JP4912876B2 - 高温動作用にパッケージ化された発光ダイオード - Google Patents

高温動作用にパッケージ化された発光ダイオード Download PDF

Info

Publication number
JP4912876B2
JP4912876B2 JP2006513307A JP2006513307A JP4912876B2 JP 4912876 B2 JP4912876 B2 JP 4912876B2 JP 2006513307 A JP2006513307 A JP 2006513307A JP 2006513307 A JP2006513307 A JP 2006513307A JP 4912876 B2 JP4912876 B2 JP 4912876B2
Authority
JP
Japan
Prior art keywords
led
metal base
packaged
assembly
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006513307A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006525679A (ja
JP2006525679A5 (enExample
Inventor
マッツォチェッテ，ジョゼフ
ブロンダー，グレグ，イー．
Original Assignee
ラミナ ライティング インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33423666&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP4912876(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by ラミナ ライティング インコーポレーテッド filed Critical ラミナ ライティング インコーポレーテッド
Publication of JP2006525679A publication Critical patent/JP2006525679A/ja
Publication of JP2006525679A5 publication Critical patent/JP2006525679A5/ja
Application granted granted Critical
Publication of JP4912876B2 publication Critical patent/JP4912876B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
JP2006513307A 2003-05-05 2004-04-26 高温動作用にパッケージ化された発光ダイオード Expired - Fee Related JP4912876B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US46785703P 2003-05-05 2003-05-05
US60/467,857 2003-05-05
US10/638,579 US7095053B2 (en) 2003-05-05 2003-08-11 Light emitting diodes packaged for high temperature operation
US10/638,579 2003-08-11
PCT/US2004/012746 WO2004100343A2 (en) 2003-05-05 2004-04-26 Light emitting diodes packaged for high temperature operation

Publications (3)

Publication Number Publication Date
JP2006525679A JP2006525679A (ja) 2006-11-09
JP2006525679A5 JP2006525679A5 (enExample) 2007-06-07
JP4912876B2 true JP4912876B2 (ja) 2012-04-11

Family

ID=33423666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006513307A Expired - Fee Related JP4912876B2 (ja) 2003-05-05 2004-04-26 高温動作用にパッケージ化された発光ダイオード

Country Status (5)

Country Link
US (3) US7095053B2 (enExample)
EP (1) EP1620896A2 (enExample)
JP (1) JP4912876B2 (enExample)
KR (1) KR101095291B1 (enExample)
WO (1) WO2004100343A2 (enExample)

