JP2013536592A - 全般照明用の固体光シートまたはストリップ - Google Patents

全般照明用の固体光シートまたはストリップ Download PDF

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Publication number
JP2013536592A
JP2013536592A JP2013527135A JP2013527135A JP2013536592A JP 2013536592 A JP2013536592 A JP 2013536592A JP 2013527135 A JP2013527135 A JP 2013527135A JP 2013527135 A JP2013527135 A JP 2013527135A JP 2013536592 A JP2013536592 A JP 2013536592A
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Japan
Prior art keywords
substrate
die
conductor
led
light
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Pending
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JP2013527135A
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Japanese (ja)
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JP2013536592A5 (https=
Inventor
ルイス・ラーマン
アラン・ブレント・ヨーク
マイケル・デヴィッド・ヘンリー
ロバート・スティール
ブライアン・ディー・オゴノウスキー
Original Assignee
クォークスター・エルエルシー
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Priority claimed from US12/870,760 external-priority patent/US8338199B2/en
Priority claimed from US12/917,319 external-priority patent/US8210716B2/en
Priority claimed from US13/018,330 external-priority patent/US8461602B2/en
Application filed by クォークスター・エルエルシー filed Critical クォークスター・エルエルシー
Publication of JP2013536592A publication Critical patent/JP2013536592A/ja
Publication of JP2013536592A5 publication Critical patent/JP2013536592A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0365—Manufacture or treatment of packages of means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP2013527135A 2010-08-27 2011-08-25 全般照明用の固体光シートまたはストリップ Pending JP2013536592A (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US12/870,760 US8338199B2 (en) 2010-08-27 2010-08-27 Solid state light sheet for general illumination
US12/870,760 2010-08-27
US12/917,319 US8210716B2 (en) 2010-08-27 2010-11-01 Solid state bidirectional light sheet for general illumination
US12/917,319 2010-11-01
US13/018,330 2011-01-31
US13/018,330 US8461602B2 (en) 2010-08-27 2011-01-31 Solid state light sheet using thin LEDs for general illumination
US13/044,456 2011-03-09
US13/044,456 US8198109B2 (en) 2010-08-27 2011-03-09 Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
PCT/US2011/049233 WO2012027616A2 (en) 2010-08-27 2011-08-25 Solid state light sheet or strip for general illumination

Publications (2)

Publication Number Publication Date
JP2013536592A true JP2013536592A (ja) 2013-09-19
JP2013536592A5 JP2013536592A5 (https=) 2014-10-09

Family

ID=44352981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013527135A Pending JP2013536592A (ja) 2010-08-27 2011-08-25 全般照明用の固体光シートまたはストリップ

Country Status (6)

Country Link
US (13) US8198109B2 (https=)
EP (3) EP4727307A2 (https=)
JP (1) JP2013536592A (https=)
KR (1) KR20140031832A (https=)
CN (2) CN107301992B (https=)
WO (1) WO2012027616A2 (https=)

Cited By (27)

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JP2015513213A (ja) * 2012-02-02 2015-04-30 ザ プロクター アンド ギャンブルカンパニー 二方向性光シート
JP2015095488A (ja) * 2013-11-08 2015-05-18 シチズン電子株式会社 Ｌｅｄ照明装置
JP2015109331A (ja) * 2013-12-04 2015-06-11 シャープ株式会社 窒化物半導体発光装置
WO2015146115A1 (ja) * 2014-03-25 2015-10-01 東芝ホクト電子株式会社 発光装置
JP2016115934A (ja) * 2014-12-11 2016-06-23 シチズン電子株式会社 発光装置及び発光装置の製造方法
JP2016171199A (ja) * 2015-03-12 2016-09-23 イビデン株式会社 発光素子搭載基板
JP2016178307A (ja) * 2015-03-20 2016-10-06 コミサリア ア エナジー アトミック エ オックス エナジーズ オルタネティヴ 発光ダイオードを備えた光電子デバイス
JP2017507493A (ja) * 2014-03-04 2017-03-16 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 電子デバイス用の可撓性を有するマルチパート封止ハウジング
JP2017092199A (ja) * 2015-11-09 2017-05-25 三菱電機株式会社 半導体レーザーおよびその製造方法
JP2017092092A (ja) * 2015-11-04 2017-05-25 豊田合成株式会社 発光装置の製造方法
JP2017123393A (ja) * 2016-01-07 2017-07-13 日亜化学工業株式会社 発光装置の製造方法
KR20170100999A (ko) * 2016-02-26 2017-09-05 삼성전자주식회사 멀티 컬러를 구현할 수 있는 발광 소자
JP2017201666A (ja) * 2016-05-06 2017-11-09 日亜化学工業株式会社 発光装置の製造方法
JP2018049981A (ja) * 2016-09-23 2018-03-29 スタンレー電気株式会社 半導体発光装置、および、その製造方法
JP2018107257A (ja) * 2016-12-26 2018-07-05 日亜化学工業株式会社 発光装置
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JP2019530249A (ja) * 2016-09-30 2019-10-17 フォルシュングスフェアブント ベルリン エー ファウＦｏｒｓｃｈｕｎｇｓｖｅｒｂｕｎｄ Ｂｅｒｌｉｎ ｅ．Ｖ． 光パルス発生器及び光パルス発生器の操作方法
JP2019212879A (ja) * 2018-06-06 2019-12-12 海華科技股▲分▼有限公司 フリップチップ型発光モジュール
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JP2020113799A (ja) * 2020-04-22 2020-07-27 日亜化学工業株式会社 発光装置
JP2020205355A (ja) * 2019-06-18 2020-12-24 スタンレー電気株式会社 発光装置
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JP2022158612A (ja) * 2021-04-02 2022-10-17 株式会社ジャパンディスプレイ 電子部品の実装方法、表示装置、及び、回路基板
WO2023176205A1 (ja) * 2022-03-17 2023-09-21 日亜化学工業株式会社 発光装置
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