wireless processor, wireless memory, information system, and semiconductor device
US8223531B2 (en) 2004-10-18 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of the same
KR101201698B1 (ko) 2004-10-18 2012-11-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101038493B1 (ko) * 2004-11-12 2011-06-01 삼성테크윈 주식회사 극초단파용 라디오 주파수 인식태그 제조방법

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