Families Citing this family (316)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003309292A (ja) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd 表面実装型発光ダイオードのメタルコア基板及びその製造方法
ATE535009T1 (de) 2002-05-08 2011-12-15 Phoseon Technology Inc Hocheffiziente halbleiter-lichtquelle sowie verfahren zu deren verwendung und herstellung
WO2006072071A2 (en) 2004-12-30 2006-07-06 Phoseon Technology Inc. Methods and systems relating to light sources for use in industrial processes
TWI299559B (en) * 2002-06-19 2008-08-01 Inpaq Technology Co Ltd Ic substrate with over voltage protection function and method for manufacturing the same
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7298046B2 (en) * 2003-01-10 2007-11-20 Kyocera America, Inc. Semiconductor package having non-ceramic based window frame
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
US7262550B2 (en) 2003-04-15 2007-08-28 Luminus Devices, Inc. Light emitting diode utilizing a physical pattern
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
US7777235B2 (en) * 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US7919787B2 (en) * 2003-06-27 2011-04-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Semiconductor device with a light emitting semiconductor die
EP1642346A1 (en) * 2003-06-30 2006-04-05 Koninklijke Philips Electronics N.V. Light-emitting diode thermal management system
EP1496551B1 (en) * 2003-07-09 2013-08-21 Nichia Corporation Light emitting diode, method of manufacturing the same and lighting equipment incorporating the same
US7183587B2 (en) * 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
WO2005041632A2 (en) 2003-10-31 2005-05-12 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
KR100586944B1 (ko) * 2003-12-26 2006-06-07 삼성전기주식회사 고출력 발광다이오드 패키지 및 제조방법
JP4312616B2 (ja) * 2004-01-26 2009-08-12 Ｎｅｃエレクトロニクス株式会社 半導体装置
US7279724B2 (en) * 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
US7964883B2 (en) * 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
TWI312583B (en) 2004-03-18 2009-07-21 Phoseon Technology Inc Micro-reflectors on a substrate for high-density led array
WO2005089477A2 (en) 2004-03-18 2005-09-29 Phoseon Technology, Inc. Direct cooling of leds
DE102004014207A1 (de) * 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
WO2005106973A1 (ja) * 2004-04-27 2005-11-10 Kyocera Corporation 発光素子用配線基板
US8188503B2 (en) 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
US20050247945A1 (en) * 2004-05-10 2005-11-10 United Epitaxy Company, Ltd. LED heat-radiating substrate and method for making the same
KR100623024B1 (ko) * 2004-06-10 2006-09-19 엘지전자 주식회사 고출력 ｌｅｄ 패키지
CN101032034A (zh) 2004-06-30 2007-09-05 克里公司 用于封装发光器件的芯片级方法和芯片级封装的发光器件
JP2006032490A (ja) * 2004-07-13 2006-02-02 Hitachi Ltd エンジン制御回路装置
US7252408B2 (en) * 2004-07-19 2007-08-07 Lamina Ceramics, Inc. LED array package with internal feedback and control
JP4528062B2 (ja) * 2004-08-25 2010-08-18 富士通株式会社 半導体装置およびその製造方法
US7745832B2 (en) 2004-09-24 2010-06-29 Epistar Corporation Semiconductor light-emitting element assembly with a composite substrate
JP4014591B2 (ja) * 2004-10-05 2007-11-28 シャープ株式会社 半導体装置および電子機器
JP5128047B2 (ja) * 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 光デバイス及び光デバイスの生産方法
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
KR100646093B1 (ko) 2004-12-17 2006-11-15 엘지이노텍 주식회사 발광소자 패키지
US7322732B2 (en) 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
PL1846949T3 (pl) * 2005-01-05 2019-01-31 Philips Lighting Holding B.V. Urządzenie przewodzące cieplnie i elektrycznie
NL1027961C2 (nl) * 2005-01-05 2006-07-06 Lemnis Lighting Ip Gmbh Elektrische schakeling, gebruik van een halfgeleidercomponent en werkwijze voor het vervaardigen van een halfgeleidercomponent.
US7821023B2 (en) * 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7304694B2 (en) * 2005-01-12 2007-12-04 Cree, Inc. Solid colloidal dispersions for backlighting of liquid crystal displays
TWI261936B (en) * 2005-01-25 2006-09-11 Lustrous Technology Ltd LED package structure and mass production method of making the same
US7525248B1 (en) 2005-01-26 2009-04-28 Ac Led Lighting, L.L.C. Light emitting diode lamp
KR101197046B1 (ko) * 2005-01-26 2012-11-06 삼성디스플레이 주식회사 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치
US7284882B2 (en) * 2005-02-17 2007-10-23 Federal-Mogul World Wide, Inc. LED light module assembly
JP2006245336A (ja) * 2005-03-03 2006-09-14 Koito Mfg Co Ltd 発光装置
KR100593935B1 (ko) * 2005-03-24 2006-06-30 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
EP1861876A1 (en) * 2005-03-24 2007-12-05 Tir Systems Ltd. Solid-state lighting device package
WO2006105638A1 (en) * 2005-04-05 2006-10-12 Tir Systems Ltd. Electronic device package with an integrated evaporator
JP2006294782A (ja) * 2005-04-08 2006-10-26 Hitachi Ltd 半導体光源装置
US7918591B2 (en) * 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
US7329942B2 (en) * 2005-05-18 2008-02-12 Ching-Fu Tsou Array-type modularized light-emitting diode structure and a method for packaging the structure
HUE068768T2 (hu) * 2005-05-20 2025-01-28 Signify Holding Bv Fénykibocsátó modul
TW200702824A (en) * 2005-06-02 2007-01-16 Koninkl Philips Electronics Nv LED assembly and module
CN2814677Y (zh) * 2005-06-03 2006-09-06 明达光电(厦门)有限公司 带凹槽式基板的发光二极管
US8272757B1 (en) * 2005-06-03 2012-09-25 Ac Led Lighting, L.L.C. Light emitting diode lamp capable of high AC/DC voltage operation
TWI294694B (en) * 2005-06-14 2008-03-11 Ind Tech Res Inst Led wafer-level chip scale packaging
US20060289887A1 (en) * 2005-06-24 2006-12-28 Jabil Circuit, Inc. Surface mount light emitting diode (LED) assembly with improved power dissipation
US20070007558A1 (en) * 2005-06-27 2007-01-11 Mazzochette Joseph B Light emitting diode package and method for making same
US20060292747A1 (en) * 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink
US7719021B2 (en) * 2005-06-28 2010-05-18 Lighting Science Group Corporation Light efficient LED assembly including a shaped reflective cavity and method for making same
US8079743B2 (en) * 2005-06-28 2011-12-20 Lighting Science Group Corporation Display backlight with improved light coupling and mixing
TWI422044B (zh) * 2005-06-30 2014-01-01 克立公司 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置
WO2007005003A1 (en) * 2005-06-30 2007-01-11 Lamina Ceramics, Inc. Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
US7249868B2 (en) * 2005-07-07 2007-07-31 Visteon Global Technologies, Inc. Lamp housing with interior cooling by a thermoelectric device
US7985357B2 (en) 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
KR100629521B1 (ko) * 2005-07-29 2006-09-28 삼성전자주식회사 Ｌｅｄ 패키지 및 그 제조방법과 이를 이용한 ｌｅｄ어레이 모듈
JP4844045B2 (ja) * 2005-08-18 2011-12-21 Ｔｄｋ株式会社 電子部品及びその製造方法
US7709855B2 (en) * 2005-08-23 2010-05-04 Kabushiki Kaisha Toshiba Light-emitting device, backlight using same, and liquid crystal display
CN101243009A (zh) * 2005-08-23 2008-08-13 皇家飞利浦电子股份有限公司 表面区域具有三维结构的构件的制造方法及陶瓷构件
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
US7196354B1 (en) 2005-09-29 2007-03-27 Luminus Devices, Inc. Wavelength-converting light-emitting devices
KR20070039398A (ko) * 2005-10-07 2007-04-11 히다치 막셀 가부시키가이샤 반도체장치, 반도체 모듈 및 반도체 모듈의 제조방법
KR101241650B1 (ko) * 2005-10-19 2013-03-08 엘지이노텍 주식회사 엘이디 패키지
CN100565950C (zh) * 2005-10-20 2009-12-02 昭和电工株式会社 发光装置安装基片、发光装置安装组件和平面光源装置
WO2007046516A1 (en) * 2005-10-20 2007-04-26 Showa Denko K.K. Luminous device mounting substrate, luminous device mounting package, and planar light source device
TWM295339U (en) * 2005-10-28 2006-08-01 Turning Prec Ind Co Ltd Multilayer LED package structure
US7365988B2 (en) * 2005-11-04 2008-04-29 Graftech International Holdings Inc. Cycling LED heat spreader
