WO2005034031A1

WO2005034031A1 - Identification document

Info

Publication number: WO2005034031A1
Application number: PCT/IB2004/003174
Authority: WO
Inventors: Yves Reignoux; Séverine CHERAMY; Benoît Thevenot; Joseph Leibenguth; Denis Groeninck; Jean-Pierre Lafon
Original assignee: Axalto Sa
Priority date: 2003-10-01
Filing date: 2004-09-29
Publication date: 2005-04-14

Abstract

The invention relates to an identification document (21) and a method for making the same. According to the invention, the identification document (21) comprises at least one paper or paperboard flexible layer (22, 25) and an electronic module (26) including a flexible support layer, an antenna positioned onto said flexible support layer and an electronic radio frequency microcontroller storing identification data, said microcontroller being affixed to said flexible support layer and electrically connected to said antenna, said module (26) being affixed to said paper or paperboard flexible layer (22, 25). The invention relates more particularly to electronic passports and visas.

Description

IDENTIFICATION DOCUMENT

The invention relates to identification documents and methods for making them. More particularly, it relates to identification documents that constitute paper booklets, such as passport, and which contain personal data of their holder such as his/her name, birth date, address and photograph. Typically, smartcards, which are plastic cards with an embedded secured microcontroller, are well-known to contain this type of personal data in a secure manner. They can be used within an automatic recognition and/or transaction system for exchange of personal or confidential data with a central database of the system, in order to allow the smartcard holder to access specific services or premises. Smartcards are classically divided into two categories. The first one uses some electrical pads to connect the microcontroller to the system. The second category, often called contactless smartcards, uses radio frequency waves to communicate. The International Standard Organization (ISO) has developed two standards, the ISO-14443A and the IS0-14443B, to define the characteristics of this radiofrequency interface. Contactless smartcards are manufactured by lamination of an inlet between two or more plastic sheets . An inlet is a plastic sheet on which a radio frequency (RF) microcontroller and an antenna connected thereto are integrated. In many countries, national authorities desire development of passports and visas that are made more resistant against forgeries, which is easily achieved with paper documents. The security of said documents would be improved by the integration of electronic means which would comprise identification data of the passport/visa holder and may include biographic and biometric authentication data. Therefore, the need to integrate a secured microcontroller with radio frequency (RF) capabilities inside a passport has emerged as a privileged way to combine the security of electronics with the easiness of connecting to central databases. Additionally, this would facilitate customs processing or border entries. However, the integration of standard smartcards manufacturing processes in the manufacturing of passports or visas is not efficient. The resulting product is a passport with thick and rigid plastic cover or internal pages that is neither very appealing nor efficient. Considering the above, a problem intended to be solved by the invention is to develop an identification document such as a passport which offers the flexibility of a paper document but which integrates a RF component. In a first aspect, the solution of the invention to this problem relates to an identification document comprising at least one paper or paperboard flexible layer and an electronic module including a flexible support layer, an antenna positioned onto said flexible support layer and an electronic radio frequency microcontroller storing identification data, said microcontroller being affixed to said flexible support layer and electrically connected to said antenna, said module being affixed to said paper or paperboard flexible layer . In a second aspect, the solution of the invention relates to a method for making an identification document comprising at least one paper or paperboard flexible layer and an electronic module including a flexible support layer, an antenna positioned onto said flexible support layer and an electronic radio frequency microcontroller storing identification data, wherein said method comprises: providing the flexible support layer, the antenna and the microcontroller; positioning said antenna on said flexible support layer; affixing the microcontroller onto said flexible layer; electrically connecting the microcontroller to said antenna; and affixing the module onto the paper or paperboard layer. Other features of the invention are: - the flexible support layer is made of epoxy glass, PET, polyamide or Kapton™; - the flexible support layer has a thickness in the range 50 to 150 μm; - the thickness of the flexible support layer is in the range 50 to 100 μm; - the flexible support layer comprises an aperture and the aperture is located inside the surface defined by the antenna; - the identification document is a passport; - the paper or paperboard flexible layer is part of the passport cover; the paper or paperboard flexible layer is an internal sheet of the passport; - the paper or paperboard