CN100397669C - 一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法 - Google Patents
一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法 Download PDFInfo
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- CN100397669C CN100397669C CNB2006100620086A CN200610062008A CN100397669C CN 100397669 C CN100397669 C CN 100397669C CN B2006100620086 A CNB2006100620086 A CN B2006100620086A CN 200610062008 A CN200610062008 A CN 200610062008A CN 100397669 C CN100397669 C CN 100397669C
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100620086A CN100397669C (zh) | 2006-08-07 | 2006-08-07 | 一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法 |
Applications Claiming Priority (1)
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CNB2006100620086A CN100397669C (zh) | 2006-08-07 | 2006-08-07 | 一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN1905223A CN1905223A (zh) | 2007-01-31 |
CN100397669C true CN100397669C (zh) | 2008-06-25 |
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CNB2006100620086A Expired - Fee Related CN100397669C (zh) | 2006-08-07 | 2006-08-07 | 一种使用热电分离设计的低温共烧陶瓷的led光源的制备方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102644867A (zh) * | 2012-03-13 | 2012-08-22 | 广东奥其斯科技有限公司 | 一种具有高集成高光效的热电分离功率型发光二极体灯泡 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7964888B2 (en) * | 2007-04-18 | 2011-06-21 | Cree, Inc. | Semiconductor light emitting device packages and methods |
CN101409320B (zh) * | 2007-10-09 | 2010-06-23 | 富士迈半导体精密工业(上海)有限公司 | 基板制作方法 |
JP5104385B2 (ja) * | 2008-02-20 | 2012-12-19 | 豊田合成株式会社 | Ledランプモジュール |
CN101681904B (zh) * | 2008-05-30 | 2012-05-09 | 香港应用科技研究院有限公司 | 多芯片封装 |
CN101635285B (zh) * | 2008-07-24 | 2012-06-13 | 达方电子股份有限公司 | 具有散热功能的陶瓷基板结构及其制造方法 |
KR20120128962A (ko) * | 2011-05-18 | 2012-11-28 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
CN102368532A (zh) * | 2011-06-03 | 2012-03-07 | 王双喜 | 一种带金属散热片的led封装结构 |
CN103531702A (zh) * | 2012-07-03 | 2014-01-22 | 深圳市蓝科电子有限公司 | 一种倒装晶片的led结构 |
CN104037305B (zh) * | 2014-07-01 | 2016-11-23 | 江阴长电先进封装有限公司 | 一种低热阻的晶圆级led封装方法及其封装结构 |
CN106793458B (zh) * | 2016-12-15 | 2023-11-24 | 北京小鸟看看科技有限公司 | 用于发热元器件的印制电路板、印制装配板及电子设备 |
CN107768366A (zh) * | 2017-11-23 | 2018-03-06 | 广东金源照明科技股份有限公司 | 一种填埋热保护ic的cob封装及其封装方法 |
CN108807357B (zh) * | 2018-06-19 | 2020-06-23 | 江苏守恒建设集团有限公司 | 一种led照明装置及其制造方法 |
CN112103258B (zh) * | 2020-11-12 | 2021-03-09 | 珠海越亚半导体股份有限公司 | 一种双面开窗封装结构及其制造方法 |
TWI769932B (zh) * | 2021-10-03 | 2022-07-01 | 郭明騰 | 光源模組 |
TWI769090B (zh) * | 2021-10-03 | 2022-06-21 | 郭明騰 | 光源模組 |
TWI797845B (zh) * | 2021-11-24 | 2023-04-01 | 財團法人工業技術研究院 | 封裝散熱結構及包含其的晶片 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030020149A1 (en) * | 2001-03-22 | 2003-01-30 | Hiroshi Ogura | Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same |
JP2003068954A (ja) * | 2001-08-28 | 2003-03-07 | Kyocera Corp | 半導体素子収納用パッケージ |
JP2003110044A (ja) * | 2001-07-25 | 2003-04-11 | Kyocera Corp | 半導体素子収納用パッケージ |
US20040222433A1 (en) * | 2003-05-05 | 2004-11-11 | Lamina Ceramics | Light emitting diodes packaged for high temperature operation |
JP2006108432A (ja) * | 2004-10-06 | 2006-04-20 | Sumitomo Metal Electronics Devices Inc | 発光素子収納用パッケージ |
-
2006
- 2006-08-07 CN CNB2006100620086A patent/CN100397669C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030020149A1 (en) * | 2001-03-22 | 2003-01-30 | Hiroshi Ogura | Laser-working dielectric substrate and method for working same and semiconductor package and method for manufacturing same |
JP2003110044A (ja) * | 2001-07-25 | 2003-04-11 | Kyocera Corp | 半導体素子収納用パッケージ |
JP2003068954A (ja) * | 2001-08-28 | 2003-03-07 | Kyocera Corp | 半導体素子収納用パッケージ |
US20040222433A1 (en) * | 2003-05-05 | 2004-11-11 | Lamina Ceramics | Light emitting diodes packaged for high temperature operation |
JP2006108432A (ja) * | 2004-10-06 | 2006-04-20 | Sumitomo Metal Electronics Devices Inc | 発光素子収納用パッケージ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102644867A (zh) * | 2012-03-13 | 2012-08-22 | 广东奥其斯科技有限公司 | 一种具有高集成高光效的热电分离功率型发光二极体灯泡 |
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Publication number | Publication date |
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CN1905223A (zh) | 2007-01-31 |
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