US7889502B1 (en) * 2005-11-04 2011-02-15 Graftech International Holdings Inc. Heat spreading circuit assembly
US7505275B2 (en) * 2005-11-04 2009-03-17 Graftech International Holdings Inc. LED with integral via
KR101171186B1 (ko) * 2005-11-10 2012-08-06 삼성전자주식회사 고휘도 발광 다이오드 및 이를 이용한 액정 표시 장치
JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
JP5113329B2 (ja) * 2005-11-25 2013-01-09 パナソニック株式会社 発光装置
US20070120138A1 (en) * 2005-11-28 2007-05-31 Visteon Global Technologies, Inc. Multi-layer light emitting device with integrated thermoelectric chip
US7528422B2 (en) * 2006-01-20 2009-05-05 Hymite A/S Package for a light emitting element with integrated electrostatic discharge protection
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
TW200737430A (en) * 2006-03-17 2007-10-01 Elit Fine Ceramics Co Ltd Method for forming light emitting diode reflector, structure thereof, and light emitting diode mounting device using reflector
CA2540268A1 (fr) * 2006-03-22 2007-09-22 Realights Inc. Procede d'eclairage par insertion de diodes electroluminescents dans l'acrylique
JP4908041B2 (ja) * 2006-03-31 2012-04-04 株式会社沖データ 発光ダイオードアレイ、ｌｅｄヘッド及び画像記録装置
JP2007294863A (ja) * 2006-03-31 2007-11-08 Sanyo Electric Co Ltd 回路装置
US20070235739A1 (en) * 2006-03-31 2007-10-11 Edison Opto Corporation Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
DE102006018161A1 (de) * 2006-04-19 2007-10-25 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Elektronisches Bauelementmodul
CN101432899B (zh) * 2006-04-28 2014-05-28 岛根县 半导体发光组件及其制造方法、半导体发光装置
EP2027412B1 (en) 2006-05-23 2018-07-04 Cree, Inc. Lighting device
CN100536180C (zh) * 2006-05-23 2009-09-02 台达电子工业股份有限公司 发光装置
US7708427B2 (en) * 2006-06-16 2010-05-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Light source device and method of making the device
US7736020B2 (en) * 2006-06-16 2010-06-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Illumination device and method of making the device
JP4946195B2 (ja) * 2006-06-19 2012-06-06 サンケン電気株式会社 半導体発光素子及びその製造方法
US7906794B2 (en) * 2006-07-05 2011-03-15 Koninklijke Philips Electronics N.V. Light emitting device package with frame and optically transmissive element
TWI320237B (en) * 2006-07-24 2010-02-01 Si-substrate and structure of opto-electronic package having the same
US7732233B2 (en) * 2006-07-24 2010-06-08 Touch Micro-System Technology Corp. Method for making light emitting diode chip package
US20090273005A1 (en) * 2006-07-24 2009-11-05 Hung-Yi Lin Opto-electronic package structure having silicon-substrate and method of forming the same
US20090273004A1 (en) * 2006-07-24 2009-11-05 Hung-Yi Lin Chip package structure and method of making the same
US20080023715A1 (en) * 2006-07-28 2008-01-31 Choi Hoi Wai Method of Making White Light LEDs and Continuously Color Tunable LEDs
TW200810145A (en) * 2006-08-04 2008-02-16 Chiang Cheng Ting A lighting structure with light emitting diodes and the method thereof
CN100397669C (zh) * 2006-08-07 2008-06-25 陈盈君 一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法
KR100796522B1 (ko) * 2006-09-05 2008-01-21 삼성전기주식회사 전자소자 내장형 인쇄회로기판의 제조방법
US20080074884A1 (en) * 2006-09-25 2008-03-27 Thye Linn Mok Compact high-intensty LED-based light source and method for making the same
KR101090575B1 (ko) * 2006-09-29 2011-12-08 로무 가부시키가이샤 반도체 발광 장치
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism
CN100510522C (zh) * 2006-10-25 2009-07-08 南茂科技股份有限公司 光源组件
WO2008052327A1 (en) * 2006-10-31 2008-05-08 Tir Technology Lp Lighting device package
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US7667378B2 (en) * 2006-11-14 2010-02-23 Epson Imaging Devices Corporation Illuminating device, electro-optic device, and electronic apparatus
KR20080049947A (ko) * 2006-12-01 2008-06-05 엘지전자 주식회사 방송 시스템, 인터페이스 방법, 및 데이터 구조
TWI320608B (en) * 2006-12-06 2010-02-11 Chipmos Technologies Inc Light emitting chip package and light source module
US8664683B2 (en) 2006-12-21 2014-03-04 Koninklijke Philips N.V. Carrier and optical semiconductor device based on such a carrier
KR100851183B1 (ko) * 2006-12-27 2008-08-08 엘지이노텍 주식회사 반도체 발광소자 패키지
JP2008166440A (ja) * 2006-12-27 2008-07-17 Spansion Llc 半導体装置
US20080158886A1 (en) * 2006-12-29 2008-07-03 Siew It Pang Compact High-Intensity LED Based Light Source
US7576425B2 (en) * 2007-01-25 2009-08-18 Xintec, Inc. Conducting layer in chip package module
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7510400B2 (en) * 2007-03-14 2009-03-31 Visteon Global Technologies, Inc. LED interconnect spring clip assembly
JP4753904B2 (ja) 2007-03-15 2011-08-24 シャープ株式会社 発光装置
KR20080092599A (ko) * 2007-04-12 2008-10-16 엘지이노텍 주식회사 풀 컬러 ｌｅｄ 제어 백라이트 유닛
KR100825766B1 (ko) * 2007-04-26 2008-04-29 한국전자통신연구원 Ｌｔｃｃ 패키지 및 그 제조방법
JP2010527158A (ja) * 2007-05-08 2010-08-05 オッカム ポートフォリオ リミテッド ライアビリティ カンパニー 半田無し発光ダイオード組立品
CN101312226B (zh) * 2007-05-24 2010-07-21 钜亨电子材料元件有限公司 具有水平热扩散件的发光二极管座体结构
EP1998101B2 (en) 2007-05-30 2019-09-25 OSRAM GmbH Lighting device
US7942556B2 (en) * 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
US20090008662A1 (en) * 2007-07-05 2009-01-08 Ian Ashdown Lighting device package
US7621752B2 (en) * 2007-07-17 2009-11-24 Visteon Global Technologies, Inc. LED interconnection integrated connector holder package
KR20090015734A (ko) 2007-08-09 2009-02-12 엘지이노텍 주식회사 광원 장치
GB2455489B (en) * 2007-08-22 2012-05-30 Photonstar Led Ltd High thermal performance packaging for optoelectronics devices
TWI356486B (en) * 2007-09-07 2012-01-11 Young Lighting Technology Led light source module and manufacturing method t
JP4809308B2 (ja) * 2007-09-21 2011-11-09 新光電気工業株式会社 基板の製造方法
TW200917518A (en) * 2007-10-05 2009-04-16 Delta Electronics Inc Co-fired ceramic module
JP2009094409A (ja) * 2007-10-11 2009-04-30 Shinko Electric Ind Co Ltd 半導体パッケージおよびその製造方法
CN100546058C (zh) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 功率发光二极管封装结构
US20100231804A1 (en) * 2007-10-24 2010-09-16 Sharp Kabushiki Kaisha Lighting device for display device, display device, and television receiver
TW200923262A (en) * 2007-11-30 2009-06-01 Tysun Inc High heat dissipation optic module for light emitting diode and its manufacturing method
TW200928203A (en) * 2007-12-24 2009-07-01 Guei-Fang Chen LED illuminating device capable of quickly dissipating heat and its manufacturing method
CN101469845B (zh) * 2007-12-29 2011-08-24 富士迈半导体精密工业（上海）有限公司 照明装置及其电源模组以及使用该照明装置的灯具
WO2009096619A1 (en) * 2008-02-01 2009-08-06 Ytel Photonics Inc. Optical device package and method for manufacturing thereof
US20090195159A1 (en) * 2008-02-03 2009-08-06 Smith Jerry L Led cooling system
JP5146256B2 (ja) * 2008-03-18 2013-02-20 富士通株式会社 シート状構造体及びその製造方法、並びに電子機器及びその製造方法
KR100982986B1 (ko) * 2008-04-17 2010-09-17 삼성엘이디 주식회사 서브마운트, 발광다이오드 패키지 및 그 제조방법
DE102008021435A1 (de) * 2008-04-29 2009-11-19 Schott Ag Gehäuse für LEDs mit hoher Leistung
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
JP5549104B2 (ja) * 2008-05-29 2014-07-16 株式会社リコー 発光装置、光走査装置及び画像形成装置
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
US20100006886A1 (en) * 2008-07-10 2010-01-14 Brilliant Technology Co., Ltd. High power light emitting diode chip package carrier structure
US8492179B2 (en) * 2008-07-11 2013-07-23 Koninklijke Philips N.V. Method of mounting a LED module to a heat sink
GB2458972B (en) * 2008-08-05 2010-09-01 Photonstar Led Ltd Thermally optimised led chip-on-board module
DE102008047100A1 (de) * 2008-09-12 2010-03-25 W.C. Heraeus Gmbh Substrat mit weißer Silberschicht
US8188486B2 (en) * 2008-09-16 2012-05-29 Osram Sylvania Inc. Optical disk for lighting module
US8183585B2 (en) 2008-09-16 2012-05-22 Osram Sylvania Inc. Lighting module