layer is provided with a cavity, the module being incorporated into said cavity; - the identification document further comprises a spacer layer, said spacer layer being attached to the flexible paper or paperboard layer and being provided with a cavity; - the entire module is incorporated into the cavity of the spacer layer; - the module part comprising the microcontroller is incorporated into the cavity of the spacer layer; - the identification document further comprises a layer, the module being positioned in between the paper or paperboard layer and said layer; and - the microcontroller comprises a memory for storing visa related information. For a better understanding of the present invention, reference will now be made, by way of example, to the accompanying drawings, in which: figure 1 is a schematic representation of a contactless smartcard according to the prior art; - figures 2A, 2B and 2C are views of identification documents according to a first, second and third embodiments of the invention; - figures 3A to 3F are cross-sections of modules embodiments used in an identification document according to the invention; - figure 3G is a top view of a module used in an identification document according to the invention; and - figures 4A to 41 are cross-sections of the cover or of an internal page of identification documents according to the invention. Corresponding numerals and symbols in the different figures refer to corresponding parts, unless otherwise indicated. In figure 1, a prior art module 10 is embedded inside a pre-laminated inlet 11. The module comprises an integrated circuit 12 connected to a support 13. The integrated circuit and its connections are protected by a resin 14. The support 13 has electrical pads 15 connected to the integrated circuit . An antenna 16 is etched on a first plastic layer 17 of the inlet and connected to the electrical pads 15. Then, a second plastic layer 18 is laminated onto the first layer 17 to create the inlet 11. The inlet 11 is inserted between other external plastic layers 19 to finalise the contactless smartcard. In a variant of the prior art, not represented, the manufacturing of the smartcard uses Flip-Chip technology. In other words, rather than using a module wherein the integrated circuit is bonded to the electrical pads 15 using connecting wires, said integrated circuit is turned over on the antenna and connected to the antenna pads using bumps. The pre-laminated inlet 11 of the prior art is rigid and has a typical thickness of 400 - 450 μm. The following embodiments of the invention relate to passports and visas. However, the invention may concern other identification documents comprising a paper or paperboard layer such as identification cards. In a first embodiment of the invention, figure 2A, a passport 21 comprises a booklet of flexible sheets 22 of paper and a flexible paper or paperboard cover 23. This cover 23 includes at two layers 24, 25. An electronic module 26 is inserted between these two layers. In a second embodiment of the invention, figure 2B, the passport 21 is also made of a booklet of sheets 22 and a cover 23. The cover includes two layers. The first layer 25 is the cover layer per se . The second layer 27 is a spacer layer. The spacer layer comprises a cavity and the module 26 is positioned in said cavity so that it is flush with the spacer layer surface. In a third embodiment, figure 2C, the module 26 is positioned onto an internal paper sheet 22 of the passport 21. It is covered by a layer 28, which is, in this embodiment, a self-adhesive paper visa. Figures 3A to 3G illustrate various module embodiments according to the invention. The modules according to these embodiments are said coil-on-module as the antenna is part of the module itself and not part of a separate body like an inlet plastic sheet. In the embodiment of figure 3A, the module 26 includes a flexible support layer 30. This support layer 30 is made of a polymer material such as epoxy glass, PET (polyethylene terephtalate) , polyamide or Kapton™. Its thickness is in the range 50 - 150 μm, preferably in the range 50 - 100 μm, in order to achieve a high degree of flexibility. Using standard manufacturing techniques of the electronics printed board industry, an antenna 31 is etched onto the support layer 30. This antenna 31 has two electric pads 32 on which a RF microcontroller or component 33 is connected by wire bonding. An epoxy resin 34 is dispatched on top of the microcontroller 33 and its bonding wires, in order to ensure their protection. As for the embodiment of figure 3A, the modules of figures 3B to 3G comprise a flexible support layer 30, a microcontroller 33 and an antenna 31, the two bonding pads of the microcontroller being electrically connected to terminals ends of the antenna through connecting means, said microcontroller and said connective means being embedded into a protective resin. However, in these embodiments, the antenna 31 and the microcontroller bonding pads are located at opposite sides of the support layer 30 so that said layer 30 includes at least two trough holes allowing connecting of said bonding pads to the antenna terminal ends. Also, a stiffener 40, generally made of epoxy or copper, is positioned onto the protective resin 34 in order to reinforce the modules 26 and improve their mechanical strength. In the module of figure 3B, a copper antenna 31 is glued to an epoxy support layer 30. The layer referenced

