FR3114635B1 - Module lumineux de véhicule automobile comprenant un substrat en céramique - Google Patents

Module lumineux de véhicule automobile comprenant un substrat en céramique Download PDF

Info

Publication number
FR3114635B1
FR3114635B1 FR2010015A FR2010015A FR3114635B1 FR 3114635 B1 FR3114635 B1 FR 3114635B1 FR 2010015 A FR2010015 A FR 2010015A FR 2010015 A FR2010015 A FR 2010015A FR 3114635 B1 FR3114635 B1 FR 3114635B1
Authority
FR
France
Prior art keywords
ceramic substrate
motor vehicle
light module
vehicle light
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2010015A
Other languages
English (en)
Other versions
FR3114635A1 (fr
Inventor
Alexandre Val
Samuel Daroussin
Lamberterie Antoine De
Zdravko Zojceski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Priority to FR2010015A priority Critical patent/FR3114635B1/fr
Priority to CN202180072486.8A priority patent/CN116530219A/zh
Priority to US18/246,953 priority patent/US12225662B2/en
Priority to EP21783534.7A priority patent/EP4223085A1/fr
Priority to PCT/EP2021/077023 priority patent/WO2022069673A1/fr
Publication of FR3114635A1 publication Critical patent/FR3114635A1/fr
Application granted granted Critical
Publication of FR3114635B1 publication Critical patent/FR3114635B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Structure Of Printed Boards (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L’invention concerne un module lumineux d’un dispositif de signalisation d’un véhicule automobile, comprenant un substrat en céramique comprenant des première et deuxième faces opposées, et une pluralité de sources lumineuses activables sélectivement montées sur la première face du substrat en céramique, chacune des première et deuxième faces du substrat en céramique étant pourvue d’au moins une première couche, respectivement d’une deuxième couche, d’interconnexion, caractérisé en ce que le substrat en céramique comporte une pluralité de trous traversants agencés pour interconnecter la première couche d’interconnexion à la deuxième couche d’interconnexion. (Fig. 1)
FR2010015A 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique Active FR3114635B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR2010015A FR3114635B1 (fr) 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique
CN202180072486.8A CN116530219A (zh) 2020-09-30 2021-09-30 包括陶瓷衬底的机动车辆照明模块
US18/246,953 US12225662B2 (en) 2020-09-30 2021-09-30 Motor vehicle lighting module comprising a ceramic substrate
EP21783534.7A EP4223085A1 (fr) 2020-09-30 2021-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique
PCT/EP2021/077023 WO2022069673A1 (fr) 2020-09-30 2021-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2010015A FR3114635B1 (fr) 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique
FR2010015 2020-09-30

Publications (2)

Publication Number Publication Date
FR3114635A1 FR3114635A1 (fr) 2022-04-01
FR3114635B1 true FR3114635B1 (fr) 2022-10-14

Family

ID=73699043

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2010015A Active FR3114635B1 (fr) 2020-09-30 2020-09-30 Module lumineux de véhicule automobile comprenant un substrat en céramique

Country Status (5)