US8022626B2 (en) * 2008-09-16 2011-09-20 Osram Sylvania Inc. Lighting module
US8203266B2 (en) * 2008-10-23 2012-06-19 Hamamatsu Photonics K.K. Electron tube
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
CN101740678A (zh) * 2008-11-10 2010-06-16 富士迈半导体精密工业（上海）有限公司 固态发光元件及光源模组
KR101018191B1 (ko) * 2008-11-27 2011-02-28 삼성엘이디 주식회사 세라믹 패키지 및 이를 구비하는 헤드램프 모듈
US20100226139A1 (en) 2008-12-05 2010-09-09 Permlight Products, Inc. Led-based light engine
US20100149771A1 (en) * 2008-12-16 2010-06-17 Cree, Inc. Methods and Apparatus for Flexible Mounting of Light Emitting Devices
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
KR101114592B1 (ko) * 2009-02-17 2012-03-09 엘지이노텍 주식회사 발광 디바이스 패키지 및 그 제조방법
US8084777B2 (en) * 2009-03-24 2011-12-27 Bridgelux, Inc. Light emitting diode source with protective barrier
JP2010245359A (ja) * 2009-04-08 2010-10-28 Iwatani Internatl Corp 半導体装置
CN101539250A (zh) * 2009-04-21 2009-09-23 薛信培 一种大功率led灯
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
US8598809B2 (en) * 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US20110110071A1 (en) * 2009-09-03 2011-05-12 The Brinkman Corporation Radial light-emitting diode lamp in flat printed circuit board form factor
US20110084612A1 (en) * 2009-10-09 2011-04-14 General Led, Inc., A Delaware Corporation Hybrid chip-on-heatsink device and methods
WO2011060319A1 (en) 2009-11-13 2011-05-19 Uni-Light Llc Led thermal management
KR101619832B1 (ko) 2009-11-30 2016-05-13 삼성전자주식회사 발광다이오드 패키지, 이를 구비한 발광다이오드 패키지 모듈과 그 제조 방법, 및 이를 구비한 헤드 램프 모듈과 그 제어 방법
US8157412B2 (en) * 2009-12-01 2012-04-17 Shin Zu Shing Co., Ltd. Light emitting diode substrate assembly
US8511851B2 (en) * 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
US8286886B2 (en) * 2009-12-23 2012-10-16 Hynix Semiconductor Inc. LED package and RFID system including the same
US8809820B2 (en) * 2010-01-27 2014-08-19 Heraeus Noblelight Fusion Uv Inc. Micro-channel-cooled high heat load light emitting device
KR101055095B1 (ko) * 2010-03-09 2011-08-08 엘지이노텍 주식회사 발광장치
TW201135151A (en) * 2010-04-09 2011-10-16 Wang Xiang Yun Illumination structure
US9240526B2 (en) * 2010-04-23 2016-01-19 Cree, Inc. Solid state light emitting diode packages with leadframes and ceramic material
JP5209075B2 (ja) * 2010-05-21 2013-06-12 有限会社 ナプラ 電子デバイス及びその製造方法
DE102010029529A1 (de) * 2010-05-31 2011-12-01 Osram Gesellschaft mit beschränkter Haftung Bauelementeträger für eine Leuchtvorrichtung, Leuchtvorrichtung, Verfahren zum Herstellen eines Bauelementeträgers und Verfahren zum Bestücken eines Bauelementeträgers
JP5545848B2 (ja) * 2010-06-24 2014-07-09 シチズン電子株式会社 半導体発光装置
DE102010017560A1 (de) * 2010-06-24 2011-12-29 Turck Holding Gmbh Leuchte aufweisend eine Leiterplattenanordnung mit Leuchtdiode
US8269244B2 (en) * 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
CN102315354B (zh) * 2010-06-29 2013-11-06 展晶科技(深圳)有限公司 发光二极管的封装结构
CN101924175B (zh) * 2010-07-12 2013-11-20 深圳大学 一种发光二极管封装装置及封装方法
US9532423B2 (en) 2010-07-23 2016-12-27 Lighting Science Group Corporation System and methods for operating a lighting device
US8253336B2 (en) 2010-07-23 2012-08-28 Biological Illumination, Llc LED lamp for producing biologically-corrected light
US8841864B2 (en) 2011-12-05 2014-09-23 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light
US8760370B2 (en) 2011-05-15 2014-06-24 Lighting Science Group Corporation System for generating non-homogenous light and associated methods
US9024536B2 (en) 2011-12-05 2015-05-05 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light and associated methods
US9681522B2 (en) 2012-05-06 2017-06-13 Lighting Science Group Corporation Adaptive light system and associated methods
US9827439B2 (en) 2010-07-23 2017-11-28 Biological Illumination, Llc System for dynamically adjusting circadian rhythm responsive to scheduled events and associated methods
US8324808B2 (en) 2010-07-23 2012-12-04 Biological Illumination, Llc LED lamp for producing biologically-corrected light
US8743023B2 (en) 2010-07-23 2014-06-03 Biological Illumination, Llc System for generating non-homogenous biologically-adjusted light and associated methods
US8686641B2 (en) 2011-12-05 2014-04-01 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light
CN102339929A (zh) * 2010-07-29 2012-02-01 富士迈半导体精密工业（上海）有限公司 Led发光组件的制造方法
CN101997074A (zh) * 2010-07-30 2011-03-30 晶科电子（广州）有限公司 一种基于硅基板的led表面贴片式封装结构及其封装方法
CN101958393A (zh) * 2010-08-06 2011-01-26 敬俊 一种发光半导体模块结构及其制作方法
DE102010044987A1 (de) * 2010-09-10 2012-03-15 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
MY166609A (en) 2010-09-15 2018-07-17 Semiconductor Components Ind Llc Connector assembly and method of manufacture
US8415704B2 (en) 2010-09-22 2013-04-09 Ut-Battelle, Llc Close-packed array of light emitting devices
US8227813B2 (en) * 2010-09-22 2012-07-24 Bridgelux, Inc. LED light source utilizing magnetic attachment
US8803183B2 (en) * 2010-10-13 2014-08-12 Ho Cheng Industrial Co., Ltd. LED heat-conducting substrate and its thermal module
US8401231B2 (en) 2010-11-09 2013-03-19 Biological Illumination, Llc Sustainable outdoor lighting system for use in environmentally photo-sensitive area
US20120126399A1 (en) * 2010-11-22 2012-05-24 Bridge Semiconductor Corporation Thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
DE102010054898A1 (de) * 2010-12-17 2012-06-21 Osram Opto Semiconductors Gmbh Träger für einen optoelektronischen Halbleiterchip und Halbleiterchip
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
WO2012084662A1 (en) * 2010-12-22 2012-06-28 Microconnections Sas Circuit for a light emitting component and method of manufacturing the same
TWI450425B (zh) 2010-12-31 2014-08-21 財團法人工業技術研究院 晶粒結構、其製造方法及其基板結構
EP2668826B1 (en) * 2011-01-28 2020-03-11 Seoul Semiconductor Co., Ltd. Led luminescence apparatus
US9166126B2 (en) * 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管（led）发光的部件和方法
US8737073B2 (en) * 2011-02-09 2014-05-27 Tsmc Solid State Lighting Ltd. Systems and methods providing thermal spreading for an LED module
US9173269B2 (en) 2011-05-15 2015-10-27 Lighting Science Group Corporation Lighting system for accentuating regions of a layer and associated methods
US8901850B2 (en) 2012-05-06 2014-12-02 Lighting Science Group Corporation Adaptive anti-glare light system and associated methods
US8754832B2 (en) 2011-05-15 2014-06-17 Lighting Science Group Corporation Lighting system for accenting regions of a layer and associated methods
US9217555B2 (en) * 2011-05-17 2015-12-22 Bridgelux Incorporated LED module with integrated thermal spreader
CN102368529A (zh) * 2011-06-03 2012-03-07 王双喜 一种大功率led光源封装结构
DE102011103412A1 (de) * 2011-06-06 2012-12-06 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optolektronischen Halbleiterbauelements und derartiges Halbleiterbauelement
US20130009191A1 (en) * 2011-07-04 2013-01-10 Lite-On Singapore Pte. Ltd. Surface mounted led package and manufacturing method therefor
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
USD700584S1 (en) 2011-07-06 2014-03-04 Cree, Inc. LED component
US9845943B2 (en) 2011-07-22 2017-12-19 Guardian Glass, LLC Heat management subsystems for LED lighting systems, LED lighting systems including heat management subsystems, and/or methods of making the same
US8992045B2 (en) 2011-07-22 2015-03-31 Guardian Industries Corp. LED lighting systems and/or methods of making the same
US8540394B2 (en) * 2011-07-22 2013-09-24 Guardian Industries Corp. Collimating lenses for LED lighting systems, LED lighting systems including collimating lenses, and/or methods of making the same