35 in said figure illustrates this glue. Also, a cavity

36 is made in the support layer 30 and the microcontroller 33 is incorporated into said cavity with a view to make the module 26 thinner. The bonding pads 37 of the microcontroller 33 are electrically connected to the terminal ends of the antenna 31 via bonding wires 38, through the holes 39. The thickness of such a module 26, comprising a 150 μm-thick microcontroller 33, is comprised between approximately 400 and 425 μm. The thicknesses of the various elements of this module 26 are as follows: Copper antenna 31 : 35 μm Glue 35 : 15 μm Epoxy layer 30 : 110 μm Resin 34 : 130 μm Epoxy stiffener 40 : 110 μm In figure 3C, the copper antenna is connected to the copper pads 41 by means of vias through the flexible support. Also, the microcontroller 33 is not positioned into a through hole of the epoxy support layer. It is glued on the upper side of this support layer. The bonding pads 37 of the microcontroller 33 are electrically connected to copper contact pads 41 placed on the upper side of the epoxy player. These contact pads 41 are electrically connected to the terminal ends of the antenna 31 through the holes 39 filled with a conductive resin (via) . The thickness of such a module 26, comprising a 50 μm-thick microcontroller, is of approximately 290 μm. The thicknesses of the various elements of this module are as follows : Cooper antenna 31 : 35 μm Lead-frame 30 : 70 μm Contact pads 41 : 35 μm Microcontroller glue : 20 μm Resin 34 : 130 μm Epoxy stiffener 40 : 55 μm. As in the module of figure 3B, the module of figure

