FR3114635B1 - Module lumineux de véhicule automobile comprenant un substrat en céramique - Google Patents

Module lumineux de véhicule automobile comprenant un substrat en céramique Download PDF

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Publication number
FR3114635B1
FR3114635B1 FR2010015A FR2010015A FR3114635B1 FR 3114635 B1 FR3114635 B1 FR 3114635B1 FR 2010015 A FR2010015 A FR 2010015A FR 2010015 A FR2010015 A FR 2010015A FR 3114635 B1 FR3114635 B1 FR 3114635B1
Authority
FR
France
Prior art keywords
ceramic substrate
motor vehicle
light module
vehicle light
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2010015A
Other languages
English (en)
Other versions
FR3114635A1 (fr
Inventor
Alexandre Val
Samuel Daroussin
Lamberterie Antoine De
Zdravko Zojceski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Priority to FR2010015A priority Critical patent/FR3114635B1/fr
Priority to CN202180072486.8A priority patent/CN116530219A/zh
Priority to EP21783534.7A priority patent/EP4223085A1/fr
Priority to US18/246,953 priority patent/US20230363088A1/en
Priority to PCT/EP2021/077023 priority patent/WO2022069673A1/fr
Publication of FR3114635A1 publication Critical patent/FR3114635A1/fr
Application granted granted Critical
Publication of FR3114635B1 publication Critical patent/FR3114635B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L’invention concerne un module lumineux d’un dispositif de signalisation d’un véhicule automobile, comprenant un substrat en céramique comprenant des première et deuxième faces opposées, et une pluralité de sources lumineuses activables sélectivement montées sur la première face du substrat en céramique, chacune des première et deuxième faces du substrat en céramique étant pourvue d’au moins une première couche, respectivement d’une deuxième couche, d’interconnexion, caractérisé en ce que le substrat en céramique comporte une pluralité de trous traversants agencés pour interconnecter la première couche d’interconnexion à la deuxième couche d’interconnexion. (Fig. 1)
FR2010015A 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique Active FR3114635B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR2010015A FR3114635B1 (fr) 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique
CN202180072486.8A CN116530219A (zh) 2020-09-30 2021-09-30 包括陶瓷衬底的机动车辆照明模块
EP21783534.7A EP4223085A1 (fr) 2020-09-30 2021-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique
US18/246,953 US20230363088A1 (en) 2020-09-30 2021-09-30 Motor vehicle lighting module comprising a ceramic substrate
PCT/EP2021/077023 WO2022069673A1 (fr) 2020-09-30 2021-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2010015A FR3114635B1 (fr) 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique
FR2010015 2020-09-30

Publications (2)

Publication Number Publication Date
FR3114635A1 FR3114635A1 (fr) 2022-04-01
FR3114635B1 true FR3114635B1 (fr) 2022-10-14

Family

ID=73699043

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2010015A Active FR3114635B1 (fr) 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique

Country Status (5)

Country Link
US (1) US20230363088A1 (fr)
EP (1) EP4223085A1 (fr)
CN (1) CN116530219A (fr)
FR (1) FR3114635B1 (fr)
WO (1) WO2022069673A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007023918A1 (de) * 2007-05-23 2008-11-27 Siemens Ag Österreich Beleuchtungseinheit
DE102007041335A1 (de) * 2007-08-31 2009-03-05 Siemens Ag Österreich Vorrichtung zur Anordnung von LED-Leuchten
TW200917518A (en) * 2007-10-05 2009-04-16 Delta Electronics Inc Co-fired ceramic module
TWI415528B (zh) * 2008-04-24 2013-11-11 Kinik Co 高導熱性電路載板及其製作方法
TW201017499A (en) * 2008-10-27 2010-05-01 Tpk Touch Solutions Inc Manufacturing method and structure of curved-surface capacitive touch panel
TW201138165A (en) * 2010-04-23 2011-11-01 yi-zhang Chen High heat-dissipation LED non-metal substrate and manufacturing method thereof and high heat-dissipation LED component and manufacturing method thereof
JP2013080904A (ja) * 2011-09-22 2013-05-02 Hoya Corp 基板製造方法、配線基板の製造方法、ガラス基板および配線基板

Also Published As

Publication number Publication date
EP4223085A1 (fr) 2023-08-09
FR3114635A1 (fr) 2022-04-01
CN116530219A (zh) 2023-08-01
WO2022069673A1 (fr) 2022-04-07
US20230363088A1 (en) 2023-11-09

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