US8742655B2 (en) 2011-07-22 2014-06-03 Guardian Industries Corp. LED lighting systems with phosphor subassemblies, and/or methods of making the same
KR101850434B1 (ko) 2011-07-29 2018-04-19 엘지이노텍 주식회사 광원 모듈 및 이를 포함하는 조명시스템
US20130037311A1 (en) * 2011-08-12 2013-02-14 Applied Nanotech Holdings, Inc. Functionalization of thermal management materials
KR101853067B1 (ko) 2011-08-26 2018-04-27 엘지이노텍 주식회사 발광 소자 패키지
KR101817807B1 (ko) 2011-09-20 2018-01-11 엘지이노텍 주식회사 발광소자 패키지 및 이를 포함하는 조명시스템
US20130069218A1 (en) * 2011-09-20 2013-03-21 Stmicroelectronics Asia Pacific Pte Ltd. High density package interconnect with copper heat spreader and method of making the same
DE102012101560B4 (de) * 2011-10-27 2016-02-04 Epcos Ag Leuchtdiodenvorrichtung
DE102012101606B4 (de) 2011-10-28 2024-11-21 Tdk Electronics Ag ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED
US20120074455A1 (en) * 2011-11-20 2012-03-29 Foxsemicon Integrated Technology, Inc. Led package structure
US20130134898A1 (en) * 2011-11-29 2013-05-30 International Business Machines Corporation Light Emitting Diode Producing Any Desired Color
US8866414B2 (en) 2011-12-05 2014-10-21 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light
US9220202B2 (en) 2011-12-05 2015-12-29 Biological Illumination, Llc Lighting system to control the circadian rhythm of agricultural products and associated methods
US9913341B2 (en) 2011-12-05 2018-03-06 Biological Illumination, Llc LED lamp for producing biologically-adjusted light including a cyan LED
US8963450B2 (en) 2011-12-05 2015-02-24 Biological Illumination, Llc Adaptable biologically-adjusted indirect lighting device and associated methods
US9289574B2 (en) 2011-12-05 2016-03-22 Biological Illumination, Llc Three-channel tuned LED lamp for producing biologically-adjusted light
EP2800926B1 (en) * 2012-01-06 2017-05-31 Thermal Solution Resources, LLC Led lamps with enhanced wireless communication
AT14124U1 (de) * 2012-02-13 2015-04-15 Tridonic Jennersdorf Gmbh LED-Modul mit Flächenverguß
TW201344093A (zh) * 2012-04-18 2013-11-01 Gem Weltronics Twn Corp 一體化多層式照明裝置及可倍數組合之一體化多層式照明裝置
DE102012213178A1 (de) * 2012-04-30 2013-10-31 At & S Austria Technologie & Systemtechnik Aktiengesellschaft LED-Modul mit Leiterplatte
US9402294B2 (en) 2012-05-08 2016-07-26 Lighting Science Group Corporation Self-calibrating multi-directional security luminaire and associated methods
US8680457B2 (en) 2012-05-07 2014-03-25 Lighting Science Group Corporation Motion detection system and associated methods having at least one LED of second set of LEDs to vary its voltage
US9006987B2 (en) 2012-05-07 2015-04-14 Lighting Science Group, Inc. Wall-mountable luminaire and associated systems and methods
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
WO2013183693A1 (ja) * 2012-06-07 2013-12-12 株式会社Ｓｔｅｑ Ｌｅｄ照明モジュールおよびｌｅｄ照明装置
DE102012108107A1 (de) * 2012-08-31 2014-03-27 Epcos Ag Leuchtdiodenvorrichtung
US9174067B2 (en) 2012-10-15 2015-11-03 Biological Illumination, Llc System for treating light treatable conditions and associated methods
WO2014073038A1 (ja) 2012-11-06 2014-05-15 日本碍子株式会社 発光ダイオード用基板
EP2919287B1 (en) 2012-11-06 2019-12-25 NGK Insulators, Ltd. Substrate for light emitting diodes
CN104854718B (zh) 2012-12-11 2018-06-12 传感器电子技术股份有限公司 具有集成的热沉的热管理结构
TWI550920B (zh) * 2012-12-13 2016-09-21 鴻海精密工業股份有限公司 發光二極體
US9136442B2 (en) * 2013-01-25 2015-09-15 Tsmc Solid State Lighting Ltd. Multi-vertical LED packaging structure
US9420682B2 (en) * 2013-02-25 2016-08-16 Abl Ip Holding Llc Heterogeneous thermal interface
US9347655B2 (en) 2013-03-11 2016-05-24 Lighting Science Group Corporation Rotatable lighting device
US9082868B2 (en) 2013-03-13 2015-07-14 Semiconductor Components Industries, Llc Semiconductor component and method of manufacture
US20140268731A1 (en) 2013-03-15 2014-09-18 Lighting Science Group Corpporation Low bay lighting system and associated methods
US9935251B1 (en) * 2013-03-15 2018-04-03 Hutchinson Technology Incorporated LED chip packaging with high performance thermal dissipation
CN103354269B (zh) * 2013-06-17 2016-01-13 苏州晶品光电科技有限公司 高可靠性smd led封装结构
CN203377255U (zh) * 2013-06-27 2014-01-01 比亚迪股份有限公司 Led散热支架
CN103579030B (zh) * 2013-10-30 2016-01-13 深圳市志金电子有限公司 一种新型芯片封装方法及芯片封装结构
DE102014204116A1 (de) * 2014-03-06 2015-09-10 Osram Gmbh LED-Modul mit Substratkörper
WO2015153903A1 (en) * 2014-04-02 2015-10-08 Kyocera America, Inc. Heat management in electronics packaging
CN105321937A (zh) * 2014-06-25 2016-02-10 常州欧密格光电科技有限公司 超小超薄高光效侧射型高亮白光多晶led元件
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US9648750B2 (en) * 2014-09-30 2017-05-09 Rsm Electron Power, Inc. Light emitting diode (LED) assembly and flexible circuit board with improved thermal conductivity
JP2015073131A (ja) * 2015-01-05 2015-04-16 ローム株式会社 Ｌｅｄ発光体およびｌｅｄ電球
JP6156402B2 (ja) * 2015-02-13 2017-07-05 日亜化学工業株式会社 発光装置
US10629513B2 (en) * 2015-06-04 2020-04-21 Eaton Intelligent Power Limited Ceramic plated materials for electrical isolation and thermal transfer
JP6030193B2 (ja) * 2015-07-23 2016-11-24 シャープ株式会社 発光装置用基板
DE102015112280A1 (de) 2015-07-28 2017-02-02 Osram Opto Semiconductors Gmbh Bauelement mit einem metallischen Träger und Verfahren zur Herstellung von Bauelementen
DE102015115713A1 (de) * 2015-09-17 2017-03-23 Hytecon Ag Vorrichtung und Verfahren zur Behandlung von Fluiden
CN106816513B (zh) * 2015-11-30 2019-06-28 讯芯电子科技（中山）有限公司 Led芯片的封装结构及其制造方法
JP6242437B2 (ja) * 2016-06-10 2017-12-06 シャープ株式会社 発光装置
US10256218B2 (en) * 2017-07-11 2019-04-09 Samsung Electronics Co., Ltd. Light emitting device package
DE102017117165B4 (de) * 2017-07-28 2023-04-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils
US10999976B2 (en) 2017-09-19 2021-05-11 Agnetix, Inc. Fluid-cooled lighting systems and kits for controlled agricultural environments, and methods for installing same
EP3662201B1 (en) 2017-09-19 2023-06-07 Agnetix, Inc. Fluid-cooled led-based lighting methods and apparatus for controlled environment agriculture
US11013078B2 (en) 2017-09-19 2021-05-18 Agnetix, Inc. Integrated sensor assembly for LED-based controlled environment agriculture (CEA) lighting, and methods and apparatus employing same
WO2019188063A1 (ja) * 2018-03-27 2019-10-03 ソニーセミコンダクタソリューションズ株式会社 素子組立体及び素子・実装用基板組立体
CN112351676B (zh) 2018-05-04 2023-09-26 阿格尼泰克斯股份有限公司 用于受控农业环境中的照明和分布式感测的方法、设备和系统
KR102635813B1 (ko) 2018-11-13 2024-02-08 아그네틱스, 인크. 통합된 카메라 및/또는 센서 및 무선 통신 수단을 구비한 환경 제어 농업을 위한 유체 냉각식 led-기반 조명 방법 및 장치
WO2020133381A1 (zh) * 2018-12-29 2020-07-02 泉州三安半导体科技有限公司 一种激光器封装结构
TWI692100B (zh) * 2019-07-04 2020-04-21 宏碁股份有限公司 微型發光顯示器及其製造方法
CN112259529B (zh) * 2019-07-22 2023-05-12 宏碁股份有限公司 微型发光显示器及其制造方法
US11837684B2 (en) * 2019-11-21 2023-12-05 Creeled, Inc. Submount structures for light emitting diode packages
IL293798A (en) 2019-12-10 2022-08-01 Agnetix Inc Multisensory imaging methods and devices for plant growth in a controlled environment using projectors and cameras and/or sensors
IL293805A (en) 2019-12-12 2022-08-01 Agnetix Inc Fluid-cooled led-based lighting fixture in close proximity grow systems for controlled environment horticulture
JP7497578B2 (ja) * 2020-02-26 2024-06-11 富士フイルムビジネスイノベーション株式会社 発光装置、光学装置及び情報処理装置
DE102020205043B4 (de) * 2020-04-21 2024-07-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zur Herstellung einer Leistungshalbleiterbauelementanordnung oder Leistungshalbleiterbauelementeinhausung
FR3114635B1 (fr) * 2020-09-30 2022-10-14 Valeo Vision Module lumineux de véhicule automobile comprenant un substrat en céramique
JP2023000940A (ja) * 2021-06-18 2023-01-04 株式会社小糸製作所 光源ユニット
TWI797845B (zh) * 2021-11-24 2023-04-01 財團法人工業技術研究院 封裝散熱結構及包含其的晶片
CN116995170B (zh) * 2023-05-24 2024-11-15 佛山大学 一种电极封装结构和发光模组