Country Link
US (1) US12225662B2 (fr)
EP (1) EP4223085A1 (fr)
CN (1) CN116530219A (fr)
FR (1) FR3114635B1 (fr)
WO (1) WO2022069673A1 (fr)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001305980A (ja) * 2000-04-19 2001-11-02 Mitsubishi Electric Engineering Co Ltd ドライブ基板を備えたｌｅｄ表示装置
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US20080179618A1 (en) * 2007-01-26 2008-07-31 Ching-Tai Cheng Ceramic led package
DE102007023918A1 (de) 2007-05-23 2008-11-27 Siemens Ag Österreich Beleuchtungseinheit
DE102007041335A1 (de) * 2007-08-31 2009-03-05 Siemens Ag Österreich Vorrichtung zur Anordnung von LED-Leuchten
TW200917518A (en) * 2007-10-05 2009-04-16 Delta Electronics Inc Co-fired ceramic module
TWI415528B (zh) * 2008-04-24 2013-11-11 Kinik Co 高導熱性電路載板及其製作方法
TW201017499A (en) * 2008-10-27 2010-05-01 Tpk Touch Solutions Inc Manufacturing method and structure of curved-surface capacitive touch panel
EP2273181B1 (fr) * 2009-07-07 2014-05-07 Siteco Beleuchtungstechnik GmbH Luminaire d'intérieur ou d'exterieur
WO2011104963A1 (fr) * 2010-02-25 2011-09-01 旭硝子株式会社 Substrat pour monter un élément luminescent, et dispositif luminescent
TW201138165A (en) * 2010-04-23 2011-11-01 yi-zhang Chen High heat-dissipation LED non-metal substrate and manufacturing method thereof and high heat-dissipation LED component and manufacturing method thereof
EP2694876A1 (fr) * 2011-04-04 2014-02-12 CeramTec GmbH Lampe à diode électroluminescente comprenant une diode électroluminescente comme moyen d'éclairage et un réflecteur en verre ou en plastique
JP2013080904A (ja) * 2011-09-22 2013-05-02 Hoya Corp 基板製造方法、配線基板の製造方法、ガラス基板および配線基板
KR102161078B1 (ko) * 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제작 방법
US9873446B2 (en) * 2014-07-23 2018-01-23 Tk Holdings, Inc. Steering grip light bar systems
EP3450833B1 (fr) * 2017-08-31 2022-11-02 Valeo Iluminacion Dispositif électronique et module d'éclairage

Also Published As

Publication number Publication date
US20230363088A1 (en) 2023-11-09
FR3114635A1 (fr) 2022-04-01
EP4223085A1 (fr) 2023-08-09
WO2022069673A1 (fr) 2022-04-07
CN116530219A (zh) 2023-08-01
US12225662B2 (en) 2025-02-11

Similar Documents

Publication Publication Date Title
DE69905266D1 (de) Beleuchtungssystem für nicht-emitierende elektronische anzeigeeinrichtungen
FR3080325B1 (fr) Dispositif de marquage optique
ATE339650T1 (de) Oberflächenlichtquelle, bildanzeigevorrichtung und lichtleiterplatte
MA42901A (fr) Substrats de sécurité, dispositifs de sécurité et leurs procédés de fabrication
FR3074257B1 (fr) Module lumineux pour l’eclairage et/ou la signalisation d’un vehicule automobile
FR3097938B1 (fr) Dispositif de signalisation lumineuse modulaire pour un véhicule
FR3105345B1 (fr) Dispositif d'éclairage automobile
FR3114633B1 (fr) Module lumineux pour véhicule automobile
FR3085903B1 (fr) Systeme lumineux pour dispositif d'eclairage et/ou de signalisation d'un vehicule automobile
ATE307347T1 (de) Wellenlängenkompensierter optischer wellenlängenmultiplex-koppler und zugehörige verfahren
FR3114635B1 (fr) Module lumineux de véhicule automobile comprenant un substrat en céramique
CN107179592A (zh) 镜头模组、相机模组及电子装置
KR950034715A (ko) 반도체 다이로부터 열을 제거하기 위한 전자 모듈 및 그 제조 방법
EP1168022A3 (fr) Module opto-électronique avec substat à connexions traversantes
FR3089344B1 (fr) Test de circuit photonique intégré
FR3128820B1 (fr) Refroidissement d'un dispositif électronique
FR3100870B1 (fr) Dispositif lumineux d’un véhicule
TWI507796B (zh) 背光模組
FR3122244B1 (fr) Module lumineux d’un dispositif de signalisation d’un véhicule automobile
CN114387631B (zh) 指纹识别装置
US20210013124A1 (en) Heat dissipating structure for electronic units and display device comprising same
FR3106396B1 (fr) Dispositif lumineux de véhicule automobile incorporant un écran
US20040136637A1 (en) Sensor,display device and recording device
FR3063048B1 (fr) Dispositif lumineux pour vehicule automobile
US20090317033A1 (en) Integrated circuit and photonic board thereof

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20220401

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6