3D comprises an epoxy support layer 30 and the microcontroller 33 is incorporated in a cavity 36 of said layer 30. However, in this embodiment, as in the embodiment of figure 3C, the epoxy support layer comprises copper contact pads 41 electrically connected to the terminal ends of the antenna 31 through connecting vias, the microcontroller 33 being connected to said contact pads 41 through bonding wires 38. The thickness of such a module 26, comprising a 88 μm-thick microcontroller 33, is of approximately 305 μm. The thicknesses of the various elements of this module are as follows : Copper antenna 31 : 35 μm Glue 35 : 20 μm Epoxy support layer 30 : 70 μm Contact pads 41 : 18 μm Resin 34 : 130 μm Epoxy stiffener 40 : 55 μm The structure of the module 26 of figure 3E is similar to the structure of the module of figure 3C. However, the thickness of the copper layer is reduced so that the total thickness of the module, comprising a 50 μm-thick microcontroller 33, is equal to approximately 263 +/- 50 μm. Practically, the thicknesses of the various elements of said module are as follows: Copper antenna 31 : 18 μm Epoxy support layer 30 : 70 μm Contact pads 41 : 18 μm Microcontroller glue : 20 μm Resin 34 : 120 μm Epoxy stiffener 40 : 55 μm Finally, in the module of figure 3F, the support layer 30 is not made of epoxy but of PET (polyethylene terephthalate) , the microcontroller 33 is not bonded to the contact pads with bonding wires but using bumps 42 (Flip-Chip) and the stiffener 40 is made of metal. The thicknesses of the various elements of such a module, comprising a 50 μm-thick microcontroller 33, is of approximately 226 μm. The thicknesses of the various elements are as follows: Copper antenna 31 : 18 μm PET support layer 30 : 70 μm Contact pads 41 : 18 μm Bumps 42 : 30 μm Stiffener 40 and glue : 40 μm Figure 3G illustrates a module 26 according to one of the embodiments of figures 3B to 3F. As appearing in this figure, the dimensions of the support layer 30 are considerably more important than the dimensions of the microcontroller 33. As a result, the antenna 31, which is positioned onto the support layer 30, may define an internal surface sufficient to allow an efficient inductive coupling distance of a few centimetres with a reader. Practically, the length the antenna 31 is comprised between approximately 25 and approximately 120 mm but is preferentially of approximately 80 mm, whereas its width is comprised between approximately 15 and approximately 100 mm but is preferentially of about 35 mm. Also, the support layer 30 may present some perforations 44 close to its edges. These perforations are used to displace the support layer 30 during the manufacture of the modules, prior to their cutting off. Finally, it is to be noted that the internal zone of the support layer, illustrated by the doted line in figure 3G and referenced 43, may be removed and in particular punched out from the module 26. In this case, the support layer 30 presents a central aperture. Due to this central aperture, the flexibility of the module is improved. Moreover, the epoxy surface is reduced so that the risk of delamination between the spacer and the last page of the passport or the internal cover page (in case of a 3-layer construction) is lowered. In accordance with the invention, the module as in figures 3A to 3G is embedded into a passport as in figures 2A to 2C. This may be achieved as in figures 4A to 41. As shown in figure 4A, the cover layer 25 of the passport cover includes a cavity 45. This cavity 45 is used to glue the module 26 and the second layer 24 is laminated on top of the layer 25 to protect the module 26. In figure 4B, the layer 25 of the passport cover does not include any cavity. A Spacer layer 27 is glued to said layer 25. This spacer layer 27 comprises a through hole defining a cavity 46. The module part comprising the microcontroller and the resin reinforced by the stiffener is included into said cavity 46 whereas the module part comprising the support layer 30 and the antenna. Moreover, the module 26 and the spacer layer 27 are covered by an adhesive internal layer 24. The glue, which is used to stick - the spacer layer 27 to the cover layer 25, - the module 26 to the spacer layer 27, and - the internal layer 24 to the spacer layer 27 and to the module 26, can be a solvent or waterbased pressure sensitive adhesive (PSA) . In figure 4C, the passport cover layer 25 does not include any cavity as well. A spacer layer 27 is glued to said passport cover layer 25. This spacer layer 27 includes a cavity 46. The entire module 26 is incorporated in said cavity 46 which is filled with one or more layers of glue 47. The glue may be a Tesa™ type glue and the total thickness of the glue inside the cavity 46 may be of approximately 240 μm. There is no internal layer covering the embedded module 26 and the antenna located on the support layer 30 is flush with the spacer layer 27 surface. As a result, the passport cover in accordance with this embodiment only includes two layers a first layer corresponding to the cover itself and a second layer corresponding to the spacer layer in which is incorporated the entire module, as in figure 2B. The support layer of the module is visible at the spacer surface. In figure 4D, the module is embedded into a spacer layer 27 as in figure 4C . However, this spacer layer 27 and the module 26 are positioned onto an internal page 22 of the passport and not onto the cover layer 25. In the represented configuration, the module being thinner, the thickness of the Tesa™ type glue is of approximately 175 μm. For very thin modules 26, the spacer layer 27 may not be essential so that said module may be only glued on the inner side of the passport cover layer 25. Figures 4E to 41 illustrate embodiments wherein the electronic module 26 is attached to an internal page 22 of the passport, and is associated with a visa 28 in order to constitute an electronic visa. In figure 4E, a module as in figures 3B to 3E is positioned upside-down on a passport internal page 22. Thus, the microcontroller part of the module 26 is located above the support layer 30 