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JPH0361556A (ja) * 1989-07-31 1991-03-18 Ricoh Co Ltd 光プリントヘッド
JPH04247645A (ja) * 1991-02-04 1992-09-03 Nissan Motor Co Ltd 金属基板の実装構造
JPH04369873A (ja) * 1991-06-19 1992-12-22 Matsushita Electric Ind Co Ltd 光電子ｉｃモジュール
JPH07263625A (ja) * 1993-12-08 1995-10-13 Hughes Aircraft Co 誘電体テープから形成されたディスクリートなチップキャリアを有する垂直なｉｃチップ積層体
JPH10321909A (ja) * 1997-05-19 1998-12-04 Nichia Chem Ind Ltd 半導体装置
JP2000236116A (ja) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd 光源装置
JP2000353826A (ja) * 1999-06-09 2000-12-19 Sanyo Electric Co Ltd 混成集積回路装置および光照射装置
JP2002232017A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 発光素子収納用パッケージおよびその製造方法
JP2002314148A (ja) * 2001-04-13 2002-10-25 Citizen Electronics Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2003031850A (ja) * 2001-04-25 2003-01-31 Agilent Technol Inc 光 源
JP2003060106A (ja) * 2001-08-21 2003-02-28 Matsushita Electric Ind Co Ltd 積層セラミックパッケージおよびこれを用いた電子部品
WO2003034508A1 (fr) * 2001-10-12 2003-04-24 Nichia Corporation Dispositif d'emission de lumiere et procede de fabrication de celui-ci

