JP6940495B2 - 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 - Google Patents

所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 Download PDF

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JP6940495B2
JP6940495B2 JP2018521856A JP2018521856A JP6940495B2 JP 6940495 B2 JP6940495 B2 JP 6940495B2 JP 2018521856 A JP2018521856 A JP 2018521856A JP 2018521856 A JP2018521856 A JP 2018521856A JP 6940495 B2 JP6940495 B2 JP 6940495B2
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Prior art keywords
polishing
zeta potential
feature
polishing pad
weight
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Japanese (ja)
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JP2018538152A (ja
JP2018538152A5 (enExample
Inventor
アシュウィン チョカリンガム，
アシュウィン チョカリンガム，
マヘンドラ シー． オリラル，
マヘンドラ シー． オリラル，
マユ ヤマムラ，
マユ ヤマムラ，
ボイ フー，
ボイ フー，
ラジーブ バジャージ，
ラジーブ バジャージ，
ダニエル レッドフィールド，
ダニエル レッドフィールド，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2018538152A5 publication Critical patent/JP2018538152A5/ja
Priority to JP2021142982A priority Critical patent/JP7334220B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H10P52/402—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2018521856A 2015-10-30 2016-10-20 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 Active JP6940495B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021142982A JP7334220B2 (ja) 2015-10-30 2021-09-02 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562249025P 2015-10-30 2015-10-30
US62/249,025 2015-10-30
PCT/US2016/057811 WO2017074773A1 (en) 2015-10-30 2016-10-20 An apparatus and method of forming a polishing article that has a desired zeta potential

Related Child Applications (1)

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JP2021142982A Division JP7334220B2 (ja) 2015-10-30 2021-09-02 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法

Publications (3)

Publication Number Publication Date
JP2018538152A JP2018538152A (ja) 2018-12-27
JP2018538152A5 JP2018538152A5 (enExample) 2019-12-05
JP6940495B2 true JP6940495B2 (ja) 2021-09-29

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JP2018521856A Active JP6940495B2 (ja) 2015-10-30 2016-10-20 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
JP2021142982A Active JP7334220B2 (ja) 2015-10-30 2021-09-02 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法

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Country Status (6)

Country Link
US (2) US10618141B2 (enExample)
JP (2) JP6940495B2 (enExample)
KR (2) KR20230169424A (enExample)
CN (2) CN108290267B (enExample)
TW (3) TWI765248B (enExample)
WO (1) WO2017074773A1 (enExample)

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