when affixed to said passport page 22. The module 26 is affixed to the passport page using glue 48. The visa is glued to the module and the passport page using a glue 49. The glue does not compensate the thickness of the module so that the electronic visa presents a protrusion corresponding to said module. Therefore, the electronic visa presents various thicknesses along its cross-section: 100 μm corresponding to the thickness of the passport page 22, 170 μm corresponding to the thickness of the passport page plus the thickness of the visa 28 and associated glue, 430 μm corresponding to the addition of the previous 170 μm plus the support layer 30 and associated glue 48 and 645 μm corresponding to the previous 430 μm plus the microcontroller part of the module. In figure 4F, a module as in figures 3B to 3E is affixed on a passport page in such a way that the microcontroller part is positioned under the support layer 30, between said support layer and the passport page 22. As compared to the embodiment of figure 4E, the electronic visa of this embodiment presents a thick glue layer 48 which compensates the thickness of the microcontroller part of the module, said microcontroller part being included into a cavity 50 of said thick glue layer. As a result, the electronic visa does not present any protrusion due to the microcontroller part of the module and the electronic visa cross-section shown in figure 4F presents three thicknesses along its cross- section: 100 μm corresponding to the thickness of the passport page 22, 170 μm corresponding to the thickness of said passport page plus the thickness of the visa 28 and associated glue; and 595 μm corresponding to the previous 170 μm plus the thickness of the module and associated glue. In figure 4G, the paper visa and associated glue are provided with a cavity 51 and the module is included in said cavity, the antenna 31 of said module appearing at said visa surface. Practically, the various thicknesses along the electronic visa profile of this embodiment are as follows: 100 μm for the passport page; 500 μm for the passport page, the visa per se and the glue; and 525 μm for the passport page and the module. It is noted that the electronic visa configuration of figure 4G may be used with an thin coil-on-module. The total thickness of this electronic module is then of approximately 350 - 400 μm. In the embodiment of figure 4H, the module 26 is positioned upside-down, as in figure 4E. However, the visa 28 and corresponding glue layers include a cavity and the microcontroller part of the module is included in said cavity 52. Thus, the electronic visa profile presents three thicknesses: 100 μm corresponding to the thickness of the passport page 22; 260 μm corresponding to the thickness of the passport page 22 and the visa 28 and associated glue 49; and 575 μm corresponding to the thickness of the module 26 and the passport page 22. in this embodiment, only the back side of the module, i.e. the stiffener is appearing at the visa surface. The embodiment of figure 41 is similar to the embodiment of figure 4G but the coil-on-module is thinner and the microcontroller part of the module is embedded into the visa and corresponding glue layers so that the total thickness of the electronic visa is of approximately 450 μm. In the embodiments of figures 4C, 4D and 4G, the coil-on-module itself is embedded into the layers 25 and 27 (figures 4C and 4D) or into the layers 22, 49 and 28 (figures 4G) . Technologies associated with embedding of modules are generally well controlled by card manufacturers and in particular by the applicant of the present patent application. Additionally, the embedding of a module may be done in a very last step of the manufacture of the identification document according the invention. The previous various layers of an electronic passport or an electronic visa according to the invention are glued or laminated. A paper laminate is then obtained and, when finished, the passport incorporating the module 26 appears similar to a standard passport. Except for the small area where the RF microcontroller is positioned, the flexibility of the cover or page is identical or close to the flexibility of the cover or page of a standard passport. Further, the module and all electronic components are, according to some embodiments of the invention, invisible. The previous embodiments were described for a passport or visa comprising one electronic module, said electronic module comprising one electronic component (microcontroller) . However, it will be obvious for the person skilled in the art to adapt the technology described to passports and visas comprising a plurality of modules or to modules comprising a plurality of electronics components. For example, a battery can be added to the module to supply the electrical power to the RF component . The module antenna is advantageously etched. However, it may be screen printed using a conductive ink or obtained from a process such as electrolysis wherein a conductive ions are accumulated within a particular zone to define an antenna. Moreover, the antenna may be a thermo-sonic embedded wire in a plastic substrate. The RF micro-controller is chosen among the standard micro-controllers for smartcards. For instance, the ST19RF08 from STMicroelectronics™ has the processing power, data storage, security and RF interface. With these types of processors, it is possible to integrate different applications on the same chip. For a passport, in parallel with the personal data contained in the passport itself, the microcontroller contains and processes electronics visas. Visa information, such as validity, stay, countries visited, place of issue, date of issue are electronically downloaded in the passport with a contactless transmitter in consulates or official places that issue visas. The traveller's information is then displayed and verified when transiting through a customs clearance area in various destination countries. Thereafter, an electronic stamp, equivalent to a physical stamp, is written by the customs clearance personnel into the microcontroller upon verification and clearance.

Claims

1. An identification document (21) comprising at least one paper or paperboard flexible layer (22, 25) and an electronic module (26) including a flexible support layer (30) , an antenna (31) positioned onto said flexible support layer (30) and an electronic radio frequency microcontroller (33) storing identification data, said microcontroller (33) being affixed to said flexible support layer (30) and electrically connected to said antenna (31) , said module (26) being affixed to said paper or paperboard flexible layer (22, 25) .

2. The identification document (21) of claim 1, wherein the flexible support layer (30) is made of epoxy glass, PET, polyamide or Kapton™.

3. The identification document (21) of one of claims 1 or 2 , wherein the flexible support layer (30) has a thickness in the range 50 to 150 μm.

4. The identification document (21) of claim 3, wherein the thickness of the flexible support layer (30) is in the range 50 to 100 μm.

5. the identification document (21) of one of the previous claims, wherein the flexible support layer (30) comprises an aperture (43) and that the aperture is located inside the surface defined by the antenna (31) .

6. The identification document (21) of any one of the preceding claims, wherein the identification document is a passport.

7. The identification document (21) of claim 5, wherein the paper or paperboard flexible layer (25) is part of the passport cover.

8. The identification document (21) of claim 5, wherein the paper or paperboard flexible layer (22) is an internal sheet of the passport.

9. the identification document (21) of one of the previous claims, wherein the paper or paperboard layer is provided with a cavity (45), the module (26) being incorporated into said cavity.

10. The identification document (21) of one of claims 1 to 8, further comprising a spacer layer (27), said spacer layer being attached to the flexible paper or paperboard layer (25) and being provided with a cavity (46) .

11. The identification document (21) of claim 10, wherein the entire module (26) is incorporated into the cavity (46) .

12. The identification document (21) of claim 10, wherein the module part comprising the microcontroller

(33) is incorporated into the cavity (36).

13. The identification document (21) of one of the previous claims, further comprising a layer (24, 28) , the module (26) being positioned in between the paper or paperboard layer (22, 25) and said layer (24, 28).

14. The identification document (21) of one of the preceding claims, wherein the microcontroller (33) comprises a memory for storing visa related information.

15. A method for making an identification document (21) comprising at least one paper or paperboard flexible layer (22, 25) and an electronic module (26) including a flexible support layer (30) , an antenna (31) positioned onto said flexible support layer (30) and an electronic radio frequency microcontroller (33) storing identification data, wherein said method comprises: providing the flexible support layer (30) , the antenna (31) and the microcontroller (33); positioning said antenna (31) on said flexible support layer (30) ; affixing the microcontroller onto said flexible layer (30) ; electrically connecting the microcontroller (33) to said antenna (31) ; and affixing the module (26) onto the paper or paperboard layer (22, 25).

16. The method of claim 15, further comprising: providing the support layer (30) with an aperture (43) .

17. The method of one of claims 14 or 15, further comprising providing the paper or paperboard layer (25) with a spacer layer (27) comprising a cavity (46) .

18. The method of claim 17, wherein the module (26) is incorporated in said cavity (46) .

19. The method of claim 17, wherein the module part comprising the microcontroller (33) is incorporated into the cavity (36) .

20. The method of one of claims 15 to 19, further comprising positioning the module (26) in between the paper or paperboard layer (22, 25) and a layer (24, 28) .