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711789A (en) 1970-11-18 1973-01-16 Texas Instruments Inc Diode array assembly for diode pumped lasers
US5140220A (en) * 1985-12-02 1992-08-18 Yumi Sakai Light diffusion type light emitting diode
US5660481A (en) 1987-05-29 1997-08-26 Ide; Russell D. Hydrodynamic bearings having beam mounted bearing pads and sealed bearing assemblies including the same
CA1284536C (en) * 1987-07-03 1991-05-28 Akira Sasame Member for semiconductor apparatus
DE3736519A1 (de) 1987-10-28 1989-05-11 Standard Elektrik Lorenz Ag Gleichstrommaschine mit permanentmagnetischem staender
JP2503685B2 (ja) * 1989-10-23 1996-06-05 日本電気株式会社 ヒ―トシンク付半導体装置
US5122781A (en) * 1990-09-06 1992-06-16 Bolan Trading Inc. Hazard warning light
FI95540C (fi) * 1990-09-25 1996-02-26 Ahlstroem Oy Menetelmä ja laite kaasun erottamiseksi kiintoainetta sisältävästä nesteestä
US5482898A (en) * 1993-04-12 1996-01-09 Amkor Electronics, Inc. Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
US5581876A (en) * 1995-01-27 1996-12-10 David Sarnoff Research Center, Inc. Method of adhering green tape to a metal support substrate with a bonding glass
US5725808A (en) * 1996-05-23 1998-03-10 David Sarnoff Research Center, Inc. Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
JPH1012926A (ja) * 1996-06-20 1998-01-16 Toyoda Gosei Co Ltd 全色発光型発光ダイオードランプ及びディスプレイ装置
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US5745624A (en) * 1996-08-23 1998-04-28 The Boeing Company Automatic alignment and locking method and apparatus for fiber optic module manufacturing
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US5847935A (en) * 1996-12-16 1998-12-08 Sarnoff Corporation Electronic circuit chip package
US5953203A (en) * 1997-03-06 1999-09-14 Sarnoff Corporation Multilayer ceramic circuit boards including embedded capacitors
US5841244A (en) 1997-06-18 1998-11-24 Northrop Grumman Corporation RF coil/heat pipe for solid state light driver
CA2298491C (en) 1997-07-25 2009-10-06 Nichia Chemical Industries, Ltd. Nitride semiconductor device
US6016038A (en) 1997-08-26 2000-01-18 Color Kinetics, Inc. Multicolored LED lighting method and apparatus
JP3618534B2 (ja) * 1997-11-28 2005-02-09 同和鉱業株式会社 光通信用ランプ装置とその製造方法
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
US6016036A (en) * 1998-01-28 2000-01-18 Eaton Corporation Magnetic filter for ion source
US6046240A (en) * 1998-05-01 2000-04-04 Harvard Scientific Corporation Methods for treating female sexual dysfunction
KR100282819B1 (ko) * 1998-08-20 2001-03-02 김충섭 조합화학합성에 유용한 신규 할로겐화 왕레진
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
WO2000017569A1 (en) * 1998-09-17 2000-03-30 Koninklijke Philips Electronics N.V. Led lamp
US6793374B2 (en) 1998-09-17 2004-09-21 Simon H. A. Begemann LED lamp
US6325524B1 (en) * 1999-01-29 2001-12-04 Agilent Technologies, Inc. Solid state based illumination source for a projection display
US6259846B1 (en) 1999-02-23 2001-07-10 Sarnoff Corporation Light-emitting fiber, as for a display
JP2000294701A (ja) 1999-04-02 2000-10-20 Nkk Seimitsu Kk 半導体用ケース
US6455930B1 (en) * 1999-12-13 2002-09-24 Lamina Ceramics, Inc. Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US6847935B1 (en) * 1999-12-22 2005-01-25 Parago, Inc. System and method for computer-aided rebate processing
US6885035B2 (en) 1999-12-22 2005-04-26 Lumileds Lighting U.S., Llc Multi-chip semiconductor LED assembly
US6362578B1 (en) 1999-12-23 2002-03-26 Stmicroelectronics, Inc. LED driver circuit and method
US6318886B1 (en) 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
DE10038213A1 (de) * 2000-08-04 2002-03-07 Osram Opto Semiconductors Gmbh Strahlungsquelle und Verfahren zur Herstellung einer Linsensform
ATE508676T1 (de) * 2001-03-15 2011-05-15 Amo Wavefront Sciences Llc Topografisches wellenfrontanalysesystem und abbildungsverfahren für ein optisches system
US6518502B2 (en) * 2001-05-10 2003-02-11 Lamina Ceramics, In Ceramic multilayer circuit boards mounted on a patterned metal support substrate
KR100419611B1 (ko) * 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
US6474858B1 (en) * 2001-05-24 2002-11-05 Ching-Shin Liao Illumination device with an outer tube encasing a transparent center rod
EP2241803B1 (en) * 2001-05-26 2018-11-07 GE Lighting Solutions, LLC High power LED-lamp for spot illumination
US6581876B2 (en) * 2001-07-25 2003-06-24 The Boeing Company Aircraft multi-function overhead space access module
US6634770B2 (en) * 2001-08-24 2003-10-21 Densen Cao Light source using semiconductor devices mounted on a heat sink
US20030057421A1 (en) * 2001-09-27 2003-03-27 Tzer-Perng Chen High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate
US6692252B2 (en) * 2001-12-17 2004-02-17 Ultradent Products, Inc. Heat sink with geometric arrangement of LED surfaces
US6480389B1 (en) * 2002-01-04 2002-11-12 Opto Tech Corporation Heat dissipation structure for solid-state light emitting device package
US6827469B2 (en) 2003-02-03 2004-12-07 Osram Sylvania Inc. Solid-state automotive lamp
US7095053B2 (en) 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
US7033060B2 (en) 2003-05-23 2006-04-25 Gelcore Llc Method and apparatus for irradiation of plants using light emitting diodes
US7964883B2 (en) 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
US20050225222A1 (en) 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JPH0361556A (ja) * 1989-07-31 1991-03-18 Ricoh Co Ltd 光プリントヘッド
JPH04247645A (ja) * 1991-02-04 1992-09-03 Nissan Motor Co Ltd 金属基板の実装構造
JPH04369873A (ja) * 1991-06-19 1992-12-22 Matsushita Electric Ind Co Ltd 光電子ｉｃモジュール
JPH07263625A (ja) * 1993-12-08 1995-10-13 Hughes Aircraft Co 誘電体テープから形成されたディスクリートなチップキャリアを有する垂直なｉｃチップ積層体
JPH10321909A (ja) * 1997-05-19 1998-12-04 Nichia Chem Ind Ltd 半導体装置
JP2000236116A (ja) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd 光源装置
JP2000353826A (ja) * 1999-06-09 2000-12-19 Sanyo Electric Co Ltd 混成集積回路装置および光照射装置
JP2002232017A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 発光素子収納用パッケージおよびその製造方法
JP2002314148A (ja) * 2001-04-13 2002-10-25 Citizen Electronics Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2003031850A (ja) * 2001-04-25 2003-01-31 Agilent Technol Inc 光 源
JP2003060106A (ja) * 2001-08-21 2003-02-28 Matsushita Electric Ind Co Ltd 積層セラミックパッケージおよびこれを用いた電子部品
WO2003034508A1 (fr) * 2001-10-12 2003-04-24 Nichia Corporation Dispositif d'emission de lumiere et procede de fabrication de celui-ci

Also Published As

Publication number Publication date
US20050029535A1 (en) 2005-02-10
KR20060026015A (ko) 2006-03-22
US20040222433A1 (en) 2004-11-11
EP1620896A2 (en) 2006-02-01
JP2006525679A (ja) 2006-11-09
KR101095291B1 (ko) 2011-12-16
WO2004100343A3 (en) 2005-05-19
US7176502B2 (en) 2007-02-13
US7098483B2 (en) 2006-08-29
US7095053B2 (en) 2006-08-22
US20050161682A1 (en) 2005-07-28
WO2004100343A2 (en) 2004-11-18

Similar Documents

Publication Publication Date Title
JP4912876B2 (ja) 高温動作用にパッケージ化された発光ダイオード
US7528421B2 (en) Surface mountable light emitting diode assemblies packaged for high temperature operation
US7300182B2 (en) LED light sources for image projection systems
US7728341B2 (en) Illumination device for providing directionally guided light
US7473933B2 (en) High power LED package with universal bonding pads and interconnect arrangement
US6492725B1 (en) Concentrically leaded power semiconductor device package
US7670872B2 (en) Method of manufacturing ceramic LED packages
CN102148316B (zh) 采用电表面安装的发光晶片封装
US8487339B2 (en) Light-emitting diode chip package body and method for manufacturing same
JP4915058B2 (ja) Ｌｅｄ部品およびその製造方法
US20070176182A1 (en) Structure for integrating LED circuit onto heat-dissipation substrate
US20060289887A1 (en) Surface mount light emitting diode (LED) assembly with improved power dissipation

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070413

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070413

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100805

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100901

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20101201

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20101208

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20101227

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110301

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110622

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111021

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111101

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20111021

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20111114

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111226

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120118

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150127

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees